WO2017140671A3 - Wärmeübertrager - Google Patents

Wärmeübertrager Download PDF

Info

Publication number
WO2017140671A3
WO2017140671A3 PCT/EP2017/053284 EP2017053284W WO2017140671A3 WO 2017140671 A3 WO2017140671 A3 WO 2017140671A3 EP 2017053284 W EP2017053284 W EP 2017053284W WO 2017140671 A3 WO2017140671 A3 WO 2017140671A3
Authority
WO
WIPO (PCT)
Prior art keywords
type
fin structure
semiconductors
heat exchanger
base layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/053284
Other languages
English (en)
French (fr)
Other versions
WO2017140671A2 (de
Inventor
DR. Jürgen GRÜNWALD
Christian Heneka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle International GmbH
Original Assignee
Mahle International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mahle International GmbH filed Critical Mahle International GmbH
Priority to CN201780011854.1A priority Critical patent/CN108701745A/zh
Priority to US15/999,526 priority patent/US20200161526A1/en
Priority to DE112017000863.8T priority patent/DE112017000863A5/de
Publication of WO2017140671A2 publication Critical patent/WO2017140671A2/de
Publication of WO2017140671A3 publication Critical patent/WO2017140671A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Die vorliegende Erfindung betrifft einen Wärmeübertrager (1) mit einer Rippenstruktur (4) und einer thermoelektrischen Temperiereinrichtung (6) mit zumindest einem Peltierelement (7), das p-dotierte P-Halbleiter (8) und n-dotierte N-Halbleiter (9) aufweist. Eine verbesserte Effizienz und eine erhöhte Belastbarkeit des Wärmeübertragers (1) ergibtsich durch Verbindungsstrukturen (12), diejeweils eine elektrisch isolierende Grundschicht (13) und eine elektrisch leitende Verbindungsschicht (14) aufweisen, wobei die Grundschicht (13) an der Rippenstruktur (4) vorgesehen ist und die Verbindungsschicht (14) auf der Grundschicht (13) angebracht ist, wobei zugehörige Halbleiter (8, 9) zum elektrischen Verbinden an der Verbindungsschicht (14) angebracht sind. Die Erfindung betrifft desweiteren eine Anordnung (21) aus einer solchen Rippenstruktur (4) sowie einer solchen Temperiereinrichtung (6), dessen Halbleiter (8, 9) mittels solcher Verbindungsstrukturen (12) elektrisch miteinander kontaktiert und an der Rippenstruktur (4) angebracht sind.
PCT/EP2017/053284 2016-02-17 2017-02-14 Wärmeübertrager Ceased WO2017140671A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780011854.1A CN108701745A (zh) 2016-02-17 2017-02-14 热交换器
US15/999,526 US20200161526A1 (en) 2016-02-17 2017-02-14 Heat exchanger
DE112017000863.8T DE112017000863A5 (de) 2016-02-17 2017-02-14 Wärmeübertrager

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016202435.3A DE102016202435A1 (de) 2016-02-17 2016-02-17 Wärmeübertrager
DE102016202435.3 2016-02-17

Publications (2)

Publication Number Publication Date
WO2017140671A2 WO2017140671A2 (de) 2017-08-24
WO2017140671A3 true WO2017140671A3 (de) 2018-02-01

Family

ID=58044075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/053284 Ceased WO2017140671A2 (de) 2016-02-17 2017-02-14 Wärmeübertrager

Country Status (4)

Country Link
US (1) US20200161526A1 (de)
CN (1) CN108701745A (de)
DE (2) DE102016202435A1 (de)
WO (1) WO2017140671A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110425767A (zh) * 2019-08-30 2019-11-08 冠冷科技(深圳)有限公司 一种方便调整形状的热电半导体制冷制热装置
DE102019214497A1 (de) * 2019-09-23 2021-03-25 Mahle International Gmbh Rohrkörper-Anordnung für eine Temperiereinrichtung, Temperiereinrichtung sowie elektrische Vorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635037A (en) * 1969-09-02 1972-01-18 Buderus Eisenwerk Peltier-effect heat pump
US20030102554A1 (en) * 2001-10-11 2003-06-05 Rencai Chu Thermoelectric module
DE102009058550A1 (de) * 2009-07-21 2011-01-27 Emcon Technologies Germany (Augsburg) Gmbh Thermoelektrisches Modul, Baugruppe mit Modul, thermoelektrische Generatoreinheit und Abgasleitungsvorrichtung mit Generatoreinheit
EP2513584A2 (de) * 2009-12-16 2012-10-24 Behr GmbH & Co. KG Thermoelektrischer wärmetauscher

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138934A (en) * 1962-11-19 1964-06-30 Kysor Industrial Corp Thermoelectric heating and cooling system for vehicles
JP3451107B2 (ja) * 1992-10-05 2003-09-29 株式会社エコ・トゥエンティーワン 電子冷却装置
JP3951315B2 (ja) * 1995-05-26 2007-08-01 松下電工株式会社 ペルチェモジュール
DE10022726C2 (de) * 1999-08-10 2003-07-10 Matsushita Electric Works Ltd Thermoelektrisches Modul mit verbessertem Wärmeübertragungsvermögen und Verfahren zum Herstellen desselben
JP3510831B2 (ja) * 1999-12-22 2004-03-29 株式会社小松製作所 熱交換器
JP2003332642A (ja) * 2002-05-10 2003-11-21 Komatsu Electronics Inc 熱電変換素子ユニット
US7032389B2 (en) * 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US9105809B2 (en) * 2007-07-23 2015-08-11 Gentherm Incorporated Segmented thermoelectric device
US20090236087A1 (en) * 2008-03-19 2009-09-24 Yamaha Corporation Heat exchange device
KR101195674B1 (ko) * 2009-01-29 2012-10-30 야마하 가부시키가이샤 열교환 유닛

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635037A (en) * 1969-09-02 1972-01-18 Buderus Eisenwerk Peltier-effect heat pump
US20030102554A1 (en) * 2001-10-11 2003-06-05 Rencai Chu Thermoelectric module
DE102009058550A1 (de) * 2009-07-21 2011-01-27 Emcon Technologies Germany (Augsburg) Gmbh Thermoelektrisches Modul, Baugruppe mit Modul, thermoelektrische Generatoreinheit und Abgasleitungsvorrichtung mit Generatoreinheit
EP2513584A2 (de) * 2009-12-16 2012-10-24 Behr GmbH & Co. KG Thermoelektrischer wärmetauscher

Also Published As

Publication number Publication date
CN108701745A (zh) 2018-10-23
DE102016202435A1 (de) 2017-08-17
DE112017000863A5 (de) 2018-11-15
WO2017140671A2 (de) 2017-08-24
US20200161526A1 (en) 2020-05-21

Similar Documents

Publication Publication Date Title
US9620700B2 (en) Wafer scale thermoelectric energy harvester
JP6114398B2 (ja) 熱電モジュール
US20150333246A1 (en) Heat conversion device
WO2016129873A3 (ko) 발광소자 및 발광 다이오드
WO2013039344A3 (ko) 발광 다이오드 및 그것을 제조하는 방법
JP2012064849A5 (de)
IN2015DN00029A (de)
RU2011104079A (ru) Раздельная термоэлектрическая структура, устройства и системы, в которых используется эта структура
MY203375A (en) Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
JP2013098561A5 (de)
WO2012054335A8 (en) Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
EP2894682A3 (de) Thermoelektrisches Modul und Wärmeumwandlungsvorrichtung damit
JP2013026618A (ja) 熱電モジュール
WO2010003629A3 (en) Thermoelectric apparatus and methods of manufacturing the same
TW200802997A (en) Thermoelectric device
JP2015201557A5 (de)
WO2014074933A3 (en) Microelectronic assembly with thermally and electrically conductive underfill
WO2009077468A3 (de) Thermoelektrisches modul und thermoelektrischer generator
WO2017140671A3 (de) Wärmeübertrager
WO2012057482A3 (ko) 수직형 발광 다이오드 셀 어레이 및 그의 제조 방법
WO2015130364A3 (en) Materials for thermoelectric energy conversion
WO2018162438A3 (de) Verfahren zum herstellen von thermoelektrischen bausteinen
JP6524406B2 (ja) 熱電変換モジュール
KR101795172B1 (ko) 열전모듈 구조
US10672968B2 (en) Thermoelectric devices

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17705121

Country of ref document: EP

Kind code of ref document: A2

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
REG Reference to national code

Ref country code: DE

Ref legal event code: R225

Ref document number: 112017000863

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17705121

Country of ref document: EP

Kind code of ref document: A2