WO2015147561A1 - Matériau composite grâce auquel un motif conducteur peut être facilement formé, procédé de fabrication du matériau composite, matériau d'ensemencement de nitrure de cuivre du matériau composite et procédé de synthèse du nitrure de cuivre - Google Patents

Matériau composite grâce auquel un motif conducteur peut être facilement formé, procédé de fabrication du matériau composite, matériau d'ensemencement de nitrure de cuivre du matériau composite et procédé de synthèse du nitrure de cuivre Download PDF

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Publication number
WO2015147561A1
WO2015147561A1 PCT/KR2015/002951 KR2015002951W WO2015147561A1 WO 2015147561 A1 WO2015147561 A1 WO 2015147561A1 KR 2015002951 W KR2015002951 W KR 2015002951W WO 2015147561 A1 WO2015147561 A1 WO 2015147561A1
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WO
WIPO (PCT)
Prior art keywords
copper
composite material
fiber
conductor pattern
urea
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Ceased
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PCT/KR2015/002951
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English (en)
Korean (ko)
Inventor
유명재
임호선
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Korea Electronics Technology Institute
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Korea Electronics Technology Institute
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Priority claimed from KR1020140035536A external-priority patent/KR101595295B1/ko
Application filed by Korea Electronics Technology Institute filed Critical Korea Electronics Technology Institute
Publication of WO2015147561A1 publication Critical patent/WO2015147561A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/0615—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium
    • C01B21/0625—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with transition metals other than titanium, zirconium or hafnium with copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the present invention relates to a composite material that can implement a conductor pattern on a three-dimensional part using electromagnetic waves, in particular, a laser.
  • a composite material capable of forming a three-dimensional conductor pattern by a laser and a composite material It is about a method.
  • the method of forming a conductor pattern using the double injection method is not only difficult to manufacture a mold in producing a complicated part, but also has a great variation between the manufactured parts.
  • the thickness of the manufactured part should be 1 mm or more, which is slim.
  • the production of one type of part is difficult.
  • a laser direct structuring (LSD) method of forming a conductor pattern by applying a laser treatment and plating process to a material is used, but it is included in a material to form a pattern by laser.
  • the seed forming agent to be deteriorated in the formability of the finally produced part.
  • the composite material and the composite material that is easy to generate a conductor pattern by coating an inorganic material that is activated during laser irradiation to form a metal layer in the plating process on a fiber type material It aims at providing the manufacturing method.
  • a composite material having an easy conductor pattern and a method of manufacturing the composite material may be heated by heating a mixture including a fiber-type material and a liquid-form Cu 3 N composition, except for the fiber-type material. Dissolving the same, cooling and degassing the mixture, heat treating the degassed mixture, and washing and drying the heat treated mixture.
  • a composite material and a method of manufacturing the composite material which are easily formed with a conductor pattern, may be formed by injection molding the washed and dried mixture, and patterning the laser on the surface of the injection molded mixture. Plating the patterned mixture further.
  • seed produced in a composite material capable of forming a three-dimensional conductor pattern by laser produced by dissolving copper acetate in urea and 1-nonanol It provides a copper nitride material.
  • copper acetate By obtaining the copper acetate by reacting copper hydroxide (Copper Hydroxide) or copper carbonate (Copper Carbonate) with acetic acid, it is possible to provide copper acetate at a lower cost.
  • copper hydroxide Copper Hydroxide
  • copper carbonate Copper Carbonate
  • the ratio of the copper acetate and the urea may be 1: 1 to 1: 100.
  • dissolving copper acetate in urea and 1-octanol (1-Octanol); And when the copper acetate is dissolved provides a method for synthesizing the copper nitride of the seed material in a composite material capable of forming a three-dimensional conductor pattern by a laser comprising a step of degassing and heat treatment in a nitrogen atmosphere.
  • the step of heating dodecanol (Dodecanol); Mixing copper acetate and urea with the heated dodecanol; Performing nitrogen gas bubbling while stirring the mixed solution; And it provides a method for synthesizing a copper nitride as a seed material in a composite material capable of forming a three-dimensional conductor pattern by a laser including a step of performing a heat treatment stepwise at a temperature within 250 degrees and maintaining a predetermined time.
  • an inorganic material particularly Cu 3 N (copper nitride) is coated on a fiber-type material, thereby providing a composite material which is easy to form a conductor pattern through a laser treatment and a plating process.
  • the composite material according to the present invention provides the advantage that the conductor pattern can be formed even in a slim or three-dimensional complex form parts.
  • the process pattern is reduced by the first injection process, thereby forming the conductor pattern, thereby reducing the manufacturing cost of the part.
  • FIG. 1 is a flowchart illustrating a process of a method of manufacturing a composite material having easy conductor pattern formation according to an embodiment of the present invention.
  • 3 and 4 is a view showing a method for forming a conductor pattern on the composite material according to an embodiment of the present invention and the components manufactured according to the method.
  • the present invention includes a fiber type material and a material coated on the fiber type material, specifically, glass fiber, carbon fiber, cellulose fiber, kenaf On a composite material including a fiber type material such as fiber, graphite fiber and carbon nanotube, and a Cu 3 N material coated on the fiber type material and activated during laser irradiation to form a metal layer in a plating process. It is about.
  • the fiber-type material may be used after being treated with a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent, and in particular, when the fiber material surface-treated with the coupling agent is used, an interface between the fiber-type material and the Cu3N material It is possible to coat more uniform and dense Cu3N material on the fiber type material by increasing the bonding force.
  • a surface treatment agent such as a focusing agent, a coupling agent, and a smoothing agent
  • Coupling agents include silane coupling agents (e.g., shinet su, momentive, dow corning), polymer couplings (e.g. polycarboxylic, polyacrylic acid), polymerizable coupling agents (e.g. triazinethiosulfate) and alkoxythio Sulfuric acid (alkoxythiosulfate) coupling agents and the like may be used.
  • silane coupling agents e.g., shinet su, momentive, dow corning
  • polymer couplings e.g. polycarboxylic, polyacrylic acid
  • polymerizable coupling agents e.g. triazinethiosulfate
  • alkoxythio Sulfuric acid alkoxythiosulfate
  • fiber-type materials surface-treated in various ways provides the advantages of minimizing damage to the fiber-type material itself, as well as improving adhesion, mechanical properties, and chemical properties.
  • the conductor pattern can be formed on the composite material in a simple process as compared with the conventional method of forming the conductor pattern.
  • the dissolved mixture may be cooled using liquid nitrogen to form a solid state, and then gaseous nitrogen may be used to remove unnecessary residual gas.
  • the degassing process may be repeated one or more times to increase the removal rate of residual gas.
  • the temperature of the mixture is gradually heat-treated to the second temperature range (S130).
  • Cu 3 N is a glass fiber surface in the form of a cube of about 25nm in size It can be seen that it is coated.
  • FIG. 3 is a flowchart illustrating a method of forming a conductor pattern on a composite material according to an embodiment of the present invention
  • FIG. 4 is a view illustrating a part manufactured according to the method of forming a conductor pattern on a composite material according to an embodiment of the present invention. to be.
  • the method of forming a conductor pattern on the composite material first, to produce a composite material by coating Cu 3 N on the fiber-type material in the manner described above (S310) .
  • Injection molding into a shape to manufacture the manufactured composite material S320.
  • Patterning by irradiating a laser in the form of a pattern to be formed on the injection-molded composite material S330.
  • the patterned composite is first plated by an electroless plating method (S340).
  • a more uniform metal layer may be formed, but in order to implement a more uniform metal layer, it is preferable to perform a second electroplating process after the electroless process (S350).
  • the composite material is manufactured by coating a Cu 3 N in the material of fiber type Cu 3 N is activated, when the laser irradiation by the laser absorbent role to form a pattern.
  • Figure 4a shows an example of forming a rectangular pattern using a laser on the surface of the part produced by injection molding.
  • Such a composite material is a thermoplastic resin
  • various resins capable of injection molding can be used.
  • PE, ABS, PBT, PET, LCP, PPA, PA6 or composite resins thereof may be used.
  • the activated pattern can be metallized via electrolytic plating or electroless plating or both.
  • 4B illustrates an example in which a metal layer is formed by electroless plating the component of FIG. 4A.
  • the composite material according to the embodiment of the present invention enables the conductor pattern to be easily formed by a simple process compared to the conventional conductor pattern forming method by coating Cu 3 N on a fiber type material.
  • the present invention provides a technique for inexpensively synthesizing nitride, in particular Cu 3 N material, the Cu 3 N inorganic filler is a cubic structure of space group Pm3m.
  • the present invention provides a method for synthesizing copper nitride using a cheap material unlike the above and in the composite material capable of forming a three-dimensional conductor pattern by a laser according to an embodiment of the present invention in FIG. Indicate the process.
  • copper acetate (Copper (2) acetate monohydrate) is dissolved in urea (Urea) and 1-nonanol (1-Nonaol) (S410), and degassing in a nitrogen atmosphere (S420), Heat treatment is performed in a temperature range within 250 degrees (S430) to synthesize a copper nitride (Cu 3 N) powder (S440).
  • copper acetate (Copper (2) hydroxide) or copper carbonate (Copper (2) carbonate) in acetic acid (Acetic acid) )
  • Copper acetate (Copper (2) hydroxide) or copper carbonate (Copper (2) carbonate) in acetic acid (Acetic acid)
  • acetic acid (Acetic acid)
  • it may be synthesized using an electrolysis process in water containing calcium acetate from a Cu electrode to provide a higher purity copper (2) acetate.
  • the copper acetate (Copper (2) acetate) thus provided is cheaper and more pure than conventional copper compounds.
  • dodecanol molecular weight 186.33
  • 1-octanol 1-Octanol, molecular weight 130.23
  • 1-nonanol as a solvent in which copper acetate is dissolved to provide a cheaper synthesis method
  • -Hexadecanol 1-Hexadecanol, molecular weight 242.44
  • the process of synthesizing copper nitride using dodecanol as a solvent heats the dodecanol and mixes copper acetate and urea with the heated dodecanol. Nitrogen gas bubbling is carried out while stirring the mixed solution, and heat treatment is performed stepwise at a temperature within 250 degrees and maintained for a certain time. The product can then be washed in an organic solvent and dried to obtain a copper nitride powder.
  • the present invention can provide even more inexpensive synthesis technology by utilizing urea as providing nitrogen which facilitates the synthesis into copper nitride in synthesis.
  • the ratio of copper acetate (Copper (2) acetate) and urea (Urea) synthesized in the present invention can be limited to 1 to 1 to 100.
  • the following shows an example of synthesizing a copper nitride material according to the present invention.
  • the present invention by inexpensively synthesizing copper nitride, which is a seed material, in a composite material capable of forming a three-dimensional conductor pattern by a laser, the overall price of the composite material can be lowered, thereby enabling the formation of a three-dimensional conductor pattern by a laser. It is possible to provide a material that can replace the conventional composite material.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

La présente invention concerne un matériau composite grâce auquel un motif conducteur peut être facilement formé et un procédé de fabrication du matériau composite. Un matériau composite selon la présente invention comprend un matériau fibreux qui peut être fabriqué sous forme de constituants en trois dimensions et un matériau à base de Cu3N qui est revêtu sur le matériau fibreux, et est activé lorsqu'il est exposé à un laser et forme une couche de métal dans un processus de placage. Lorsque le matériau composite selon la présente invention est utilisé, un motif conducteur peut être plus facilement formé à l'aide d'un procédé plus simple par rapport aux procédés existants de formation de motif conducteur.
PCT/KR2015/002951 2014-03-26 2015-03-26 Matériau composite grâce auquel un motif conducteur peut être facilement formé, procédé de fabrication du matériau composite, matériau d'ensemencement de nitrure de cuivre du matériau composite et procédé de synthèse du nitrure de cuivre Ceased WO2015147561A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020140035536A KR101595295B1 (ko) 2014-03-26 2014-03-26 전도체 패턴의 형성이 용이한 복합소재와 그 복합소재를 제조하는 방법
KR10-2014-0035536 2014-03-26
KR10-2014-0175060 2014-12-08
KR20140175060 2014-12-08

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WO2015147561A1 true WO2015147561A1 (fr) 2015-10-01

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268328A (ja) * 1990-03-16 1991-11-29 Sumitomo Electric Ind Ltd 配線形成方法
JP2008140972A (ja) * 2006-12-01 2008-06-19 Auto Network Gijutsu Kenkyusho:Kk 導電回路を有する成形品及びその製造方法
KR101088886B1 (ko) * 2009-12-29 2011-12-07 한국기계연구원 레이저를 이용한 회로 형성 방법, 회로 연결 방법 및 그에 의하여 형성된 회로
JP2013144767A (ja) * 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
KR101434423B1 (ko) * 2013-04-02 2014-08-26 전자부품연구원 도전성 패턴을 위한 소재 및 이를 이용한 도전성 패턴 형성방법
JP2014166939A (ja) * 2013-01-31 2014-09-11 National Institute Of Advanced Industrial & Technology 窒化銅微粒子およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268328A (ja) * 1990-03-16 1991-11-29 Sumitomo Electric Ind Ltd 配線形成方法
JP2008140972A (ja) * 2006-12-01 2008-06-19 Auto Network Gijutsu Kenkyusho:Kk 導電回路を有する成形品及びその製造方法
KR101088886B1 (ko) * 2009-12-29 2011-12-07 한국기계연구원 레이저를 이용한 회로 형성 방법, 회로 연결 방법 및 그에 의하여 형성된 회로
JP2013144767A (ja) * 2011-03-18 2013-07-25 Mitsubishi Engineering Plastics Corp 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
JP2014166939A (ja) * 2013-01-31 2014-09-11 National Institute Of Advanced Industrial & Technology 窒化銅微粒子およびその製造方法
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
KR101434423B1 (ko) * 2013-04-02 2014-08-26 전자부품연구원 도전성 패턴을 위한 소재 및 이를 이용한 도전성 패턴 형성방법

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
T. NAKAMURA ET AL.: "Preparation of Copper Nitride (Cu3N) Nanoparticles in Long-Chain Alcohols at 130-200°C and Nitridation Mechanism", INORG. CHEM., vol. 53, 26 December 2013 (2013-12-26), pages 710 - 715, XP055227567 *
T. NAKAMURA ET AL.: "Preparation of copper nitride nanoparticles using urea as a nitrogen source in a long-chain alcohol", J. NANOPART. RES., vol. 16, 15 October 2014 (2014-10-15), pages 2699-1 - 2699-6, XP035382680 *
WIKIPEDIA, 18 May 2013 (2013-05-18), XP055227562, Retrieved from the Internet <URL:http://en.wikipedia.org/wiki/Copper(II)_acetate> *

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