WO2016005609A3 - Customer-specific sensor produced by triple moulding - Google Patents

Customer-specific sensor produced by triple moulding Download PDF

Info

Publication number
WO2016005609A3
WO2016005609A3 PCT/EP2015/066161 EP2015066161W WO2016005609A3 WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3 EP 2015066161 W EP2015066161 W EP 2015066161W WO 2016005609 A3 WO2016005609 A3 WO 2016005609A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
triple
moulding
customer
specific sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2015/066161
Other languages
German (de)
French (fr)
Other versions
WO2016005609A2 (en
Inventor
Jakob Schillinger
Dietmar Huber
Lothar Biebricher
Manfred Goll
Marc Panis
Ulrich Schrader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of WO2016005609A2 publication Critical patent/WO2016005609A2/en
Publication of WO2016005609A3 publication Critical patent/WO2016005609A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention relates to a method for producing a sensor (10, 28) comprising a sensor circuit (35, 40) supported on an assembly island (48) of a circuit carrier (44) for emitting a sensor signal (42) dependent on a physical transmitting field (33) and comprising an interface (76) for transmitting the sensor signal (42) to a superordinate signal processing device (18). Said method comprises the following steps: Enveloping one part of the circuit carrier (44) containing the assembly island (48) and the sensor circuit (35, 40) in a first protective compound (72) in which a positive fit element (74) is formed; enveloping at least one part of the first protective compound (72) containing the positive fit elements (74) and the interface (76) in a second protective compound (84).
PCT/EP2015/066161 2014-07-11 2015-07-15 Customer-specific sensor produced by triple moulding Ceased WO2016005609A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213588.5 2014-07-11
DE102014213588.5A DE102014213588A1 (en) 2014-07-11 2014-07-11 Custom sensor manufactured by Triple Molden

Publications (2)

Publication Number Publication Date
WO2016005609A2 WO2016005609A2 (en) 2016-01-14
WO2016005609A3 true WO2016005609A3 (en) 2016-03-24

Family

ID=55065032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/066161 Ceased WO2016005609A2 (en) 2014-07-11 2015-07-15 Customer-specific sensor produced by triple moulding

Country Status (2)

Country Link
DE (1) DE102014213588A1 (en)
WO (1) WO2016005609A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015224257A1 (en) * 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Electrical trace, method and use
DE102016207664A1 (en) * 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg SENSOR ELEMENT FOR A MOTOR VEHICLE
DE102016208782A1 (en) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Method of encasing an electrical unit and electrical component
CN216483147U (en) * 2018-12-21 2022-05-10 大陆-特韦斯贸易合伙股份公司及两合公司 sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (en) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Sensor for detecting variation in magnetic field
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (en) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Method for producing a sensor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146949A1 (en) 2000-11-22 2002-06-06 Continental Teves Ag & Co Ohg Active magnetic sensor for electronic brake systems
DE102008064046A1 (en) 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Method for producing a speed sensor element
DE102011080789B4 (en) 2010-08-10 2022-11-10 Continental Automotive Technologies GmbH Process and system for controlling driving stability
WO2013117772A1 (en) * 2012-02-10 2013-08-15 Continental Teves Ag & Co. Ohg Sensor molded in two stages
DE102012223982A1 (en) * 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Method for producing an electronic assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0282967A2 (en) * 1987-03-18 1988-09-21 Sumitomo Electric Industries, Ltd. Sensor for detecting variation in magnetic field
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
US20040118227A1 (en) * 2002-12-18 2004-06-24 Masatoshi Tokunaga Sensor having resin mold casing and method of manufacturing the same
US20130154626A1 (en) * 2011-12-16 2013-06-20 Denso Corporation Rotation detection device and manufacturing method for the same
DE102014208425A1 (en) * 2013-11-28 2015-05-28 Continental Teves Ag & Co. Ohg Method for producing a sensor

Also Published As

Publication number Publication date
DE102014213588A1 (en) 2016-02-18
WO2016005609A2 (en) 2016-01-14

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