WO2013013992A2 - Plaque de refroidissement, procédé pour sa fabrication et utilisation de la plaque de refroidissement - Google Patents

Plaque de refroidissement, procédé pour sa fabrication et utilisation de la plaque de refroidissement Download PDF

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Publication number
WO2013013992A2
WO2013013992A2 PCT/EP2012/063689 EP2012063689W WO2013013992A2 WO 2013013992 A2 WO2013013992 A2 WO 2013013992A2 EP 2012063689 W EP2012063689 W EP 2012063689W WO 2013013992 A2 WO2013013992 A2 WO 2013013992A2
Authority
WO
WIPO (PCT)
Prior art keywords
plate
cooling
recesses
plates
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/063689
Other languages
German (de)
English (en)
Other versions
WO2013013992A3 (fr
Inventor
Robert Goraj
Norbert Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2013013992A2 publication Critical patent/WO2013013992A2/fr
Publication of WO2013013992A3 publication Critical patent/WO2013013992A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Definitions

  • the present invention relates to a cooling plate, a method for their manufacture and use, with a stack of at least two plates each with recesses, wherein the at least two plates are stacked in a frame with a base and a cover plate in such a way that through the recesses are formed by continuous cooling channels for a cooling fluid.
  • the cooling fluid is passed through fixtures and tried a large surface area for cooling to testify he ⁇ .
  • eg water e.g.
  • Cooling fluid meandering cooling coils integrated in cooling plates integ ⁇ .
  • cooling devices In the air cooling of electrical power components, which can be done by forced or free convection, cooling devices with very fine structures are needed, which have a large overflow surface.
  • the necessary fine structures are, as well as meandering cooling coils in cooling plates usually expensive to manufacture and thus very expensive.
  • the massive construction of the cooling coils and plates leads to a high weight of the device for cooling, a high material consumption and price, without a large heat exchange surface between the device for cooling and the
  • the object of the present invention is to provide a cooling plate, its manufacture and its use, which ensure good heat transfer between cooling fluid, e.g. Air or water, and equipment to be cooled, e.g. electric power component, with low manufacturing cost and cost and reduced material cost and weight compared to massive plates in connection with cooling coils.
  • cooling fluid e.g. Air or water
  • equipment to be cooled e.g. electric power component
  • the cooling plate according to the invention comprises a stack made of soft ⁇ ilias two plates each provided with recesses.
  • the Wenig ⁇ least two plates are stacked in a frame with a base and a cover plate in such a way above each other that are formed by the recesses continuous cooling channels for a cooling fluid.
  • At least two plates with Ausseidun ⁇ gene expanded metal, in particular rolled expanded mesh used. are arranged one above the other so that at least one flow channel and / or at least one return channel ⁇ be formed.
  • Expanded mesh are easy and inexpensive to produce. In contrast to plates with punched-out recesses fall with expanded metal no waste parts. They have a larger surface than cooling coils with lower material consumption. In expanded metal panels, large surfaces are quickly and easily perforated by shearing, whereby the recesses are formed as perforations in the panels. In contrast to plates with connected cooling coils, a stack of expanded mesh leads to no problems of the connection with different thermal properties. The stack has a large surface area over which heat from a ⁇ exchange with a cooling fluid, eg water, may take place. The weight and spent material is lower at an enlarged upper ⁇ surface. The cost and the cost of production are also lower.
  • a cooling fluid eg water
  • only forward or only return passages may be formed, in which case the flow direction between the supply and return channels differs.
  • the stack of at least two plates each with recesses mechanically and thermally to the device to be cooled, such as the electrical power component or component be attached. Over a surface of the base plate and / or Deckplat- te the contact area between the to cow ⁇ lumbar device and the cooling plate is formed in this case.
  • the at least two plates may be metallically connected to one another and / or to the base plate and / or cover plate.
  • compounds via e.g. Thermal conductive adhesive possible.
  • the advantage of a metallic connection is the high mechanical and thermal stability and the good heat transfer via such a connection.
  • the metallic compound may be a solder joint, a braze joint and / or a welded joint.
  • the at least two plates can be arranged with their plate plane pa ⁇ rallel to the plate plane of the base plate. This allows a good, space-saving arrangement and orientation in the context of the cooling plate. By the frame a Jus ⁇ orientation of the expanded metal and recesses takes place to one another, thus allowing easy and inexpensive assembly of the cooling plate is ge ⁇ ensured.
  • Through the recesses of the at least two plates may be formed equal regular patterns, with a constant distance P between adjacent recesses along a direction in the plane of the plate. This allows the use of equal-shaped expanded metal mesh, which can be produced cheaper in large quantities. A confusion in the assembly of differently shaped expanded metal mesh can not happen. This makes assembly easier.
  • the at least two plates may be attached ⁇ arranged one above the other, that the patterns of adjacent plates are displaced against each other to tenebene half the distance P between adjacent recesses along one direction in the plate-. As a result, it is easy to form flow and / or return channels when using the same plate shapes.
  • the plates may be stacked such that the patterns of adjacent plates are rotated relative to one another by an angle beta, in particular by an angle N times beta, where N is the numbered number of the Nth plate in the stack.
  • the angle beta can have a value equal to or in the range of 90 °.
  • the rotation of plates or their patterns against each other can have the same advantages as previously described for a displacement of the patterns of the plates against each other.
  • N the natural number again gege ⁇ ben indicating expected in contact with a base plate of which number plate in the plate stack of the first plate, for example, representing the N-th sheet.
  • DIE se structures can be easily realized, have a low height, low weight and good heat efficiencies ⁇ . It can be so easily separate, only fluidly connected at one point flow and return channels through the recesses.
  • the shape of the recesses of the at least two plates may be the same, in particular within a plate and / or in comparison of a first plate with a second plate.
  • the expanded metal screens typically have wavy profiles on the surfaces as a result of the shearing process. These expanded metal mesh can be rolled, which makes the surface planar and can be stacked and joined together with a good, ie large contact area. Thus, the con- Clocks of the expanded metal with each other and to the final walls not only selectively but area, which allows or improves the heat transfer across the wall.
  • the recesses can essentially have the shape of a parallelogram.
  • the angle can of production technology or intentionally not be sharp, but to include rounded in the form of a Kreisra ⁇ diusausitess or a straight piece, having a length H.
  • the angle alpha between the legs of the parallelogram may be in the range of 91 ° to 170 °.
  • the distance P of the center points of adjacent recesses may be in the range of 5 to 70 mm, with center being the point of intersection of the diagonal in a parallelogram.
  • the distance B of adjacent boundaries of two adjacent recesses may be in the range of 0.4 times P, in particular with a value of the distance B in the range of 1 to 10 mm.
  • the distance B the smallest width of Ste ⁇ conditions in a plane between recesses referred to, which remain in the production of the plate material.
  • the distance H of two legs of the parallelogram can be in the range of less than 0.1 times P, in particular in the range of 5 to 20 mm.
  • the shape of the recesses of the at least two plates can also be of other shapes, e.g. have a circular shape.
  • the cooling plate may have at least ⁇ comprise a fluid inlet and a fluid outlet little. These can each be fluidically connected to the inflow or outflow channel.
  • a simple supply and removal of cooling fluid is possible lent.
  • cold water can simply be supplied and warm water can be removed.
  • the inventive method for producing adeplat ⁇ te includes that the recesses are generated in the expanded metal each by local shearing.
  • the webs between the recesses in the plate plane can be flat-rolled. When shearing, the webs can be set up perpendicular to the plate plane. This can hinder the Anord ⁇ drying of the plates as a stack and / or prevent a cooling fluid flow. In order to reduce or eliminate such problems, a processing step of flat rolling can be useful.
  • the expanded metal can then be arranged in a frame on top of each other so that by partially overlapping recesses in total a permeable porous body is formed, the at least one fluid flow channel in fluidi ⁇ cal contact with at least one fluid inlet andarguess ⁇ least one fluid return channel in fluidic contact with we ⁇ least one fluid drain comprises.
  • the use of the frame makes it possible to easily adjust the expanded meshes relative to one another and to the fluid inflow and outflow, as well as to complete and seal off the entire cooling plate.
  • An elaborate step to form the flow and drainage channels by overlapping the recesses, and to bring them into fluidic contact with the fluid inflow and outflow is thereby saved, which saves effort, time and money.
  • a use according to the invention of the above-described cooling plate or a cooling plate produced according to the method described above may comprise, for cooling, a fluid flowing air, water, water-glycol mixture or oil through the cooling channels. Due to the large area of the expanded metal mesh, which is covered by the cooling fluid, as well as the resulting twisted channels, a high heat exchange between the cooling fluid and the plates and thus the device to be cooled is ensured.
  • the cooling plate can be used to cool electrical power components. But there are also other uses such as the cooling of a machine conceivable.
  • the inventive method for producing the cooling plate and for their use the above-mentioned, associated with the cooling plate according to the invention results in advantages.
  • Fig. 1 is a plan view of a plate 3 of the plate stack 2 with parallelogram-shaped recesses 5 of a cooling plate 1 according to the invention.
  • Fig. 2 is a schematic sectional view through the dung OF INVENTION ⁇ proper cooling plate 1 with base and cover plates 6, 7, frame 14, inlet and outlet 12, 13, and flow 8 through the fluid-permeable plate stack, and
  • Fig. 3 is a schematic plan view of the invention
  • FIG. 1 shows a plan view of a plate 3 with wesentli ⁇ chen parallelogram-shaped recesses 5 of a device 1 according to the invention for cooling.
  • the plate 3 is a
  • the plate plane is in Fig. 1, the plane of the drawing.
  • the terms expanded mesh and plate 3, 4 are used equivalently.
  • the expanded metal 3 can, for example, from a metal sheet, such as an aluminum sheet, a Be made of sheet steel, a galvanized sheet or a CuNiFe sheet.
  • the sheet usually has a thickness not shown in FIG. 1 in the range of a few mm.
  • the recesses 5 are the same in shape and give a regular pattern, which results from each other by the parallelogram shape and the distance P of the centers of the recesses 5.
  • a center point of a parallelogram results from the intersection of the diagonal of the parallelogram, which connect the vertices together.
  • the distance P of the centers of adjacent recesses is in the range of 5 to 70 mm, e.g. 5 mm.
  • the webs 9 have a width B in the range of 0.4 times P, in particular 1 to 10 mm. At a value P equal to 5 mm results in a value B of 2 mm.
  • the recesses 5 are only substantially parallelogram. At two opposing points of intersection 10, 10 'of a recess 5, no tip is formed, but a straight region of length H is inserted, which is parallel to a diagonal of the parallelogram.
  • the straight area encloses an angle Alfa with the adjacent leg of the parallelogram, which lies in the range of 91 ° to 170 °. In the embodiment of Fig. 1, the angle alpha is 170 °.
  • the straight portion has ei ⁇ NEN value H to 0.1 times P, in particular in the range 5 to 20 mm. At a value P of 5 mm, H is equal to 0.5 mm.
  • Fig. 1 the sake of clarity, no second Plat ⁇ run 4 of the panel stack 2 located.
  • the second plate 4 can be arranged below the first plate 3, rotated with a pattern by the angle beta, with beta insbesonde ⁇ re 90 °.
  • beta insbesonde ⁇ re 90 °.
  • FIG. 2 shows a schematic sectional view through the cooling plate 1 according to the invention.
  • the cooling plate 1 comprises a stack 2 of plates 2, 3 consisting of stretch ⁇ grids, which are shown only schematically for the sake of simplicity.
  • the stack 2 is fixed in a frame 14 and a base and cover plate 6, 7, analogous to a box in which the expanded mesh 2, 3 are arranged.
  • the cover plate 7 comprises an inflow and outflow 12, 13 on opposite ⁇ lying sides, which are formed in the form of eg holes in the cover plate 7. This fluid lines can be connected.
  • the inflows and outflows 12, 13 may also be formed in the frame 14 or in the base plate 6, depending on the arrangement of the cooling plate 1 relative to the device to be cooled.
  • the cooling fluid for example water, flows in the use of the cooling plate 1 through the inlet 12 at low temperature, ie cold, in the cooling plate 1.
  • the flow direction 8 with the flow through the overlapping recesses 5 is shown in Fig. 2 in the form of arrows. From the inflow 12, the cooling fluid flows into the flow channel, which is overlapped by
  • Recesses 5 of the expanded metal 3, 4 is formed. From the flow channel, the cooling fluid flows into the return channel, which is not shown in Fig. 2 for the sake of simplicity.
  • the flow channel and return channel can also be formed by one and the same channel. From the return channel, the cooling fluid flows via the outlet 13 from the cooling plate.
  • the base and cover plates 6, 7 in conjunction with the frame 14 form a fluid-tight cooling plate 1. They can thus be part of the walls or boundary of the overlapping recesses 5 of the expanded mesh 3 4 be formeddefuidkanals or channels.
  • Fig. 3 is a plan view of the invention cooling ⁇ plate 1 is shown with transparent cover plate 6.
  • the recesses 5 of the expanded metal mesh 3 and 4 each give the same pattern.
  • the expanded meshes 3 and 4 are arranged one above the other in such a way that the pattern of the upper expanded mesh 3 is displaced from the pattern of the underlying expanded mesh 4 in the direction of the fluid flow 8 by half the distance P of two recesses.
  • a cooling plate 1 with forward and return flow channel is obtained when the cooling plate 1 shown in Fig. 3 is doubly USAGE ⁇ det, stacked.
  • the second cooling ⁇ plate 1 is reflected at the central horizontal axis for ERS th arranged without a cover plate 7.
  • the cover plate 7 is replaced by that shown in Fig. 3 cooling plate 1.
  • a fluid-tight plate can also be arranged in the frame 14, which only comprises a fluid-permeable opening at the location of the outflow 13.
  • the fluid inflow 12 is arranged in the cover plate 7 and the fluid outlet 13 is disposed in the base plate 6, in the same place as the Flu ⁇ id inflow 12 7 in the top plate, the cooling fluid flows through the flow channels as shown in Fig. 3 represented by file 8.
  • the cooling fluid flows into the lower part of the cooling plate 1 below the arrangement shown in Fig. 3, which is constructed analogously to the part shown of two expanded meshes 3, 4. In the lower part, the flow takes place exactly opposite to that indicated by the file 8 in the upper part ⁇ showed flow.
  • the cooling fluid flows out of the cooling plate 1 via the fluid outflow (not shown) in the baseplate 6 at the same point in the fluid inflow 12 in the cover plate 7.
  • the plates 3, 4 of the disk stack 2 with ih ⁇ rer plate plane as Darge ⁇ up as drawing plane in FIG. 1, is disposed parallel to the base plate 6.
  • the arrangement is preferable in parallel because of the more favorable flow conditions.
  • the expanded metal mesh 3, 4 may be mechanically and / or thermally fixed to the base plate 6 and / or cover plate 7. This can e.g. by metallic compound, e.g. via soldering, brazing or welding.
  • FIG. 3 shows a stack 2 with two expanded gratings 3, 4.
  • the expanded metal mesh 3 is displaced in such a way against the pattern of the recesses 5 of the expanded metal mesh 4 that the displacement corresponds to a length of 1/2 P, ie at P equal to 5 mm has a value of 2.5 mm, in a direction parallel to the plane of the base plate 6 or Cover plate 7.
  • the arranged above the expanded grid of the stack 2, which is not shown in Fig. 3 for simplicity, may be moved with its pattern by the same value in the same or in the opposite direction. The result is the same overall pattern at a glance.
  • further expanded mesh stacking is analog.
  • other types of stacking are also conceivable, as described above, with rotation and / or irregular displacement of expanded mesh patterns relative to one another.
  • the expanded metal meshes 3, 4 are arranged on the base plate at an angle not equal to zero or 90 ° between expanded metal plane and base plate plane.
  • the examples described above are not intended to limit the device 1 according to the invention for cooling, but to explain, and are also applicable in combination with each other and with the prior art.
  • the recesses 5 may be e.g. also circular shape or Y-shaped, or have any other shapes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne une plaque de refroidissement (1), un procédé pour sa fabrication et son utilisation, la plaque de refroidissement comportant un empilement (2) d'au moins deux plaques (3, 4) respectivement pourvues d'évidements (5), les au moins deux plaques (3, 4) étant superposées dans un cadre (14) avec une plaque de base et une plaque de couverture (6, 7) de manière à former des canaux de refroidissement pour un fluide de refroidissement, traversant les évidements (5). Les au moins deux plaques (3, 4) pourvues d'évidements (5) se présentent sous la forme de plaques de métal déployé (3, 4), notamment de plaques de métal déployé laminé (3, 4), superposées de manière à former au moins un canal de départ et au moins un canal de retour.
PCT/EP2012/063689 2011-07-22 2012-07-12 Plaque de refroidissement, procédé pour sa fabrication et utilisation de la plaque de refroidissement Ceased WO2013013992A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201110079635 DE102011079635A1 (de) 2011-07-22 2011-07-22 Kühlplatte und Verfahren zu deren Herstellung sowie Verwendung der Kühlplatte
DE102011079635.5 2011-07-22

Publications (2)

Publication Number Publication Date
WO2013013992A2 true WO2013013992A2 (fr) 2013-01-31
WO2013013992A3 WO2013013992A3 (fr) 2013-04-04

Family

ID=46516737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/063689 Ceased WO2013013992A2 (fr) 2011-07-22 2012-07-12 Plaque de refroidissement, procédé pour sa fabrication et utilisation de la plaque de refroidissement

Country Status (2)

Country Link
DE (1) DE102011079635A1 (fr)
WO (1) WO2013013992A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025090959A1 (fr) * 2023-10-26 2025-05-01 Stafl Systems, LLC Plaque de refroidissement soudée au laser

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4665104A1 (fr) * 2024-06-12 2025-12-17 Semikron Danfoss GmbH Dispositif de refroidissement pour refroidir des composants électroniques et son utilisation

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4016928A (en) * 1973-12-26 1977-04-12 General Electric Company Heat exchanger core having expanded metal heat transfer surfaces
US4359181A (en) * 1978-05-25 1982-11-16 John Chisholm Process for making a high heat transfer surface composed of perforated or expanded metal
GB8910241D0 (en) * 1989-05-04 1989-06-21 Secretary Trade Ind Brit Heat exchangers
US5607778A (en) * 1995-07-20 1997-03-04 Purolator Products Company Method of manufacturing a porous metal mat
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
JP4570168B2 (ja) * 2003-08-06 2010-10-27 シエル・インターナシヨネイル・リサーチ・マーチヤツピイ・ベー・ウイ 展伸金属
US7549460B2 (en) * 2004-04-02 2009-06-23 Adaptivenergy, Llc Thermal transfer devices with fluid-porous thermally conductive core
EP2486359A2 (fr) * 2009-09-29 2012-08-15 Siemens Aktiengesellschaft Procédé de fabrication d'une plaque de refroidissement et dispositif fabriqué selon ce procédé

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025090959A1 (fr) * 2023-10-26 2025-05-01 Stafl Systems, LLC Plaque de refroidissement soudée au laser

Also Published As

Publication number Publication date
WO2013013992A3 (fr) 2013-04-04
DE102011079635A1 (de) 2013-01-24

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