WO2017197866A1 - Del et son procédé de fabrication, et dispositif électronique utilisant la del - Google Patents

Del et son procédé de fabrication, et dispositif électronique utilisant la del Download PDF

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Publication number
WO2017197866A1
WO2017197866A1 PCT/CN2016/107841 CN2016107841W WO2017197866A1 WO 2017197866 A1 WO2017197866 A1 WO 2017197866A1 CN 2016107841 W CN2016107841 W CN 2016107841W WO 2017197866 A1 WO2017197866 A1 WO 2017197866A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
emitting diode
light emitting
filler
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/107841
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English (en)
Chinese (zh)
Inventor
唐玮
王昌勇
聂宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of WO2017197866A1 publication Critical patent/WO2017197866A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Definitions

  • the present invention relates to the field of illuminating device technologies, and in particular, to an LED and a method of manufacturing the same, and an electronic device using the same.
  • the LED manufacturer causes the size of the gate to be prevented from protruding beyond the gate, leaving a gate in the middle portion of the LED and recessing the gate.
  • the recessed portion of the gate results in a poor strength in this region and is prone to breakage.
  • the thickness requirements of various components inside the mobile phone are further improved.
  • the appearance size of the light emitting diode (LED) is getting thinner and thinner, the intensity of the LED is significantly reduced.
  • the general LED size on mobile phones is 3.2*1.8*0.4mm.
  • the length of the LED of 2in1 technology is extended from 3.2mm to 3.8mm. The length of a single LED package becomes longer, which is equivalent to the support span becoming larger and the overall strength is reduced.
  • the latest technology 2in1LED, as well as the thinner 0.3mm thick LED further weakens.
  • Embodiments of the present invention provide an LED, a method of manufacturing the same, and an electronic device using the same, which provide a higher intensity LED by adding a filler to a gate of the LED.
  • An LED a method of manufacturing the same, and an electronic device using the same according to embodiments of the present invention. Pass The filler is filled on the gate of the LED body to increase the strength of the LED. The LED should be protected from damage caused by low strength.
  • a specific embodiment of the present invention provides a method of fabricating a light emitting diode, the method comprising determining a light emitting diode body, the determined light emitting diode body comprising an injection gate, the injection gate being a recessed notch.
  • the obtained light emitting diode body is fixed.
  • the surface of the light emitting diode body is not protruded.
  • fixing the obtained LED body specifically includes upwardly molding the injection gate of the LED body.
  • the setting of the filling is facilitated by setting the injection gate upward.
  • the fixing of the LED body to be obtained specifically includes fixing the LED body by a clamp.
  • the fixture is used to make the fixing of the LED more stable.
  • the filling of the injection gate of the fixed LED body comprises: injecting glue into the injection gate through the dispensing needle to form a filling.
  • the dispensing of the filler is more accurate by the dispensing needle, which reduces the exit of the unqualified product.
  • the glue injected into the injection gate is a UV shadowless glue. Thereby increasing the strength of the LED.
  • the glue injected into the injection gate is a thermoset glue. Thereby increasing the strength of the LED.
  • the glue injected into the injection gate is AB glue. Thereby increasing the strength of the LED.
  • a specific embodiment of the present invention provides a light emitting diode including a light emitting diode body and a filler.
  • the LED body includes an injection gate, the injection gate The gap is a depression.
  • the filler is disposed in the recessed recess of the injection gate and the filler does not exceed the dimensions of the LED body.
  • the filler is a UV shadowless glue. Thereby increasing the strength of the LED.
  • the filler is a thermoset glue. Thereby increasing the strength of the LED.
  • the filler is an AB glue. Thereby increasing the strength of the LED.
  • a specific embodiment of the present invention provides an electronic device including a screen, and a plurality of light emitting diodes according to any one of claims 8-11 are disposed under the screen.
  • the electronic device is a cell phone.
  • the light-emitting diode according to any one of claims 8-11 is disposed in the mobile phone, thereby improving the intensity of the light-emitting diode in the mobile phone and reducing the risk of LED breakage of the mobile phone.
  • the electronic device is a tablet.
  • the tablet computer is provided with a plurality of light emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light emitting diodes in the tablet computer and reducing the risk of LED breakage of the tablet computer.
  • the electronic device is a computer.
  • the computer is provided with a plurality of light-emitting diodes according to any one of claims 8-11, thereby improving the intensity of the light-emitting diodes in the computer and reducing the risk of LED breakage of the computer.
  • FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present disclosure
  • FIG. 4 is a schematic view of processing according to a specific embodiment of the present invention.
  • FIG. 5 is a filled LED according to an embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a display structure of an electronic device according to an embodiment of the present invention.
  • an electronic device 101 includes a liquid crystal display (LCD) and a light-emitting diode (LED) 105.
  • the LED 105 is disposed under the LCD 103 and passes through the LED 105.
  • a light source is provided for the LCD 103.
  • the LED is disposed on one side under the LCD, and other portions under the LCD are further provided with a light guide plate 104, through which the light emitted by the LED 105 is uniformly transmitted to the entire LCD 103.
  • the protective cover glass 102 is also disposed on the LCD 103 to protect the LCD 103 from force.
  • the LED body 202 is an LED body according to an embodiment of the present invention. As shown in FIG. 2, the LED body 202 further includes a gate 201 for injection molding, and the gate 201 has a recessed structure. In order to avoid that the size of the gate 201 of the LED during the injection molding process is larger than the size of the LED body 202, it is inconvenient to install the LED.
  • FIG. 3 is a schematic diagram of an LED injection molding method according to an embodiment of the present invention. The method is used to provide a higher intensity LED. As shown in FIG. 3, the method includes:
  • S301 determines a light emitting diode body, the determined light emitting diode body includes an injection gate, and the injection gate is a recessed notch.
  • the size of the gate portion is set to a recessed structure to prevent the gate from having the remaining glue so that the size of the gate is larger than the size of the entire LED.
  • FIG. 4 is a schematic view of a process according to an embodiment of the present invention.
  • the LED body 202 is placed in a dedicated jig 401, and the gate 201 is placed upward.
  • the example shown in FIG. 4 is only an example of the present invention and is not intended to limit the present invention.
  • Ben The jig of the embodiment of the invention may be in various forms as long as the LED body 202 can be fixed, that is, the jig described in the specific embodiment of the present invention.
  • the illustrated LED body 202 is disposed in a top open clamp 401, which is a top open rectangular frame that is slightly larger in size than the LED body 202.
  • the gate shown can also be secured in any orientation by the clamp 401.
  • S303 is filled with the injection gate of the fixed LED body, so that the recessed recess on the LED is provided with the filling by the filling manner, and after the filling fills the recess of the recess, the filling The object does not protrude from the surface of the light emitting diode body.
  • the dispensing needle 402 corresponds to the gate 201 by moving the LED body 202 provided with the clamp 401 below the dispensing needle 402.
  • the LED body 202 is dispensed by the dispensing needle 402, so that the recessed portion of the gate 201 is filled, and the strength of the LED body 202 is improved. And the filler of the LED body after the filler is filled does not protrude from the surface of the LED body
  • dispensing of the gate 201 by the dispensing needle 402 is only an example of a specific embodiment of the present invention, and any other method may be employed for filling the gate.
  • the filler to be cast by the dispensing needle 402 may be any one of various types of electronic device filling objects such as UV shadowless glue, thermosetting glue, and AB glue.
  • the dispensing needle 402 also needs to be irradiated with UV light to fill the filler to cure the filler.
  • a monitoring device is also disposed on one side of the dispensing tip 402.
  • the monitoring device is configured to determine whether the filled LED product is qualified.
  • the monitoring device is a camera monitoring device that photographs the LEDs after completing the filling of one of the LEDs. The results of the photographed after filling were compared with the results of photographing before filling.
  • the outline size of the photograph of the filled LED is the same as the outline of the outline of the photo of the LED before filling, the filled LED is a qualified product.
  • filled LED The contour of the photo is larger than the outline size of the photo of the LED before filling, and the filled LED is a defective product.
  • FIG. 5 is a filled LED according to an embodiment of the present invention.
  • an LED product 501 includes an LED body 202 and a filler 502.
  • the LED body 202 is provided with a filler 502 on the gate.
  • the outline size of the LED product 501 after the filler is added 502 is not greater than the outline size of the LED body 202 before the filler 502 is added.
  • an electronic device 101 as shown in FIG. 1, which employs an LED product 501 as shown in FIG.
  • the electronic device 101 can be any one or more of a mobile phone, a tablet, or a computer.

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne une diode électroluminescente (DEL) et son procédé de fabrication, et un dispositif électronique utilisant la DEL, la diode électroluminescente (105) comprenant un corps de diode électroluminescente (202) et une charge (502) ; le corps de diode électroluminescente (202) comprenant une carotte de moulage par injection (201), la carotte de moulage par injection (201) étant une encoche en retrait ; et la charge (502) étant disposée dans l'encoche en retrait de la carotte de moulage par injection (201), et la charge (502) ne dépassant pas la taille du corps de diode électroluminescente (202). Par introduction de la charge (502) sur la carotte (201) du corps de DEL (202), la résistance mécanique de la DEL est améliorée, de manière à éviter un endommagement de la DEL dû à une faible résistance mécanique.
PCT/CN2016/107841 2016-05-19 2016-11-30 Del et son procédé de fabrication, et dispositif électronique utilisant la del Ceased WO2017197866A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610340758.9A CN107403856B (zh) 2016-05-19 2016-05-19 一种led及其制造方法以及采用该led的电子设备
CN201610340758.9 2016-05-19

Publications (1)

Publication Number Publication Date
WO2017197866A1 true WO2017197866A1 (fr) 2017-11-23

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Application Number Title Priority Date Filing Date
PCT/CN2016/107841 Ceased WO2017197866A1 (fr) 2016-05-19 2016-11-30 Del et son procédé de fabrication, et dispositif électronique utilisant la del

Country Status (2)

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CN (1) CN107403856B (fr)
WO (1) WO2017197866A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113359345B (zh) * 2020-03-04 2023-06-02 华为技术有限公司 电子设备

Citations (5)

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US20060072315A1 (en) * 2004-10-05 2006-04-06 Byung-Woong Han White light generating unit, backlight assembly having the same and liquid crystal display device having the same
EP2506301A2 (fr) * 2011-03-31 2012-10-03 Yamaichi Electronics Co., Ltd. Carte souple à corps lumineux et dispositifs lumineux
CN202773244U (zh) * 2012-07-04 2013-03-06 吴江市博众精工科技有限公司 运动模组
CN203103352U (zh) * 2012-04-25 2013-07-31 嘉悠国际贸易（上海）有限公司 一种uv硅胶封装led
CN104483778A (zh) * 2014-12-31 2015-04-01 上海中航光电子有限公司 发光装置、背光模组及液晶显示装置

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KR100691364B1 (ko) * 2005-09-27 2007-03-09 삼성전기주식회사 도광판과 발광 패키지를 구비하는 발광장치
JP2008047573A (ja) * 2006-08-11 2008-02-28 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置の製造装置、樹脂封止型半導体装置の製造方法、および樹脂封止型半導体装置
KR200453847Y1 (ko) * 2009-01-19 2011-05-30 주식회사 파워라이텍 균일한 수지표면을 형성한 발광다이오드 패키지
CN101477974B (zh) * 2009-01-23 2011-04-20 日月光半导体制造股份有限公司 导线架条的封胶方法与具有导线架的半导体封装构造
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
CN101887871B (zh) * 2010-06-11 2012-12-05 日月光半导体制造股份有限公司 芯片封装结构、芯片封装模具与芯片封装工艺
JP5211131B2 (ja) * 2010-10-07 2013-06-12 株式会社ジャパンディスプレイイースト バックライト装置及び液晶表示装置
JP5836067B2 (ja) * 2011-10-31 2015-12-24 株式会社エンプラス 光束制御部材、発光装置、面光源装置および表示装置
CN203331359U (zh) * 2013-05-16 2013-12-11 上海甬兴塑胶有限公司 一种注塑件浇口切割装置
CN104626425A (zh) * 2013-11-11 2015-05-20 鸿富锦精密工业（深圳）有限公司 浇口残料修正装置

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US20060072315A1 (en) * 2004-10-05 2006-04-06 Byung-Woong Han White light generating unit, backlight assembly having the same and liquid crystal display device having the same
EP2506301A2 (fr) * 2011-03-31 2012-10-03 Yamaichi Electronics Co., Ltd. Carte souple à corps lumineux et dispositifs lumineux
CN203103352U (zh) * 2012-04-25 2013-07-31 嘉悠国际贸易（上海）有限公司 一种uv硅胶封装led
CN202773244U (zh) * 2012-07-04 2013-03-06 吴江市博众精工科技有限公司 运动模组
CN104483778A (zh) * 2014-12-31 2015-04-01 上海中航光电子有限公司 发光装置、背光模组及液晶显示装置

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CN107403856B (zh) 2019-10-22

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