WO2012148848A3 - Procédé et système de contrôle hybride par réticule - Google Patents

Procédé et système de contrôle hybride par réticule Download PDF

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Publication number
WO2012148848A3
WO2012148848A3 PCT/US2012/034665 US2012034665W WO2012148848A3 WO 2012148848 A3 WO2012148848 A3 WO 2012148848A3 US 2012034665 W US2012034665 W US 2012034665W WO 2012148848 A3 WO2012148848 A3 WO 2012148848A3
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
die
cell
reticle
reticle inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2012/034665
Other languages
English (en)
Other versions
WO2012148848A2 (fr
Inventor
Carl Hess
John D. Miller
Shan XUE
Patrick LOPRESTI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Priority to US13/814,535 priority Critical patent/US9208552B2/en
Priority to KR1020137031252A priority patent/KR101834601B1/ko
Priority to JP2014508464A priority patent/JP6041865B2/ja
Priority to TW101115004A priority patent/TWI567485B/zh
Publication of WO2012148848A2 publication Critical patent/WO2012148848A2/fr
Anticipated expiration legal-status Critical
Publication of WO2012148848A3 publication Critical patent/WO2012148848A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention concerne un appareil de contrôle de semiconducteurs qui réalise un processus de contrôle hybride comprenant un contrôle de cellule à cellule, un contrôle de pastille à pastille et un contrôle de pastilles par rapport à un modèle doré ou par rapport à une base de données. L'appareil crée une image dorée d'un réticule complémentaire à des parties du réticule qui peuvent être contrôlées par un contrôle de cellule à cellule ou de pastille à pastille. En variante, l'appareil crée une base de données réduite complémentaire à des parties du réticule qui peuvent être contrôlées par un contrôle de cellule à cellule ou de pastille à pastille.
PCT/US2012/034665 2011-04-26 2012-04-23 Procédé et système de contrôle hybride par réticule Ceased WO2012148848A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/814,535 US9208552B2 (en) 2011-04-26 2012-04-23 Method and system for hybrid reticle inspection
KR1020137031252A KR101834601B1 (ko) 2011-04-26 2012-04-23 하이브리드 레티클 검사 방법 및 시스템
JP2014508464A JP6041865B2 (ja) 2011-04-26 2012-04-23 ハイブリッドレチクル検査のための方法及びシステム
TW101115004A TWI567485B (zh) 2011-04-26 2012-04-26 用於混合式十字線檢視之方法及系統

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161478998P 2011-04-26 2011-04-26
US61/478,998 2011-04-26
US201261611236P 2012-03-15 2012-03-15
US61/611,236 2012-03-15

Publications (2)

Publication Number Publication Date
WO2012148848A2 WO2012148848A2 (fr) 2012-11-01
WO2012148848A3 true WO2012148848A3 (fr) 2014-05-01

Family

ID=47073010

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/034665 Ceased WO2012148848A2 (fr) 2011-04-26 2012-04-23 Procédé et système de contrôle hybride par réticule

Country Status (3)

Country Link
JP (1) JP6041865B2 (fr)
KR (1) KR101834601B1 (fr)
WO (1) WO2012148848A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015027198A1 (fr) 2013-08-23 2015-02-26 Kla-Tencor Corporation Inspection de réticule bloc à bloc
US9390884B2 (en) 2014-05-09 2016-07-12 Globalfoundries Inc. Method of inspecting a semiconductor substrate
KR102599657B1 (ko) 2016-08-17 2023-11-08 삼성전자주식회사 반도체 웨이퍼 검사 방법 및 시스템, 및 이를 이용한 반도체 소자의 제조 방법
US10451563B2 (en) * 2017-02-21 2019-10-22 Kla-Tencor Corporation Inspection of photomasks by comparing two photomasks
US11263741B2 (en) * 2020-01-24 2022-03-01 Applied Materials Israel Ltd. System and methods of generating comparable regions of a lithographic mask
EP3862814A1 (fr) * 2020-02-10 2021-08-11 ASML Netherlands B.V. Procédé d'inspection de processus en plusieurs étapes
JP7465138B2 (ja) * 2020-04-13 2024-04-10 株式会社ニューフレアテクノロジー パターン検査装置及びパターン検査方法
US12165306B2 (en) * 2021-03-16 2024-12-10 Kla Corporation Segmentation of design care areas with a rendered design image

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234139A1 (en) * 2005-04-13 2006-10-19 Kla-Tencor Technologies Corporation Systems and methods for modifying a reticle's optical properties
US20090080759A1 (en) * 2007-09-20 2009-03-26 Kla-Tencor Corporation Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10141932A (ja) * 1996-11-07 1998-05-29 Fujitsu Ltd パターン検査方法と装置
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
JP2004212221A (ja) * 2002-12-27 2004-07-29 Toshiba Corp パターン検査方法及びパターン検査装置
JP2005134347A (ja) * 2003-10-31 2005-05-26 Nec Corp レチクル検査装置及びレチクル検査方法
JP2008082740A (ja) * 2006-09-26 2008-04-10 Toshiba Corp 半導体装置のパターン欠陥検査方法
US8611639B2 (en) 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
US8401272B2 (en) * 2007-08-02 2013-03-19 Asti Holdings Limited Patterned wafer defect inspection system and method
JP2010107412A (ja) * 2008-10-31 2010-05-13 Toshiba Corp 欠陥観察装置、欠陥観察方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234139A1 (en) * 2005-04-13 2006-10-19 Kla-Tencor Technologies Corporation Systems and methods for modifying a reticle's optical properties
US20090080759A1 (en) * 2007-09-20 2009-03-26 Kla-Tencor Corporation Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions

Also Published As

Publication number Publication date
KR101834601B1 (ko) 2018-03-05
JP2014519598A (ja) 2014-08-14
KR20140029464A (ko) 2014-03-10
WO2012148848A2 (fr) 2012-11-01
JP6041865B2 (ja) 2016-12-14

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