WO2013015591A3 - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

Info

Publication number
WO2013015591A3
WO2013015591A3 PCT/KR2012/005875 KR2012005875W WO2013015591A3 WO 2013015591 A3 WO2013015591 A3 WO 2013015591A3 KR 2012005875 W KR2012005875 W KR 2012005875W WO 2013015591 A3 WO2013015591 A3 WO 2013015591A3
Authority
WO
WIPO (PCT)
Prior art keywords
present application
composition
curable composition
additives
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/005875
Other languages
English (en)
French (fr)
Other versions
WO2013015591A2 (ko
Inventor
고민진
문명선
정재호
최범규
강대호
김민균
조병규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to JP2014521572A priority Critical patent/JP5907262B2/ja
Priority to CN201280046489.5A priority patent/CN103827216B/zh
Priority to EP12817922.3A priority patent/EP2735590B1/en
Publication of WO2013015591A2 publication Critical patent/WO2013015591A2/ko
Publication of WO2013015591A3 publication Critical patent/WO2013015591A3/ko
Priority to US14/161,563 priority patent/US9147819B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/053—Organic silicon compound, e.g. organosilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Led Device Packages (AREA)

Abstract

본 출원은 경화성 조성물 및 그 용도에 관한 것이다. 본 출원의 조성물은, 우수한 가공성 및 작업성을 나타내면서, 경화되어 뛰어난 광추출 효율, 균열 내성, 경도, 내열 충격성 및 접착성을 보이고, 가혹 조건에서 장시간 동안 우수한 신뢰성을 나타내며, 백탁 및 표면에서의 끈적임 등이 방지되는 경화물을 제공할 수 있다. 또한, 본 출원은, 형광체 또는 광변환 물질 등의 첨가제가 첨가되는 경우에도 상기 첨가제의 침강이 방지되면서 투명도도 우수한 경화물을 형성하는 경화성 조성물을 제공할 수 있다.
PCT/KR2012/005875 2011-07-22 2012-07-23 경화성 조성물 Ceased WO2013015591A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014521572A JP5907262B2 (ja) 2011-07-22 2012-07-23 硬化性組成物
CN201280046489.5A CN103827216B (zh) 2011-07-22 2012-07-23 可固化组合物
EP12817922.3A EP2735590B1 (en) 2011-07-22 2012-07-23 Curable composition
US14/161,563 US9147819B2 (en) 2011-07-22 2014-01-22 Curable composition

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20110073103 2011-07-22
KR20110073097 2011-07-22
KR10-2011-0073103 2011-07-22
KR10-2011-0073097 2011-07-22
KR1020120080009A KR101560030B1 (ko) 2011-07-22 2012-07-23 경화성 조성물
KR10-2012-0080009 2012-07-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/161,563 Continuation US9147819B2 (en) 2011-07-22 2014-01-22 Curable composition

Publications (2)

Publication Number Publication Date
WO2013015591A2 WO2013015591A2 (ko) 2013-01-31
WO2013015591A3 true WO2013015591A3 (ko) 2013-03-21

Family

ID=47840797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005875 Ceased WO2013015591A2 (ko) 2011-07-22 2012-07-23 경화성 조성물

Country Status (6)

Country Link
US (1) US9147819B2 (ko)
EP (1) EP2735590B1 (ko)
JP (1) JP5907262B2 (ko)
KR (1) KR101560030B1 (ko)
CN (1) CN103827216B (ko)
WO (1) WO2013015591A2 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9299896B2 (en) * 2010-01-25 2016-03-29 Lg Chem, Ltd. Curable composition
US9410018B2 (en) * 2010-01-25 2016-08-09 Lg Chem, Ltd. Curable composition
EP2784128B1 (en) * 2011-11-25 2016-05-25 LG Chem, Ltd. Curable composition
JP2013139547A (ja) * 2011-12-05 2013-07-18 Jsr Corp 硬化性組成物、硬化物および光半導体装置
KR101591169B1 (ko) * 2013-04-04 2016-02-02 주식회사 엘지화학 경화성 조성물
US9688820B2 (en) 2013-04-04 2017-06-27 Lg Chem, Ltd. Curable composition
KR101591167B1 (ko) * 2013-04-04 2016-02-02 주식회사 엘지화학 경화성 조성물
KR101591170B1 (ko) * 2013-04-04 2016-02-02 주식회사 엘지화학 경화성 조성물
EP2960295B1 (en) * 2013-04-04 2020-01-08 LG Chem, Ltd. Curable composition
DE102014223785A1 (de) * 2014-11-21 2016-05-25 Wacker Chemie Ag Härtbare hochtransparente Siliconzusammensetzung mit verbesserter Mechanik für optische Bauteile
JP6688003B2 (ja) * 2015-02-26 2020-04-28 旭化成株式会社 硬化性樹脂組成物及びその製造方法、並びに、光半導体用封止材、光半導体用ダイボンド材、及び光半導体パッケージ
KR101768310B1 (ko) * 2015-04-30 2017-08-16 삼성에스디아이 주식회사 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치
CN105602259A (zh) * 2016-03-15 2016-05-25 东莞市天凯电子有限公司 一种可固化的有机聚硅氧烷组合物及其应用
JP6481647B2 (ja) * 2016-03-22 2019-03-13 信越化学工業株式会社 紫外線硬化性シリコーン組成物、その硬化物、及び該組成物からなる光学素子封止材、並びに該光学素子封止材により封止された光学素子
CN107068896B (zh) * 2016-12-28 2019-06-18 上海天马有机发光显示技术有限公司 一种有机发光显示面板及其制备方法
US10759697B1 (en) 2019-06-11 2020-09-01 MSB Global, Inc. Curable formulations for structural and non-structural applications
JP7818749B2 (ja) * 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060125267A (ko) * 2005-06-02 2006-12-06 주식회사 엘지화학 열경화형 막 형성용 코팅 조성물 및 이로부터 제조된 막
KR20080111480A (ko) * 2006-03-16 2008-12-23 제이에스알 가부시끼가이샤 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법
KR20090017495A (ko) * 2006-03-31 2009-02-18 제이에스알 가부시끼가이샤 금속 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법
KR20100058491A (ko) * 2007-08-23 2010-06-03 코니카 미놀타 옵토 인코포레이티드 광학용 수지 재료 및 광학 소자
KR20110068867A (ko) * 2009-12-15 2011-06-22 신에쓰 가가꾸 고교 가부시끼가이샤 광반도체 소자 밀봉용 수지 조성물 및 당해 조성물로 밀봉된 광반도체 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241338B2 (ja) 1998-01-26 2001-12-25 日亜化学工業株式会社 半導体発光装置
JP2001196151A (ja) 2000-01-12 2001-07-19 Takazono Sangyo Kk 発熱体装置及び発熱体温度制御方法
JP2002226551A (ja) 2001-01-31 2002-08-14 Matsushita Electric Ind Co Ltd 発光ダイオード
KR101325792B1 (ko) * 2006-01-17 2013-11-04 다우 코닝 코포레이션 열 안정성 투명 실리콘 수지 조성물 및 이의 제조 방법 및용도
JP2008023119A (ja) 2006-07-21 2008-02-07 Aruze Corp 遊技機
JP4895879B2 (ja) * 2007-03-19 2012-03-14 サンユレック株式会社 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
US9193833B2 (en) * 2010-02-19 2015-11-24 Toray Industries, Inc. Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, LED package, light-emitting device, and process for production of LED-mounted substrate
JP5640476B2 (ja) * 2010-06-08 2014-12-17 信越化学工業株式会社 光半導体素子封止用樹脂組成物及び発光装置
JP5971835B2 (ja) * 2010-08-23 2016-08-17 信越化学工業株式会社 硬化性シリコーン樹脂組成物及びそれを用いた発光ダイオード装置
JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060125267A (ko) * 2005-06-02 2006-12-06 주식회사 엘지화학 열경화형 막 형성용 코팅 조성물 및 이로부터 제조된 막
KR20080111480A (ko) * 2006-03-16 2008-12-23 제이에스알 가부시끼가이샤 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법
KR20090017495A (ko) * 2006-03-31 2009-02-18 제이에스알 가부시끼가이샤 금속 산화물 미립자 함유 폴리실록산 조성물 및 그의 제조 방법
KR20100058491A (ko) * 2007-08-23 2010-06-03 코니카 미놀타 옵토 인코포레이티드 광학용 수지 재료 및 광학 소자
KR20110068867A (ko) * 2009-12-15 2011-06-22 신에쓰 가가꾸 고교 가부시끼가이샤 광반도체 소자 밀봉용 수지 조성물 및 당해 조성물로 밀봉된 광반도체 장치

Also Published As

Publication number Publication date
CN103827216B (zh) 2016-03-16
US20140132892A1 (en) 2014-05-15
JP5907262B2 (ja) 2016-04-26
JP2014520946A (ja) 2014-08-25
KR101560030B1 (ko) 2015-10-15
EP2735590A4 (en) 2014-12-10
EP2735590A2 (en) 2014-05-28
WO2013015591A2 (ko) 2013-01-31
KR20130011998A (ko) 2013-01-30
CN103827216A (zh) 2014-05-28
US9147819B2 (en) 2015-09-29
EP2735590B1 (en) 2020-12-09

Similar Documents

Publication Publication Date Title
WO2013015591A3 (ko) 경화성 조성물
WO2011090364A3 (ko) 경화성 조성물
WO2011090361A3 (ko) 경화성 조성물
WO2012099382A3 (ko) 디에틸헥실사이클로헥산을 포함하는 벽지용 염화비닐계 수지 조성물
WO2013032908A3 (en) Compositions comprising tetrafluoropropene and methods of use thereof
WO2012128596A3 (ko) 점착제 조성물
WO2011047123A3 (en) Anaerobically curable compositions
WO2011084553A3 (en) Compositions and uses of cis-1,1,1,4,4,4-hexafluoro-2-butene
WO2012109035A3 (en) Stable bio-oil
WO2013066461A3 (en) Renewable bio-based (meth) acrylated monomers as vinyl ester cross-linkers
WO2011126263A3 (ko) 점착제 조성물, 점착시트 및 터치 패널
WO2009106721A3 (fr) Composition organopolysiloxanique vulcanisable a temperature ambiante en elastomere et nouveaux catalyseurs de polycondensation d'organopolysiloxanes
IN2012DN01776A (ko)
MX336216B (es) Composicion curable que tiene estabilizadores combinados.
WO2012093907A3 (ko) 경화성 조성물
WO2013012666A3 (en) Compounds, methods of making, and methods of use
WO2014201185A3 (en) Bio-oil polyols, alkoxylated bio-oil polyols and bio-oil phenolic resins
WO2011139817A3 (en) Photochemical cross-linkable polymers, methods of marking photochemical cross-linkable polymers, methods of using photochemical cross-linkable polymers, and methods of making articles containing photochemical cross-linkable polymers
WO2012144798A3 (ko) 고분자 및 이를 포함하는 감광성 수지 조성물
WO2016099922A3 (en) Resins and compositions for high temperature applications
AU2018294335A1 (en) High stability polymer compositions with poly(alkyl) acrylate compounds for enhanced oil recovery applications
PH12015500774B1 (en) Melt processed polymer composition derived from leaf sheaths of trees of the genus arecaceae
WO2013074624A3 (en) Silicone resins comprising metallosiloxane
WO2009011819A3 (en) Thermally resistant anaerobically curable compositions
MX346427B (es) Composiciones de polimero elastomerico para revestimientos y selladores.

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201280046489.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12817922

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2012817922

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2014521572

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE