WO2012172937A1 - Corps de câblage, et procédé de fabrication de celui-ci - Google Patents

Corps de câblage, et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2012172937A1
WO2012172937A1 PCT/JP2012/063113 JP2012063113W WO2012172937A1 WO 2012172937 A1 WO2012172937 A1 WO 2012172937A1 JP 2012063113 W JP2012063113 W JP 2012063113W WO 2012172937 A1 WO2012172937 A1 WO 2012172937A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
copper foil
flexible printed
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/063113
Other languages
English (en)
Japanese (ja)
Inventor
良啓 赤羽
齊藤　裕久
直太 上西
山本　正道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of WO2012172937A1 publication Critical patent/WO2012172937A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to a wiring body and a manufacturing method of the wiring body. Specifically, the present invention relates to a wiring body on which an electronic component having a large calorific value is mounted and a manufacturing method thereof.
  • an illumination device used as a backlight of a liquid crystal display includes a plurality of LED light emitting elements. Since the LED light emitting element generates a large amount of heat, the LED light emitting element is often configured to include a metal substrate with high heat dissipation.
  • the light emitting elements are not necessarily arranged on a flat surface.
  • the light emitting element is mounted on a metal substrate having a curved surface or a bent surface.
  • a method of laminating a flexible printed wiring board on which a light emitting element is mounted in advance by solder reflow processing on a metal structure having high heat dissipation such as a heat sink can be considered.
  • the light emitting elements may have to be arranged along a curved surface or a bent surface.
  • the flexible printed wiring board lamination surface of the metal structure is formed in a curved shape or a bent shape, it is difficult to press the entire area of the flexible printed wiring board uniformly and laminate and bond them.
  • the flexible printed wiring board when the flexible printed wiring board is laminated along the curved surface or the bent surface, the flexible printed wiring board is likely to be distorted, and bubbles are likely to enter the adhesive layer due to the distortion. For this reason, the heat dissipation of the metal substrate is hindered and the temperature of the light emitting element is likely to increase.
  • the present invention solves the above-described conventional problems, and provides a wiring body and a method of manufacturing a wiring body, in which a flexible printed wiring board on which electronic components are mounted by solder reflow processing is laminated and bonded to a metal structure without hindering heat dissipation.
  • the issue is to provide.
  • the invention described in claim 1 of the present application is a wiring body configured by laminating a flexible printed wiring board on which an electronic component is mounted on a metal structure having heat dissipation, and the electronic of the flexible printed wiring board.
  • the reinforcing copper foil layer is provided on the back side of the region where the component is mounted, and includes a reinforcing copper foil layer having a thickness of 35 ⁇ m or more, and an adhesive layer for adhering the flexible printed wiring board to the metal structure.
  • the bubble rate in the adhesive layer between the metal structure and the metal structure is set to be smaller than the bubble rate of the adhesive layer in other regions.
  • the flexible printed wiring board After mounting electronic components on the flexible printed wiring board by solder reflow processing, the flexible printed wiring board is laminated and bonded to a metal structure having heat dissipation.
  • a reinforced copper foil layer having a thickness of 35 ⁇ m or more is provided on the back surface side of at least the region where the electronic component is mounted on the flexible printed wiring board.
  • the rigidity of the electronic component mounting area is increased by the reinforcing copper foil layer, it is possible to apply a large pressing force to the electronic component mounting area even when the periphery of the electronic component mounting area is pressed. Become. Thereby, in the step of laminating and bonding the flexible printed wiring boards, the bubbles in the electronic component mounting area can be pushed out together with the adhesive. Therefore, the heat dissipation in the electronic component mounting area can be enhanced as compared with other areas.
  • the bubble rate in areas other than the electronic component mounting area increases, but the copper foil has a high thermal conductivity, and since heat dissipation in the area immediately below the electronic component mounting area can be ensured, the temperature of the electronic component is reduced. It will not rise.
  • the bubble rate in the adhesive layer between the reinforcing copper foil layer and the metal structure is set to 20% or less as in the invention described in claim 2. Is preferred.
  • the laminating step of the flexible printed wiring board and the metal structure is performed by setting the pressing force to be applied, the pressing time, and the like so as to achieve the bubble ratio. By setting it as the said bubble rate, it becomes possible to laminate
  • the bubble rate per volume in the adhesive layer is not so important, and the bubbles in the adhesive layer are attached to the bonding surface.
  • the area ratio projected onto is important. Therefore, in the present invention, the bubble rate is determined by the area ratio obtained by projecting the bubbles in the adhesive layer onto the bonding surface.
  • the copper foil can be provided by setting the copper foil on one side of the double-sided flexible printed wiring board provided with copper foil on both sides of the insulating substrate to be thick and removing the area other than the electronic component mounting area by etching or the like. it can.
  • the reinforcing copper foil layer is provided at least on the back surface side of the region to which the connection electrode of the electronic component is connected.
  • the connection electrode is also a heat conduction path, the heat generated in the electronic component can be efficiently conducted to the metal structure and radiated.
  • the connection electrodes include, for example, non-energized electrodes provided for heat dissipation.
  • the reinforcing copper foil layer is configured to include a pressing area set outside the area where the electronic component is mounted. Is preferred. By providing the pressing area, it is possible to further increase the pressing force acting on the electronic component mounting area.
  • the copper foil in 80% or more of the area where the electronic component is mounted as in the invention described in claim 5.
  • the present invention is applied to a case where a flexible printed wiring board is used as a double-sided board using the reinforced copper foil layer.
  • the reinforced copper foil layer is set to a thickness of 70 ⁇ m or more as in the invention described in claim 7.
  • the configuration and type of the flexible printed wiring board are not particularly limited. Not only a single-sided flexible printed wiring board having a circuit surface on which electronic components are mounted on one side, but also a double-sided printed wiring board can be employed.
  • the material for the metal structure is not particularly limited.
  • a metal structure made of aluminum can be employed.
  • the form of the metal structure is not particularly limited.
  • a flat plate-like metal structure can be employed.
  • the flexible printed wiring board is laminated and bonded in a curved state or a bent state.
  • the said copper foil is provided, the rigidity of the said electronic component mounting area increases. Thereby, it is hard to produce distortion in the said electronic component mounting area
  • a heat sink provided with heat radiating means such as heat radiating fins can be adopted.
  • the wiring body according to the present invention can be applied to various electronic devices.
  • a lighting device can be configured by employing a light emitting element as the electronic component.
  • the invention described in claim 10 is a method of manufacturing a wiring body on which an electronic component that generates heat is mounted, and includes a reinforced copper foil layer having a thickness of 35 ⁇ m or more on at least the back surface side of the region on which the electronic component is mounted.
  • Laminating step of laminating on the metal structure, and in the laminating step, the electronic component and / or the flexible printed wiring so as to extrude air bubbles between the copper foil and the surface of the metal structure together with the adhesive layer.
  • a plate is pressed and laminated.
  • the said reinforcement copper foil layer is provided, when an electronic component is pressed directly, the said pressing force can be concentrated on the area
  • the reinforcing copper foil layer increases the rigidity of the electronic component mounting region, and even when the periphery of this region is pressed, a large pressing force can be applied to the reinforcing copper foil layer.
  • the electronic component and the flexible printed wiring board are pressed so as to extrude air bubbles in the adhesive layer between the reinforcing copper foil layer and the metal structure surface together with the adhesive layer. can do.
  • the pressing part in the laminating step is not particularly limited.
  • the pressing step can be performed so as to include an electronic component pressing step in which a pressing force is applied to the mounted electronic component.
  • the said electronic component press process can be performed by applying the force of the grade which does not destroy or break down an electronic component.
  • the invention described in claim 12 includes the copper foil pressing step of pressing the pressing region of the copper foil set outside the region where the electronic component is mounted.
  • FIG. 1 is a cross-sectional view of a main part of a flexible printed wiring board 1 used in the first embodiment.
  • the flexible printed wiring board 1 includes a base film 2 formed from an insulating resin such as polyimide, a circuit pattern 3 formed from a copper foil laminated on the upper surface of the base film 2, and the circuit pattern 3.
  • An electronic component connection electrode 4 exposed at a predetermined portion, an electronic component 5 connected to the electronic component connection electrode 4 via a solder 11, a cover layer 6 covering a region other than the electronic component connection electrode 4, and An adhesive layer 7 is provided.
  • An LED light emitting element is employed as the electronic component 5, and the electrode 10 provided on the lower surface of the electronic component 5 and the electronic component connection electrode 4 are connected via a solder 11.
  • a double-sided flexible printed wiring board is adopted as the flexible printed wiring board 1, and a copper foil that forms a circuit pattern (not shown) is laminated on the back side. Moreover, the cover layer 8 and the adhesive bond layer 9 which protect the circuit pattern formed with the said copper foil are provided also in the back surface side.
  • a reinforced copper foil layer 12 is provided on the back side of the area where the electronic component 5 is mounted, leaving a copper foil that forms the back side circuit pattern.
  • the thickness of the reinforcing copper foil layer 12 is set to 35 ⁇ m, and the back surface of the electronic component mounting region is formed in a protruding shape by the thickness from the surrounding region.
  • the flexible printed wiring board 1 is laminated and bonded to a heat dissipating metal structure.
  • FIG. 2 is a cross-sectional view showing a state immediately before the flexible printed wiring board 1 is laminated and bonded to the metal structure 15. As shown in this figure, the flexible printed wiring board 1 is laminated and bonded to the metal structure 15 via an adhesive layer 16.
  • the adhesive layer 16 contains a large number of bubbles 17, and as it is, the thermal conductivity of the adhesive layer 16 becomes low, and the required heat dissipation performance cannot be ensured.
  • a laminating step of laminating and bonding the flexible printed wiring board 1 to the metal structure 15 is performed by applying a predetermined pressure to the area around the electronic component 5 using the press die 20.
  • the reinforcing copper foil layer 12 having a thickness of 35 ⁇ m is provided on the back surface side of the electronic component mounting region, the convex portion formed by the reinforcing copper foil layer 12 is the metal structure.
  • the adhesive layer 16 having a predetermined thickness on the surface 15 is pressed so as to push away.
  • the wiring body 100 in which the lamination process has been completed has a bubble rate in the adhesive layer 16 between the reinforcing copper foil layer 12 and the metal structure 15, as compared to the bubble rate in the surrounding area. Get smaller. Thereby, it becomes possible to prevent the heat conduction performance in the region immediately below the electronic component mounting region from being deteriorated by the bubbles 17 included in the adhesive layer 16, and the heat generated from the electronic component 5 is efficiently reduced. It is possible to conduct heat to the metal structure 15 to dissipate heat.
  • the electronic component 5 can be connected to the flexible printed wiring board 1 by a solder reflow process, the working efficiency is remarkably increased as compared with a conventional electronic component connecting step by manual work.
  • the rigidity of the electronic component mounting region is increased. Thereby, even if the periphery of the electronic component mounting area is pressed, a large pressing force can be applied to the inside of the electronic component mounting area. Even when the electronic component is directly pressed, the pressing force can be concentrated on the portion where the reinforcing copper foil layer 12 is provided. For this reason, it is possible to efficiently eliminate the bubbles 17 together with a part of the adhesive layer 16 in the surrounding area.
  • the electronic component is an LED light emitting element.
  • the present invention is not particularly limited to this, and the same effect can be expected if the electronic component generates heat.
  • FIG. 4 shows a second embodiment of the present invention.
  • a flexible printed wiring board 201 according to the present invention is laminated and bonded to a metal structure 215 having a bent portion 250.
  • a single-sided flexible printed wiring board 201 having a circuit pattern 203 formed on one side is employed. For this reason, it is not necessary to provide a cover layer or the like for circuit protection on the back surface side in the first embodiment.
  • the reinforcing copper foil layer 212 is provided only on the back surface of the electronic component mounting area, the flexibility of the flexible printed wiring board 201 other than the area where the reinforcing copper foil layer 212 is provided is high. For this reason, the flexible printed wiring board 201 can be laminated and bonded along the bent surface of the metal structure 215.
  • the adhesive layer 216 immediately below the electronic component mounting region is deformed to extrude bubbles, thereby ensuring heat dissipation. .
  • the rigidity of the electronic component mounting area of the flexible printed wiring board 201 is high, it is difficult to deform. For this reason, distortion etc. are hard to produce in the electronic component mounting area
  • the bending angle is not limited and can be laminated and bonded along the bending surface of the metal structure 215 having an L-shaped cross section.
  • FIG. 5 shows a third embodiment according to the present invention.
  • the stacking process is performed using positioning pins 330 that are capable of relatively moving the flexible printed wiring board 301 and the metal structure 315 in the stacking direction.
  • the flexible printed wiring board 301 and the metal structure 315 are formed with positioning holes, and the positioning pins 330 are inserted into the positioning holes. For this reason, the flexible printed wiring board 301 and the metal structure 315 can be laminated and bonded by applying a pressing force without shifting in the lateral direction.
  • FIG. 6 to 8 show a fourth embodiment of the present invention. The effect of this invention is confirmed using this embodiment.
  • an LED light emitting element 405 is mounted as an electronic component.
  • a flexible printed wiring board 401 on which a plurality of LED light emitting elements 405 are mounted is laminated and adhered along one side of a rectangular plate-like metal structure 415. Since the configuration of the flexible printed wiring board 401 is the same as that of the above-described embodiment, the description thereof is omitted.
  • the light emitting element 405 as an electronic component according to the present embodiment has a mounting area of 8 mm ⁇ 5 mm.
  • the temperature rise of the light emitting element 405 between the connection electrodes Solder temperature and the bubble rate of the adhesive layer in the region where the reinforcing copper foil layer was provided were measured.
  • the bubble ratio was calculated from the ratio of the projected area of the bubbles by observing the adhesive layer between the metal structure surface and the flexible printed wiring board from the metal structure side using an ultrasonic flaw detector.
  • Comparative Example 1 is configured by connecting a LED light emitting element 405 after laminating and bonding a flexible printed wiring board (FPC) to the metal structure 415 by hot pressing.
  • the LED light-emitting element 405 is connected to a flexible printed wiring board (FPC) having no reinforcing copper foil layer on the back surface, and then laminated and adhered to the metal structure 415.
  • FPC flexible printed wiring board
  • Examples 1 to 6 are each configured by providing a copper foil on the back side of the region where the LED light emitting element 405 is mounted.
  • a reinforcing copper foil layer is provided only directly below the region where the LED light emitting element 405 is provided.
  • Example 4 and Example 5 provide the reinforcement copper foil layer in the part wider than the said LED mounting area, as shown in FIG.
  • the thickness of the reinforced copper foil layer is 18 ⁇ m.
  • the thickness of the reinforced copper foil layer is 35 ⁇ m.
  • the reinforced copper foil is A layer having a thickness of 70 ⁇ m is employed.
  • the temperature of the LED light emitting element 405 and the temperature of the solder at the electrode connection part were adopted.
  • the temperature of the LED light emitting element 405 is derived from the value and temperature characteristics of the voltage drop when the LED is energized.
  • the temperature of the solder is a value measured by a thermocouple attached to the solder of the LED light emitting element 405 at the center.
  • the temperature increase value of the LED light emitting element is lower than that of the comparative example 2 in any case.
  • a copper foil is provided in a region larger than the region immediately below the LED light emitting element 405 (Example 4 and Example 5)
  • the temperature rise of the LED light emitting element becomes smaller.
  • a predetermined effect can also be expected when the copper foil is set in a range smaller than the region immediately below the LED light emitting element 405 (Example 6).
  • the thickness of the reinforcing copper foil layer is 35 ⁇ m, the LED temperature rise and the solder temperature are within the usable range in any case. For this reason, it is preferable to set the thickness of the reinforcing copper foil layer to 35 ⁇ m or more. Furthermore, it can be seen that the thickness is more preferably 70 ⁇ m or more.
  • the bubble ratio of the adhesive layer between the reinforcing copper foil layer and the metal structure substantially corresponds to the LED temperature increase described above. Therefore, the temperature rise of the wiring body can be reduced by controlling the bubble rate of the adhesive layer.
  • the air bubble rate in the adhesive layer between the reinforcing copper foil layer and the metal structure is 20% or less.
  • the electronic component is an LED light emitting element.
  • the present invention is not particularly limited to this, and the same effect can be expected if the electronic component generates heat.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un corps de câblage (100) qui est composé par stratification, sur un corps de structure métallique (15) présentant des propriétés de dissipation de chaleur, d'une carte de circuit imprimé flexible (1) sur laquelle est monté un composant électronique (5). Ce corps de câblage est équipé : d'une couche de feuille de cuivre de renforcement (12) qui est agencée côté face envers de la région de montage dudit composant électronique sur ladite carte de circuit imprimé flexible, et qui possède une épaisseur supérieure ou égale à 35µm; et d'une couche adhésive (16) qui met en adhésion ladite carte de circuit imprimé flexible sur ledit corps de structure métallique. La proportion de bulles dans la couche adhésive entre ladite couche de feuille de cuivre de renforcement et ledit corps de structure métallique, est établie de sorte à être plus faible que la proportion de bulles dans les autres régions de la couche adhésive.
PCT/JP2012/063113 2011-06-17 2012-05-23 Corps de câblage, et procédé de fabrication de celui-ci Ceased WO2012172937A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-135028 2011-06-17
JP2011135028A JP2013004775A (ja) 2011-06-17 2011-06-17 配線体及び配線体の製造方法

Publications (1)

Publication Number Publication Date
WO2012172937A1 true WO2012172937A1 (fr) 2012-12-20

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PCT/JP2012/063113 Ceased WO2012172937A1 (fr) 2011-06-17 2012-05-23 Corps de câblage, et procédé de fabrication de celui-ci

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JP (1) JP2013004775A (fr)
TW (1) TW201301962A (fr)
WO (1) WO2012172937A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207182A (ja) * 2013-04-15 2014-10-30 Ｄｎライティング株式会社 照明装置
US20190131363A1 (en) * 2017-10-30 2019-05-02 Boe Technology Group Co., Ltd. Flexible display device, display apparatus, and method for manufacturing the flexible display device
CN119815689A (zh) * 2025-01-16 2025-04-11 昆山国显光电有限公司 线路板组件及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI611740B (zh) 2015-02-05 2018-01-11 頎邦科技股份有限公司 可撓性基板
JP7676887B2 (ja) * 2021-04-02 2025-05-15 株式会社レゾナック 冷却装置
TWI777760B (zh) * 2021-08-09 2022-09-11 頎邦科技股份有限公司 具散熱片之軟性電路板及其散熱片

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH1092971A (ja) * 1996-09-13 1998-04-10 Ibiden Co Ltd 電子部品搭載用基板の製造方法
JP2001127398A (ja) * 1999-10-27 2001-05-11 Hitachi Chem Co Ltd 金属板付き配線基板の製造法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092971A (ja) * 1996-09-13 1998-04-10 Ibiden Co Ltd 電子部品搭載用基板の製造方法
JP2001127398A (ja) * 1999-10-27 2001-05-11 Hitachi Chem Co Ltd 金属板付き配線基板の製造法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207182A (ja) * 2013-04-15 2014-10-30 Ｄｎライティング株式会社 照明装置
US20190131363A1 (en) * 2017-10-30 2019-05-02 Boe Technology Group Co., Ltd. Flexible display device, display apparatus, and method for manufacturing the flexible display device
US10950672B2 (en) * 2017-10-30 2021-03-16 Boe Technology Group Co., Ltd. Flexible display device with hardened layer, display apparatus, and method for manufacturing the flexible display device
CN119815689A (zh) * 2025-01-16 2025-04-11 昆山国显光电有限公司 线路板组件及其制备方法

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JP2013004775A (ja) 2013-01-07

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