WO2012153232A3 - Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats - Google Patents

Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats Download PDF

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Publication number
WO2012153232A3
WO2012153232A3 PCT/IB2012/052184 IB2012052184W WO2012153232A3 WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3 IB 2012052184 W IB2012052184 W IB 2012052184W WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transporting
processing installation
module
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2012/052184
Other languages
German (de)
English (en)
Other versions
WO2012153232A2 (fr
Inventor
Joachim Mai
Markus BALLMANN
Danny Mueller
Thomas Schulze
Patrick LIPPOLD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Publication of WO2012153232A2 publication Critical patent/WO2012153232A2/fr
Publication of WO2012153232A3 publication Critical patent/WO2012153232A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un module de transport de substrats d'une installation de traitement de substrats, le module de transport de substrats comportant un dispositif support sous forme d'un plateau support et/ou d'un cadre support et étant conçu pour la réception horizontale et pour le transport horizontal d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat. L'invention concerne en outre un système de chargement et de déchargement d'une installation de traitement de substrats comportant un module de transport de substrats de ce type. En outre, l'invention concerne aussi un procédé de transport d'au moins un substrat plat ou d'au moins un objet de transport de substrats plat dans une installation de traitement de substrats comportant au moins un module de transport de substrats qui comprend un dispositif support sous forme d'un plateau support et/ou d'un cadre support. L'invention vise à proposer un module de transport de substrats, un système de chargement et de déchargement et un procédé de transport de substrats dans une installation de traitement de substrats qui permettent d'éviter des risques de contamination d'une partie de l'installation vers une autre partie de l'installation dans une installation de traitement de substrats en continu et de faire fonctionner de manière efficace une installation de traitement de substrats, le module de transport de substrats et le système de chargement et de déchargement correspondant étant de conception la moins onéreuse possible. À cet effet, le module de transport de substrats d'une installation de traitement de substrats du type susmentionné comprend un dispositif support doté d'éléments support présentant des parties réceptrices horizontales qui forment une réception pour le au moins un substrat plat ou le au moins un objet de transport de substrats plat et qui s'étendent dans une zone se trouvant sous le dispositif support, ledit dispositif support pouvant être couplé à un système de transport du module de transport de substrats dans l'installation de traitement de substrats. L'invention porte également sur un système de chargement et de déchargement utilisant le module de transport de substrats selon l'invention et sur un procédé correspondant.
PCT/IB2012/052184 2011-05-12 2012-05-02 Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats Ceased WO2012153232A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011050324.2 2011-05-12
DE102011050324A DE102011050324A1 (de) 2011-05-12 2011-05-12 Substrattransportmodul, Belade- und Entladesystem und Transportverfahren für Substrate in einer Substratbearbeitungsanlage

Publications (2)

Publication Number Publication Date
WO2012153232A2 WO2012153232A2 (fr) 2012-11-15
WO2012153232A3 true WO2012153232A3 (fr) 2013-01-03

Family

ID=46124583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/052184 Ceased WO2012153232A2 (fr) 2011-05-12 2012-05-02 Module de transport de substrats, système de chargement et de déchargement et procédé de transport de substrats dans une installation de traitement de substrats

Country Status (3)

Country Link
DE (1) DE102011050324A1 (fr)
TW (1) TW201308482A (fr)
WO (1) WO2012153232A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120723B4 (de) * 2015-11-30 2024-09-26 VON ARDENNE Asset GmbH & Co. KG Beschichtungsanordnung, Substratträger und Verfahren
DE102018216878A1 (de) * 2018-10-01 2020-04-02 centrotherm international AG Transporteinheit für paralleles Einfahren oder Ausfahren von Substratträgern, in parallele Prozessrohre und Verfahren zum gleichzeitigen Beladen von parallelen, horizontal beabstandeten Prozessrohren
CN111471965B (zh) * 2020-04-30 2024-08-23 苏州迈正科技有限公司 传送载板、真空镀膜设备及真空镀膜方法
CN111519169A (zh) * 2020-05-28 2020-08-11 深圳市捷佳伟创新能源装备股份有限公司 顶升装置和物料加工设备
CN115513118B (zh) * 2022-08-31 2025-02-14 东方日升（常州）新能源有限公司 一种浮动平台、载板浮动定位装置及载板上料系统
CN116588658A (zh) * 2023-07-04 2023-08-15 广东汇芯半导体有限公司 一种自动更换载具的装置
CN117878044B (zh) * 2024-03-12 2024-06-04 四川富美达微电子股份有限公司 一种引线框架转移系统

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (fr) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Mecanismes de chargement
DE9116285U1 (de) * 1991-11-05 1992-05-27 Leybold AG, 6450 Hanau Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen
WO1999060611A1 (fr) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. Navette de transfert de substrats in situ
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (fr) * 2000-10-10 2002-04-17 Applied Materials, Inc. Dispositif d' élévateur pour plusieurs plaquettes et procédé
EP1622192A1 (fr) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Dispositif de transfert de substrat d'un appareil de formation de couches minces
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (fr) * 2009-07-31 2011-02-02 Tokyo Electron Limited Procédé d'assemblage d'un mécanisme de transfert et chambre de transfert

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6646857B2 (en) * 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
EP1855324A1 (fr) * 2006-05-12 2007-11-14 Applied Materials GmbH & Co. KG Substrate de type vitroceramique
GB2449309A (en) * 2007-05-18 2008-11-19 Renewable Energy Corp Asa A method for exposing a solar cell wafer to a liquid

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (fr) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Mecanismes de chargement
DE9116285U1 (de) * 1991-11-05 1992-05-27 Leybold AG, 6450 Hanau Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
WO1999060611A1 (fr) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. Navette de transfert de substrats in situ
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (fr) * 2000-10-10 2002-04-17 Applied Materials, Inc. Dispositif d' élévateur pour plusieurs plaquettes et procédé
EP1622192A1 (fr) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Dispositif de transfert de substrat d'un appareil de formation de couches minces
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (fr) * 2009-07-31 2011-02-02 Tokyo Electron Limited Procédé d'assemblage d'un mécanisme de transfert et chambre de transfert

Also Published As

Publication number Publication date
DE102011050324A1 (de) 2012-11-29
TW201308482A (zh) 2013-02-16
WO2012153232A2 (fr) 2012-11-15

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