WO2015115338A1 - Bande de revêtement pour emballage de pièces électroniques - Google Patents

Bande de revêtement pour emballage de pièces électroniques Download PDF

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Publication number
WO2015115338A1
WO2015115338A1 PCT/JP2015/051933 JP2015051933W WO2015115338A1 WO 2015115338 A1 WO2015115338 A1 WO 2015115338A1 JP 2015051933 W JP2015051933 W JP 2015051933W WO 2015115338 A1 WO2015115338 A1 WO 2015115338A1
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WIPO (PCT)
Prior art keywords
cover tape
conductive polymer
layer
polymer layer
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/051933
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English (en)
Japanese (ja)
Inventor
亮介 森藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014013989A external-priority patent/JP2015140200A/ja
Priority claimed from JP2014198471A external-priority patent/JP2016068987A/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to KR1020167020387A priority Critical patent/KR20160114602A/ko
Priority to CN201580005861.1A priority patent/CN105934396B/zh
Publication of WO2015115338A1 publication Critical patent/WO2015115338A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the present invention relates to a cover tape for packaging electronic parts.
  • This application claims priority based on Japanese Patent Application No. 2014-013989 filed in Japan on January 29, 2014 and Japanese Patent Application No. 2014-198471 filed on September 29, 2014 in Japan, The contents are incorporated here.
  • the carrier tape is used as one of the packaging forms for transporting and storing them.
  • Such an electronic component is stored in each pocket of these carrier tapes and sealed with a cover tape as a lid.
  • the cover tape is usually stored in a wound state until it is used as a carrier tape. While being stored in the wound state, the front and back surfaces of the cover tape are in contact with each other. For this reason, the front and back surfaces of the cover tape are pseudo-adhered or in close contact, and blocking may occur. Blocking means that when the cover tape stored in the wound body state is unwound in the manufacturing process or the taping packaging machine, the front and back surfaces of the cover tape stored in the wound body state are stored, Since it is in contact, it is in a pseudo-adhesive or close contact state and cannot be unwound at all or cannot be stably unwound.
  • Patent Document 1 a method of adding an antiblocking agent to a sealant material
  • Patent Document 2 a method of adding an antistatic agent to an adhesive agent
  • Patent Document 3 a glass transition temperature of 40 ° C. or more as a sealing material to prevent blocking
  • Patent Document 4 a method in which the heat seal layer contains an ethylene-vinyl acetate copolymer resin, a fatty acid amide type antiblocking agent and a particulate antiblocking agent
  • Patent Document 5 A method of containing a plastic resin and a ⁇ -electron conjugated conductive polymer dissolved in the thermoplastic resin (Patent Document 5), and a method in which an antistatic blocking prevention layer is laminated (Patent Document 6)
  • Patent Document 7 A method of providing a prevention layer as a stripe pattern on the heat sealant layer by a gravure printing method (Patent Document 7) is known. There.
  • the cover tape includes at least a base material layer and a sealant layer.
  • all of them include a blocking preventive agent in the sealant layer, or the anti-blocking layer on the surface of the sealant layer.
  • the current situation is that the improvement of the sealant layer alone does not provide sufficient blocking prevention measures.
  • the cover tape may be transferred by a ship, a truck, or the like in a wound state, and may be stored for a long time at a high temperature of about 60 ° C. during the transfer period. When exposed to such a storage environment, the cover tape is liable to block and cause trouble. Further, in countries such as Southeast Asia, the cover tape in a wound state may be stored for a long time in a hot and humid environment. When exposed to such an environment, the cover tape in the wound state is likely to be blocked, causing trouble.
  • Patent Documents 1 to 7 and the like are used when the wound cover tape is stored for a long time at a high temperature of about 60 ° C. or when it is stored for a long time in a high temperature and humidity environment. Therefore, when the cover tape in the wound state is transferred or stored for a long time in a high-temperature and high-humidity area, blocking frequently occurs.
  • Patent Document 8 a method of kneading a surfactant having an antistatic function into a base material layer or coating a surfactant on the surface of the base material layer is generally used.
  • surfactants have low antistatic performance under low humidity, and surfactants are water-soluble, so water resistance is low.
  • the cover tape is bonded and left after storing the electronic components, the cover tape is easily peeled off.
  • Patent Document 9 may contain a PET (polyethylene terephthalate) sheet as a base material layer, polyethylene dioxythiophene polystyrene sulfate as a conductive polymer, and colloidal silica (h) in a conductive layer.
  • the material has a surface resistance value of 10 1 to 10 12 ⁇ / ⁇ at a temperature of 25 ° C. and a relative humidity of 15%, and the conductive packaging material has a visible light transmittance of 80% or more. It can be used as a cover tape.
  • Patent Document 10 A conductive coating composition containing a water-soluble or water-dispersible ⁇ -conjugated conductive polymer, a water-soluble antioxidant, and water has been developed (Patent Document 10).
  • Patent Document 10 a conductive film obtained by applying an aqueous dispersion of a composite of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid as a water-dispersible ⁇ -conjugated conductive polymer to a PET film.
  • An adhesive coating composition is shown.
  • Patent Document 11 discloses that a sealant layer is provided on a base material layer in order to suppress charge generated upon peeling from a carrier tape, and the sealant layer includes a polyolefin resin and a polyether / polyolefin copolymer.
  • a cover tape characterized in that it is included is disclosed.
  • the surface resistance value of the surface of the sealant layer is 10 4 to 10 12 ⁇ / ⁇ (23 ° C.-15% RH environment) in order to suppress charging and the like generated by friction between the cover tape and the electronic component.
  • a cover tape characterized by the following is disclosed.
  • the present invention even when stored for a long time in a wound body in a high temperature environment of 60 ° C. or a high temperature and high humidity environment of a temperature of 40 ° C. and a humidity of about 90%, it is stably stored. It is an object of the present invention to provide a cover tape that is capable of maintaining the antistatic performance stably.
  • Patent Document 11 is a technique for suppressing charging that occurs when the cover tape is peeled off from the carrier tape.
  • Patent Document 12 is a technique that uses a cover tape and an electronic component. This technology suppresses the charge generated by friction between the two. In other words, the techniques disclosed in Patent Documents 11 and 12 focus only on the surface of the sealant layer among the surfaces of the cover tape.
  • an object of the second embodiment of the present invention is to provide an electronic component wrapping cover tape that can suppress the occurrence of charging due to friction on the surface opposite to the surface of the sealant layer.
  • the present inventors have intensively studied to solve the above problems.
  • a cover tape for packaging electronic parts comprising at least a base material layer and a sealant layer, and the base material layer has a light transmittance of 85% or more under a temperature environment of 25 ° C. 2 having a surface resistance value of 1 ⁇ 10 9 ⁇ / ⁇ or less over a relative humidity of 12% or more and 50% or less, and in particular, the base material layer contains at least one selected from polyester, polypropylene, or nylon.
  • a cover tape for packaging electronic parts which is an axially stretched film and has a conductive polymer layer on the surface of the base material layer, can solve all of the above problems.
  • the first embodiment of the present invention has been completed as a result of further studies based on these findings.
  • a cover tape for packaging electronic parts comprising at least a base material layer and a sealant layer, the base material layer having a light transmittance of 85% or more under a temperature environment of a temperature of 25 ° C.
  • An electronic component packaging cover tape having a surface resistance value of 1 ⁇ 10 9 ⁇ / ⁇ or less over a relative humidity of 12% to 50%.
  • the base material layer is a biaxially stretched film containing at least one selected from polyester, polypropylene, or nylon, and the surface of the base material layer is provided with a conductive polymer layer
  • a conductive polymer layer comprising: a base material layer; a sealant layer provided on one surface side of the base material layer; and a conductive polymer layer provided on the other surface side of the base material layer.
  • a cover tape for packaging electronic parts wherein the frictional voltage on the surface is -2200 to 2200V.
  • the conductive polymer layer includes a positive compound located on the positive side in the charged column with respect to the material subject to friction of the conductive polymer layer, and a negative compound in the charged column relative to the material subject to friction.
  • the substrate layer provided with the conductive polymer layer has a surface resistance value of 1 ⁇ 10 11 ⁇ / ⁇ or less in an environment of a temperature of 25 ° C. and a humidity of 12 to 65% RH.
  • the cover tape for electronic component packaging as described in any one of 11 above.
  • the cover tape for packaging electronic parts according to the first embodiment of the present invention is capable of blocking even when stored for a long time in a wound body in a high-temperature environment of 60 ° C. or a high-temperature and high-humidity environment of a temperature of 40 ° C. and a humidity of about 90%. It does not occur and can be stored stably, and the antistatic performance can be maintained stably.
  • the cover tape for packaging electronic parts of the second embodiment of the present invention it is possible to suppress the generation of charging due to friction on the surface of the conductive polymer layer, that is, the surface opposite to the surface of the sealant layer.
  • the electronic component packaging cover tape of the third embodiment of the present invention the effects of the first embodiment of the present invention and the second embodiment of the present invention can be achieved simultaneously.
  • the cover tape for packaging electronic components according to the first embodiment of the present invention (hereinafter sometimes simply referred to as a cover tape) includes at least a base material layer and a sealant layer, and the base material layer is 85% or more. It has a light transmittance, and has a surface resistance value of 1 ⁇ 10 9 ⁇ / ⁇ or less over a relative humidity of 12% to 50% in a temperature environment of 25 ° C.
  • the cover tape according to the first embodiment of the present invention includes at least a base material layer and a heat seal layer.
  • a base material layer a film made of various materials as appropriate depending on the application if it has mechanical strength that can withstand external forces applied during tape processing or heat sealing to a carrier tape, and heat resistance that can withstand heat sealing. Can be used.
  • polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, polyetherimide, polyarylate, polysulfone, Polyethersulfone, polyphenylene ether, polycarbonate, ABS resin and the like are examples of the material for the base layer film.
  • the base layer is preferably a biaxially stretched film containing at least one selected from polyester, polypropylene, or nylon, more preferably a biaxially stretched film containing polyester.
  • An axially stretched polyethylene terephthalate film (hereinafter sometimes referred to as O-PET film) is particularly preferred.
  • the base material layer needs to have a light transmittance of 85% or more. If the light transmittance of the base material layer is 85% or more, the transparency of the cover tape can be maintained, so that electronic components can be identified and inspected by a sensor or the like. When the light transmittance is less than 85%, the transparency of the cover tape becomes low, and it may be impossible to identify and inspect electronic components by a sensor or the like.
  • the surface of the base material layer preferably includes a conductive polymer layer.
  • the base material layer provided with the conductive polymer layer is stably 1 ⁇ 10 5 over a relative humidity of 12% to 50% in a temperature environment of 25 ° C. It can have a surface resistance value of 9 ⁇ / ⁇ or less.
  • the cover tape of the first embodiment of the present invention can be stored in a wound body in a high temperature environment of 60 ° C. for 30 days or longer. Blocking does not occur, and the antistatic performance can be stably maintained even when stored for a long period of 30 days or longer in a hot and humid environment with a temperature of 40 ° C. and a humidity of about 90%.
  • the conductive polymer layer used in the first embodiment of the present invention contains at least a conductive polymer and a solubilized polymer having an anion group.
  • the conductive polymer is not particularly limited, but a ⁇ -conjugated conductive polymer is preferable because it is excellent in transparency and exhibits a low volume resistivity and an excellent antistatic function when added in a small amount.
  • the ⁇ -conjugated conductive polymer is not particularly limited as long as the main chain is an organic polymer composed of a ⁇ -conjugated system.
  • ⁇ -conjugated conductive polymer examples include polypyrrole, poly (N-methylpyrrole), poly (3-methylpyrrole), poly (3-ethylpyrrole), poly (3-n-propylpyrrole), poly ( 3-butylpyrrole), poly (3-octylpyrrole), poly (3-decylpyrrole), poly (3-dodecylpyrrole), poly (3,4-dimethylpyrrole), poly (3,4-dibutylpyrrole), Poly (3-carboxypyrrole), poly (3-methyl-4-carboxypyrrole), poly (3-methyl-4-carboxyethylpyrrole), poly (3-methyl-4-carboxybutylpyrrole), poly (3- Hydroxypyrrole), poly (3-methoxypyrrole), poly (3-ethoxypyrrole), poly (3-butoxypyrrole), poly (3- Til-4-hexyloxypyrrole), poly (thiophene), poly (3-methylthiol
  • the solubilized polymer having an anionic group is used to solubilize the ⁇ -conjugated conductive polymer.
  • the solubilized polymer having an anionic group is coordinated to the ⁇ -conjugated conductive polymer via the anionic group, and as a result, the ⁇ -conjugated conductive polymer and the solubilized polymer having an anionic group form a complex. And functions as a dopant for the ⁇ -conjugated conductive polymer.
  • the solubilized polymer having an anion group (hereinafter sometimes referred to as polyanion) has at least a structural unit having an anion group.
  • the anion group of the polyanion functions as a dopant for the ⁇ -conjugated conductive polymer, and improves the conductivity and heat resistance of the ⁇ -conjugated conductive polymer.
  • polyanions include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polyacryl sulfonic acid, polymethacryl sulfonic acid, poly (2-acrylamido-2-methylpropane sulfonic acid), polyisoprene sulfonic acid, polyvinyl Examples thereof include carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacryl carboxylic acid, polymethacryl carboxylic acid, poly (2-acrylamido-2-methylpropane carboxylic acid), polyisoprene carboxylic acid and polyacrylic acid.
  • polystyrene sulfonic acid polyacryl sulfonic acid, and polymethacryl sulfonic acid are preferable, and polystyrene sulfonic acid is particularly preferable.
  • Polystyrene sulfonic acid, polyacryl sulfonic acid and polymethacryl sulfonic acid absorb heat energy and decompose by themselves, so that thermal decomposition of ⁇ -conjugated conductive polymer component is alleviated. Excellent. Moreover, it is excellent in the compatibility and dispersibility with the binder added to a conductive polymer layer as needed.
  • poly (3,4-ethylenedioxythiophene) is preferable from the viewpoint of conductivity and heat resistance, and prevents adhesion of cover tapes in a high temperature (60 ° C) environment, and 40 ° C / high humidity.
  • a complex of poly (3,4-ethylenedioxythiophene): polystyrene sulfonic acid (so-called PEDOT / PSS) is more preferable.
  • PEDOT / PSS exhibits a particularly excellent adhesion prevention effect is presumed as follows.
  • the conductive polymer layer containing PEDOT / PSS is presumed to have low surface energy, so that it is difficult for substances to adhere to the surface of the conductive polymer layer, and it is used in PEDOT / PSS.
  • the binder that is used is generally thermosetting resin, and the thermosetting resin does not soften with heat after curing and has excellent weather resistance, so the cover tape deteriorates and adheres. It can be difficult.
  • the amount of the solubilized polymer having an anionic group is preferably in the range of 0.1 to 10 mol, more preferably in the range of 1 to 7 mol, relative to 1 mol of the ⁇ -conjugated conductive polymer.
  • the amount of the solubilized polymer relative to 1 mol of the ⁇ -conjugated conductive polymer is less than 0.1 mol, the doping effect on the ⁇ -conjugated conductive polymer tends to be weakened, and the conductivity may be insufficient.
  • the conductive polymer layer used in the first embodiment of the present invention may contain various additives in addition to the conductive polymer and the solubilized polymer having an anion group.
  • additives include a polymer having a binder function, an antistatic improver, a polymer having an electron withdrawing group, an inorganic filler, an organic filler, and other additives. It is preferable to contain silica particles.
  • the conductive polymer layer used in the first embodiment of the present invention is prepared by dissolving a conductive polymer, a solubilized polymer having an anionic group, and other additives in a solvent to form a conductive polymer solution. To be applied.
  • Examples of the solvent include water, methanol, ethanol, isopropanol, butanol, propylene carbonate, N-methylpyrrolidone, dimethylformamide, dimethylacetamide, cyclohexanone, acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, butyl acetate and the like.
  • a solvent may be used individually by 1 type and 2 or more types of mixtures may be sufficient as it.
  • Examples of the method for applying the conductive polymer solution include gravure coating, comma coating, roll coating, and the like. After apply
  • the thickness of the conductive polymer layer is preferably 0.020 to 2.0 ⁇ m. Within this thickness range, the conductive polymer layer forms a conductive network, and the light transmittance of the base material layer can be stabilized to 85% or more.
  • the thickness of the conductive polymer layer is more preferably 0.020 to 1.0 ⁇ m, particularly preferably 0.020 to 0.5 ⁇ m. When the thickness of the conductive polymer layer is thinner than 0.020 ⁇ m, the conductive polymer layer easily peels off, and when it exceeds 2.0 ⁇ m, the light transmittance of the base material layer may be lower than 85%.
  • the sealant layer is not particularly limited as long as it is conventionally known. Those having a surface resistance value of less than 1 ⁇ 10 11 ⁇ / ⁇ over a relative humidity of 12% to 50% in a temperature environment of 25 ° C. are preferable.
  • cover tape for packaging electronic parts
  • cover tape 10 is used as a cover material for a carrier tape 20 in which concave pockets 21 are continuously provided in accordance with the shape of an electronic component.
  • the cover tape 10 seals the opening of the pocket 21 of the carrier tape 20 by sealing the surface of the carrier tape 20 (for example, heat sealing).
  • the cover tape 10 is integrated with the carrier tape 20 to constitute a package 100 for an electronic component. Then, when the package 100 is conveyed while being wound on a reel, the bottom surface 20a of the carrier tape 20 and the surface 10a of the cover tape 10 come into contact (friction).
  • the cover tape 10 includes a base material layer 1, a sealant layer 2 provided on one surface side of the base material layer 1, and a conductive polymer provided on the other surface side of the base material layer 1.
  • the total thickness of the cover tape 10 is preferably 20 to 100 ⁇ m, and more preferably 40 to 60 ⁇ m. When the thickness of the entire cover tape 10 is within a predetermined range, it is possible to avoid a situation in which the cover tape 10 is twisted when the cover tape 10 is sealed to the carrier tape 20 and to improve workability. it can. Next, each layer constituting the cover tape 10 will be described.
  • the base material layer 1 is a main layer constituting the cover tape 10.
  • the base material layer 1 has mechanical strength that can withstand external force applied during processing of the cover tape 10, heat sealing to the carrier tape 20, use, and heat resistance that can withstand heat during heat sealing. If it exists, the film which processed various materials can be used.
  • the base material layer 1 preferably has a total light transmittance of 85% or more, and more preferably 90% or more.
  • the total light transmittance of the base material layer 1 can be measured by the method defined in JISK7105-1981.
  • the material of the base material layer 1 examples include polyester resins, polyamide resins, polyolefin resins, polyacrylate resins, polymethacrylate resins, polyimide resins, polycarbonate resins, and ABS resins.
  • a polyester resin is preferable, and in particular, polyethylene terephthalate capable of improving mechanical strength is preferable.
  • the base material layer 1 may contain the lubricating material in the range which does not impair the characteristic.
  • what is necessary is just to select the material of the base material layer 1 so that a surface resistance value may become below the predetermined value mentioned later, and a total light transmittance may become above-mentioned predetermined value.
  • the base material layer 1 may be a single-layer film composed of any of the resins, but may be a laminate of two or more layers selected from the resins. Further, as the base material layer 1, an unstretched film may be used, but in order to increase the mechanical strength of the cover tape 10 as a whole, it is preferable to use a film stretched in a uniaxial direction or a biaxial direction. .
  • the thickness of the base material layer 1 is preferably 9 to 25 ⁇ m, and more preferably 9 to 16 ⁇ m.
  • the cover tape 10 does not have too high rigidity, and even if a twist stress is applied to the carrier tape 20 after sealing, the cover tape 10 Can follow the deformation of the carrier tape 20 and reduce the possibility of peeling.
  • the thickness of the base material layer 1 is equal to or greater than a predetermined value, the mechanical strength of the cover tape 10 becomes suitable, and even when the cover tape 10 is peeled off from the carrier tape 20 at a high speed, The possibility that the tape 10 will break can be reduced.
  • the sealant layer 2 is a layer provided on one surface side of the base material layer 1 and is a layer that comes into contact with the carrier tape 20 when the cover tape 10 is sealed (for example, heat sealed) to the carrier tape 20.
  • the sealant layer 2 includes an acrylic resin or a polyester resin and an antistatic agent.
  • an antistatic agent for example, any one selected from metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate.
  • metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon
  • surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkyl sulfonate.
  • Carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.
  • the sealant layer 2 is made of oxide particles mainly composed of silicon, magnesium, or calcium, for example, silica, talc, or polyethylene particles, polyacrylate particles, polystyrene, to prevent blocking that occurs during transportation. One kind selected from particles or an alloy thereof may be contained.
  • the material of the sealant layer 2 is preferably adjusted so that the surface resistance value is 10 4 to 10 12 ⁇ / ⁇ (measurement condition: 23 ° C.-15% RH) so that static electricity can be discharged quickly. .
  • the thickness of the sealant layer 2 is preferably 1 to 15 ⁇ m and more preferably 1 to 5 ⁇ m so that the sealing work and the peeling work can be suitably performed.
  • the conductive polymer layer 3 is a layer provided on the other surface side of the base material layer 1 (the surface side opposite to the surface side on which the sealant layer 2 is provided), and is a layer constituting the surface 10 a of the cover tape 10. is there.
  • the frictional voltage of the conductive polymer layer 3 is ⁇ 2200 to 2200V, preferably ⁇ 800 to 800V, and particularly preferably ⁇ 500 to 500V.
  • the absolute value of the frictional voltage of the conductive polymer layer 3 is 2200 V or less, preferably 800 V or less, and particularly preferably 500 V or less.
  • the bottom surface 20a of the carrier tape 20 and the surface 10a of the cover tape 10 are caused by vibration during conveyance. ), The generation of charging due to such friction can be suppressed.
  • the frictional voltage of the conductive polymer layer 3 is obtained by removing the charge from the cover tape 10 and the material to be rubbed (polystyrene carrier tape 20 to be described later), and then to the material to be rubbed. It can be obtained by rubbing the cover tape 10 (the surface of the conductive polymer layer 3) twice in one direction (for example, speed: about 100 mm / s, distance: about 50 mm) and measuring with a known surface electrometer. .
  • the object of friction of the conductive polymer layer 3 (hereinafter referred to as “object of friction” as appropriate) assumes the bottom surface 20a of the carrier tape 20 as described above, but is not limited to this.
  • a substance that may come into contact with the conductive polymer layer 3 during the transportation of the body 100 or in the mounting process of the electronic component may be considered.
  • the material subject to friction of the conductive polymer layer 3 (hereinafter, referred to as “material subject to friction” as appropriate) is limited to polystyrene, polyethylene terephthalate, polycarbonate, etc. used as the material of the carrier tape 20. It is not a thing, but also includes polyethylene, rubber (material processed from natural rubber, synthetic rubber, etc.) that may come into contact during the transportation of the package 100 or the mounting process of the electronic component.
  • the conductive polymer layer 3 includes a “positive compound” positioned on the positive side in the charged column with respect to the material to be rubbed and a “negative compound” positioned on the negative side in the charged column with respect to the material to be rubbed. It is preferable to include.
  • the conductive polymer layer 3 includes a positive compound and a negative compound, when the conductive polymer layer 3 rubs against the friction target, the positive compound is positively charged and the negative compound is negatively charged. In order to be charged, the conductive polymer layer 3 is electrically neutralized.
  • the frictional voltage of the conductive polymer layer 3 can be reliably within the predetermined range described above, and the occurrence of charging due to friction on the surface of the conductive polymer layer 3 can be reliably suppressed.
  • the position of the charge train can be measured by changing the measurement object in the method for measuring the frictional voltage described above.
  • the positive compound examples include an aziridinyl compound and its ring-opening compound when the friction target material is assumed to be polystyrene or rubber.
  • the aziridinyl compound is a compound having an aziridinyl group.
  • the “ring-opening compound” (ring-opening compound of the aziridinyl compound) is a compound in a state where the aziridinyl group in the above-mentioned aziridinyl compound is opened.
  • the negative compound examples include ester compounds when the friction target material is assumed to be polystyrene or rubber.
  • the ester compound is a compound formed by combining an organic acid or inorganic acid and an alcohol by a dehydration reaction, and examples thereof include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate derivatives thereof.
  • the content ratio of the positive compound and the content ratio of the negative compound in the conductive polymer layer 3 are not particularly limited, and may be appropriately set in consideration of the mechanical characteristics of the conductive polymer layer 3 and the entire cover tape 10.
  • the frictional voltage of the conductive polymer layer 3 can be set to a desired value by adjusting the contents of the positive compound and the negative compound in the conductive polymer layer 3.
  • positive compounds and negative compounds have various charging tendencies (intervals with the friction target material in the charge train) depending on the substance, by appropriately selecting the positive compounds and negative compounds to be used The frictional voltage of the conductive polymer layer 3 can be set to a desired value.
  • the conductive polymer layer 3 preferably contains a conductive polymer in order to reduce the surface resistance value, and also contains a surfactant in order to improve wettability and leveling properties when forming the layer.
  • the conductive polymer include polyaniline and polypyrrole, but a polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) -based compound can be preferably used.
  • the surfactant may be either a low molecular type or a polymer type, but an alkyl fluoride can be suitably used.
  • the base material layer 1 provided with the conductive polymer layer 3 preferably has a surface resistance value of 1 ⁇ 10 11 ⁇ / ⁇ or less in an environment of a temperature of 25 ° C. and a humidity of 12 to 65% RH. More preferably, it is 9 ⁇ / ⁇ or less.
  • the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is not more than a predetermined value, static electricity can be discharged quickly even when charged.
  • the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is kept below a predetermined value in the above environment. Static electricity can be discharged quickly and troubles based on static electricity can be prevented.
  • the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 can be measured by the method defined in JIS K6911-1995.
  • the cover tape 10 may be provided with an intermediate layer (not shown) between the base material layer 1 and the sealant layer 2. This intermediate layer can improve the cushioning property of the entire cover tape 10 and can improve the adhesion between the cover tape 10 and the carrier tape 20 during sealing.
  • the intermediate layer includes a resin, and examples of the resin include olefin-based resins, styrene-based resins, and cyclic olefin-based resins. Among them, the use of the olefin-based resin ensures the effect of improving the adhesion. be able to.
  • the thickness of the intermediate layer 3 is preferably 10 to 30 ⁇ m, more preferably 15 to 25 ⁇ m, in order to ensure the effect of improving adhesion.
  • the cover tape 10 may be provided with an adhesive layer (not shown) between the layers. This adhesive layer can improve the adhesion between the layers.
  • the adhesive layer contains a resin and a conductive substance
  • the resin include urethane-based dry laminate adhesive resins and anchor coat adhesive resins.
  • polyester resins such as polyester polyols and polyether polyols and the like What combined the isocyanate compound is mentioned.
  • the conductive substance include metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and organic conductive substances such as a conductive polymer, or a mixture thereof.
  • Carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.
  • the presence or absence of a reaction between substances does not ask
  • the conductive polymer layer 3 includes an aziridinyl compound as a positive compound, the aziridinyl compound may or may not react with another compound (such as a negative compound).
  • the manufacturing method of the cover tape 10 which concerns on 2nd Embodiment of this invention is not specifically limited, For example, by apply
  • an intermediate layer When an intermediate layer (not shown) is provided, it may be laminated on the other surface of the base material layer 1 by extrusion lamination, or may be laminated on the other surface of the base material layer 1 after forming a sheet in advance. Further, when an adhesive layer (not shown) is provided, the material of the adhesive layer may be applied to the target surface by a conventionally known application method.
  • the cover tape 10 which concerns on 2nd Embodiment of this invention, since the conductive polymer layer 3 contains a positive compound and a negative compound, the frictional voltage on the surface of the conductive polymer layer 3 is ensured. Therefore, it is possible to reliably suppress the occurrence of charging due to friction on the surface.
  • the cover tape 10 which concerns on 2nd Embodiment of this invention, since the aziridinyl compound (or its ring-opening compound) is included as a positive compound and an ester compound is included as a negative compound, the material of friction object is In the case of polystyrene or rubber, the conductive polymer layer 3 can more reliably suppress the occurrence of charging due to friction.
  • the cover tape 10 according to the second embodiment of the present invention since the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is equal to or less than a predetermined value, even if charged, the static electricity is quickly generated. Can be discharged.
  • the surface resistance value of the base material layer 1 provided with the conductive polymer layer 3 is kept below a predetermined value in the above environment, the work environment such as peeling of the cover tape 10 is in a dry state.
  • static electricity can be discharged quickly, and troubles based on static electricity can be prevented.
  • the cover tape 10 since the total light transmittance of the base material layer 1 is not less than a predetermined value, the electronic component is correctly stored in the pocket 21 of the carrier tape 20. The inspection of whether or not there is can be suitably performed through the cover tape 10.
  • the electronic component packaging cover tape according to the third embodiment of the present invention is the same as the electronic component packaging cover tape according to the first embodiment of the present invention and the electronic component packaging cover tape according to the second embodiment of the present invention.
  • the conductive polymer layer is characterized by containing at least one of an aziridinyl compound and its ring-opening compound and poly (3,4-ethylenedioxythiophene).
  • the conductive polymer layer preferably further contains polystyrene sulfonic acid.
  • the cover tape was evaluated by the following test method. ⁇ Blocking resistance> Two sheets of the cover tape were placed on a smooth plate so that the front and back surfaces of the cover tape were in contact with each other, and the two cover tapes were pressed by a disc having a cushioning diameter of 30 mm. After placing a 1 kg weight on the disc, it was stored for several days in each environment. After storage, the two cover tapes were peeled off, and those that peeled off without resistance were marked with ⁇ , those that felt resistance but peeled off were marked with ⁇ , and those that did not peel off due to sticking on the front and back surfaces were marked with ⁇ .
  • the cover tape was stored for several days in different environments. After storage, the light transmittance was measured according to JIS K7105. In the case where the light transmittance was 85% or more, “Good”, and in the case where the light transmittance was lower than 85%, it was evaluated as “X”.
  • ⁇ Surface resistance value> The cover tape was stored for several days in each environment. After storage, the surface resistance value of the base material layer was measured with a surface resistivity meter manufactured by TREK under the conditions of 25 ° C. and 30% RH and 25 ° C. and 50% RH in accordance with IEC613405-1. .
  • Examples 1-12 As the cover tape, one obtained by washing the surface of the O-PET base material layer of CSL-Z7302 made of Sumitomo Bakelite Co., Ltd., with acetone was used. As a conductive polymer solution containing poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid, 43 parts by mass of a PEDOT / PSS complex aqueous solution and 46.3 parts by mass of ion-exchanged water are formed on the surface of the base layer of this cover tape.
  • a conductive polymer solution containing poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid 43 parts by mass of a PEDOT / PSS complex aqueous solution and 46.3 parts by mass of ion-exchanged water are formed on the surface of the base layer of this cover tape.
  • the coated tape was uniformly applied by a gravure coating method, dried, and UV cured to produce a cover tape having a conductive polymer layer having a thickness of 150 nm.
  • the cover tape of the first embodiment of the present invention was stored in the storage environment and storage days as shown in Tables 1 and 2, and the surface resistance, light transmittance, and blocking were evaluated. Tables 1 and 2 show the evaluation results of the obtained cover tape for packaging electronic parts according to the first embodiment of the present invention.
  • the security environment of Examples 3, 6, 9 and 12 is an environment in a 60 ° C. oven.
  • Comparative Examples 1 to 4 As the cover tape, a surface layer of CSL-Z7302 manufactured by Sumitomo Bakelite Co., Ltd., washed with acetone was used. A polymer surfactant (Acryt 1SX-1090, manufactured by Taisei Fine Chemical Co., Ltd.), which is a conductive surfactant, is applied to the surface of the base layer of the cover tape so as to have a thickness of 150 nm. A comparative cover tape was prepared. This comparative cover tape was stored in the storage environment and the storage days as shown in Table 3, and the surface resistance, light transmittance, and blocking were evaluated. Table 3 shows the evaluation results of the obtained comparative electronic component packaging cover tape.
  • Examples 13 to 15 and Comparative Example 5 ⁇ Production of test material ⁇
  • a biaxially stretched polyester film (Toyobo Co., Ltd. product: E5102) having a thickness of 16 ⁇ m was prepared as a base material layer.
  • a sealant layer was formed on one surface of the base material layer, and a conductive polymer layer was formed on the other surface by the following procedure.
  • IPA isopropyl alcohol
  • PEDOT / PSS dispersion manufactured by Soken Chemical Co., Ltd .: WED-SM
  • triethylamine manufactured by Wako Pure Chemical Industries, Ltd .: TEA
  • a positive compound and a negative compound (manufactured by Kyoyo Chemical Co., Ltd .: Pluscoat Z565, Z760, Nisshinbo Chemical Co., Ltd .: Carbodiimide V-02-L2) were added as a binder resin and stirred for 30 seconds.
  • This solution was applied to the other surface of the base material layer using a bar coater or a gravure coater so that the wet film thickness was 4 ⁇ m, and dried at 100 ° C. to form a conductive polymer layer.
  • the compounding weight of each reagent is as shown in Table 4.
  • the carrier tape 70 As the carrier tape 70, a polystyrene sheet (Electrochemical Co., Ltd .: Clearen CST2401) cut to 8 mm width was used. The wheeled pedestal 30 was always in a grounded state. (2) The carrier tape 70 was neutralized using an ionizer (Kasuga Denki Co., Ltd .: BLH-H). (3) The pedestal 30 with wheels was moved, and the carrier tape 70 was moved under the measurement probe 60 of the surface potentiometer (manufactured by TREK: MODEL 370), and it was confirmed that the charge was removed. The interval between the carrier tape 70 and the measurement probe 60 was 1 to 2 mm.
  • the cover tape 10 (width: 8 mm) was wound around a rod-shaped support 80 (less than 1.0 ⁇ 10 9 ⁇ ) so that the conductive polymer layer became the surface layer.
  • This support 80 is preferably made of a conductor such as a carbon kneaded film or metal in order to reduce the influence of charging when it is supported by hand.
  • the cover tape 10 was also neutralized using an ionizer.
  • the pedestal 30 with the wheel was moved, the carrier tape 70 was moved from below the measurement probe 60, and the surface of the carrier tape 70 was rubbed by the cover tape 10 wound around the support 80.
  • ⁇ Surface resistance value> Regarding the surface resistance values of the base material layers (base material layer + conductive polymer layer, sealant layer) of the test materials 1 to 4, conditions of 25 ° C., 30% RH and 25 ° C. according to IEC 61340 5-1.
  • the surface resistance value of the base material layer was measured with a surface resistivity meter manufactured by TREK under the condition of 50% RH.
  • test material 1 (Example 13) had a frictional voltage (absolute value) on the surface of the conductive polymer layer of 413 V, and it was found that the generation of charging due to friction on the surface could be suppressed.
  • sample material 1 has a surface resistance value of 5.0 ⁇ 10 6 ⁇ / ⁇ of the base material layer (base material layer + conductive polymer layer), and it was found that static electricity can be discharged quickly even when charged. .
  • the frictional voltage (absolute value) on the surface of the conductive polymer layer is not more than a predetermined value, and it is possible to suppress the occurrence of charging due to friction on the surface. all right.
  • the test material 2 (Comparative Example 5) contained no positive compound in the conductive polymer layer, the frictional voltage (absolute value) on the surface of the conductive polymer layer was 3000 V, and the surface It was found that the generation of electrification due to friction cannot be sufficiently suppressed.

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  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)

Abstract

L'invention porte sur une bande de revêtement pour l'emballage de pièces électroniques, laquelle bande peut être stockée de façon stable sans production d'un bouchage, et laquelle peut conserver de façon stable une capacité antistatique même quand elle est stockée dans un état enroulé pendant une longue période dans un environnement à température élevée de 60° C ou dans un environnement à température élevée et à humidité élevée d'approximativement 40° C avec 90 % d'humidité, ou laquelle peut contrôler l'apparition d'électricité statique provoquée par un frottement sur la surface sur le côté opposé de la surface de couche d'agent de scellement. Cette bande de revêtement pour l'emballage de pièces électroniques comprend une couche de matériau de base, une couche d'agent de scellement disposée sur la surface de la couche de matériau de base, et une couche polymère conductrice disposée sur l'autre face de la couche de matériau de base.
PCT/JP2015/051933 2014-01-29 2015-01-23 Bande de revêtement pour emballage de pièces électroniques Ceased WO2015115338A1 (fr)

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JP2017128354A (ja) * 2016-01-19 2017-07-27 住友ベークライト株式会社 電子部品包装用カバーテープ
WO2021070935A1 (fr) * 2019-10-11 2021-04-15 大日本印刷株式会社 Bande protectrice destinée à l'emballage d'un composant électronique et emballage

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KR102232958B1 (ko) 2020-12-08 2021-03-26 김동준 방수목적의 전자부품 이송 및 표면 실장을 위한 커버테이프 및 그 제조장치
CN114133709A (zh) * 2021-11-30 2022-03-04 浙江洁美电子科技股份有限公司 一种导电性片材及微型封装件用载带
KR102542727B1 (ko) 2022-10-25 2023-06-14 (주)켐텍솔루션 전자 부품 포장용 커버 테이프의 접착층 형성을 위한 액상 수지 조성물 및 이를 이용하여 제조된 커버 테이프
JP7409543B1 (ja) * 2023-03-24 2024-01-09 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体

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