WO2015198770A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2015198770A1
WO2015198770A1 PCT/JP2015/064945 JP2015064945W WO2015198770A1 WO 2015198770 A1 WO2015198770 A1 WO 2015198770A1 JP 2015064945 W JP2015064945 W JP 2015064945W WO 2015198770 A1 WO2015198770 A1 WO 2015198770A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
cooling device
heat generating
generating member
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/064945
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English (en)
Japanese (ja)
Inventor
淳 柳原
三浦　忠将
是如 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2015198770A1 publication Critical patent/WO2015198770A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control

Definitions

  • the present invention relates to an electronic apparatus provided with a cooling device.
  • a cooling device that combines a heat sink and a fan or Peltier element as described above requires a relatively large device and consumes power. Time) is disadvantageous. Therefore, an electronic device that can be used without a power source and includes a small cooling device is strongly desired.
  • an object of the present invention is to provide an electronic device that can be reduced in thickness and size and has high cooling efficiency for a heat generating member.
  • the present inventors can effectively use the space inside the electronic device by installing the cooling device in a place other than the top surface of the heating member, As a result, it has been found that a cooling device having a larger volume can be used and the cooling efficiency can be increased.
  • an electronic apparatus comprising a heat generating member and a cooling device, wherein the cooling device is installed on a surface other than the top surface of the heat generating member.
  • the cooling device by installing the cooling device in a place other than the top surface of the heat generating member, it is possible to reduce the thickness and size, and to provide an electronic apparatus having excellent heat generating member cooling efficiency.
  • FIG. 1 schematically shows a configuration of a heat generating member and a cooling device in an electronic apparatus according to an aspect of the present invention.
  • FIG. 2 schematically shows configurations of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 3 schematically shows configurations of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 4 schematically shows configurations of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 1 schematically shows a configuration of a heat generating member and a cooling device in an electronic apparatus according to an aspect of the present invention.
  • FIG. 2 schematically shows configurations of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 3 schematically shows configurations of
  • FIG. 5 schematically shows configurations of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • 6A to 6C schematically show the configuration of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 7 schematically shows the configuration of the heat generating member, the cooling device, and the heat conductive member in the electronic apparatus according to another aspect of the present invention in a cross-sectional view.
  • FIG. 8 is a cross-sectional view schematically showing the configuration of the heat generating member, the cooling device, and the heat conductive member in the electronic apparatus according to another aspect of the present invention.
  • FIG. 9 schematically shows a configuration of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • Fig.10 (a) shows typically the structure of the heat-emitting member in the electronic device of another aspect of this invention, a cooling device, and a heat conductive member with a side view.
  • FIG. 10B schematically shows the configuration of FIG. 10A in a plan view.
  • FIG. 11 is a cross-sectional view schematically showing the configuration of the heat generating member, the cooling device, and the heat conductive member in the electronic apparatus according to another aspect of the present invention.
  • FIG.10 (a) shows typically the structure of the heat-emitting member in the electronic device of another aspect of this invention, a cooling device, and a heat conductive member with a side view.
  • FIG. 10B schematically shows the configuration of FIG. 10A in a plan view.
  • FIG. 11 is a cross-sectional view schematically showing the configuration of the heat
  • FIG. 12 schematically shows, in a cross-sectional view, the configuration of a heat generating member, a cooling device, and a heat conductive member in an electronic apparatus according to another aspect of the present invention.
  • FIG. 13 schematically shows the arrangement of the heat generating member, the cooling device, and the heat conductive member in the electronic apparatus in the example in a plan view.
  • FIG. 14 shows the results of Test Example 1.
  • the present invention is an electronic device having a heat generating member and a cooling device, wherein the cooling device is installed on a surface other than the top surface of the heat generating member (see, for example, FIG. 1).
  • the space inside the electronic device can be used effectively. That is, it becomes possible to use a cooling device having a larger volume, and the cooling efficiency can be increased.
  • the “location other than the top surface of the heat generating member” may be any location other than the top surface of the heat generating member inside the electronic device, for example, may be a location on the side of the heat generating member, or It may be a location on the back side of the heat generating member through a substrate or the like.
  • the “top surface of the heat generating member” means the surface opposite to the surface where the heat generating member is in contact with the support (for example, the substrate), in the illustrated example, the upper surface of the drawing. Further, “installed on a surface other than the top surface of the heat generating member” does not exclude the presence on the top surface. That is, the cooling device may be installed on a surface other than the top surface of the heat generating member and may be present on the top surface of the heat generating member.
  • the cooling device may be one or two or more. When two or more cooling devices are used, they can be installed at predetermined locations independently of each other, for example, they may be installed with a heating member interposed therebetween, and one side of the heating member may be installed. And one may be installed on the back surface of the support via a support (for example, a substrate).
  • the shape of the cooling device is not particularly limited, and may be any form such as a cube, a rectangular parallelepiped, a cylinder, a prism, and a sheet. Moreover, the shape by which the center part of the cooling device was hollowed may be sufficient, and you may install a heat generating member in the hollow part hollowed out in this case. That is, a cooling device may be installed so as to surround the heat generating member.
  • the device containing the thermal storage material containing the substance which can absorb heat with 1 or more types of latent heat is mentioned.
  • the heat storage material containing a substance that can absorb heat by latent heat include metal halides, metal nitrates, metal carbonates, metal hydrates, paraffins, fatty acids, and ceramic materials.
  • the halide of the metal is not particularly limited, for example, lithium fluoride (LiF), lithium chloride (LiCl), sodium fluoride (NaF), include magnesium fluoride (MgF 2) or the like.
  • the nitrate of the metal is not particularly limited, for example, lithium nitrate (LiNO3), sodium nitrate (NaNO 3), potassium nitrate (KNO 3), and the like.
  • carbonate of the metal is not particularly limited, for example, lithium carbonate (Li 2 CO 3), and the like potassium carbonate (K 2 CO 3) is.
  • hydrated salt of a metal is not particularly limited, for example, NaCH 3 COO ⁇ 3H 2 O , Ba (OH) 2 ⁇ 8H 2 O, Sr (OH) 2 ⁇ 8H 2 O , and the like.
  • Paraffins are not particularly limited, and examples thereof include n-docosane (C 22 H 46 ), n-tetracosane (C 24 H 50 ), and n-triacontane (C 30 H 62 ).
  • the fatty acid is not particularly limited, and examples thereof include stearic acid, polymitic acid, myristic acid and the like.
  • the ceramic material is not particularly limited, and examples thereof include vanadium oxide, particularly vanadium dioxide.
  • the other element is not particularly limited as long as it can be used as a doping element, and examples thereof include W, Ta, Mo, and Nb.
  • the vanadium oxide is an oxide containing vanadium V and M (where M is at least one selected from W, Ta, Mo and Nb), and the sum of V and M is 100.
  • the content mole part of M when it is made a mole part is about 0 to about 5 parts by mole. Note that M is not an essential component, and the content molar part of M may be 0.
  • the vanadium oxide is an oxide containing A (where A is Li or Na) and vanadium V, and the content mole part of A when V is 100 mole parts is About 50 mol part or more and about 100 mol part or less.
  • the vanadium oxide has the formula: V 1-x M x O 2 (In the formula, M is W, Ta, Mo or Nb, and x is 0 or more and 0.05 or less) Or the formula: A y VO 2 (In the formula, A is Li or Na, and y is 0.5 or more and 1.0 or less) It is an oxide represented by.
  • the vanadium oxide is Ti-doped vanadium oxide or further vanadium oxide doped with other atoms selected from the group consisting of W, Ta, Mo and Nb,
  • the other atom is W
  • the content mole part of the other atom is greater than 0 mole part and less than or equal to 5 mole part with respect to a total of 100 mole parts of vanadium, Ti, and other atoms
  • the other atom is Ta, Mo or Nb
  • the content mole part of the other atom is greater than 0 mole part and 15 mole parts or less with respect to 100 mole parts in total of vanadium, Ti and other atoms
  • the content mole part of titanium is not less than 2 mole parts and not more than 30 mole parts with respect to 100 mole parts in total of vanadium, Ti and other atoms.
  • the Ti-doped vanadium oxide may contain 5 to 10 mole parts of titanium with respect to 100 mole parts of Ti and other atoms in total.
  • the vanadium oxide is Formula: V 1-xy Ti x M y O 2 [Wherein M is W, Ta, Mo or Nb; x is 0.02 or more and 0.3 or less, y is 0 or more, When M is W, y is 0.05 or less, When M is Ta, Mo or Nb, y is 0.15 or less. ] It is vanadium oxide represented by these. By setting it as such a structure, the moisture resistance of vanadium oxide improves.
  • x may be 0.05 or more and 0.1 or less.
  • the heating member is not particularly limited.
  • an integrated circuit such as a central processing unit (CPU), a power management IC (PMIC), a power amplifier (PA), a transceiver IC, and a voltage regulator (VR), light emission
  • the light source include a diode (LED), an incandescent light bulb, and a semiconductor laser, and a component that can be a heat source such as a field effect transistor (FET).
  • IC integrated circuit
  • CPU central processing unit
  • PMIC power management IC
  • PA power amplifier
  • VR voltage regulator
  • LED diode
  • FET field effect transistor
  • the electronic device is not particularly limited, and examples thereof include mobile electronic devices such as smartphones, mobile phones, tablet terminals, laptop computers, portable game machines, portable music players, and digital cameras.
  • the heat generating member 2 and the cooling device 4 are installed on a support (for example, the substrate 6) so that their side surfaces are in contact with each other.
  • the heat generating member 2 and the cooling device 4 are thermally coupled by a heat conductive member 8.
  • the cooling device can be installed in any space of the electronic device. For example, it is advantageous when there is another electronic component immediately adjacent to the heat generating member and the cooling device cannot be installed in contact with the heat generating member.
  • the material for forming the heat conductive member is not particularly limited as long as it can conduct heat efficiently. And oxides such as Al 2 O 3 ).
  • the metal material is not particularly limited, and examples thereof include tin, nickel, copper, bismuth, silver, iron, aluminum, and alloys containing them. These metal materials may be used alone or in combination of two or more.
  • the shape and arrangement of the heat conductive member are not particularly limited as long as the heat generated by the heat generating member can be efficiently transmitted to the cooling device.
  • the top surface of the heat generating member 2 and the top surface of the cooling device 4 are thermally coupled by the heat conductive member 8 (FIG. 3).
  • the efficiency of heat radiation from the surface of the heat conductive member can be increased. Further, since the heat conductive member is installed at a position away from the support (for example, the substrate), it is advantageous in that it does not physically interfere with other electronic components on the support.
  • the bottom surface of the heat generating member 2 and the bottom surface of the cooling device 4 are thermally coupled by a heat conductive member 8.
  • a thermally conductive member can be formed at the same time. Further, even when there is another electronic component on the top surface (or upper part) of the heat generating member, the heat generating member and the heat conductive member can be brought into direct contact.
  • the heat conductive member 8 is thermally coupled between the opposing side surfaces of the heat generating member 2 and the cooling device 4.
  • Such a configuration makes it possible to reduce the height, which is advantageous from the viewpoint of reducing the thickness of the electronic device.
  • the heat generating member is installed on the support, and the cooling device is installed separately from the support.
  • Such a configuration makes it difficult for the cooling device to physically interfere with other electronic components on a support (for example, a substrate).
  • the cooling device is installed on a part (for example, the inner surface) of another member 10 (for example, a casing or a shield) of the electronic device.
  • the installation location of the heat conductive member 8 that thermally couples the heat generating member 2 and the cooling device 4 is not particularly limited.
  • the heat conductive member 8 may be installed so as to connect both side surfaces (FIG. )), May be installed so as to connect the top surface of the heat generating member and the bottom surface of the cooling member (FIG. 6B), or may be installed so as to connect the top surface of the heat generating member and other members. Good (FIG. 6C).
  • produced with the heat generating member is transferred to another member (a housing
  • the other member is preferably thermally conductive, and is preferably a metal member, for example.
  • At least a part of the heat conductive member 8 is located inside the support 6.
  • Such a configuration makes it difficult for the heat conductive member to physically interfere with other electronic components on the support (for example, the substrate).
  • the heat generating member 2 and the cooling device 4 are installed to face each other via a support 6 and are installed in a via hole 12 penetrating the support.
  • the heat-sensitive member 8 is thermally coupled.
  • the heat generating member and the cooling device are placed on the same plane of a support (eg, a substrate), each in contact with a thermally conductive member exposed from the support. Are thermally coupled.
  • Such a configuration makes it possible to reduce the height, which is advantageous from the viewpoint of reducing the thickness of the electronic device.
  • the electronic device of the present invention comprises two or more thermally conductive members.
  • the heat generating member 2 and the cooling device 4 are thermally coupled to other members 10 (eg, housings or shields) by separate thermal conductive members 8, 8 ′, respectively.
  • the heat generating member 2 and the cooling device 4 are thermally coupled via the heat conductive members 8 and 8 ′ and the other member 10.
  • the heat conductive member does not have to exist above the support (for example, the substrate) other than the portion where the heat generating member and the cooling device are installed. And physical interference with the electronic components on the support surface can be eliminated.
  • one side surface of the heat generating member 2 and one side surface of the cooling device 4 are thermally coupled by a heat conductive member 8
  • Another side surface of the heat generating member 2 and another side surface of the cooling device 4 are thermally coupled by another heat conductive member 8 ′.
  • a portion of the thermally conductive member is located inside the cooling device.
  • the contact area between the heat conductive member and the cooling device can be increased, and the thermal bondability can be improved.
  • the heat conductive member 8 is penetrated to the inside of the cooling device 4.
  • the portion of the thermally conductive member located inside the cooling device has an uneven shape.
  • the contact area between the heat conductive member and the cooling device can be increased, and the thermal bondability can be further increased.
  • the uneven shape of the heat conductive member inside the cooling device is not particularly limited, but may be a comb-teeth shape.
  • the cooling device and the heat conductive member described above may be integrated.
  • the present invention provides a cooling member comprising a cooling device and a heat conductive member.
  • the cooling member can be suitably used for manufacturing the electronic device of the present invention described above. By using such a cooling member, the electronic device of the present invention can be easily manufactured.
  • Example 1 and 2 As shown in FIG. 13, one heat generating member and four cooling devices were installed on a glass epoxy substrate. This was placed in a housing to produce the electronic devices of Examples 1 and 2. The heating member and cooling device used are shown below.
  • Comparative Example 1 An electronic device of Comparative Example 1 was produced in the same manner as in Examples 1 and 2 except that no cooling device was used.
  • Test example 1 A thermocouple was installed on the upper surface of the heat generating member in the electronic devices of Examples 1 and 2 and Comparative Example 1 described above, the heat generating member was operated at a power of 1.4 W, and the temperature of the upper surface of the heat generating member was measured. The results are shown in FIG.
  • Examples 3 and 4 In the electronic device of Example 2, a heat conductive sheet was further pasted so that the entire top surface of the heat generating member and the cooling device was hidden, and the electronic devices of Examples 3 and 4 were produced.
  • the heat conductive sheet used is shown below.
  • Test example 2 A thermocouple is installed on the upper surface of the heat generating member in the electronic devices of Examples 2 to 4 and Comparative Example 1, and the heat generating member is operated with power of 2.5, 3, 3.5, and 4 W. The time until the temperature reached 90 ° C. was measured, and the delay time from the case where no cooling device was present (Comparative Example 1) was calculated. The results are shown in the table below.
  • Example 4 using a copper plate as a thermally conductive member was confirmed to have a large delay effect in order. This is considered because the heat from the heat generating member was efficiently transferred to the cooling device by the heat conductive members such as the copper plate and the graphite sheet.
  • the electronic device of the present invention can be used as, for example, a small communication terminal in which the problem of heat countermeasures has become prominent.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif électronique comportant un élément calogène (2) et un dispositif de refroidissement (4). Le dispositif électronique est caractérisé en ce que le dispositif de refroidissement (4) est disposé ailleurs à côté de la surface supérieure de l'élément calogène (2). Ce dispositif électronique peut être rendu mince et compact, et l'efficacité de refroidissement de l'élément calogène (2) est élevée.
PCT/JP2015/064945 2014-06-25 2015-05-25 Dispositif électronique Ceased WO2015198770A1 (fr)

Applications Claiming Priority (2)

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JP2014130558 2014-06-25
JP2014-130558 2014-06-25

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WO2015198770A1 true WO2015198770A1 (fr) 2015-12-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184002A1 (fr) * 2019-03-13 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 Dispositif à semi-conducteur, dispositif d'imagerie et procédé de fabrication de dispositif à semi-conducteur

Citations (12)

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Publication number Priority date Publication date Assignee Title
JPH01118497U (fr) * 1988-02-03 1989-08-10
JPH0449760U (fr) * 1990-08-18 1992-04-27
JPH0482562U (fr) * 1990-11-26 1992-07-17
JPH06291481A (ja) * 1993-04-02 1994-10-18 Furukawa Electric Co Ltd:The 高密度放熱型回路基板
JP2005311257A (ja) * 2004-04-26 2005-11-04 Sharp Corp 放熱体
JP2006024948A (ja) * 2005-07-08 2006-01-26 Nec Corp 放熱構造、パッケージ組立体、及び放熱用シート
JP2008516413A (ja) * 2004-10-06 2008-05-15 アドバンスド、エナジー、テクノロジー、インコーポレーテッド サンドイッチ構造を有するサーマルソリューション
JP2009158744A (ja) * 2007-12-27 2009-07-16 Shinko Electric Ind Co Ltd 電子装置及びその製造方法及び配線基板及びその製造方法
JP2010171350A (ja) * 2009-01-26 2010-08-05 Inoac Corp 放熱構造
JP2013055355A (ja) * 2012-11-20 2013-03-21 Panasonic Corp 冷却装置およびそれを備えた電子機器
JP2013080767A (ja) * 2011-10-03 2013-05-02 Rhythm Kyoshin Co Ltd ヒートシンク
JP2013250880A (ja) * 2012-06-01 2013-12-12 Panasonic Corp 電子機器

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01118497U (fr) * 1988-02-03 1989-08-10
JPH0449760U (fr) * 1990-08-18 1992-04-27
JPH0482562U (fr) * 1990-11-26 1992-07-17
JPH06291481A (ja) * 1993-04-02 1994-10-18 Furukawa Electric Co Ltd:The 高密度放熱型回路基板
JP2005311257A (ja) * 2004-04-26 2005-11-04 Sharp Corp 放熱体
JP2008516413A (ja) * 2004-10-06 2008-05-15 アドバンスド、エナジー、テクノロジー、インコーポレーテッド サンドイッチ構造を有するサーマルソリューション
JP2006024948A (ja) * 2005-07-08 2006-01-26 Nec Corp 放熱構造、パッケージ組立体、及び放熱用シート
JP2009158744A (ja) * 2007-12-27 2009-07-16 Shinko Electric Ind Co Ltd 電子装置及びその製造方法及び配線基板及びその製造方法
JP2010171350A (ja) * 2009-01-26 2010-08-05 Inoac Corp 放熱構造
JP2013080767A (ja) * 2011-10-03 2013-05-02 Rhythm Kyoshin Co Ltd ヒートシンク
JP2013250880A (ja) * 2012-06-01 2013-12-12 Panasonic Corp 電子機器
JP2013055355A (ja) * 2012-11-20 2013-03-21 Panasonic Corp 冷却装置およびそれを備えた電子機器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184002A1 (fr) * 2019-03-13 2020-09-17 ソニーセミコンダクタソリューションズ株式会社 Dispositif à semi-conducteur, dispositif d'imagerie et procédé de fabrication de dispositif à semi-conducteur
JPWO2020184002A1 (fr) * 2019-03-13 2020-09-17
JP7470673B2 (ja) 2019-03-13 2024-04-18 ソニーセミコンダクタソリューションズ株式会社 半導体装置、撮像装置、半導体装置の製造方法
US12132061B2 (en) 2019-03-13 2024-10-29 Sony Semiconductor Solutions Corporation Semiconductor device, imaging device, and method of manufacturing semiconductor device

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