WO2016005609A3 - Kundenspezifischer sensor hergestellt durch dreifach-molden - Google Patents

Kundenspezifischer sensor hergestellt durch dreifach-molden Download PDF

Info

Publication number
WO2016005609A3
WO2016005609A3 PCT/EP2015/066161 EP2015066161W WO2016005609A3 WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3 EP 2015066161 W EP2015066161 W EP 2015066161W WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
triple
moulding
customer
specific sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/066161
Other languages
English (en)
French (fr)
Other versions
WO2016005609A2 (de
Inventor
Jakob Schillinger
Dietmar Huber
Lothar Biebricher
Manfred Goll
Marc Panis
Ulrich Schrader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of WO2016005609A2 publication Critical patent/WO2016005609A2/de
Publication of WO2016005609A3 publication Critical patent/WO2016005609A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Herstellen eines Sensors (10, 28) mit einer auf einer Bestückinsel (48) eines Schaltungsträgers (44) getragenen Sensorschaltung (35, 40) zur Ausgabe eines von einem physikalischen Geberfeld (33) abhängigen Sensorsignals (42) und mit einer Schnittstelle (76) zum Senden des Sensorsignals (42) an eine übergeordnete Signalverarbeitungseinrichtung (18), umfassend: - Einhüllen eines die Bestückinsel (48) und die Sensorschaltung (35, 40) enthaltenen Teils des Schaltungsträgers (44) in einer ersten Schutzmasse (72), in der ein Formschlusselement (74) ausgebildet wird, - Einhüllen wenigstens eines das Formschlusselement (74) enthaltenden Teils der ersten Schutzmasse (72) und der Schnittstelle (76) in einer zweiten Schutzmasse (84).
PCT/EP2015/066161 2014-07-11 2015-07-15 Kundenspezifischer sensor hergestellt durch dreifach-molden Ceased WO2016005609A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213588.5 2014-07-11
DE102014213588.5A DE102014213588A1 (de) 2014-07-11 2014-07-11 Kundenspezifischer Sensor hergestellt durch Dreifach-Molden

Publications (2)

Publication Number Publication Date
WO2016005609A2 WO2016005609A2 (de) 2016-01-14
WO2016005609A3 true WO2016005609A3 (de) 2016-03-24

Family

ID=55065032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/066161 Ceased WO2016005609A2 (de) 2014-07-11 2015-07-15 Kundenspezifischer sensor hergestellt durch dreifach-molden

Country Status (2)

Country Link
DE (1) DE102014213588A1 (de)
WO (1) WO2016005609A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224257A1 (de) * 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Elektrische Leiterbahn, Verfahren und Verwendung
DE102016207664A1 (de) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
DE102016208782A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
CN216483147U (zh) * 2018-12-21 2022-05-10 大陆-特韦斯贸易合伙股份公司及两合公司 传感器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (de) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Sensor zur Feststellung von einer Änderung im magnetischen Feld
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (de) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Sensors

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146949A1 (de) 2000-11-22 2002-06-06 Continental Teves Ag & Co Ohg Aktiver Magnetsensor für elektronische Bremssysteme
DE102008064046A1 (de) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102011080789B4 (de) 2010-08-10 2022-11-10 Continental Automotive Technologies GmbH Verfahren und System zur Regelung der Fahrstabilität
WO2013117772A1 (de) * 2012-02-10 2013-08-15 Continental Teves Ag & Co. Ohg Zweistufig gemoldeter sensor
DE102012223982A1 (de) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen einer elektronischen Baugruppe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (de) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Sensor zur Feststellung von einer Änderung im magnetischen Feld
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (de) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Verfahren zum Herstellen eines Sensors

Also Published As

Publication number Publication date
DE102014213588A1 (de) 2016-02-18
WO2016005609A2 (de) 2016-01-14

Similar Documents

Publication Publication Date Title
EP3754326B8 (de) Integrierter optischer schaltkreis mit eingekapseltem referenzarm
EP3531131A4 (de) Halbleitersensor und herstellungsverfahren dafür sowie verbundsensor
WO2015049321A3 (en) A sensor for an oral appliance
EP4152012A3 (de) Verpackung für eine elektronische schaltung
MY155671A (en) LED package and method for manufacturing same
EP3419170A4 (de) Schutzschaltung, verfahren zum betrieb einer schutzschaltung und integrierte halbleiterschaltung
WO2016155936A3 (de) Verfahren zur herstellung mindestens eines federkontaktstifts oder einer federkontaktstift-anordnung sowie entsprechende vorrichtungen
HK1207522A2 (en) A digital stylus
EP3222692A4 (de) Licht- und wärmehärtender tintenstrahlklebstoff, halbleiterbauelementherstellungsverfahren und elektronisches teil
WO2016081318A3 (en) Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield
EP3249022A4 (de) Tintenstrahlklebstoff, verfahren zur herstellung eines halbleiterbauelements und elektronische komponente
EP3098844A4 (de) Wärmeableitendes element, verfahren zur herstellung eines wärmeableitenden elements, elektronische vorrichtung, verfahren zur herstellung einer elektronischen vorrichtung, integriertes modul und informationsverarbeitungssystem
WO2016005609A3 (de) Kundenspezifischer sensor hergestellt durch dreifach-molden
EP3144985A4 (de) Phosphor, keramik versiegeltes optisches halbleiterelement, leiterplatte, optisches halbleiterbauelement und lichtemittierende vorrichtung
PH12018501307A1 (en) Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators
MX2015015165A (es) Metodo para proporcionar un sistema optico montado en la cabeza.
WO2017097786A3 (fr) Dispositif et procédé d'assistance à la conduite
WO2014095316A3 (de) Elektronische vorrichtung und verfahren zur herstellung einer elektronischen vorrichtung
MY181325A (en) Chip scale packages and related methods
MX2019010304A (es) Dispositivo y metodo para determinar la longitud de una linea.
WO2014036456A3 (en) Method and apparatus for routing die signals using external interconnects
WO2017050047A1 (zh) 芯片组以及电子设备
WO2016037675A8 (de) Träger für ein sensorelement, bauteilgruppe und drehzahlsensor
TW201614739A (en) Package structure and method of manufacture
PH12018500414A1 (en) Air cavity package

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15741145

Country of ref document: EP

Kind code of ref document: A2