WO2016005609A2 - Détecteur spécifique au client réalisé par triple moulage - Google Patents

Détecteur spécifique au client réalisé par triple moulage Download PDF

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Publication number
WO2016005609A2
WO2016005609A2 PCT/EP2015/066161 EP2015066161W WO2016005609A2 WO 2016005609 A2 WO2016005609 A2 WO 2016005609A2 EP 2015066161 W EP2015066161 W EP 2015066161W WO 2016005609 A2 WO2016005609 A2 WO 2016005609A2
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
protective
circuit
bestückinsel
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/066161
Other languages
German (de)
English (en)
Other versions
WO2016005609A3 (fr
Inventor
Jakob Schillinger
Dietmar Huber
Lothar Biebricher
Manfred Goll
Marc Panis
Ulrich Schrader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of WO2016005609A2 publication Critical patent/WO2016005609A2/fr
Publication of WO2016005609A3 publication Critical patent/WO2016005609A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the invention relates to a method for producing a sensor circuit and the sensor circuit.
  • a sensor with a sensor circuit is known, which is connected in the manufacture of the sensor on a base element called wiring carrier.
  • the wiring carrier is held in a band called holding frame and forms integrally with this a so-called leadframe.
  • a method for producing a sensor having a sensor circuit carried on a mounting pad of a circuit carrier for outputting a sensor signal dependent on a physical encoder field and having an interface for transmitting the sensor signal to a higher-level signal processing device comprises the steps of enveloping the mounting pad and the sensor circuit included part of the circuit substrate in a first
  • Protective material in which a positive-locking element is formed and enveloping at least one of the positive-locking element containing part of the first protective ground and the interface in a second protective compound.
  • the procedure given is based on the consideration that the sensor circuit must be wrapped to protect them in a protective mass, how to protect, for example, Ver ⁇ weather the sensor from damage caused by mechanical stresses and other influences.
  • the protective compound must fit the installation space be adapted in which the sensor is to be used.
  • the sensor could be damaged without the protective compound, it must be immediately prepared with the protective compound and can not simply be stored unprotected until it is covered with the protective compound. For this reason, customer-specific on ⁇ production of sensors in small quantities are always very expensive, because this always has its own production facility must be provided.
  • the specified method starts with the knowledge that sensors such as rotational speed sensors and inertial sensors, which measure their physical measured variable contactlessly via a physical encoder field, actually hang in the air in the area of the sensor circuit and are less dependent on the installation space at this point.
  • the actual dependence on space is more on the side of the sensor, where the sensor is connected to its environment in which it is to be used, in a vehicle such as the vehicle chassis. Therefore, it is proposed within the scope of the specified method to divide the aforementioned protective compound into two protective compounds and to initially encase the sensor with the first protective compound in the region of the sensor circuit. In this way, the sensor circuit and the assembly island would be protected and could be stored, transported and googleverar ⁇ processed in any way.
  • the second protective compound which could in principle also be the same material as the first protective compound, could then be formed completely independently of time and location to the first protective compound, whereby the sensor could be mass-produced for the most part and only for a small part of the sensor a correspondingly specific production tool must be provided.
  • the stated method comprises the step of forming a part of the second protective mass as a connection element, which is suitable for being mechanically connected to a holder for holding the sensor.
  • This connecting member may be formed in the aforementioned manner text- ⁇ zifisch time and place, completely independently from the remaining part of the sensor, so that its production need not be directly involved in the rest of the manufacturing process of the sensor.
  • the circuit carrier is held during wrapping in the first protective compound at a position at which the mold closing element is formed. In this way, the circuit carrier during wrapping with the first
  • Protective ground can be made with a high precision around the circuit carrier.
  • the positive-locking element itself thereby not only fulfills the purpose of connecting the two protective compounds to one another, but also makes it possible to support the shaping process of the first protective compound.
  • the specified method comprises the step wrapping the Be Division Huawei and the
  • the mechanical Entkopp ⁇ lung mass holds the sensor circuit and, more particularly present in the sensor circuit sensor free of mechanical stresses that could distort the dependent physical timer field sensor signal and the measurement of the above-earth physi ⁇ measurand.
  • the web of wrapping the Be Glainsel and Sensor circuit in the first protective mass is at least partially removed.
  • This process can be described as partial free punching, in the context of which the sensor circuit with the first protective compound can be completely enveloped so that no marginal gaps or other unnecessary openings remain, through which moisture or other weathering-supporting substances could penetrate to the sensor circuit.
  • the sensor due to the further connection to the support element with other sensors, the sensor can be held together thereon and transported in a particularly efficient manner and further processed. The final separation of the sensor can then finally take place after wrapping in the second protective compound.
  • the interface can be selected as a location different from the placement island, because the interface must be kept free in any case until it is connected to a data cable for transmitting the sensor signal.
  • the invention further comprises the step of forming an alignment element on the first protection ground, on which the first protection ground can be aligned in a predetermined direction for enveloping the second protection ground.
  • This alignment element ensures that the sensor can continue to be produced with high precision with small tolerances after being wrapped in the first protective compound and, if appropriate, subsequently transported to another production facility when it is being wrapped with the second protective compound.
  • a sealing element is arranged between the first protective compound and the second protective compound, which avoids the penetration of moisture in a gap between the first protective compound and the second protective compound, which could possibly arise due to the positive connection.
  • a sensor is manufactured by one of the specified methods.
  • the indicated sensor may be a wheel speed sensor or an inertial sensor for a vehicle.
  • a vehicle includes a specified sensor.
  • FIG. 1 is a schematic view of a vehicle with a vehicle dynamics control
  • FIG. 2 is a schematic representation of a speed sensor in the vehicle of FIG. 1,
  • FIG. 3 shows a schematic representation of a read head of the rotational speed sensor of FIG. 2 in an intermediate production state
  • Fig. 4 is a sectional view of an alternative read head of the speed sensor of FIG. 2 in a plan view
  • Fig. 5 shows a sectional view of the reading head of Fig. 5 in a side view.
  • Fig. 1 shows a schematic view of a vehicle 2 with a known vehicle dynamics control. Details of this driving dynamics control can be found for example in DE 10 2011 080 789 AI.
  • the vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).
  • ABS antilock braking system
  • ESP electronic stability program
  • the Fahrdynamichal 16 of the vehicle 2 detects from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a Leksbeschleu ⁇ nist and / or a vertical acceleration can be output in a manner known to those skilled in the art.
  • a controller 18 can determine in a manner known to those skilled, whether the vehicle 2 slips on the road or even deviates from the above-mentioned predetermined trajectory and respond with a known controller output signal 20 to respond.
  • the controller output signal 20 may then be used by an actuator 22 to communicate by means of
  • the controller 18 may be integrated, for example, in a known motor control of the vehicle 2. Also, the controller 18 and the actuator 22 as a common Control device formed and optionally be integrated into the aforementioned engine control.
  • FIG. 2 shows a schematic view of one of the speed sensors 10 in the vehicle dynamics control of FIG. 1.
  • the speed sensor 10 is designed in the present embodiment as an active speed sensor, which comprises a non-rotatably mounted on the wheel 6 donor element in the form of an encoder disc 26 and a fixed to the chassis 4 sensor circuit, which is hereinafter referred to as read head 28 for simplicity.
  • the encoder disk 26 consists in the present embodiment of juxtaposed magnetic north poles 30 and magnetic south poles 32, which together excite a physical field in the form of a donor ⁇ magnetic field 33. This donor magnetic field is indicated in FIG. 3 for the sake of clarity with two field lines shown in dashed lines. Turns attached to the wheel 6
  • Encoder disc 26 with this in a direction of rotation 34, the encoder magnetic field rotates with so.
  • the reading head 28 comprises in the present embodiment, a sensor, also called sensor, in the form of a
  • the magnetostriction element 35 changes in dependence of the angular position of the
  • Encoder 26 energized encoder magnetic field its electrical resistance. To detect the speed 12 is connected to the
  • a test signal 39 is applied, which is changed depending on the angular position of the encoder wheel 26 and thus the electrical resistance magnetoresisitv element 35. Based on this change in the Probesig- nals 39 evaluates a signal evaluation circuit 40, the speed 12 and outputs them in a data signal 42 to the controller 18.
  • This signal evaluation circuit 40 may also be part of the read head 28.
  • the read head 28 is held in a production state of the present embodiment in a circuit carrier embodied as a so-called leadframe 44.
  • a circuit carrier embodied as a so-called leadframe 44.
  • the leadframe 44 may particularly preferably be embodied as an endless belt, to which the leadframe 44 shown in FIG. 3 adjoins one another and / or one above the other. An example of this is shown in FIG.
  • the part of the leadframe 44 shown in FIG. 3 comprises a holding frame 46, a wiring carrier in the form of a
  • the senor in the form of the magnetoresistive element 35 and the signal evaluation circuit 40 are applied to the placement island 48 and contacted electrically, for example by soldering or gluing.
  • the magnetoresistive element 35 and the signal output In this case, the circuit 40 is also connected to one another via a bonding wire 54, so that the sample signal 39 can be transmitted via the placement island 48 and the bonding wire 54 between the magnetoresistive element 35 and the signal evaluation circuit 40.
  • the placement island 48 is connected directly to one of the two contact terminals 52, while the other of the two contact terminals 52 is galvanically isolated from the placement island 48 and connected to the signal evaluation circuit 40 via another bonding wire 54.
  • the support frame 46 has, in the present embodiment, two mutually parallel transport stiffeners 58, which are connected to one another via connecting webs 60.
  • transport holes 62 are formed on the transport strip 58, in which a transport tool (not further illustrated) can engage and move the leadframe 44.
  • an index hole 64 is formed on the transport strip 58, by means of which the position of the lead frame 44 during transport can be determined and thus regulated.
  • FIGS. 4 and 5 show an alternative to FIG. 3 speed sensor 10, but which acts in the same manner as the explained in principle in Fig. 2.
  • Be Glance 48 a magnetoresistive element 35 and a signal evaluation circuit 40 interconnected. Accordingly, the sample signal 39 is applied to the magnetic-sensitive element 35 and data signal 42 is generated.
  • the circuit can for another scarf ⁇ processing components 66, such as protective capacitors or other sensors can be extended in any way. Corresponding further circuit components 66 can also be interconnected outside the placement island 48. After the reading head 28 of FIG. 4 and 5 of Fig. 3 corresponding intermediate production state is reached, the circuit on the Be Glainsel 48 and optionally au ⁇ ßer somehow the Be Glainsel 48 may be interconnected encased electric scarf ⁇ processing components in a mechanical decoupling material 68. For an optimal hold of the mechanical
  • Decoupling material 68 to guarantee the leadframe 44, 44 so-called anchor holes 70 are formed on the leadframe, which are penetrated by the mechanical decoupling material 68 and thus form a positive connection with the lead frame 44.
  • the mechanical decoupling material is preferably a Durop ⁇ last-material such as an epoxy resin selected.
  • the mechanical decoupling material 68 should have properties that exert only a slight mechanical stress on the individual encased electrical components 35, 40, 66.
  • the reading head 28 is partially punched out of its holding frame 46.
  • the read head 28 is cut out of the holding frame 46 at the Tiebars 50, so that it is held only at the contact terminals 52 on the support frame 46.
  • the read head 28 is now encased in a first protective compound 72, wherein a shielding plate 73 for increasing the electromagnetic compatibility, called EMC, may optionally be placed on the mechanical decoupling material 68 beforehand.
  • EMC electromagnetic compatibility
  • the first protective compound can also be used a thermoset.
  • special thermoplastics such as LCP (liquid crystalline polymers) or PPS
  • Polyphenylene sulfide can be used.
  • the focus should be on criteria such as a low coefficient of thermal expansion, good chemical resistance, high mechanical strength and / or high density.
  • the reading head 28 in the thus-prepared state will hereinafter be referred to as a pre-molded part.
  • This can be stored or transported in a particularly advantageous manner before further processing, because the first protective compound 72 provides a sufficiently high density, with which the components 35, 40, 66 of the sensor circuit are optimally protected.
  • this can now be separated from the support frame 46.
  • the contact terminals 52 can be separated from the support frame 46, for example by punching out.
  • the regions of the contact connections 52 projecting from the first protective ground 72 can now be used as an interface 76 for connecting a data cable 78 with which the data signal 42 can be transmitted to the controller 18.
  • the leadframe 44 could of course also be designed as a plug to which the data cable 78 is non-positively and / or positively connected. If the data cable 78 with the cut point connected ⁇ 76 can techniques, such as welding, soldering, adhesive bonding, crimping, splicing, ultrasonic welding, or combinations thereof are used it known Kaustech-. Particularly preferred is a variant in which the data cable has already been provided with a cable end sleeve 80 by a cable manufacturer and this is now welded to the lead frame 44 by means of resistance welding.
  • Clamping elements 82 have, with which the ferrules 80 can be additionally included non-positively.
  • the pre-molded part can now be at least partially enveloped in a second protective compound 84.
  • suitable alignment elements 86 in the form of me ⁇ chanical characteristics, such as recesses, lands, edges can be formed on the lead frame 44 and / or on the first protective compound 72 , In this way, an exact alignment of the pre-molded part in the tool when enveloping the second protective mass 84 and thus the above-mentioned low tolerance can be ensured.
  • the preform can be positioned floating in the tool when wrapping with the second protective mass 84 with special support pins.
  • the support pins can also be formed retractable. That is, after an initial wrapping of the protrusion with the second guard mass 84 (after hardening of the latter), the support pins are retracted to close any locations not detected by the second guard mass 84.
  • Anchor holes 70 in the leadframe 44 can further improve the retention of the second protective mass 72 on the pre-molded part.
  • a connection ⁇ element 86 is formed with the second protective mass 84, in which the read head 28 can be attached to the chassis 4 of the vehicle 2 as a holder only in this step, when wrapping in the second protective mass 84.
  • the connecting element 86 in this case comprises a retaining flange 88, which can be applied to the chassis 4 and a mounting hole 90, via which the reading head 28 can be screwed for example by means of a screw on the chassis.
  • a sleeve 92 may be inserted into the mounting hole.
  • an elastic thermoplastic can be selected.
  • the unit can be subjected to surface cleaning and activation immediately before the respective enveloping process.
  • OpenAir or vacuum plasmas can be used.
  • Particularly advantageous is a hydrogen plasma pre-purification, followed by a nitrogen-argon-plasma activation.
  • the reading heads 28 are still partially held on the holding frame 46 via the contact terminals 52 after wrapping in the first protective mass 72, they can be jointly programmed in a particularly effi ⁇ cient manner before wrapping with the second protective mass 84 and optionally adjusted. Alternatively, this would of course be possible even after separation.
  • an angled loading ⁇ rich 94 which stiffens the lead frame 44th
  • This angled region 94 can be achieved by bending a part of the leadframe into an L-shape or a U-shape in section.
  • At least one sealing element can be arranged, for example in the form of a sealing ring 96, which seals a gap 98 between the two protective compounds 72, 84.
  • This sealing ring 96 also dampens vibrations in a particularly favorable manner.
  • a sensor manufactured in the context of the method described above can be produced in any desired manner by the design of the leadframe and different configurations, independently of its sensor-specific differences such as measuring principle, sensing direction, wiring.
  • Devices can be connected to the leadframe 44 even after wrapping with the mechanical decoupler 68 standard ICs. So production-tested ICs can be used ⁇ example.
  • a protective circuit can be installed. It may, as seen in Figures 4 and 5, be installed in the component subunit.
  • the final preform can be made identical in its external dimensions, so that a central production of the
  • Protection mass 84 can be distributed.
  • the proposed method is characterized in that the entire process chain for producing a sensor has low tolerances and that a high tightness between the lead frame 44 and the protective compounds 72, 84 is given (the essential seal is made by the first protective compound 72).
  • the thermal expansion coefficient may be dimensioned for 72 material of the leadframe 44 so in terms of decoupling and protection compound 68, that only minor differences in linear expansion temperature changes occurring defects ⁇ th. A significantly longer service life is waiting thus to be expected.
  • the advantage of this concept is that no additional handling is required. Only another tool for wrapping in the second protective mass 84 may be necessary. In a tool for wrapping with the second protective mass 84, retrofit fixing pins could be required. If the sensor is designed in Carrier Design, there is an additional leadframe, a carrier-mold and a
  • IC-in-carrier assembly station required.
  • cost savings can be expected in drawing set production, qualification, mold flow simulation, process optimization, logistics, tool manufacturing and BOM.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un procédé de réalisation d'un détecteur (10, 28) comportant un circuit de détection (35, 40) porté par un îlot d'implantation (48) d'un porte-circuit (44), ledit circuit de détection servant à émettre un signal de détection (42) dépendant d'un champ de détection physique (33), et une interface (76) destinée à transmettre le signal de détection (42) à un dispositif de traitement de signal (18) supérieur. Le procédé comprend les étapes consistant : à envelopper une partie du porte-circuit (44) contenant l'îlot d'implantation (48) et le circuit de détection (35, 40) dans une première masse de protection (72) dans laquelle est formé un élément à complémentarité de forme (74) ; à envelopper au moins une partie de la première masse de protection (72) contenant l'élément à complémentarité de forme (74), et l'interface (76) dans une seconde masse de protection (84).
PCT/EP2015/066161 2014-07-11 2015-07-15 Détecteur spécifique au client réalisé par triple moulage Ceased WO2016005609A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213588.5 2014-07-11
DE102014213588.5A DE102014213588A1 (de) 2014-07-11 2014-07-11 Kundenspezifischer Sensor hergestellt durch Dreifach-Molden

Publications (2)

Publication Number Publication Date
WO2016005609A2 true WO2016005609A2 (fr) 2016-01-14
WO2016005609A3 WO2016005609A3 (fr) 2016-03-24

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Application Number Title Priority Date Filing Date
PCT/EP2015/066161 Ceased WO2016005609A2 (fr) 2014-07-11 2015-07-15 Détecteur spécifique au client réalisé par triple moulage

Country Status (2)

Country Link
DE (1) DE102014213588A1 (fr)
WO (1) WO2016005609A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017198573A1 (fr) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Procédé pour enrober une unité électrique et composant électrique
WO2020127197A1 (fr) * 2018-12-21 2020-06-25 Continental Teves Ag & Co. Ohg Technologie de connexion de soudage par ultrasons dans la ligne de produits des capteurs de vitesse des roues

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224257A1 (de) * 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Elektrische Leiterbahn, Verfahren und Verwendung
DE102016207664A1 (de) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug

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Publication number Priority date Publication date Assignee Title
US4847557A (en) * 1987-03-18 1989-07-11 Sumitomo Electric Industries, Ltd. Hermetically sealed magnetic sensor
JP3671563B2 (ja) * 1996-12-09 2005-07-13 株式会社デンソー モールドｉｃをケースに固定した構造の半導体装置
DE10146949A1 (de) 2000-11-22 2002-06-06 Continental Teves Ag & Co Ohg Aktiver Magnetsensor für elektronische Bremssysteme
JP2004198240A (ja) * 2002-12-18 2004-07-15 Denso Corp センサ装置
DE102008064046A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102011080789B4 (de) 2010-08-10 2022-11-10 Continental Automotive Technologies GmbH Verfahren und System zur Regelung der Fahrstabilität
JP5573826B2 (ja) * 2011-12-16 2014-08-20 株式会社デンソー 回転検出装置およびその製造方法
WO2013117772A1 (fr) * 2012-02-10 2013-08-15 Continental Teves Ag & Co. Ohg Capteur moulé à deux niveaux
DE102012223982A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer elektronischen Baugruppe
DE102014208425A1 (de) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Sensors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017198573A1 (fr) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Procédé pour enrober une unité électrique et composant électrique
WO2020127197A1 (fr) * 2018-12-21 2020-06-25 Continental Teves Ag & Co. Ohg Technologie de connexion de soudage par ultrasons dans la ligne de produits des capteurs de vitesse des roues

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WO2016005609A3 (fr) 2016-03-24
DE102014213588A1 (de) 2016-02-18

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