WO2017207164A1 - Encapsulation d'une carte de circuits imprimés - Google Patents

Encapsulation d'une carte de circuits imprimés Download PDF

Info

Publication number
WO2017207164A1
WO2017207164A1 PCT/EP2017/059276 EP2017059276W WO2017207164A1 WO 2017207164 A1 WO2017207164 A1 WO 2017207164A1 EP 2017059276 W EP2017059276 W EP 2017059276W WO 2017207164 A1 WO2017207164 A1 WO 2017207164A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cover
hot
pin
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/059276
Other languages
German (de)
English (en)
Inventor
Dirk Osswald
Andreas Wehrle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Original Assignee
Endress and Hauser SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Publication of WO2017207164A1 publication Critical patent/WO2017207164A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/14—Casings, e.g. of special material

Definitions

  • the invention relates to a printed circuit board with a lid for the encapsulation of components located on the circuit board by means of a
  • Hot riveting is arranged on the circuit board.
  • field devices are often used which serve to detect and / or influence process variables.
  • Sensors that are used, for example, in level gauges, flowmeters, pressure and temperature measuring devices, pH redox potential measuring devices, conductivity meters, etc., which contain the corresponding process variables level, flow, pressure, temperature, pH value, redox potential, resp Detect conductivity.
  • actuators such as valves or pumps, are used to control the flow of a liquid in a single fluid
  • Pipe section or the level can be changed in a container.
  • Field devices are in principle all those devices that are used close to the process and that provide or process process-relevant information. In connection with the invention are under
  • Field devices also include remote I / Os, radio adapters or general
  • an elastomer for example Silgel®
  • Silgel® elastomer
  • a capping of the printed circuit board is necessary, by means of which the potting is fixed at the relevant points on the printed circuit board at least until it cures, in which case the fixing of the lid is critical, since on the one hand this should be time-consuming and fast.
  • the invention is therefore based on the object to provide a secure encapsulation of electronic components on printed circuit boards, which
  • the invention solves this problem with a printed circuit board
  • located components is disposed at least on a portion of an upper surface of the circuit board.
  • the first lid according to the invention by means of at least one
  • Hot rivet connection which consists of at least one hot-rivet pin and at least one passage corresponding to the pin, fixed to the printed circuit board.
  • the lid in contrast to existing methods little effort and quickly attached. It is advantageous here if the at least one hot-rivetable pin is arranged on the first cover and the printed circuit board has the one or more bushings corresponding thereto.
  • a second Lid is arranged, which means of at least one
  • Hot rivet connection is attached to the circuit board.
  • the first cover and / or second cover is configured such that at least one cavity is formed between the circuit board and the first cover and / or the second cover, and that in the at least one cavity, a potting material, for example SilGel ® is introduced.
  • a potting material for example SilGel ® is introduced.
  • the first cover and / or the second cover for sealing the at least one cavity it is necessary for the first cover and / or the second cover for sealing the at least one cavity to comprise at least one sealing element to protect against leakage of the uncured potting material.
  • a sealing element especially a sealing cord with O- or X-shaped cross section offers.
  • the at least first cover is made of a heat-Riveting material
  • the at least one pin is designed as an integral part of the first lid, whereby a separate attachment of the pins, for example by injection, is superfluous.
  • the invention provides a method for attaching the at least one cover on the circuit board according to one of the previously described embodiments variants. It includes the following
  • a first cover is so on an upper surface of the circuit board
  • At least one cavity is formed between the printed circuit board and the first cover and / or the second cover, it is preferred that the at least one cavity be formed by means of a potting material
  • a particularly time-efficient variant of the method is that the pins are simultaneously hot-riveted.
  • Fig. 1 a circuit board with two inventively arranged lids.
  • FIG. 1 shows a printed circuit board 1 with a first cover 2 arranged on the upper side 3 and a second cover 7 arranged on the lower side 6.
  • the two covers 2, 7 are connected to the circuit board 1 via hot rivet connections 4, 5, 10. In the example shown, this takes place via four H devisnieteducationen 4, 5, 10. These consist of a respectively arranged on the first cover 2 pin 4, a passage 5 at the
  • the first cover 2 is such a form-fitting plugged onto the top 3 of the circuit board 1, so that the four pins. 4 on the back of the four bushings 5 on the circuit board 1 survive.
  • the second cover 7 is fitted in a form-fitting manner onto the pins 4 protruding on the rear side, which protrude on the underside 6 of the printed circuit board 1, wherein the pins 4 also engage through the through-holes 10 provided there for the second cover 7.
  • those parts of the pins 4, which protrude beyond the bushings 10 on the second cover hot riveted. Depending on the production plant, this can be done serially or simultaneously.
  • the first cover 2 is made of a H Schonietbaren material and the pins 4 are designed as an integral part of the first lid 2. As a result, it is not necessary to attach the four pins 4 in an upstream production step on the first cover 2.
  • the two covers 2, 7 also each comprise a directed to the circuit board 1 cavity 8.
  • the lid 2, 7 each have a potting material, for example, a silicone elastomer can be introduced. Leakage of possibly not cured potting material is prevented by two sealing elements 9.
  • the sealing elements 9 are arranged on the first cover 2 and on the second cover 7 in such a way that they close the cavity 8 in a form-fitting manner to the upper side 3 or to the lower side 6.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne une carte de circuits imprimés comprenant un couvercle qui est disposé sur la carte de circuits imprimés pour l'encapsulation des composants se trouvant sur la carte de circuits imprimés. Selon l'invention, ce couvercle est fixé sur la carte de circuits imprimés à l'aide d'au moins un assemblage par rivetage à chaud faisant intervenir au moins un tourillon pouvant être riveté à chaud et au moins une traversée correspondant au tourillon. Par rapport aux procédés existants, cette invention permet une fixation peu complexe et rapide du couvercle dans lequel la matière d'enrobage est ultérieurement introduite. La fixation selon l'invention permet en outre le montage d'un deuxième couvercle d'encapsulation sur la face inférieure de la carte de circuits imprimés, sans qu'une étape de fixation supplémentaire soit nécessaire.
PCT/EP2017/059276 2016-05-31 2017-04-19 Encapsulation d'une carte de circuits imprimés Ceased WO2017207164A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016110052.8 2016-05-31
DE102016110052.8A DE102016110052B4 (de) 2016-05-31 2016-05-31 Feldgerät mit einer gekapselten Leiterplatte sowie Verfahren zur Kapselung einer Leiterplatte eines solchen Feldgerätes

Publications (1)

Publication Number Publication Date
WO2017207164A1 true WO2017207164A1 (fr) 2017-12-07

Family

ID=58549162

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/059276 Ceased WO2017207164A1 (fr) 2016-05-31 2017-04-19 Encapsulation d'une carte de circuits imprimés

Country Status (2)

Country Link
DE (1) DE102016110052B4 (fr)
WO (1) WO2017207164A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560840B1 (en) * 2000-11-10 2003-05-13 Yazaki North America Method for assembling a plurality of junction box components
EP1359662A1 (fr) * 2002-05-04 2003-11-05 Jungheinrich Aktiengesellschaft Système d'entrainement pour moteur triphasé basse tension avec commande de convertisseur
US20090039494A1 (en) * 2007-07-26 2009-02-12 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
US20090180265A1 (en) * 2006-03-02 2009-07-16 Lubomir Chlumsky Electric Device Having a Plastic Plug Part Arranged on a Circuit Support

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3011784B1 (fr) * 2013-10-11 2017-04-21 Valeo Vision Belgique Dispositif d'eclairage ou de signalisation de vehicule automobile et procede d'assemblage correspondant

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560840B1 (en) * 2000-11-10 2003-05-13 Yazaki North America Method for assembling a plurality of junction box components
EP1359662A1 (fr) * 2002-05-04 2003-11-05 Jungheinrich Aktiengesellschaft Système d'entrainement pour moteur triphasé basse tension avec commande de convertisseur
US20090180265A1 (en) * 2006-03-02 2009-07-16 Lubomir Chlumsky Electric Device Having a Plastic Plug Part Arranged on a Circuit Support
US20090039494A1 (en) * 2007-07-26 2009-02-12 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it

Also Published As

Publication number Publication date
DE102016110052B4 (de) 2018-10-04
DE102016110052A1 (de) 2017-11-30

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