WO2018016423A1 - セラミック－金属構造体 - Google Patents

セラミック－金属構造体 Download PDF

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Publication number
WO2018016423A1
WO2018016423A1 PCT/JP2017/025642 JP2017025642W WO2018016423A1 WO 2018016423 A1 WO2018016423 A1 WO 2018016423A1 JP 2017025642 W JP2017025642 W JP 2017025642W WO 2018016423 A1 WO2018016423 A1 WO 2018016423A1
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WIPO (PCT)
Prior art keywords
ceramic
ring member
metal structure
pad layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/025642
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English (en)
French (fr)
Inventor
宗之 岩田
善明 長屋
堀尾　俊和
茂幸 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to EP17830942.3A priority Critical patent/EP3488959A4/en
Priority to US16/302,758 priority patent/US10639736B2/en
Publication of WO2018016423A1 publication Critical patent/WO2018016423A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C04B2237/406—Iron, e.g. steel
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/74—Forming laminates or joined articles comprising at least two different interlayers separated by a substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y10T428/218—Aperture containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component

Definitions

  • the present invention relates to a ceramic-metal structure in which a ceramic and a metal are brazed.
  • Patent Document 1 a technique is known in which a flange made of Kovar is brazed to ceramic, for example, and a metal pipe part is connected to the flange 2 with a silver solder (Patent Document 1).
  • Patent Document 1 a technique is known in which a flange made of Kovar is brazed to ceramic, for example, and a metal pipe part is connected to the flange 2 with a silver solder.
  • Patent Document 1 a groove is provided at the end of the pipe part and the molten brazing material is dammed up by this groove, so that the brazing material does not flow into unnecessary portions and the brazing material is concentrated at the brazing location. And can be brazed firmly.
  • an object of the present invention is to provide a ceramic-metal structure that can prevent brazing from being peeled off at the time of cooling or cracks in a ceramic substrate and can ensure brazing.
  • the ceramic-metal structure of the present invention is such that a pipe-shaped or rod-shaped metal body is inserted into a through-hole penetrating in the thickness direction of the ceramic substrate from the surface of the ceramic substrate.
  • a ceramic-metal structure that is coaxially disposed immediately above the through-hole, and is disposed around the through-hole in the surface of the ceramic base, and is made of an annular metal A pad layer, an annular ring member bonded to the pad layer via a first row portion and having a smaller thermal expansion coefficient than the metal body, and between the ring member and the metal body A second row part interposed between the ring member and the metal body, and a pad of the outer surface of the pad layer so as to expose a central region of an upper surface facing the first row part.
  • a low flow prevention layer that covers an outer surface of the low flow prevention layer, wherein the first row portion joins the central region and the ring member without protruding to a radially inner side and a radial outer side of the low flow prevention layer. It is characterized by becoming.
  • the first row portion does not protrude radially inward and radially outward of the low flow preventing layer, so that the first row portion can be prevented from coming into direct contact with the ceramic base.
  • the low flow prevention layer covers the outer surface of the pad layer so as to expose the central region of the upper surface facing the first low portion, and this low flow prevention layer is disposed on the surface of the ceramic substrate.
  • the pad layer is formed so as to be in contact with the surface of the ceramic substrate so as to cover the inner and outer peripheral surfaces of the pad layer.
  • the low flow prevention layer is disposed on the interface between the most stressed ceramic substrate and the metal pad layer, and the strength is improved. Further, the end of the first row portion is disposed on the inner side of the interface. As a result, the stress applied to the interface is relaxed. As a result, the occurrence of cracks in the ceramic substrate can be suppressed and brazing can be ensured.
  • the outer diameter of the ring member is smaller than the outer diameter of the pad layer, and the first row portion is in contact with the outer peripheral surface of the ring member.
  • the first row portion has a fillet-shaped (concave) portion, it indicates that the molten row has penetrated between the ring member and the pad layer with sufficient wettability, and the brazing strength is improved.
  • the first row portion may have a portion that extends radially inward of the ring member and has a fillet shape. This part also has a fillet shape, so that brazing strength is improved.
  • the ceramic base and the brazing material flow preventing layer may be composed mainly of the same material. According to this ceramic-metal structure, since the main components of the ceramic base and the brazing material flow prevention layer are the same material, the adhesion between them is excellent.
  • a flow path is formed in the ceramic substrate, the flow path being connected to the through-hole and through which gas flows.
  • the metal body is pipe-shaped, and the metal body It may be possible to exchange gas between the flow path and the outside of the ceramic substrate through the inside of the ceramic substrate.
  • the ceramic base and the metal body are securely brazed. Gas leakage from the brazed portion can be suppressed, and gas can be exchanged stably.
  • FIG. 1 is an exploded perspective view of a ceramic-metal structure according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA in FIG.
  • FIG. 6 is a cross-sectional view showing a modification of the ceramic-metal structure according to the embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing another modified example of the ceramic-metal structure according to the embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of a ceramic-metal structure 100 according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along line AA of FIG.
  • a ceramic-metal structure 100 includes a pipe-shaped metal body 2, a substantially rectangular ceramic base 4 having a through-hole 4h, and a pad disposed around the through-hole 4h on the surface of the ceramic base 4.
  • Layer 6 low flow prevention layers 7 a and 7 b, which will be described in detail later, ring member 8 that forms an annular shape, first row portion 10 that joins pad layer 6 and ring member 8, ring member 8, and metal body 2. And a second row portion 12 for joining together.
  • the ceramic substrate 4 is a ceramic sintered body mainly composed of alumina, and the metal body 2 is formed of stainless steel.
  • the pad layer 6 is made of a metal and has an annular shape to improve the adhesion between the ceramic base 4 and the first row part 10 and to prevent the first row part 10 from being in direct contact with the ceramic base 4 and being brazed.
  • the pad layer 6 can be formed, for example, by printing a paste mainly composed of at least one of tungsten and molybdenum on the surface of the unfired body of the ceramic substrate 4, firing it, and further plating the surface with Ni.
  • the low flow preventing layers 7a and 7b are formed so that, for example, a paste of a material whose main component is the same as that of the ceramic base 4 (alumina in this example) is sandwiched between the green bodies of the ceramic base 4 and the pad layer 6 respectively. After printing in a ring shape, it can be formed by simultaneous firing with the ceramic substrate 4 and the pad layer 6.
  • the ring member 8 is formed of, for example, kovar having a smaller coefficient of thermal expansion than that of the metal body 2.
  • Au—Cu alloy, Ag—Cu alloy, and various conductor materials for example, Cu (copper) or Ag (silver)
  • Cu (copper) or Ag (silver) can be used as the brazing material for the first row portion 10 and the second row portion 12. It is.
  • a flow path 4 c (see FIG. 2) communicating with the through hole 4 h is formed in the internal space of the ceramic base 4, and a gas G between the flow path 4 c and the outside of the ceramic base 4 through the inside of the metal body 2. Can be exchanged. Note that, inside the ceramic substrate 4, the gas G can be subjected to a predetermined process (for example, heating), or the concentration of the gas G can be detected.
  • the metal body 2 is inserted inside the through hole 4 h that penetrates the ceramic base 4 in the thickness direction, and is arranged coaxially with the axis AX of the through hole 4 h.
  • the row flow preventing layers 7 a and 7 b cover the outer surface of the pad layer 6 so as to expose the central region 6 c of the upper surface facing the first row portion 10 among the outer surface of the pad layer 6.
  • an annular inner low flow prevention layer 7 a is formed so as to protrude from the upper surface 6 f of the pad layer 6 so as to straddle between the radially inner periphery of the pad layer 6 and the ceramic base 4. Yes.
  • the inner low flow prevention layer 7 a is formed so as to contact the surface of the ceramic substrate 4 while covering the inner peripheral surface of the pad layer 6.
  • an annular outer low flow prevention layer 7 b is formed so as to protrude from the upper surface 6 f of the pad layer 6 so as to straddle between the radially outer periphery of the pad layer 6 and the ceramic substrate 4.
  • the outer low flow prevention layer 7 b is formed so as to contact the surface of the ceramic substrate 4 while covering the outer peripheral surface of the pad layer 6.
  • column part 10 does not protrude in the radial direction inner side of the inner side low flow prevention layer 7a and the radial direction outer side of the outer side low flow prevention layer 7b, but between the center area
  • the second row part 12 is interposed between the ring member 8 and the metal body 2 to braze and join them.
  • the first row portion 10 does not protrude from the radially inner side and the radially outer side of the row flow preventing layers 7a and 7b, it is possible to prevent the first row portion 10 from coming into direct contact with the ceramic base 4. Further, by providing the low flow prevention layers 7a and 7b on the interface between the ceramic substrate 4 and the metal pad layer 6 which are most stressed, the strength is improved, and the end portion of the first row portion 10 is more than the above interface. Is also arranged on the inner side, so that the stress applied to the interface is relaxed. As a result, due to the difference in thermal expansion coefficient between them, the stress concentrates on the first row portion 10 when cooled, and the first row portion 10 is prevented from peeling off or cracking in the ceramic base 4 is suppressed. The attachment can be ensured.
  • the outer diameter D1 of the ring member 8 is smaller than the outer diameter D2 of the pad layer 6, and the first row portion 10 has a fillet shape in contact with the outer peripheral surface of the ring member 8. It has a portion 10a.
  • the first row portion 10 has a portion 10b that extends radially inward of the ring member 8 and has a fillet shape. This part 10b also has a fillet shape, so that the brazing strength is improved.
  • the ceramic base 4 and the brazing material flow preventing layers 7a and 7b are excellent in adhesiveness because the main components are the same material.
  • the ceramic-metal structure 100 of the present embodiment can be manufactured as follows, for example. First, the first brazing material that becomes the first brazing portion 10 is disposed on the pad layer 6 of the ceramic substrate 4, and the ring member 8 is disposed on the first brazing material. Next, in a state where the metal body 2 is inserted inside the ring member 8 and the through hole 4h of the ceramic base body 4, the metal body 2 is held with a jig or the like. Further, a second brazing material that becomes the second brazing portion 12 is disposed between the metal body 2 and the ring member 8. Then, the whole is heated to melt and braze the first brazing material and the second brazing material at once.
  • the present invention is not limited to the above-described embodiment, but extends to various modifications and equivalents included in the spirit and scope of the present invention.
  • the tip 2f of the metal body 2 may be arranged coaxially with the through hole 4h so as to abut against the surface of the ceramic base 4 around the through hole 4h.
  • the first row portion 10 and the second row portion 12 are integrated at a portion R on the radially inner side of the ring member 8.
  • first row portion 10 a portion where the pad layer 6 and the ring member 8 are joined
  • second row portion 12 a portion where the ring member 8 and the metal body 2 are joined
  • the boundary of both may not be clear.
  • the outer diameter D3 of the metal body 2 is larger than the diameter D4 of the through hole 4h, and the metal body 2 is arranged coaxially with the axis AX immediately above the through hole 4h. Good.
  • the metal body 2 was pipe shape, a rod shape may be sufficient.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
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Abstract

冷却の際にロー付けが剥がれたり、セラミック基体にクラックが生じることを抑制したセラミック－金属構造体を提供する。 パイプ状又はロッド状をなす金属体２が、セラミック基体４の貫通孔４ｈの内側に挿入される、または、貫通孔の直上に配置されてなるセラミック－金属構造体であって、セラミック基体の貫通孔の周囲に配置される環状をなす金属製のパッド層６と、パッド層に対して第１ロー部１０を介して接合されると共に、金属体よりも熱膨張係数が小さい、環状をなすリング部材８と、リング部材と金属体との間に介在する第２ロー部１２と、パッド層の外表面のうち、第１ロー部に面する上面の中央領域６ｃを露出させるようにしてパッド層の外表面を被覆するロー流れ防止層７ａ、７ｂと、を含み、第１ロー部は、ロー流れ防止層の径方向内側及び径方向外側にはみ出ることなく、中央領域とリング部材とを接合してなる。

Description

セラミック－金属構造体
　本発明は、セラミックと金属とがロー付けされたセラミック－金属構造体に関する。
　従来から、例えばセラミックにコバールからなるフランジをロー付けしておき、このフランジ２内に金属製のパイプ部品を銀ローで接続する技術が知られている（特許文献１）。
　この技術によれば、パイプ部品の端部に周状に溝を設け、溶融ロー材をこの溝で堰き止めることで、不要な部分にロー材が流れ込まず、ロー材をロー付け箇所に集中させて強固にロー付けすることができる。
特開平5-277721号公報
　ところで、セラミックにロー材が直接接してロー付けされると、両者の熱膨張率の差により、冷却された際にロー付け部に応力が集中し、ロー付けが剥がれたり、セラミックにロー材が直接接していなくてもセラミックとメタライズの界面付近に応力が集中してセラミックにクラックが生じるおそれがある。
　そこで、本発明は、冷却の際にロー付けが剥がれたり、セラミック基体にクラックが生じることを抑制し、ロー付けを確実にすることができるセラミック－金属構造体を提供することを目的とする。
　上記課題を解決するため、本発明のセラミック－金属構造体は、パイプ状又はロッド状をなす金属体が、セラミック基体の表面から当該セラミック基体の厚み方向に貫通した貫通孔の内側に挿入される、または、前記貫通孔の直上に同軸状に配置されてなるセラミック－金属構造体であって、前記セラミック基体の前記表面のうち前記貫通孔の周囲に配置されると共に、環状をなす金属製のパッド層と、前記パッド層に対して第１ロー部を介して接合されると共に、前記金属体よりも熱膨張係数が小さい、環状をなすリング部材と、前記リング部材と前記金属体との間に介在し、前記リング部材と前記金属体とを接合する第２ロー部と、前記パッド層の外表面のうち、第１ロー部に面する上面の中央領域を露出させるようにして前記パッド層の外表面を被覆するロー流れ防止層と、を含み、前記第１ロー部は、前記ロー流れ防止層の径方向内側及び径方向外側にはみ出ることなく、前記中央領域と前記リング部材とを接合してなることを特徴とする。
　このセラミック－金属構造体によれば、第１ロー部がロー流れ防止層の径方向内側及び径方向外側にはみ出ることがないので、セラミック基体に第１ロー部が直接接することを防止できる。その結果、両者の熱膨張率の差により、冷却された際に第１ロー部に応力が集中し、第１ロー部が剥がれることを抑制できる。
　又、ロー流れ防止層が、第１ロー部に面する上面の中央領域を露出させるよういしてパッド層の外表面を覆うことで、このロー流れ防止層は、セラミック基体の表面上に配置されるパッド層の内周面及び外周面を覆うようにしてセラミック基体の表面に接するよう形成される。これにより、最も応力の掛かるセラミック基体と金属製のパッド層の界面上にロー流れ防止層が配置されて強度が向上し、さらに第１ロー部の端部が上記界面よりも内側に配置されることで、当該界面に掛かる応力が緩和される。その結果、セラミック基体にクラックが生じることを抑制し、ロー付けを確実にすることができる。
　本発明のセラミック－金属構造体であって、前記リング部材の外径は、前記パッド層の外径よりも小さくなっており、前記第１ロー部は、前記リング部材の外周面に対して接するフィレット形状をなす部位を有してもよい。
　第１ロー部がフィレット形状（凹状）をなす部位を有する場合は、リング部材とパッド層との間に溶融ローが十分な濡れ性を持って浸透したことを示し、ロー付け強度が向上する。
　本発明のセラミック－金属構造体であって、前記第１ロー部は、前記リング部材の径方向内側に向けて延び、フィレット形状をなす部位を有してもよい。
　この部位も、フィレット形状であることでロー付け強度が向上する。
　本発明のセラミック－金属構造体であって、前記セラミック基体と前記ロー材流れ防止層とは、主成分が同材質であってもよい。
　このセラミック－金属構造体によれば、セラミック基体とロー材流れ防止層の主成分が同材質であるので、両者の密着性に優れる。
　本発明のセラミック－金属構造体であって、前記セラミック基体の内部に、前記貫通孔に接続されると共にガスが流れる流路が形成されており、前記金属体はパイプ状であり、前記金属体の内部を介して前記流路と前記セラミック基体の外部とのガスの交換が可能であってもよい。
　このセラミック－金属構造体によれば、セラミック基体の内部の流路にパイプ状の金属体を介してガスを導入、導出する際、セラミック基体と金属体とが確実にロー付けされているので、ロー付け部からのガスの漏れ等を抑制でき、安定してガスの交換が行える。
　この発明によれば、冷却の際にロー付け（第１ロー部）が剥がれたり、セラミック基体にクラックが生じることを抑制し、ロー付けを確実にすることができるセラミック－金属構造体が得られる。
本発明の実施形態に係るセラミック－金属構造体の分解斜視図である。 図１のＡ－Ａ線に沿う断面図である。 本発明の実施形態に係るセラミック－金属構造体の変形例を示す断面図である。 本発明の実施形態に係るセラミック－金属構造体の別の変形例を示す断面図である。
　以下に、本発明を、図面を参照しながら詳細に説明する。図１は、本発明の実施形態におけるセラミック－金属構造体１００の分解斜視図、図２は図１のＡ－Ａ線に沿う断面図である。
　図１において、セラミック－金属構造体１００は、パイプ状の金属体２と、貫通孔４ｈを有する略矩形のセラミック基体４と、セラミック基体４の表面のうち貫通孔４ｈの周囲に配置されるパッド層６と、詳しくは後述するロー流れ防止層７ａ、７ｂと、環状をなすリング部材８と、パッド層６とリング部材８とを接合する第１ロー部１０と、リング部材８と金属体２とを接合する第２ロー部１２と、を備える。
　セラミック基体４はアルミナを主体とするセラミック焼結体であり、金属体２はステンレスで形成されている。パッド層６は金属製で環状をなし、セラミック基体４と第１ロー部１０との密着性を高めると共に、第１ロー部１０がセラミック基体４に直接接してロー付けされることを防止する。パッド層６は、例えばタングステン及びモリブデンの少なくとも一方を主成分とするペーストをセラミック基体４の未焼成体の表面に印刷後、焼成し、さらに表面にＮｉめっきして形成することができる。
　ロー流れ防止層７ａ、７ｂは、例えばセラミック基体４と主成分が同材質である（本例ではアルミナ）材料のペーストをセラミック基体４とパッド層６の両未焼成体の間を跨ぐようにそれぞれ環状に印刷後、セラミック基体４及びパッド層６と同時焼成して形成することができる。
　リング部材８は、金属体２よりも熱膨張係数が小さい、例えばコバールで形成されている。
　第１ロー部１０及び第２ロー部１２となるロウ材としては、例えばＡｕ－Ｃｕ合金、Ａｇ－Ｃｕ合金や、種々の導体材料（例えば、Ｃｕ（銅）やＡｇ（銀））を採用可能である。
　セラミック基体４の内部空間には、貫通孔４ｈに連通する流路４ｃ（図２参照）が形成されており、金属体２の内部を介して流路４ｃとセラミック基体４の外部とのガスＧの交換が可能になっている。なお、セラミック基体４の内部では、ガスＧに所定の処理（例えば加熱）を施したり、ガスＧの濃度を検出することができる。
　図２に示すように、金属体２は、セラミック基体４の厚み方向に貫通した貫通孔４ｈの内側に挿入され、貫通孔４ｈの軸心ＡＸと同軸状に配置されている。
　又、ロー流れ防止層７ａ、７ｂは、パッド層６の外表面のうち、第１ロー部１０に面する上面の中央領域６ｃを露出させるようにしてパッド層６の外表面を被覆している。具体的には、パッド層６の径方向内側の周縁とセラミック基体４との間を跨ぐようにして、環状の内側ロー流れ防止層７ａがパッド層６の上面６ｆよりも隆起して形成されている。又、内側ロー流れ防止層７ａは、パッド層６の内周面を覆いながら、セラミック基体４の表面に接するように形成されている。
　同様に、パッド層６の径方向外側の周縁とセラミック基体４との間を跨ぐようにして、環状の外側ロー流れ防止層７ｂがパッド層６の上面６ｆよりも隆起して形成されている。又、外側ロー流れ防止層７ｂは、パッド層６の外周面を覆いながら、セラミック基体４の表面に接するように形成されている。
　そして、第１ロー部１０は、内側ロー流れ防止層７ａの径方向内側及び外側ロー流れ防止層７ｂの径方向外側にはみ出ることなく、パッド層６の中央領域６ｃとリング部材８との間に介在して両者をロー付け接合している。
　一方、第２ロー部１２は、リング部材８と金属体２との間に介在して両者をロー付け接合している。
　このように、第１ロー部１０がロー流れ防止層７ａ、７ｂの径方向内側及び径方向外側にはみ出ることがないので、セラミック基体４に第１ロー部１０が直接接することを防止できる。又、最も応力の掛かるセラミック基体４と金属製のパッド層６との界面上にロー流れ防止層７ａ、７ｂを設けることにより強度が向上し、さらに第１ロー部１０の端部が上記界面よりも内側に配置されることで、当該界面に掛かる応力が緩和される。その結果、両者の熱膨張率の差により、冷却された際に第１ロー部１０に応力が集中し、第１ロー部１０が剥がれたり、セラミック基体４にクラックが生じることを抑制し、ロー付けを確実にすることができる。
　又、本実施形態では、リング部材８の外径Ｄ１は、パッド層６の外径Ｄ２よりも小さくなっており、第１ロー部１０は、リング部材８の外周面に対して接するフィレット形状をなす部位１０ａを有する。このように、第１ロー部１０がフィレット形状（凹状）をなす部位１０ａを有する場合は、リング部材８とパッド層６との間に溶融ローが十分な濡れ性を持って浸透したことを示し、ロー付け強度が向上する。
　同様に、本実施形態では、第１ロー部１０は、リング部材８の径方向内側に向けて延び、フィレット形状をなす部位１０ｂを有する。この部位１０ｂも、フィレット形状であることでロー付け強度が向上する。
　又、本実施形態では、セラミック基体４とロー材流れ防止層７ａ、７ｂとは、主成分が同材質であるので、両者の密着性に優れる。
　本実施形態のセラミック－金属構造体１００は例えば次のようにして製造することができる。
　まず、セラミック基体４のパッド層６の上に第１ロー部１０となる第１ロー材を配置し、第１ロー材の上にリング部材８を配置する。次に、リング部材８及びセラミック基体４の貫通孔４ｈの内側に金属体２を挿入した状態で、金属体２を治具等で保持する。さらに、金属体２とリング部材８の間に第２ロー部１２となる第２ロー材を配置する。
　そして、全体を加熱して第１ロー材及び第２ロー材を一度に溶融させ、ロー付けする。
　本発明は上記実施形態に限定されず、本発明の思想と範囲に含まれる様々な変形及び均等物に及ぶことはいうまでもない。
　例えば、図３に示すように、金属体２の先端２ｆが、貫通孔４ｈの周囲のセラミック基体４の表面に突き当たるようにして貫通孔４ｈと同軸状に配置されてもよい。又、図３の例では、第１ロー部１０と第２ロー部１２とは、リング部材８の径方向内側の部位Ｒで一体となっている。この場合、パッド層６とリング部材８とを接合する部位を「第１ロー部１０」とし、リング部材８と金属体２とを接合する部位を「第２ロー部１２」とするが、第１ロー部１０と第２ロー部１２が同材質の場合、両者の境界は明確でなくてもよい。
　又、図４に示すように、金属体２の外径Ｄ３が、貫通孔４ｈの径Ｄ４よりも大きく、この金属体２が貫通孔４ｈの直上に軸心ＡＸと同軸状に配置されてもよい。
　なお、上記実施形態においては、金属体２がパイプ状であったがロッド状であってもよい。
　２　　金属体
　４　　セラミック基体
　４ｃ　　流路
　４ｈ　　貫通孔
　６　　パッド層
　６ｃ　　パッド層の中央領域
　７ａ、７ｂ　　ロー流れ防止層
　８　　リング部材
　１０　　第１ロー部
　１０ａ、１０ｂ　　フィレット形状をなす部位
　１２　　第２ロー部
　１００　　セラミック－金属構造体
　ＡＸ　　貫通孔の軸心
　Ｄ１　　リング部材の外径
　Ｄ２　　パッド層の外径
　Ｇ　　ガス

Claims (5)

  1. 　パイプ状又はロッド状をなす金属体が、セラミック基体の表面から当該セラミック基体の厚み方向に貫通した貫通孔の内側に挿入される、または、前記貫通孔の直上に同軸状に配置されてなるセラミック－金属構造体であって、
    　前記セラミック基体の前記表面のうち前記貫通孔の周囲に配置されると共に、環状をなす金属製のパッド層と、
    　前記パッド層に対して第１ロー部を介して接合されると共に、前記金属体よりも熱膨張係数が小さい、環状をなすリング部材と、
    　前記リング部材と前記金属体との間に介在し、前記リング部材と前記金属体とを接合する第２ロー部と、
    　前記パッド層の外表面のうち、第１ロー部に面する上面の中央領域を露出させるようにして前記パッド層の外表面を被覆するロー流れ防止層と、を含み、
    　前記第１ロー部は、前記ロー流れ防止層の径方向内側及び径方向外側にはみ出ることなく、前記中央領域と前記リング部材とを接合してなる
    ことを特徴とするセラミック－金属構造体。
  2. 　請求項１に記載のセラミック－金属構造体であって、
    　前記リング部材の外径は、前記パッド層の外径よりも小さくなっており、前記第１ロー部は、前記リング部材の外周面に対して接するフィレット形状をなす部位を有する、セラミック－金属構造体。
  3. 　請求項１又は請求項２に記載のセラミック－金属構造体であって、
    　前記第１ロー部は、前記リング部材の径方向内側に向けて延び、フィレット形状をなす部位を有する、セラミック－金属構造体。
  4. 　請求項１～請求項３に記載のセラミック－金属構造体であって、
    　前記セラミック基体と前記ロー流れ防止層とは、主成分が同材質である、セラミック－金属構造体。
  5. 　請求項１～請求項４のいずれか１項に記載のセラミック－金属構造体であって、
    　前記セラミック基体の内部に、前記貫通孔に接続されると共にガスが流れる流路が形成されており、前記金属体はパイプ状であり、前記金属体の内部を介して前記流路と前記セラミック基体の外部とのガスの交換が可能なセラミック－金属構造体。 
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JP6328697B2 (ja) 2018-05-23
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US20190126373A1 (en) 2019-05-02
JP2018012116A (ja) 2018-01-25
EP3488959A1 (en) 2019-05-29

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