WO2012165801A3 - Complexe particulaire de cuivre destiné à l'électronique imprimée et pâte de cuivre - Google Patents

Complexe particulaire de cuivre destiné à l'électronique imprimée et pâte de cuivre Download PDF

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Publication number
WO2012165801A3
WO2012165801A3 PCT/KR2012/004083 KR2012004083W WO2012165801A3 WO 2012165801 A3 WO2012165801 A3 WO 2012165801A3 KR 2012004083 W KR2012004083 W KR 2012004083W WO 2012165801 A3 WO2012165801 A3 WO 2012165801A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper
particulate complex
printed electronics
paste
copper paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/004083
Other languages
English (en)
Korean (ko)
Other versions
WO2012165801A2 (fr
Inventor
정인범
이병윤
정순철
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chang Sung Co
Original Assignee
Chang Sung Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chang Sung Co filed Critical Chang Sung Co
Publication of WO2012165801A2 publication Critical patent/WO2012165801A2/fr
Publication of WO2012165801A3 publication Critical patent/WO2012165801A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention a trait à un complexe particulaire de cuivre utilisé lors de la préparation d'une pâte de cuivre, ce complexe particulaire de cuivre étant obtenu grâce à la mise en réaction d'un sel de cuivre, qui sert de précurseur, avec de l'acide formique. Ledit complexe particulaire de cuivre comporte du cuivre (Cu) ainsi que du formiate de cuivre (II) anhydre (Cu(COOH)2) présentant une dimension des particules inférieure ou égale à 1 μm.
PCT/KR2012/004083 2011-05-27 2012-05-23 Complexe particulaire de cuivre destiné à l'électronique imprimée et pâte de cuivre Ceased WO2012165801A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0050737 2011-05-27
KR1020110050737A KR101258402B1 (ko) 2011-05-27 2011-05-27 전자 인쇄용 구리 미립자 콤플렉스 및 구리 페이스트

Publications (2)

Publication Number Publication Date
WO2012165801A2 WO2012165801A2 (fr) 2012-12-06
WO2012165801A3 true WO2012165801A3 (fr) 2013-01-24

Family

ID=47260030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004083 Ceased WO2012165801A2 (fr) 2011-05-27 2012-05-23 Complexe particulaire de cuivre destiné à l'électronique imprimée et pâte de cuivre

Country Status (2)

Country Link
KR (1) KR101258402B1 (fr)
WO (1) WO2012165801A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233293B1 (ko) * 2014-01-15 2021-03-29 (주)창성 구리포메이트-아민 컴플렉스를 포함하는 잉크 조성물의 제조방법
KR101782799B1 (ko) 2015-08-11 2017-09-28 (주)창성 구리-아민 코-콤플렉스의 제조방법 및 이를 포함하는 전도성 이온 잉크 및 이를 이용한 미세 패턴전극의 제조방법
CN119747963A (zh) * 2024-11-20 2025-04-04 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) 一种基于热分解铜盐的自还原铜膏及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100109A (ja) * 1989-09-12 1991-04-25 Mitsubishi Gas Chem Co Inc 微細銅粉の製造法
KR100693970B1 (ko) * 2003-02-06 2007-03-12 뷜러 파르텍 게엠베하 관능성 콜로이드의 화학기계적 제조 방법
JP2007258123A (ja) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd 導電性組成物及び導電膜形成方法
KR20080032625A (ko) * 2007-11-12 2008-04-15 삼성전기주식회사 구리 나노입자의 제조방법 및 그에 의해 제조된 구리나노입자

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100109A (ja) * 1989-09-12 1991-04-25 Mitsubishi Gas Chem Co Inc 微細銅粉の製造法
KR100693970B1 (ko) * 2003-02-06 2007-03-12 뷜러 파르텍 게엠베하 관능성 콜로이드의 화학기계적 제조 방법
JP2007258123A (ja) * 2006-03-27 2007-10-04 Sumitomo Metal Mining Co Ltd 導電性組成物及び導電膜形成方法
KR20080032625A (ko) * 2007-11-12 2008-04-15 삼성전기주식회사 구리 나노입자의 제조방법 및 그에 의해 제조된 구리나노입자

Also Published As

Publication number Publication date
WO2012165801A2 (fr) 2012-12-06
KR20120132115A (ko) 2012-12-05
KR101258402B1 (ko) 2013-05-02

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