WO2017155249A1 - Système de lamination pour fabriquer un substrat à base de céramique, et procédé de fabrication d'un substrat à base de céramique l'utilisant - Google Patents

Système de lamination pour fabriquer un substrat à base de céramique, et procédé de fabrication d'un substrat à base de céramique l'utilisant Download PDF

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Publication number
WO2017155249A1
WO2017155249A1 PCT/KR2017/002331 KR2017002331W WO2017155249A1 WO 2017155249 A1 WO2017155249 A1 WO 2017155249A1 KR 2017002331 W KR2017002331 W KR 2017002331W WO 2017155249 A1 WO2017155249 A1 WO 2017155249A1
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WO
WIPO (PCT)
Prior art keywords
ceramic substrate
tool material
load
unit
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/KR2017/002331
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English (en)
Korean (ko)
Inventor
홍주섭
소장미
장원철
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KCC Corp
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KCC Corp
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Publication date
Application filed by KCC Corp filed Critical KCC Corp
Publication of WO2017155249A1 publication Critical patent/WO2017155249A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Definitions

  • the present invention relates to a lamination system for producing a ceramic substrate and a method for producing a ceramic substrate.
  • a so-called metal bonded ceramic substrate which is conventionally used as an electronic circuit board by bonding a metal such as copper (Cu) and aluminum (Al) to an insulating ceramic substrate such as alumina (Al 2 O 3 ), aluminum nitride (AlN), or the like, It is widely used and used as a component of semiconductor devices.
  • a metal such as copper (Cu) and aluminum (Al)
  • an insulating ceramic substrate such as alumina (Al 2 O 3 ), aluminum nitride (AlN), or the like.
  • a metal plate such as copper is placed in contact with the ceramic substrate, and then heated to a temperature lower than the melting point of copper (1083 ° C) and higher than the eutectic point of copper and oxygen (1065 ° C).
  • a direct bonding copper (DBC) method for directly bonding a substrate to a substrate has been developed and commercialized.
  • ceramic circuit boards manufactured by an active metal method for joining metal circuit boards through a brazing filler metal layer have also been developed and applied to power semiconductors requiring high reliability.
  • Metal-bonded ceramic substrates can be manufactured simultaneously with circuit boards having several identical circuit patterns arranged in a trend of applying a method of forming a desired circuit pattern by chemically etching a metal plate after bonding a metal plate to a ceramic substrate.
  • the manufactured circuit board is finally cut into individual products through laser processing.
  • the metal bonded ceramic substrate is cut into individual circuit boards, and then the semiconductor is mounted.
  • the composite array circuit board is effective only when the cutting line is processed with a laser.
  • Due to the large size of the metal-bonded ceramic substrate in the composite array it is not only difficult to transfer the process through automated process or vacuum fixing for mass production due to the warpage of the board, but also due to breakage during loading or transfer. There is also a high probability of failure. Therefore, in order to solve this problem, studies are being actively conducted to improve the warpage of the composite array metal-bonded ceramic substrate.
  • Patent Document 1 Domestic Patent Publication No. 10-1280250
  • Patent Document 2 Japanese Laid-Open Patent No. 2011-216533
  • This invention makes it a technical subject to provide the lamination
  • a method of manufacturing a ceramic substrate comprising: loading a ceramic substrate on a mounting tool material in direct contact with a combustion furnace; and placing a lid on the ceramic substrate loaded on the mounting tool material, wherein the lid part Laminating a load tool material such that a predetermined load is applied onto the ceramic substrate.
  • the multilayer system for manufacturing a ceramic substrate according to the present invention and a method for manufacturing a ceramic substrate using the same, it is possible to improve the warpage of the manufactured ceramic substrate.
  • FIG. 1 is a view showing a lamination system for manufacturing a ceramic substrate according to an embodiment of the present invention.
  • FIG. 2 is a view showing a lamination system for manufacturing a ceramic substrate according to another embodiment of the present invention.
  • FIG 3 is a view showing a lamination system for manufacturing a ceramic substrate according to another embodiment of the present invention.
  • the alumina ceramic substrate is manufactured by molding a green sheet by a tape casting method and heat treatment (sintering) at a high temperature in consideration of productivity.
  • the ceramic substrate is warped by a long axis or a short axis.
  • One is known to be due to the difference in ceramic substrate shrinkage. Due to the horizontal and longitudinal particle arrangement of the green sheet formed by the tape casting method, and the difference between the upper and lower densities, the shrinkage difference occurs during the sintering process, which causes heat and warp in the long axis or short axis.
  • the other is warping due to the influence of temperature and cooling rate in the sintering process, which is a heat treatment.
  • the larger or thinner the ceramic substrate the greater the likelihood of warpage and the degree of warpage.
  • metal bonding mounted on the substrate may not be easy, and thus work efficiency and productivity may be reduced.
  • the warpage of the bonded substrate may be affected and a packaging process may not be normally performed in a subsequent process. Since the warpage of the ceramic substrate is closely related to the warpage of the metal bonded substrate, the warpage of the ceramic substrate should be minimized.
  • the term "bending" in the present invention means a percentage of the length deformation amount in the thickness direction with respect to the long axis longitudinal direction of each member.
  • a support unit 121 supporting a lower portion of the ceramic substrate 122 and a cover portion 123 surrounding the upper portion of the ceramic substrate may include one unit. And a unit tool material 120 to be formed.
  • the support part 121 and the cover part 123 may be formed to stack a plurality of unit sets in a lamination system according to an embodiment of the present invention as described below.
  • the cover part 123 is located on the upper part of the unit tool material 120 to directly affect the ceramic substrate 122 by heat transfer during the high temperature treatment in the combustion furnace, and to minimize the influence of the load. The action can be performed.
  • the stacking system for manufacturing a ceramic substrate of the present invention includes a mounting tool member 110 and the unit tool member, on which the support part 121 of the unit tool member 120 rests and surrounds the unit tool member. Located on the cover 123 of the 120 and includes a load tool 130 for applying a load to the unit tool 120.
  • the seating tool 110 is located at the lowest end of the stacking system 100 of the present invention, and does not directly contact the ceramic substrate 122 during the reheating treatment of the ceramic substrate 122,
  • the unit tool material 120 is disposed on the mounting tool material 110, and thus serves as a combustion furnace and a lamination system support, and the mounting tool material is heated at a high temperature. Since the slope of the entire lamination system is changed during deformation, an even load may not be applied to the ceramic substrate, and thus a ceramic material having a low deformation rate may be used even at a high temperature.
  • the load tool material 130 may serve to increase the flatness of the ceramic substrate by evenly loading the load on the ceramic substrate included in the lamination system 100 at a high temperature.
  • the material of the load tool member 130 may be applied to a ceramic-based material that is resistant to deformation at high temperatures and has high thermal conductivity.
  • the weight to apply the load of the load tool material 130 may be set to 0.5kg or more and less than 6kg. If the weight of the load tool 130 is less than 0.5kg, the weight is too low may not be easy to improve the warp of the ceramic substrate, if the weight of the load tool 130 is more than 6kg impose too high load Due to this, an excessive load may be applied to the ceramic substrate inside the lamination system, thereby deforming the ceramic substrate.
  • the warpage of the ceramic substrate can be improved by performing heat treatment on the warpage of the manufactured ceramic substrate using the lamination system in the combustion furnace. This is to improve the warpage of the ceramic substrate efficiently in terms of the structural aspect of the lamination system, but the inventors have also derived that it is possible to minimize the effective process and failure rate by changing the material of each member in the lamination system .
  • the seating tool material 110, the cover 123, the support portion 121, and the load tool material 130 is selected from the group consisting of Al 2 O 3 , SiC, and Si 3 N 4 . It may include one or more, according to an embodiment of the present invention, the mounting tool material 110 includes Al 2 O 3 because it is the lowest end of the lamination system and is not directly in contact with the ceramic substrate SiC may be included for the temperature uniformity at the time of heat processing.
  • the cover part 123 may include Al 2 O 3 which can be deformed at a high temperature for a buffering action because the cover part 123 is in direct contact with the ceramic substrate to affect deformation and minimize the influence of the load.
  • the 121 and the load tool material 130 may include SiC to resist heat deformation and to evenly transfer heat.
  • the mounting tool material 110 and the cover portion 123 may have a thickness of 2 to 20 mm. If the thickness of the mounting tool material is less than 2 mm, it is not good in terms of improving the warpage of the substrate, and if the thickness is more than 20 mm, the warpage size of the ceramic substrate is reduced, but the shape is unevenly changed, which is ineffective.
  • the base portion 121 may have a thickness of 2 to 20mm.
  • a plurality of unit tool members 120 may be included in the stacking system 100 for efficiency of the process.
  • the unit tool material 120 may minimize the above-described warping amount of the ceramic substrate, and increase the number of laminations within the range of the lower weight of the load tool material of the present invention as long as the temperature uniformity of the heat treatment process is maintained. Can be.
  • the bending of the seating tool member 110, the cover 123, the support portion 121, and the load tool member 130 according to an embodiment of the present invention is 0.5% of the strain in the thickness direction relative to the length of each tool material long axis It may be: By setting the strain at 0.5% or less, the warpage of the ceramic substrate reheated by the lamination system of the present invention can be improved to 0.5% or less.
  • the ceramic substrate 122 may have a thickness of 0.25 mm to 1.0 mm, and the ceramic substrate 122 may be formed of Al 2 O 3 , AlN, and Si 3 N 4 . It may include one or more selected one, may be included in the form of a stack of 1 to 100 sheets in the unit 120, for the efficiency of the process 20 to 40 sheets in a stacked form in the unit 120 It may be included.
  • a method of manufacturing a ceramic substrate comprising the steps of loading the ceramic substrate on a mounting tool material in direct contact with the combustion furnace in order to improve the warpage of the ceramic substrate produced by heat treatment and the mounting tool material phase Positioning the lid over the ceramic substrate loaded in, and laminating a load tool material to apply a predetermined load on the lid portion can provide a method of manufacturing a ceramic substrate.
  • the loading of the ceramic substrate on the mounting tool material may include laminating a support portion on the mounting tool material and laminating the ceramic substrate on the support portion. And a plurality of ceramic substrates having an upper portion and a lower portion wrapped with the cover part and the pedestal, may be stacked between the mounting tool material and the mounting tool material.
  • the cover part, the load tool material, and the support part may be the same or larger in width and width than the ceramic substrate.
  • a heat treatment is performed in a combustion furnace, and the heat treatment may be 1200 to 1500 ° C.
  • the heat treatment temperature is less than 1200 ° C.
  • the warpage change of the ceramic substrate may not be easy.
  • the heat treatment temperature is above 1500 ° C., the ceramic substrate and the ceramic substrate may be stuck due to the high temperature, or the ceramic substrate and the mounting tool material and Sticking with the support tool may occur.
  • the heating according to an embodiment of the present invention specifically, the stacking system of the present application laminated in the furnace may be disposed in the furnace, and the temperature may be raised from 1200 to 1500 °C from room temperature. Thereafter, the temperature may be maintained for 2 to 8 hours, and further comprising cooling to room temperature.
  • the warpage of the ceramic substrate may have a strain in the thickness direction with respect to the major axis length of 0.5% or less.
  • Example of this invention is described, the scope of a present invention is not limited to the following Example.
  • an Al 2 O 3 substrate having a thickness of 0.38 mm and a major axis length of 190 mm manufactured by a tape casting method was used.
  • a supporting part, a mounting tool material, a cover part, and a load tool material having the same width and width as the ceramic substrate were prepared, and a lamination system was formed in the order as shown in FIG. 2.
  • the unit tool material in which 40 ceramic substrates were stacked was 5, and a total of 200 ceramic substrates were included in the lamination system.
  • the thickness of the support part was 5 mm and included SiC
  • the thickness of the seating tool material was 5 mm
  • the thickness of the seating tool material was 5 mm
  • the thickness of the seating tool material was 5 mm
  • the thickness of the seating tool material was 5 mm
  • the thickness of the cover part was 5 mm
  • Al 2 O 3 was 5 mm
  • the loading tool material included SiC, and its weight was 0.5 kg.
  • the said lamination system was arrange
  • the same heating process was performed after the lamination system was formed like Example 1 except having made the weight of the said load tool material into 3.0 kg, and the ceramic substrate was obtained.
  • a copper metal plate having a thickness of 0.3 mm is placed in contact with the surface of the ceramic substrate, and then heated at a temperature of 1065 to 1200 ° C. under a reducing atmosphere in which nitrogen is added thereto.
  • the alumina copper bonded substrate was manufactured by the direct copper bonding (DCB) method of directly bonding the ceramic substrate.
  • a copper metal bonded alumina substrate was prepared in the same manner as in Example 4 except that the alumina substrate was not subjected to the reheating treatment of the ceramic substrate as in the present example.
  • TherMoir (Model PS200) was used as the warpage measuring device.
  • Table 1 shows the warpage size (mm) of the ceramic substrate before the heat treatment and the ceramic substrate after the heat treatment
  • Table 2 shows the warpage size (mm) of the metal bonded ceramic substrate after the metal bonding process of the ceramic substrate having the warpage difference.
  • Example 4 Weight of tool material none 0.5kg 1.5 kg 3 kg Average value of warpage of ceramic substrate after heat treatment 1.31mm0.69% 0.79mm0.42% 0.46mm0.24% 0.82 mm 0.43% Metal Bonded Board Bending Averages 1.39 mm 0.73% 0.81 mm 0.43% 0.52 mm 0.27% 0.88 mm 0.46%
  • the warpage of the ceramic substrate increases as the weight of the load tool material increases, and as the warpage of the ceramic substrate decreases, the warpage of the metal-bonded ceramic substrate also decreases.
  • Examples 1 to 3 of the present invention which have undergone the warpage improvement process of the ceramic substrate, have an average value of the warpage amount relative to the long axis length of 0.5% or less, so that a defective rate can be minimized in a subsequent mounting process or a bonding process. It was confirmed that a substrate with improved warpage could be obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne un système de lamination pour fabriquer un substrat à base de céramique, comprenant : un élément d'outil unitaire dans lequel une partie support supportant la partie inférieure du substrat à base de céramique et une partie couvercle recouvrant la partie supérieure du substrat à base de céramique forment une seule unité ; un élément d'outil de montage sur lequel la partie support de l'élément d'outil unitaire est montée et qui recouvre l'élément d'outil unitaire ; et un élément d'outil de charge qui est situé sur la partie couvercle de l'élément d'outil unitaire et donne une charge à l'élément d'outil unitaire.
PCT/KR2017/002331 2016-03-07 2017-03-03 Système de lamination pour fabriquer un substrat à base de céramique, et procédé de fabrication d'un substrat à base de céramique l'utilisant Ceased WO2017155249A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160027262A KR101900547B1 (ko) 2016-03-07 2016-03-07 세라믹 기판 제조용 적층 시스템 및 이를 이용한 세라믹 기판의 제조 방법
KR10-2016-0027262 2016-03-07

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WO2017155249A1 true WO2017155249A1 (fr) 2017-09-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020222501A1 (fr) * 2019-05-02 2020-11-05 주식회사 아모센스 Substrat en céramique et son procédé de fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102897765B1 (ko) * 2022-12-13 2025-12-10 주식회사 케이씨씨 세라믹 기판의 제조방법

Citations (5)

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JP2004253429A (ja) * 2003-02-18 2004-09-09 Matsushita Electric Ind Co Ltd セラミック多層基板の製造方法
KR20080012390A (ko) * 2008-01-17 2008-02-11 에스디에이테크놀러지 주식회사 다층인쇄회로기판의 가압접착방법
KR100965143B1 (ko) * 2009-10-27 2010-06-25 (주)앤피에스 서셉터 유닛 및 이를 구비하는 기판 처리 장치
JP4581575B2 (ja) * 2004-09-09 2010-11-17 株式会社村田製作所 板状セラミック体の製造方法及びセラミック焼成用荷重付加部材
KR101284093B1 (ko) * 2012-01-19 2013-07-10 주식회사 테라세미콘 기판용 지지 유닛 및 이를 사용한 기판 처리 장치

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Publication number Priority date Publication date Assignee Title
JP3994380B2 (ja) * 2002-06-14 2007-10-17 日立金属株式会社 セラミック多層基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253429A (ja) * 2003-02-18 2004-09-09 Matsushita Electric Ind Co Ltd セラミック多層基板の製造方法
JP4581575B2 (ja) * 2004-09-09 2010-11-17 株式会社村田製作所 板状セラミック体の製造方法及びセラミック焼成用荷重付加部材
KR20080012390A (ko) * 2008-01-17 2008-02-11 에스디에이테크놀러지 주식회사 다층인쇄회로기판의 가압접착방법
KR100965143B1 (ko) * 2009-10-27 2010-06-25 (주)앤피에스 서셉터 유닛 및 이를 구비하는 기판 처리 장치
KR101284093B1 (ko) * 2012-01-19 2013-07-10 주식회사 테라세미콘 기판용 지지 유닛 및 이를 사용한 기판 처리 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020222501A1 (fr) * 2019-05-02 2020-11-05 주식회사 아모센스 Substrat en céramique et son procédé de fabrication
US12183689B2 (en) 2019-05-02 2024-12-31 Amosense Co., Ltd. Ceramic substrate and manufacturing method therefor

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KR101900547B1 (ko) 2018-09-19
KR20170104329A (ko) 2017-09-15

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