WO2012153232A2 - Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats - Google Patents

Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats Download PDF

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Publication number
WO2012153232A2
WO2012153232A2 PCT/IB2012/052184 IB2012052184W WO2012153232A2 WO 2012153232 A2 WO2012153232 A2 WO 2012153232A2 IB 2012052184 W IB2012052184 W IB 2012052184W WO 2012153232 A2 WO2012153232 A2 WO 2012153232A2
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WO
WIPO (PCT)
Prior art keywords
substrate
support
substrate transport
transport module
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2012/052184
Other languages
German (de)
English (en)
Other versions
WO2012153232A3 (fr
Inventor
Joachim Mai
Markus BALLMANN
Danny Mueller
Thomas Schulze
Patrick LIPPOLD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Publication of WO2012153232A2 publication Critical patent/WO2012153232A2/fr
Publication of WO2012153232A3 publication Critical patent/WO2012153232A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Definitions

  • the present invention relates to a substrate transport module of a substrate processing system, wherein the substrate transport module has a support device in the form of a support plate and / or a support frame and is designed for horizontal recording and horizontal transport of at least one planar substrate or at least one planar substrate transport object.
  • the invention further relates to a loading and unloading system of a substrate processing system with such a substrate transport module.
  • the present invention relates to a method for transporting at least one planar substrate or at least one planar substrate transport object in a substrate processing system with at least one substrate transport module, which has a support device in the form of a support plate and / or a support frame.
  • substrate processing systems such as plants for the production of solar cells
  • substrate carriers are used to support substrates to be processed, which are typically deposited on the substrate carrier in the form of lines and columns.
  • the substrate carrier is for this purpose, for example, plate-shaped or grid-shaped.
  • the substrate carrier is designed such that it can be transported in at least one transport direction through the substrate processing system with substrates arranged on the substrate carrier.
  • the substrates can pass on the substrate carrier lying on several areas in the substrate processing plant and thus can be processed continuously in the substrate processing system.
  • the substrate transport module designed in the form of a substrate carrier is oriented horizontally, so that the substrates, which are typically of a planar design, likewise pass through the substrate processing system in a horizontally oriented manner.
  • the substrates lie flat on the surface of the substrate carrier. If the substrate carrier is formed in a grid shape, the substrates are in so-called carrier nests, which are formed in the substrate carrier, arranged. In the carrier esters, the substrates are typically deposited only at their edges on corresponding holding regions of the carrier esters. So it is possible in both substrate carrier variants, in particular to process the surface of the respective substrates.
  • the substrate processing system for example, coating processes, diffusion processes, etching processes, firing processes or cleaning processes are carried out on the substrates.
  • the substrate transport module In the respective processes, not only the substrates but also the respectively used substrate transport module are exposed to the respective conditions of the process.
  • the substrate transport module In the case of a coating of a substrate, the substrate transport module is also coated in the respective plant section.
  • the substrate transport module with the recorded substrates moves continuously through the substrate processing system and thereby passes different plant areas, which are characterized in part by completely different boundary conditions.
  • the substrate transport module partially transfers from one system section into the next process-unfriendly foreign atoms and / or molecules of the previous system section into the next system section. This can lead to contamination in the next section of the plant, which has an unfavorable effect on the local process.
  • the substrate transport module since the substrate transport module is coated in deposition processes in the substrate processing system in the prior art, the substrate transport module after some time on a disadvantageous for other applications coating, which must be removed at appropriate intervals.
  • serving as a substrate transport module substrate carrier must be removed and cleaned at regular intervals from the substrate processing system.
  • the coatings are removed by etching of the substrate carrier.
  • the substrate carrier can not be used in the substrate processing equipment during its cleaning, so it is necessary to have spare substrate carriers ready or to be unable to use the appropriate substrate processing equipment for the cleaning time.
  • cleaned substrate carriers must be preconditioned after cleaning. That is, they must be recoated after cleaning with a certain base layer thickness, otherwise problems with the respective Processes result. Also with the preconditioning a corresponding time and effort is connected.
  • the substrate carriers used in the prior art must be formed of high-temperature-resistant materials, so that they survive unscathed the high temperatures used in part in the plant sections.
  • the substrate carriers used in the prior art must be formed of high-temperature-resistant materials, so that they survive unscathed the high temperatures used in part in the plant sections.
  • only a limited number of materials are suitable for these substrate carriers, some of which are very expensive and difficult to process.
  • the substrate transport module and the corresponding loading and unloading system should be designed as inexpensively as possible.
  • a substrate transport module of a substrate processing system wherein the substrate transport module is designed for horizontal reception and horizontal transport of at least one planar substrate or at least one planar substrate transport object, wherein the substrate transport module has a support device in the form of a support plate or a support frame which support elements with horizontally oriented support sections, which form a support for the at least one planar substrate or the at least one planar substrate transport object, extend into an area under the support device, and wherein the support device with a Transport system for transport of the substrate transport module in the substrate processing system can be coupled.
  • the inventive approach consists in that the substrate transport module used as the substrate carrier on the one hand has a support device and on the other hand at least one substrate support region.
  • the support device has elements that are adapted to the transport system of the substrate processing system, so that the substrate transport module can be transported by the support device in a horizontal orientation through the substrate processing system.
  • At least one substrate support area allows the horizontal support of substrates on the substrate transport module, so that the substrates can be transported on the substrate transport module lying through the substrate processing system.
  • the connection between the support device and the at least one substrate support region is effected by the support elements attached to the support device or connected to the support device.
  • the support elements have horizontally aligned support sections. Either the substrates themselves can be deposited on the support sections, or at least one planar substrate transport object is placed on the support sections, on which in turn at least one substrate can be deposited.
  • a spatial region results between the support device and the support sections in which the at least one planar substrate or the at least one planar substrate transport object is lifted can be, wherein the at least one planar substrate or the at least one planar substrate transport object no longer rests on the support sections in this raised position.
  • the substrate transport module without colliding with the at least one planar substrate or the at least one planar substrate transport object to be moved away from this.
  • the substrate transport module functioning as a substrate carrier does not have to remain in the respective substrate processing area during substrate processing and only the at least one planar substrate or the at least one planar substrate transport object is left in this substrate processing area during substrate processing. Accordingly, the process conditions acting on the substrate or the substrate transport object do not simultaneously affect the substrate transport module, which can be positioned outside of the substrate processing area. Subsequent to substrate processing, the substrate transport module can be moved back into the substrate processing area and resume the substrates or substrate transport objects in order to transport them into the next plant section or out of the substrate processing system.
  • the carrying device has at least one transport system adapter.
  • the carrying device may have a flat support plate on which, for example, several substrates can be placed.
  • the support plate may be fitted into a support frame, which in turn may rest on or be coupled to elements of the transport system of the substrate processing system.
  • lattice-shaped support beams can also be provided within the support frame.
  • corresponding openings are formed between the grid-like arranged support bars, which preferably correspond at least to the size of the substrate surfaces of the substrates to be processed.
  • transport system adapter a variety of technical training can be used.
  • transport system adapters may be provided on each of the two opposite sides of the substrate transport module that extend parallel to the substrate transport direction.
  • the transport system adapters may, for example, be rails which are provided for running on rollers of a transport system of the substrate processing installation designed as a roller transport system.
  • the transport system adapters it is possible for the transport system adapters to be roller arrangements which are provided for unrolling on stationary rails of the transport system of the substrate processing installation.
  • magnetic arrangements are used as transport system adapter, which are provided for forming a linear motor within the transport system of the substrate processing system.
  • the carrying device has a supporting frame with a lattice-shaped carrying beam, it is particularly favorable if supporting beams aligned at least in one direction have grooves for receiving the carrying beams extending in the other direction and the carrying bars received in the grooves of the carrying bars are locked by connecting clamps. In this way, an easily assembled and disassembled support device is formed, whereby it is readily possible to replace worn support beams with new ones.
  • the grooves supporting devices can be created, which are adaptable to different substrate sizes.
  • the support elements are provided between the transport system adapters of the support device.
  • the transport system adapters are typically located in the exterior of the support while the support members typically reside in the interior of the substrate transport module are located.
  • the substrate transport module can be suitably stored at its outer regions, which are provided parallel to the transport direction of the substrate transport module and coupled to the transport system of the substrate processing system, while in the inner regions of the substrate transport module, which are then also provided in the inner regions of the substrate processing system, the recording of Substrates and their transport can be done by the substrate processing system.
  • the substrate transport module is preferably designed such that it has a vertical channel through which the at least one substrate or the at least one substrate transport object can be moved onto the support and from the support.
  • a vertical channel is understood to mean a free region in which the at least one substrate or the at least one substrate transport object can be moved freely in the vertical direction. Since there is nothing to prevent movement of the at least one substrate or of the at least one substrate object in the vertical channel, the at least one substrate or the at least one substrate transport object can be brought within the vertical channel into a horizontal plane in which unimpeded removal of the substrate transport module is possible without a collision occurs between the substrate transport module and the at least one substrate or the at least one substrate transport object. Conversely, if the at least one substrate or the at least one substrate transport object is located in this horizontal plane above the support, the substrate transport module can be moved in the direction of the substrate or the substrate transport object in order subsequently to be able to pick it up again on the support.
  • the substrate transport module has at least one downwardly partially open horizontal channel, which is located between the support device and the support and, when the at least one planar substrate or the at least one planar substrate transport object in a stroke position in the at least one horizontal channel is located, a horizontal relative movement between the at least one substrate or the at least one substrate transport object and the substrate transport module allowed, wherein the horizontal channel is formed by the fact that the support elements are provided on closed sides of the horizontal channel and within the horizontal channel no support elements are provided.
  • the horizontal channel may be within the vertical channel described above.
  • a horizontal channel is understood according to the invention to mean a free region within which the at least one planar substrate or the at least one planar one Substrate transport object in the horizontal direction is freely movable or in which the at least one planar substrate or the at least one planar substrate transport object during a horizontal relative movement of the substrate transport module relative to the at least one substrate or substrate transport object can be maintained.
  • This unimpeded Relativbeweg availability of the substrate transport module relative to the substrate or the substrate transport object this can be moved to the substrate or the substrate transport object to allow recording of the substrate or substrate transport object on the substrate transport module.
  • the substrate transport module can also be moved away from the substrate or the substrate transport object so that it is not processed during processing of the substrate.
  • At least two horizontal channels are provided in a horizontal plane next to each other. That is, in these horizontal channels, for example, a plurality of substrates or substrate transport objects can be recorded, the horizontal channels are indeed provided in a single horizontal plane, but separate from each other.
  • At least two horizontal channels are formed in superimposed horizontal planes, wherein in each of the at least two superimposed horizontal channels support portions of the support elements are provided.
  • the substrate transport module can be discharged successively, wherein the substrate transport module after the discharge of the substrates again from the substrate processing area of the substrate processing plant out can be moved.
  • the multistage substrate transport module may be returned to the substrate processing area, and the substrates or substrate transport objects with substrates may again be picked up by the substrate transport module and transported to another portion of the substrate processing facility.
  • a substrate transport object for example, a substrate support plate or a substrate receiving frame, which may be formed, for example, grid-shaped, are used.
  • the substrate transport module has in the region under the support device extending alignment elements, each having at least one aligned in the direction of at least one auf simplifyden to the support substrate or substrate transport object slope, wherein the alignment elements as stops for on support elements provided in at least one receiving area of the substrate transport module substrates or substrate transport objects are provided.
  • This design of the substrate module according to the invention makes it possible to position the respective substrate or substrate transport object to be placed on the substrate transport module exactly in the intended support position, since the alignment elements define this position and guide the substrate or substrate transport object into this position through the bevel provided on the alignment elements.
  • the support elements and / or the alignment elements are clamped to the support device. Since it is assumed that the support elements as well as the alignment elements are subject to a particular wear, thus the support elements or the alignment elements can be exchanged or renewed in a simple manner.
  • the support device comprises a support frame with lattice-shaped support beams
  • the support beams are support longitudinal beams and support cross beams, wherein the support longitudinal beams are oriented in a transport direction in which the substrate transport module is movable in the substrate processing equipment; and if the support elements and / or the alignment elements described above each have a U-shaped, each attachable to a supporting longitudinal beam mounting portion with thereof laterally projecting retaining hooks; and when spring elements are provided, by means of which the retaining hooks are engaged behind, in order to lock the support elements and / or the alignment elements on the supporting longitudinal beam.
  • a stable, yet easy to assemble and disassemble carrying device is designed with a low weight, the support elements and / or the alignment can be attached in different positions on the support beam, thus ensuring an adaptation to different substrate sizes and substrate shapes.
  • the spring elements are H-shaped, can be placed flat on the support longitudinal beam and formed so long that they each have the retaining hooks U-shaped mounting portions of a support element and a Aligning element, which are applied to the same support longitudinal beam, engage behind.
  • a spring element both the support element and the alignment element, which are applied to the same support longitudinal beam, are held.
  • the substrate transport module is formed at least partially from fiber composite material and / or aluminum.
  • the substrate transport module can be made particularly easy.
  • the functionality of the substrate transport module according to the invention can be further increased if the support device is designed in such a way that at least one planar substrate or substrate transport object can be deposited on a surface of the support device which is located on the side of the support device opposite the support sections.
  • the support device the surface of which is usable as a supporting plane for at least one substrate or at least one substrate transport object, the substrates lying thereby on top of the support device - parallel to the below, d. H. under the support device on the support portions resting substrates - recorded, transported by the substrate processing system and processed.
  • this embodiment of the substrate transport module according to the invention can be used for example for a double-sided processing of substrates, wherein z. B.
  • the substrate transport module can be transported, for example, continuously through a processing zone of the substrate processing system, wherein a simultaneous processing of the substrates from above and from below, or in the transport direction also successively from above and then from below or vice versa can take place.
  • the support device is preferably designed so that a strict separation of the processing of the top and bottom substrates is possible.
  • the support device may be formed, for example, as a storage plate with carrier nests introduced therein for substrates.
  • the object of the present invention is also achieved by a loading and / or unloading system of a substrate processing system with a substrate transport module in which the substrate transport module is designed for horizontal reception and for horizontal transport of at least one planar substrate or at least one planar substrate transport object, and wherein the substrate transport module has a support device in the form of a support plate and / or a support frame from which support elements with horizontally aligned Support sections, which form a support for the at least one planar substrate or the at least one flat substrate transport object, extend into an area under the support device, and wherein the support device can be coupled to a transport system for transporting the substrate transport module in the substrate processing system, and wherein the loading and / or unloading a arranged underneath the substrate transport module lifting and lowering device with liftable and lowerable lifting elements for the at least one substrate or substrate transport object, where in which the lifting elements can be brought into a lifting position, in which a deposit of the at least one substrate or substrate transport object is provided on the lifting elements, and wherein the at least one
  • the substrate transport module according to the invention makes it possible to bring the at least one planar substrate or substrate transport object into a horizontal plane, in which unimpeded reciprocal movement of the substrate transport module relative to the substrate or substrate transport object is possible.
  • the at least one planar substrate or substrate transport object can be brought by the lifting and lowering device of the loading and unloading system according to the invention.
  • the lifting elements of the lifting and lowering device either move in the direction of the at least one substrate or substrate transport object, that is, upwards, or away from them, that is, downwards.
  • the lifting elements move in the direction of the at least one substrate or substrate transport object, this can be lifted out of its support position on the support sections of the support elements by the lifting elements and is then located in a storage position on the lifting elements.
  • the at least one substrate or substrate transport object be placed within a vertical channel of the substrate transport object in a horizontal position in which the substrate transport module and the at least one substrate or substrate transport object not hinder each other, so that the substrate transport module can be moved away from the at least one substrate or substrate transport object.
  • the at least one substrate can be processed in its storage position on the lifting elements or in another position, in which the at least one substrate or substrate transport object can be subsequently brought by lifting elements in the substrate processing system.
  • the substrate transport module may be at a location, e.g. Outside of the process space, in which it remains unaffected by the particular processing process and does not even affect the process, such as a plasma process.
  • the substrate transport module can again be moved in the direction of the at least one substrate or substrate transport object in order to pick it up and subsequently bring it out into another section of the substrate processing system or out of the substrate processing system. Accordingly, according to the invention, there are reduced process-technical requirements for the carrier design and the material of the substrate transport module. In addition, this results in a reduced mutual influence of the adjacent processes (eg plasma processes) z. B. by carryover of gas molecules from process to process.
  • the substrate transport module can now otherwise serve as a substrate carrier can be used, whereby a total substrate carrier can be saved. This results in an increased throughput, in particular in the case of standing coating methods.
  • the substrate transport module If the substrate transport module is not located in the process space during substrate processing, it will not be coated or soiled. As a result, no subsequent cleaning and preconditioning of the substrate transport module is necessary. This also increases the lifetime of the substrate transport module.
  • pins can be used as lifting elements.
  • Pins have the advantage that they can be provided with a point-shaped bearing area for the substrates, so that the contact between the lifting elements and the at least one substrate or substrate transport object can be minimized.
  • the Pinhubmechanik can be provided within a vacuum chamber.
  • bushings and / or seals can be saved by a central operation of Pinhubmechanik.
  • actuators can be saved and leakage options avoided.
  • the lifting and lowering device is designed so that it allows simultaneous loading and unloading of substrates.
  • the lifting elements are completely retractable in a parallel to the horizontal support portions of the supporting elements machining table and extendable from this, wherein the machining table has vertical guides for the lifting elements.
  • the lifting elements can be brought into a position in which they can lift the at least one substrate or substrate transport object from the support position.
  • the lifting elements with the at least one substrate or substrate transport object resting thereon can then be moved down again in the direction of the processing table and lowered into the processing table, so that the at least one substrate or substrate transport object can rest on the processing table for substrate processing.
  • a suitable substrate for substrate processing is made available to the at least one substrate or substrate transport object with the processing table.
  • the lifting elements themselves are unaffected by their sinkability in the processing table by the substrate processing. It is particularly advantageous if the lifting elements protrude in at least one lowered in the processing table position down from the machining table, and below and parallel to the machining table a vertically displaceable lifting plate is provided for vertical displacement of the lifting elements.
  • the lifting plate all lifting elements can be moved vertically together. Accordingly, only a single drive, namely that for the lifting plate, required to move all the lifting elements vertically and thus move all resting on the lifting elements substrates or substrate transport objects vertically.
  • the processing table is fixedly coupled to a support plate provided at a distance below the processing table, in a space between the processing table and the support plate, the lifting plate is provided, and the support plate can be raised and lowered with a drive.
  • the support plate By coupling the support plate with the machining table is raised by lifting the support plate at the same time the editing table.
  • the processing table can be brought into a favorable for a substrate processing position within the substrate processing system.
  • projecting pins are provided on the lifting plate by the support plate, which then when the lifting plate does not rest on the support plate abut against stop springs, wherein in the stroke position the lifting plate by the stop springs and the stop pins against the processing table is pressed.
  • the lifting plate for example, when the at least one substrate is processed, rest on the support plate. Moves the support plate together with the processing table back out in a position from a substrate processing area, ie down, the lifting plate is held by the system of stop pins and stop springs in a position above the support plate until the lifting plate is able again, the To move lifting elements through the processing table upwards.
  • the lifting and lowering device is located inside a closable substrate processing chamber provided in the substrate processing system.
  • a separate substrate processing area can be created which, for example, can be evacuated to obtain optimal process results to reach.
  • the area in which the lifting and lowering device is located is not closed.
  • the object of the present invention is also achieved by a method for transporting at least one planar substrate or at least one flat substrate transport object of a substrate processing system having at least one substrate transport module, which has a support device in the form of a support plate and / or a support frame, wherein in the method the at least a planar substrate or substrate transport object is placed on horizontally aligned support sections of support elements extending from a support device of the substrate transport module into a region under the support device; the substrate transport module loaded with the at least one substrate or substrate transport object is transported into a substrate processing area of the substrate processing system; the transport of the loaded substrate transport module in the substrate processing area is stopped via a lifting and lowering device; Lifting elements of the lifting and lowering device are brought into a stroke position, wherein the previously agoauf on the support elements at least one substrate or substrate transport object is received by the lifting elements, wherein the at least one substrate or substrate transport object rests in the lifting position on the lifting elements and wherein the at least one Substrate or substrate transport object in the stroke position
  • the method according to the invention makes it possible to transport substrates and / or substrate transport objects safely and quickly through a substrate processing installation with the aid of a substrate transport object and then, when the substrate processing installation is a continuous or inline substrate processing installation, to differentiate the substrates or substrate transport objects To supply areas of the substrate processing system sequentially.
  • the substrate transport module is the at least one substrate or Substrate transport object in an area under the support device of the substrate transport module on support portions of support elements. That is, the support plane for the substrates is below the support plane defined by the support.
  • a free region or channel is provided between the support plane and the support plane, into which the at least one substrate or substrate transport object can be brought and in which the at least one substrate or substrate transport object does not hinder the transporting of the substrate transport system.
  • the at least one substrate or substrate transport object can be brought by means of the lifting and lowering device used in the method.
  • the at least one substrate or substrate transport object rests on the lifting elements of the lifting and lowering device.
  • the same can also be done at a location where no substrate processing, but any other measure is provided.
  • the lifting elements and the at least one substrate or substrate transport object lying on lifting elements are brought into the lifting position in the method, while the substrate transport module is located outside the substrate processing area; the substrate transport module is moved into the substrate processing area until the at least one substrate or substrate transport object lying on the lifting elements is located between the carrier device and the support of the substrate transport module to be formed by the carrier elements;
  • the lifting elements of the lifting and lowering device are lowered from the lifting position, wherein the first lying on the lifting elements at least one substrate or substrate transport object is placed on the horizontally oriented support portions of the support elements and the lifting elements then continue to form a distance to the at least one substrate or substrate transport object be lowered; and the substrate transport module loaded with the at least one substrate or substrate transport object is transported out of the substrate processing area.
  • the processed substrates or substrate transport objects can be picked up again by the substrate transport module and transported on. It is particularly advantageous if, according to an embodiment of the method according to the invention, the at least one substrate or substrate transport object is provided with at least one pointing in the direction of the at least one Substrattransport sandwichess extending alignment elements provided on the substrate transport module on the support sections in at least one receiving area of the substrate transport module centrally, in that the at least one substrate or substrate transport object slides from the at least one bevel down onto the support formed by the support sections of the support elements into the receiving region. With this procedure, an exact storage of substrates or substrate transport objects on the substrate transport module can be realized.
  • the at least one substrate or substrate transport object previously deposited on the support elements is received on the ends of at least three pin-shaped lifting elements.
  • at least three lifting elements By means of at least three lifting elements, a secure support of the at least one substrate or substrate transport object can be made possible. Since the lifting elements are formed pin-shaped in this embodiment, only a small contact area between the lifting elements and the at least one substrate or substrate transport object is present, so that the impairment that exert the lifting elements on the at least one substrate or substrate transport object is very low.
  • the lifting elements are vertically displaced in vertical guides which are provided in a parallel to the support device processing table, the lifting elements are extended to form a shelf for the at least one substrate or substrate transport object from the processing table and the Processing of the at least one substrate or substrate transport object are completely sunk in the processing table.
  • the at least one substrate or substrate transport object can rest safely on the processing table during substrate processing in the substrate processing installation.
  • the machining table fixedly coupled to a support plate is raised or lowered by means of a drive coupled to the support plate, wherein the support plate is provided at a distance below the work table to form a gap in which the lift plate movable vertically therein is provided is.
  • the support plate which is coupled to the machining table, to raise the machining table, for example, into a machining position for the substrates.
  • the lifting plate is first pressed by protruding through the support plate stop pins and pressing against the stop pins stop springs against the working table, being pressed by the lifting plate, the lifting elements in the stroke position, and then the working table is raised while the lifting plate remains stationary on the stopper pins and the stopper springs until the lifting plate is picked up by the carrying plate, and further the stopper pins are removed from a stopper.
  • the lifting plate can be safely absorbed by the support plate.
  • the method according to the invention is designed so that a substrate processing chamber, in which the lifting and lowering device and the substrate processing area are provided, is closed off after removal of the substrate transport module from the substrate processing area at least during processing of the at least one substrate and the Substrate processing chamber is opened after processing for an import of the substrate transport module in the substrate processing chamber.
  • the substrate processing chamber may be suitably evacuated or filled with suitable process gases without affecting the surrounding areas of the substrate processing equipment.
  • the method according to the invention can also be carried out if the substrate processing chamber can not be closed.
  • Figure 1 shows a cross section through a substrate transport module according to the invention with an overlying substrate support support plate and substrates resting thereon;
  • Figure 2 is a plan view of an embodiment of the invention
  • Substrate transport module shows
  • Substrate transport module with overlying substrates shows
  • Figure 4 is a plan view of the substrate transport module of Figure 3;
  • Figure 5 shows a cross section through a further embodiment of the substrate transport module according to the invention with overlying substrates
  • Figure 6 is a plan view of the substrate transport module of Figure 5;
  • Figure 7 shows a cross section through a further embodiment of the substrate transport module according to the invention.
  • Figure 8 shows a cross-section through another possible embodiment of the substrate transport module according to the invention.
  • Figure 9 shows a perspective view of the substrate transport module of Figure 3.
  • Figure 10 shows an enlarged detail of the substrate transport module of Figure 9;
  • Figure 1 1 shows a support element for the substrate transport module of Figure 9;
  • FIG. 12 shows an embodiment of a loading and unloading system according to the invention with a substrate transport module loaded with substrates in cross-section;
  • FIG. 13 shows an inventive loading and unloading system in which the lifting elements are in the lifting position;
  • Fig. 14 shows a loading and unloading system according to the present invention in a state in which the substrates lie on a working table in the substrate processing area while the substrate transporting module is outside the substrate processing area;
  • FIG. 1 schematically shows a cross section through an embodiment of a substrate transport module 3 according to the invention.
  • the substrate transport module 3 has a carrier device in the form of a carrier frame 5.
  • the support device gives the substrate transport module 3 its mechanical stability and it has elements which allow the transport of the substrate transport module 3 within a substrate processing system. In the embodiment shown, these elements are in the left and right ends of the substrate transport module 3, which are provided for support on rollers, not shown.
  • On the support frame 5 supporting elements 6 are fixed, which extend into the area under the support device.
  • the position of the substrate transport module 3 is not arbitrary, but provided in the position shown. In this case, extending from the support elements 6 of horizontally oriented support portions 32 which form a support for a substrate support plate 42 in the embodiment shown, on which substrates 4 rest.
  • the substrate transport module 3 of Figure 1 is shown schematically in a plan view.
  • the support frame 5 is shown only schematically by its outline. Under the support frame 5 are mounted on the support frame 5 supporting elements 6 with support portions 32. On the support portions 32, the substrate support plate 42 is located on this and are substrates. 4
  • FIG. 3 schematically shows a cross section of a further variant of the substrate transport module 3 'according to the invention with overlying substrates 4.
  • the substrate transport module 3' is designed directly for transporting substrates 4 which rest directly on substrate support sections 32, 32 '.
  • 4 supporting elements 6 are provided next to each substrate, forming the sides of a horizontal channel 41, which in the plane perpendicular to the plane of representation outstanding direction is open.
  • the transport system has, among other components, not shown, rollers 36 on which the rails 35 run.
  • the individual components of the substrate transport module 3, 3 ', 3 ", 3"', 3 “”, 3 according to the invention can be both individual parts attached to one another, or they can also be subregions of more complex bodies.
  • the substrate transport modules 3, 3 ', 3 ", 3"', 3 "", 3 are preferably composed of a plurality of components, each of which has optimum properties for the requirements of the respective components.
  • the support frame 5 is preferably formed of a lightweight and dimensionally stable fiber-plastic composite and the rails 35 may be formed of an abrasion-resistant metal, such as aluminum or an aluminum alloy.
  • the support elements 6 with the support portions 32, 32 ' are in the illustrated embodiment, profiles of a fiber-plastic composite, which are glued to the support frame 5.
  • the support members 6 are clamped to the support device, riveted, screwed or otherwise connected.
  • the materials used to make the substrate transport module 3, 3 ', 3 ", 3"', 3 "", 3 are selected depending on the specific requirements. Important properties are mechanical stability, dimensional stability, abrasion resistance, chemical and electrical compatibility with the substrates, chemical resistance to chemical stresses in the substrate processing plant and or in cleaning processes used for the substrate transport module 3, 3, 3, 3
  • FIG. 5 schematically shows a cross section through a further possible embodiment of the substrate transport module 3 "according to the invention with overlying substrates 4.
  • the carrying device consists of a support plate 44, which is reinforced by a stiffening frame 43.
  • the support plate 44 provides for the substrates 4 a protection against falling particles.
  • the support plate 44 may also be formed of a good thermal conductivity material, such as aluminum, wherein by heat conduction in the support plate 44, an approximation of the temperatures on all substrates 4 is achieved during transport. An elastic or plastic deformation of the substrate transport module 3 "is prevented by the stiffening frame 43.
  • the substrates 4 are shown in FIG Embodiment round discs, circular segments of these round discs are provided as support portions 32 "for individual substrates 4.
  • Figure 6 shows a plan view of the substrate transport module 3 ", wherein the stiffening frame 43 and the day plate 44 are visible and the round support disks are shown as hidden lines.
  • the substrate transport module 3 '" can have not only one but also several transport planes.
  • the support elements 6 have "support sections 32 in two superimposed planes, corresponding to two superimposed horizontal channels 41, 41.
  • the upper section of the substrate transport module 3" ' has similarities to the substrate transport module 3', which has already been described has been.
  • the horizontal channel 41 'in the substrate transport module 3 "' is designed to receive a substrate support plate 42 which is used, for example, when substrates 4 'of a different size than standard substrates 4 are to be processed substrates 4 or 4 'may be used, or substrates 4, 4' may be transported simultaneously, with the substrates 4, 4 'being discharged, for example, in successively arranged substrate processing areas.
  • FIG. 8 shows a cross section through a further embodiment of the substrate transport module 3 "" according to the invention.
  • the substrate transport module 3 "” uses a transport system adapter in the form of roller assemblies 37.
  • the roller assemblies 37 correspond to fixed rails 38 of the substrate transport system.
  • the substrate transport module 3 "” is driven by linear motors 40, to the formation of which on the substrate transport module 3 “” magnet arrangements 39 are provided. With the linear motors 40, a particularly low-friction transport of the substrate transport module 3 “” possible, wherein driving forces for the substrate transport module 3 "” not mechanically, but by magnetic fields are transmitted.
  • FIG. 9 is a perspective view of a preferred substrate transport module 3 according to the invention.
  • the carrying device has a support frame 5, which consists of support longitudinal beams 21 and support crossbars 22. Furthermore, the support device has rails 35.
  • the carrying longitudinal beams and the carrying crossbeams are simple and therefore inexpensive components that can be manufactured with great precision.
  • the cross-sections of the longitudinal girders and the girders are such that the girders bend weaker at the intended load than is permitted.
  • the supporting longitudinal beams and support crossbars are arranged in a grid shape, wherein between square substrates 4, 4 'is provided in each case a carrying crossbeam or a supporting longitudinal beam.
  • a uniform load of the support frame 5 is achieved.
  • other distances between carrier bars that are not adapted to the substrate dimensions can also be used.
  • the support longitudinal beams and support beams are preferably made of a fiber-plastic composite, which is lightweight, dimensionally stable and inexpensive.
  • the support longitudinal beams and the support beams are coated with aluminum to improve the chemical resistance of the surface.
  • the detail D in FIG. 10 is shown enlarged.
  • a stable connection between the support longitudinal beams 21 and the support crossbars 22 is achieved by recesses in the support crossbars 22, which are formed to match the cross section of the supporting longitudinal beams 21.
  • the crossing points of the supporting longitudinal beams 21 and the carrying crossbeams 22 are locked by carrying beam brackets 30.
  • the support members 6 are fixed, which are in this embodiment, the body shown in Figure 10 and 1 1 shallow depth. Due to the small volume of the support elements 6, a low mass of the substrate transport module 3 is achieved, which ultimately results in high transport speeds. a high transport system energy efficiency and low wear is achieved.
  • the support elements 6 are not rigidly connected to the supporting longitudinal beams 21, but clamped only by means of a U-shaped section. A secure attachment of the support members 6 is achieved by retaining hooks 29 on the support members 6, which are included by spring elements 28.
  • the clamping and elastic suspension avoid problems due to different thermal expansions of different materials.
  • the support elements 6 can be mounted quickly and inexpensively without tools, and the spring elements 28 additionally serve as a mechanical security, which leads to the fall of the support elements 6 in the event of an accident, wherein the substrate transport module 3 is not damaged.
  • aligning elements 24 are provided, which are similar to the support members 6 attached to the support longitudinal beams 21, but which have no support portions 32. Instead, the alignment elements 24 have bevels 25.
  • the bevels 25 are provided so that substrates 4, 4 ', which are not stored exactly in the receiving area 31 provided for this purpose, come to lie on the slope 25 and slide down therefrom into the receiving area 31. If the substrate 4, 4 ', as provided, is in its receiving region 31, the alignment element 24 additionally serves as a stop for the substrate 4, 4' which prevents slippage of the substrate 4 during the transport of the substrate transport module 3 through the substrate processing system.
  • an alignment member 24 is provided adjacent to each support member 6, and the two elements, d. H. the support element 6 and the alignment element 24 are held together by an H-shaped spring element 28.
  • FIG. 12 shows a loading and unloading system according to the invention with a substrate transport module 3 loaded with substrates 4 in cross-section.
  • the substrate transport module 3 rests on rollers 18 of a substrate transport system of a substrate processing system, the rollers 18 being coupled to roller drives 19.
  • the substrates 4 rest on support elements 6, which in turn are connected to a support frame 5. Between the support frame 5 and the support members 6 downwardly open horizontal channels 41 are formed.
  • the lifting and lowering device 7 has a lifting cylinder 17 shown only schematically, which can raise and lower a machining table 14 which is coupled to a table support plate 33.
  • the substrate processing area 2 is located in a vacuum-compatible chamber.
  • the lifting cylinder 17 is surrounded by a spring bar 16 and a Hubzylinderendplatte 15 of a vacuum-compatible housing.
  • the processing table 14 is fixedly coupled to the table support plate 33 to form a gap.
  • a lifting plate 12 which is connected to stop pins 13, wherein the stop pins 13 are pressed in the state shown by stop springs 34 upwards.
  • FIG. 13 shows the loading and unloading system according to the invention in a state in which the lifting elements 8 are in a lifting position.
  • the substrates 4 rest on pins 11 and are located within horizontal channels 41.
  • the substrate transport module 3 can be moved out of the display plane, wherein the substrates 4 remain resting on the pins 1 1 in the substrate processing area 2.
  • FIG. 14 shows the loading and unloading system 1 according to the invention in a state in which the substrates 4 lie on the processing table 14 in the substrate processing area 2, while the substrate transport module 3 is located outside the substrate processing area 2.
  • a processing of the substrates 4 is provided.
  • the processing table 14 is driven to its maximum height.
  • the pins 1 1 are sunk within the processing table 14.
  • the countersinking of the pins 1 1 is possible in that the stop pins 13 are removed from the stop springs 34 and thereby the lifting plate 12 is located on the table support plate 33 at a distance from the processing table 14.
  • FIG. 15 schematically shows an embodiment of the method according to the invention for transporting flat substrates 4 with a substrate transport module 3 '"
  • Process step A is the substrate transport module 3 "'loaded with substrates 4, and below the substrate transport module 3'" is the machining table 14, which is coupled to the lifting and lowering device 7.
  • step B the lifting elements 8, which are presently pins 1 1, brought into a stroke position, the substrates 4 rest on the pins 1 1 and are located in horizontal channels 41.
  • step C the substrate transport module 3 'has been moved out of the display plane so that the substrates 4 rest on the pins 1 1 separately from the substrate transport module 3'.
  • step D the pins 1 1 are sunk within the processing table 14, so that the substrates 4 rest on the processing table 14.
  • step E the processing of the substrates 4 'takes place while these rest on the processing table 14.
  • step F the pins 1 1 are pushed out of the processing table 14 with part of their length, the pins 11 and the substrates 4 being in the stroke position.
  • step G the substrate transport module 3 'is moved into the substrate processing area 2, wherein the substrates 4 are located within the horizontal channels 41.
  • step H the pins 1 1 are recessed within the processing table 14, so that a distance between the substrates 4 and the lifting elements is formed.
  • the substrate transport module 3 'loaded with the substrates 4 is moved out of the substrate processing area 2 in the direction provided for this purpose.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un module de transport de substrats d'une installation de traitement de substrats, le module de transport de substrats comportant un dispositif support sous forme d'un plateau support et/ou d'un cadre support et étant conçu pour la réception horizontale et pour le transport horizontal d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat. L'invention concerne en outre un système de chargement et de déchargement d'une installation de traitement de substrats comportant un module de transport de substrats de ce type. En outre, l'invention concerne aussi un procédé de transport d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat dans une installation de traitement de substrats comportant au moins un module de transport de substrats qui comprend un dispositif support sous forme d'un plateau support et/ou d'un cadre support. L'invention vise à proposer un module de transport de substrats, un système de chargement et de déchargement et un procédé de transport de substrats dans une installation de traitement de substrats qui permettent d'éviter des risques de contamination d'une partie de l'installation vers une autre partie de l'installation dans une installation de traitement de substrats en continu et de faire fonctionner de manière efficace une installation de traitement de substrats, le module de transport de substrats et le système de chargement et de déchargement correspondant étant de conception la moins onéreuse possible. À cet effet, le module de transport de substrats d'une installation de traitement de substrats du type susmentionné comprend un dispositif support doté d'éléments support présentant des parties réceptrices horizontales qui forment une réception pour le au moins un substrat plat ou le au moins un objet de transport de substrats plat et qui s'étendent dans une zone se trouvant sous le dispositif support, ledit dispositif support pouvant être couplé à un système de transport du module de transport de substrats dans l'installation de traitement de substrats. L'invention porte également sur un système de chargement et de déchargement utilisant le module de transport de substrats selon l'invention et sur un procédé correspondant.
PCT/IB2012/052184 2011-05-12 2012-05-02 Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats Ceased WO2012153232A2 (fr)

Applications Claiming Priority (2)

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DE102011050324.2 2011-05-12
DE102011050324A DE102011050324A1 (de) 2011-05-12 2011-05-12 Substrattransportmodul, Belade- und Entladesystem und Transportverfahren für Substrate in einer Substratbearbeitungsanlage

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WO2012153232A2 true WO2012153232A2 (fr) 2012-11-15
WO2012153232A3 WO2012153232A3 (fr) 2013-01-03

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TW201308482A (zh) 2013-02-16
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