WO2012153232A3 - Substrattransportmodul, belade- und entladesystem und transportverfahren für substrate in einer substratbearbeitungsanlage - Google Patents

Substrattransportmodul, belade- und entladesystem und transportverfahren für substrate in einer substratbearbeitungsanlage Download PDF

Info

Publication number
WO2012153232A3
WO2012153232A3 PCT/IB2012/052184 IB2012052184W WO2012153232A3 WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3 IB 2012052184 W IB2012052184 W IB 2012052184W WO 2012153232 A3 WO2012153232 A3 WO 2012153232A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
transporting
processing installation
module
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2012/052184
Other languages
English (en)
French (fr)
Other versions
WO2012153232A2 (de
Inventor
Joachim Mai
Markus BALLMANN
Danny Mueller
Thomas Schulze
Patrick LIPPOLD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Publication of WO2012153232A2 publication Critical patent/WO2012153232A2/de
Publication of WO2012153232A3 publication Critical patent/WO2012153232A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Substrattransportmodul einer Substratbe¬ arbeitungsanlage, wobei das Substrattransportmodul eine Tragvorrichtung in Form einer Tragplatte und/oder eines Tragrahmens aufweist und für eine horizontale Aufnahme und einen horizontalen Transport wenigstens eines flächigen Substrates oder wenigstens eines flächigen Substrattransportobjektes ausgebildet ist. Die Erfindung betrifft ferner eine Belade- und Entladesystem einer Substratbearbeitungsanlage mit einem solchen Substrattransportmodul. Darüber hinaus betrifft die vorliegende Erfindung ein Verfahren zum Transport wenigstens eines flächigen Substrates oder wenigstens eines flächigen Substrattransportobjektes in einer Substratbearbeitungsanlage mit wenigstens einem Substrattransportmodul, welches eine Tragvorrichtung in Form einer Tragplatte und/oder eines Tragrahmens aufweist. Es ist die Aufgabe der vorliegenden Erfindung, ein Substrattransportmodul, ein Belade- und Entladesystem sowie ein Verfahren im Transport von Substraten in einer Substratbearbeitungsanlage zur Verfügung zu stellen, die es ermöglichen, Kontaminationen von einem Anlagenabschnitt in den nächsten Anlagenabschnitt einer Durchlauf-Substratbearbeitungsanlage zu vermeiden und die es erlauben, eine Substratbearbeitungsanlage effektiver zu betreiben. Dabei soll das Substrattransportmodul und das entsprechende Belade- und Entladesystem möglichst kostengünstig ausgebildet werden können. Diese Aufgabe wird einerseits durch ein Substrattransportmodul einer Substratbearbeitungsanlage der oben genannten Gattung gelöst, wobei sich von der Tragvorrichtung Tragelemente mit horizontal ausgerichteten Auflageabschnitten, welche eine Auflage für das wenigstens eine flächige Substrat oder das wenigstens eine flächige Substrattransportobjekt ausbilden, in einen Bereich unter die Tragvorrichtung erstrecken, und wobei die Tragvorrichtung mit einem Transportsystem für einen Transport des Substrattransportmoduls in der Substratbearbeitungsanlage koppelbar ist. Die Aufgabe wird ferner durch ein das erfindungsgemäße Substrattransportmodul nutzendes Belade- und Entladesystem sowie ein entsprechendes Verfahren gelöst.
PCT/IB2012/052184 2011-05-12 2012-05-02 Substrattransportmodul, belade- und entladesystem und transportverfahren für substrate in einer substratbearbeitungsanlage Ceased WO2012153232A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011050324.2 2011-05-12
DE102011050324A DE102011050324A1 (de) 2011-05-12 2011-05-12 Substrattransportmodul, Belade- und Entladesystem und Transportverfahren für Substrate in einer Substratbearbeitungsanlage

Publications (2)

Publication Number Publication Date
WO2012153232A2 WO2012153232A2 (de) 2012-11-15
WO2012153232A3 true WO2012153232A3 (de) 2013-01-03

Family

ID=46124583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2012/052184 Ceased WO2012153232A2 (de) 2011-05-12 2012-05-02 Substrattransportmodul, belade- und entladesystem und transportverfahren für substrate in einer substratbearbeitungsanlage

Country Status (3)

Country Link
DE (1) DE102011050324A1 (de)
TW (1) TW201308482A (de)
WO (1) WO2012153232A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120723B4 (de) * 2015-11-30 2024-09-26 VON ARDENNE Asset GmbH & Co. KG Beschichtungsanordnung, Substratträger und Verfahren
DE102018216878A1 (de) * 2018-10-01 2020-04-02 centrotherm international AG Transporteinheit für paralleles Einfahren oder Ausfahren von Substratträgern, in parallele Prozessrohre und Verfahren zum gleichzeitigen Beladen von parallelen, horizontal beabstandeten Prozessrohren
CN111471965B (zh) * 2020-04-30 2024-08-23 苏州迈正科技有限公司 传送载板、真空镀膜设备及真空镀膜方法
CN111519169A (zh) * 2020-05-28 2020-08-11 深圳市捷佳伟创新能源装备股份有限公司 顶升装置和物料加工设备
CN115513118B (zh) * 2022-08-31 2025-02-14 东方日升（常州）新能源有限公司 一种浮动平台、载板浮动定位装置及载板上料系统
CN116588658A (zh) * 2023-07-04 2023-08-15 广东汇芯半导体有限公司 一种自动更换载具的装置
CN117878044B (zh) * 2024-03-12 2024-06-04 四川富美达微电子股份有限公司 一种引线框架转移系统

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
DE9116285U1 (de) * 1991-11-05 1992-05-27 Leybold AG, 6450 Hanau Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen
WO1999060611A1 (en) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (de) * 2000-10-10 2002-04-17 Applied Materials, Inc. Mehrfach-Waferhebervorrichtung und Verfahren dafür
EP1622192A1 (de) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Substrattransfereinrichtung einer dünnfilmausbildungsvorrichtung
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (de) * 2009-07-31 2011-02-02 Tokyo Electron Limited Montageverfahren einer Übergabevorrichtung und Übergabekammer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6646857B2 (en) * 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
EP1855324A1 (de) * 2006-05-12 2007-11-14 Applied Materials GmbH & Co. KG Substratträger aus glaskeramischen Material
GB2449309A (en) * 2007-05-18 2008-11-19 Renewable Energy Corp Asa A method for exposing a solar cell wafer to a liquid

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991015032A1 (en) * 1990-03-22 1991-10-03 Surface Technology Systems Limited Loading mechanisms
DE9116285U1 (de) * 1991-11-05 1992-05-27 Leybold AG, 6450 Hanau Vorrichtung zur Halterung und zum Transport von Substraten in Vakuumanlagen
US6120609A (en) * 1996-10-25 2000-09-19 Applied Materials, Inc. Self-aligning lift mechanism
US6227372B1 (en) * 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
WO1999060611A1 (en) * 1998-05-20 1999-11-25 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6364194B1 (en) * 2000-02-24 2002-04-02 Evenoak Limited Soldering apparatus
EP1197988A2 (de) * 2000-10-10 2002-04-17 Applied Materials, Inc. Mehrfach-Waferhebervorrichtung und Verfahren dafür
EP1622192A1 (de) * 2003-05-02 2006-02-01 Ishikawajima-Harima Heavy Industries Co., Ltd. Substrattransfereinrichtung einer dünnfilmausbildungsvorrichtung
US20070065581A1 (en) * 2005-09-22 2007-03-22 Tokyo Electron Limited Substrate processing system and method
EP2280410A2 (de) * 2009-07-31 2011-02-02 Tokyo Electron Limited Montageverfahren einer Übergabevorrichtung und Übergabekammer

Also Published As

Publication number Publication date
DE102011050324A1 (de) 2012-11-29
TW201308482A (zh) 2013-02-16
WO2012153232A2 (de) 2012-11-15

Similar Documents

Publication Publication Date Title
WO2012153232A3 (de) Substrattransportmodul, belade- und entladesystem und transportverfahren für substrate in einer substratbearbeitungsanlage
TWI563591B (en) Substrate load and unload mechanisms for high throughput
KR101397124B9 (ko) 기판지지프레임 및 이를 포함하는 기판처리장치, 이를이용한 기판의 로딩 및 언로딩 방법
MY172163A (en) Methods for treating substrates prior to metathesis reactions, and methods for metathesizing substrates
EP2405477A3 (de) Verfahren und Vorrichtung zur Beschichtung und zur Entwicklung
ZA201100063B (en) Process device for processing in particular stacked processes goods
GB0803305D0 (en) Method for laser processing on the opposite sides of thin transparent substrates
WO2012030703A3 (en) Apparatus and method for heat treating a glass substrate
KR101882033B1 (ko) 기판 처리 장치를 세정하기 위한 세정 지그와 세정 방법, 및 기판 처리 시스템
WO2013078065A8 (en) Chamber sealing member
EP2599583A4 (de) Substratverarbeitungsverfahren
EP2599582A4 (de) Substratverarbeitungsverfahren
WO2013023092A3 (en) Robot systems, apparatus, and methods adapted to process substrates in multiple tiers
GB201101759D0 (en) Surface treated substrates for top gate organic thin film transistors
WO2009142446A3 (ko) 진공처리시스템, 진공처리시스템에 사용되는 버퍼모듈 및 진공처리시스템의 트레이 이송방법
AU2012344085A8 (en) Method and system for controlling items on a production/distribution line
SG10201408496XA (en) Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing soi substrate
WO2011147508A3 (de) Verfahren zum transportieren eines objektes, fahrzeug, anlage
FR2933812B1 (fr) Dispositif de chargement/dechargement de substrats
FR2979165B1 (fr) Procede de correction des effets de proximite electronique utilisant des fonctions de diffusion decentrees
GB0812594D0 (en) High throughput securitty screening system for transportation applications
WO2011086325A3 (fr) Dispositif de fixation de panneaux solaires, et procede de montage de panneaux solaires
HK1198218A1 (en) System and method for processing document
WO2012161458A3 (ko) 피시비 기판 검사장치
MX346511B (es) Plataforma para uso en sistema logístico.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12721935

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 12721935

Country of ref document: EP

Kind code of ref document: A2