WO2018024707A1 - Système de transport et système d'usinage de substrats - Google Patents

Système de transport et système d'usinage de substrats Download PDF

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Publication number
WO2018024707A1
WO2018024707A1 PCT/EP2017/069390 EP2017069390W WO2018024707A1 WO 2018024707 A1 WO2018024707 A1 WO 2018024707A1 EP 2017069390 W EP2017069390 W EP 2017069390W WO 2018024707 A1 WO2018024707 A1 WO 2018024707A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
support surface
compressed air
transport system
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/069390
Other languages
German (de)
English (en)
Inventor
Florian WAMSLER
Achim Arnold
Klaus Oppelt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asys Automatisierungssysteme GmbH
Original Assignee
Asys Automatisierungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatisierungssysteme GmbH filed Critical Asys Automatisierungssysteme GmbH
Priority to EP17755427.6A priority Critical patent/EP3490916A1/fr
Priority to CN201780048605.XA priority patent/CN109689541A/zh
Publication of WO2018024707A1 publication Critical patent/WO2018024707A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Definitions

  • the invention relates to a transport system for substrates, in particular wafers, solar cells, printed circuit boards or the like, having a first device for holding and transporting the substrates, the gripper head having at least a first Auflagefiumblee on its underside for laying a substrate and at least one suction device for sucking Substrate against the support surface, and with a second device for holding and transporting the substrates, having at least a second Auflagefiambae on which a substrate is deposited, and with means for moving the deposited substrate from the second Auflagefiumblee to the first Auflagefiambae.
  • the invention relates to a processing system for substrates, in particular wafers, solar cells, printed circuit boards or the like, with at least one workstation or processing station for treating or processing the substrates and at least one transport system of the type mentioned above, which is used, for example, a substrate of a Workstation to spend another workstation.
  • Transport systems of the type mentioned are known from the prior art.
  • substrates are not manually carried from one processing station to the next, but moved automatically.
  • requirements for cleanliness and care in the manufacturing process safely guaranteed.
  • devices are necessary which allow a transport of the substrates, by which the substrates are not damaged.
  • To carry out the transport it is therefore customary, for example, to make the support surface on which the substrates can be stored for processing movable in order to move the substrate from a processing position into a transport position or transfer position. Frequently transport belts or treadmills are used, on which the substrates can be stored and conveyed through a processing station.
  • the invention has for its object to improve the transport system of the type mentioned, so that the transfer of a substrate from the first device to the second device is safe and inexpensive.
  • the problem underlying the invention is achieved by a transport system having the features of claim 1.
  • This has the advantage that the transfer of the substrates from the first device to the second device takes place without much additional effort and in particular requires no moving parts which raise the respective substrate and closer to the gripping head or move the gripping head in the direction of the second support surface to the lying there substrate to be able to access.
  • the manufacturing and assembly costs of the transport system is simplified, so that in particular production costs are reduced.
  • the device comprises at least one compressed air nozzle which is arranged below the second support surface such that a compressed air flow generated / generated by it flows in the direction of a lying on the second support surface substrate or is aligned to the Raise substrate in the direction of the first support surface, in particular, when the substrate is located in a designated transfer region of the second support surface.
  • the invention thus provides that the substrates or the respective substrate are lifted by the second device by compressed air and fed to the first device / is. In other words, the substrates or the respective substrate are blown from the second device to the first device. As a result, a particularly simple transfer of the substrates is guaranteed, the no moving mechanical parts needed.
  • first device and / or the second device dispenses in particular with elements that are subject to mechanical wear and increase the maintenance of the transport system.
  • first device and / or the second device it is not necessary for the first device and / or the second device to have actuators which move the first bearing surface or the second bearing surface downwards or upwards in order to transfer the respective substrate.
  • the manufacturing, wiring and design effort is greatly facilitated.
  • By blowing on the substrates to the gripping head a particularly gentle handling of the substrates is also ensured, as is dispensed with mechanical force even in the transfer of the substrates.
  • the first bearing surface and the second bearing surface are arranged so close to each other that is blown by the blowing of the respective substrate from the second bearing surface in the direction of the first bearing surface to the first bearing surface, or raised, or at least raised to the area, in which the negative pressure of the first device is sufficiently high to further attract / attract the substrate to the first support surface.
  • the at least one compressed air nozzle is assigned to the transfer area of the second support surface or of the transport system, in which the first support surface and the second support surface are opposite one another.
  • the device comprises a plurality of mutually parallel compressed air nozzles for lifting the substrate.
  • a plurality of compressed air nozzles is ensured that the substrate, for example, not tilted when blowing and its orientation is maintained altogether when lifting.
  • at least two compressed-air nozzles are present, which are each assigned to one longitudinal side of the substrate or the second bearing surface, in order to pressurize a substrate on both sides with compressed air and thereby lift it safely.
  • the compressed-air nozzles have a symmetrical arrangement in order to ensure a uniform supply of compressed air to the respective substrate.
  • a compressed air cushion is thereby produced, which ensures a uniform application of force to the respective substrate, so that, for example, sagging of the substrate during lifting is avoided.
  • the compressed-air nozzles are arranged next to the second bearing surface. As a result, areas of the respective substrate are subjected to the compressed air, which protrude beyond the second bearing surface. This is In particular, an advantageous solution when the second bearing surface is formed by a transport belt or a plurality of transport belts.
  • At least one compressed air nozzle is arranged centrally in an interruption of the second bearing surface.
  • the compressed-air nozzle is arranged, for example, between two transport belts which are arranged parallel to one another and spaced apart from one another and which form the second support surface.
  • a resting on the second support surface substrate is also centrally applied with compressed air and raised in the direction of the first support surface.
  • the first and / or second bearing surface is formed by at least one movably mounted transport belt.
  • the transport belt is preferably an endless traction means, which is guided in particular circumferentially by deflection rollers on the second device.
  • at least one belt tensioner is assigned to the respective transport belt, which ensures that the transport belt extends along the intended track, in particular in the running section, in which the transport belt forms the first or second bearing surface.
  • the first and / or second support surface is formed by at least two parallel and spaced from each other and movably mounted transport belt.
  • the respective substrate rests on or on two conveyor belts, so that it is securely held and guided.
  • the one or more compressed-air nozzles may be arranged centrally between the transport belts or outside the two transport belts in order to pressurize the respective substrate from below with compressed air.
  • the compressed air nozzles are fluidly connected to a common compressed air generator, so that the compressed air nozzles are acted upon by the same compressed air, whereby a simple compressed air generation and raising the respective substrate is realized cost.
  • the respective compressed-air nozzle has a controllable valve for setting a flow cross-section in the respective compressed-air nozzle.
  • the respective valve thus the flow cross sections of the particular be adapted to a plurality of compressed air nozzles, for example, to ensure that the respective substrate is raised evenly, without it loses its orientation with respect to the support surface and, for example, tilts in one direction.
  • the valves are actuated to turn on or off the pressurization by releasing or completely closing the flow area. This ensures that the compressed air cushion is generated only when the substrate is in a favorable position on the second support surface.
  • only one controllable valve is provided which, for example, downstream of the compressed air generator and upstream of the branch to the compressed air nozzles, so that the compressed air flow can be interrupted or released with a single valve.
  • the respective valve is electrically actuated and has a corresponding actuator for adjusting a valve element, which influences the flow cross-section.
  • the second device has at least one sensor for detecting the resting of a substrate on the second support surface.
  • the sensor it is then possible to detect, for example, that a substrate has been transported by means of the transport belts into a transfer region, that is to say into a position advantageous for transfer along the second support surface. If this is detected, then, for example, the one or more valves are activated in order to release the respective flow cross section, so that the respective substrate is raised in the direction of the gripping head.
  • the sensor is designed to detect only the presence of the substrate on the second bearing surface, in particular in the transfer section.
  • the senor not only detects the presence, but also the orientation of the substrate in the transfer section, wherein the alignment is to be understood in particular as the orientation of the substrate with respect to the plane of the support surface.
  • the possibility is thereby made available to detect the inclination of a substrate with respect to the second bearing surface.
  • the compressed air nozzles are driven to counteract the tilt so that the substrate is aligned parallel to the second support surface.
  • a control device is preferably present, which is signal-technically connected to the at least one sensor and the at least one valve.
  • a plurality of sensors are arranged distributed for detecting the inclination of the substrate For example, each detect a distance to the substrate, so that the inclination of the substrate is determined depending on the determined distances.
  • the senor is designed as a contact-free operating sensor, in particular as a distance sensor, for example as an optical sensor, ultrasonic sensor, radar sensor, laser sensor, lidar sensor or the like. If it is determined that a distance detected by the sensor does not correspond to a desired distance that would be detected when the substrate is in the transfer area, it is recognized that there is no substrate in the transfer area or the substrate has already been transferred to the first device. As a result, a simple control of the transport system by means of the previously mentioned control device is ensured.
  • a distance sensor for example as an optical sensor, ultrasonic sensor, radar sensor, laser sensor, lidar sensor or the like.
  • the processing system according to the invention is characterized by the transport system according to the invention.
  • the second device is integrated into the at least one processing station in order to convey a substrate through the processing station.
  • the first device operates according to the transport system according to the invention with the second device together to remove the substrate from the at least one processing station and spend, for example, at least a second processing station.
  • the gripping head is designed to be movable, for example, so that it can be moved horizontally, for example, to transfer the substrate from one processing station to another processing station, which in particular likewise has a transport device according to the second device, and place it there on the second support surface.
  • FIG. 1 shows an advantageous transport system for substrates in a perspective
  • Partial view Figure 2 is a front view of the transport system
  • Figure 3 is a side view of the transport system.
  • the transport system 1 shows a perspective partial representation of a transport system 1 of a processing system 2, not shown, for substrates, in particular printed circuit boards, solar cells, wafers or the like.
  • the substrates are thus, in particular, flat plate-like structures which must be handled, handled and transported carefully.
  • the transport system 1 serves, for example, to transport the substrates from a processing station 3 of the processing system 2 to a further processing station.
  • the transport system 1 has a first device 4 and a second device 5, which are each designed to grip or hold and transport the substrates.
  • the device 4 has a gripping head 6, which has a support structure 7, on which a suction device 8 and two circulating transport belts 9 are arranged.
  • the transport belts 9 in this case each bypass the support structure 7 as endless traction means and together form a first support surface 11 on the underside 10 of the gripper head 6.
  • a negative pressure can be generated by which substrates are sucked against the support surface 11 against the gripper head 6 and thereby can be held the gripping head 6.
  • a drive device (not shown here) is then actuated to set the transport belts 9 in a circulating motion, the sucked-in substrate with the transport belts 9 is moved along the support surface 11 in the longitudinal extent of the gripper head 6, as indicated by a double arrow 12.
  • the vacuum necessary for holding the substrate is generated, for example, by the suction device 8 between the transport belts 9.
  • the transport belts 9 each have a plurality of suction openings 13, which are fluidically connected to one or more vacuum chambers in the support structure 7.
  • the Tragpro fil has, for example, for each of the conveyor belts each have a hollow profile, which is fluidically connected to the suction device 8 to set in at least one hollow chamber or vacuum chamber of the Hohlpro fils the negative pressure.
  • the respective vacuum chamber is then fluidically connected to a running surface on which the transport belt 9 rests continuously at least on the underside 10 of the gripping head 6, the passage openings in particular opening into a longitudinal groove in the running surface, the is arranged corresponding to the suction openings 13, so that along the entire movement path of the conveyor belt 9 on the underside 10 of the gripping head 6, a negative pressure at the suction openings 13 of the conveyor belt 9 can be generated.
  • the suction openings 13 may be distributed uniformly over the respective transport belt 9, or evenly distributed in groups, as shown by way of example in FIG.
  • the second device 5 which is arranged below the gripping head 6, also has a support structure 14, on which two circulating transport belts 15 are arranged.
  • the transport belts 15 are displaceable into the circulating movement by a drive device 16, of which only one drive shaft 17 is shown here.
  • the transport belts 15 as well as the transport belts 9 are each spaced apart and arranged parallel to each other as Endloszugstoff on the support structure 14.
  • the transport belt 15 analogously, the conveyor belt 9, driven simultaneously and uniformly.
  • the transport belts 15 also run substantially horizontally, as do the transport belts 9, but are aligned with respect to their longitudinal extent according to the present embodiment perpendicular to the conveyor belt 9, as indicated by a double arrow 30.
  • the top section of the transport belt 15 forms a second support surface 18, on which substrates can be placed.
  • On the support surface 18 resting substrates can then be moved or moved by driving the conveyor belt 15 in a simple manner perpendicular to the longitudinal extent of the gripping head 6, for example, to supply them to a processing device or dissipate therefrom.
  • the devices 4 and 5 or the support structures 7 and 14 are arranged at a fixed distance from one another, so that the support surfaces 9 and 15 formed by the respective transport surfaces 18 and 11 have a fixed distance from one another.
  • the device 5 has a device 20 which is designed to lift the substrate 19 by compressed air in the direction of the gripping head 6.
  • the device 20 has two compressed-air nozzles 21, as can be seen in particular in FIG.
  • FIG. 2 shows in a simplified front view the transport system 1 from FIG. 1.
  • the support structure 14 carries a compressed air distributor 22, which on the output side is in each case fluidically connected to one of the compressed air nozzles 21.
  • the compressed air distributor 22 is fluidly connected to a compressed air generator 25 by a valve 23, which is shown only schematically here, and also by an optional pressure regulator 24, which is also shown only schematically.
  • the compressed air generator 25 may be, for example, a pump or the like.
  • the valve 23 is designed to close a flow cross-section between the pressure generator 25 and the compressed-air nozzles 21 or the compressed-air distributor 22 (switching position shown in FIG. 2) or to release them.
  • valve 23 is designed as a proportional valve in order to vary the flow cross-section so that the compressed air flow originating from the compressed-air nozzles 21 can be varied.
  • the pressure regulator 24 has a spring-loaded actuating element and a return channel in order to automatically calm or adjust the pneumatic air pressure generated by the compressed air generator 25 to a predefinable value, so that compressed air fluctuations generated by the compressed air generator 25 are compensated.
  • the compressed air nozzles 21 are arranged on the outlet side respectively below the support surface 18 on the support structure 14 and point upwards in the direction of the gripping head 6 and the Aufiagefikiee 18.
  • the compressed air nozzles 21 on both sides of the support structure 14 are arranged such that they laterally spaced from the conveyor belt 15 and are still in the range of the substrate to be transported or moved 19, so that the compressed air flow of the compressed air nozzles 21, indicated by dashed lines in Figure 2, strikes the underside of the respective substrate 19.
  • one or more compressed-air nozzles can also be arranged within the support structure 14 in the free space in which the sensor 27 is arranged.
  • the compressed air generator 25 For lifting or bringing the respective substrate 19 from the support surface 18 to the support surface 11, the compressed air generator 25 is thus activated and the valve 23 is opened so that the compressed air flow coming from the compressed air nozzles 21 lifts the substrate 19 in the direction of the gripper head 6 and against the support surface 11 pushes or at least so close to the gripping head 6 zoom in that it enters the effective range of the suction device 8 and is pulled by this against the support surface 11.
  • a control device 26 is expediently provided, which is connected at least to the compressed air generator 25 and the valve 23 in order to control it.
  • the control unit 26 is also connected to a sensor 27, which is arranged between the compressed-air nozzles 21 within the support structure 14 in a region in which there is a clearance between the sensor 27 and underside of the respective substrate 19.
  • the sensor 27 is aligned in the direction of the support surface 18 and the gripping head 6 and in particular formed as an optical distance sensor.
  • the control unit 26 detects in particular continuously the distance of the sensor 27 to the next in the detection range of the sensor 27 lying object. If the substrate 19 is located above the sensor 27, as shown in FIG. 2, it thus covers the distance to the substrate 19. If the substrate 19 is lifted by the device 22 against the gripping head 6, the detected distance 27 increases the successful lifting of the substrate 19 in a simple manner detectable.
  • the compressed air nozzles 21 are arranged at a distance from the support surface 18, in particular below the transport belt 15. This has the advantage that a uniform compressed air flow is formed, which acts on the underside of the respective substrate 19, in particular Verwirb eluations are avoided. Characterized in that the two compressed-air nozzles 21 are provided, the respective substrate 19 is acted upon uniformly in the compressed air at its side edges and raised, so that tilting of the substrate 19 is avoided.
  • two compressed air nozzles 21 are provided on each longitudinal side of the support structure 14 to bias the substrate 19 symmetrically with compressed air, so that tilting both about a transverse axis and about a longitudinal axis of the substrate 19 is reliably avoided ,
  • the sensor 27 the presence of the substrate 19 can be detected.
  • the valve 23 is opened only when the substrate 19 is in the transfer region 28. Otherwise, a one-sided lifting of the substrate 19 could occur, whereby the substrate 19 would tilt with respect to the support surface 18.
  • the device 5 has a plurality of these sensors 27 to determine the positioning and possibly inclination of the substrate 19.
  • the one or more sensors 27 are assigned to the transfer region or arranged in the region of the device 5 which lies opposite the device 4 or the gripping head 6.
  • the respective sensor 27 is designed as an optical sensor, in particular as a laser sensor, Lidarsensor, ultrasonic sensor, radar sensor or the like to detect the distance without contact.
  • each of the compressed air nozzles 21 is assigned its own controllable valve 23, so that the respective flow cross section is individually adjustable.
  • the valves 23 are then actuated such that the substrate 19 maintains its orientation parallel to the support surface 15 during lifting.
  • FIG. 3 shows a side view of the transport system 1, which shows the positioning of the two compressed-air nozzles 21 to the transfer region 28.
  • the two conveyor belt 9 can be seen, which extend perpendicular to the longitudinal extent of the conveyor belt 15, as already mentioned above. If the substrate 19 is located in the transfer region 28, it is lifted directly in the direction of the transport belts 9, as indicated by arrows 29, wherein the substrate 19 is shown by way of example by dashed lines in the transfer position applied to the transport belt 9.
  • the transport system 1 thus allows in a simple manner a transfer of the respective substrate 19 from the device 5 to the device 4 by the substrate 19 is blown up.
  • the device 5 can in particular represent a discharge device of the processing station 3 of the processing system 2.
  • the transport belt 15 can extend as far as into the processing station 3, or as shown in Figure 3, connect to a transport system of the processing station 3, so that the respective substrate 19 is passed directly to the conveyor belt 15, for example, from an integrated conveyor belt of the processing station.
  • existing processing systems can be supplemented in a simple manner by the advantageous transport system 1.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un système de transport (1) destiné à des substrats (19), en particulier des tranches de semi-conducteurs, des cellules solaires, des plaquettes de circuits imprimés ou similaires. Le système de transport comporte un premier dispositif (4), destiné à maintenir et transporter les substrats (19), qui comporte une tête de préhension (11) pourvue sur son côté inférieur (10) d'au moins une première surface d'application (11) destinée à l'application d'un substrat (19) et au moins un moyen d'aspiration (8) destiné à aspirer le substrat (19) contre la surface d'application (11), et un deuxième dispositif (5), destiné à maintenir et transporter les substrats (19), qui comporte au moins une deuxième surface d'application (18) sur laquelle un substrat (19) peut être appliqué, et un moyen (20) destiné à déplacer le substrat appliqué (19) de la deuxième surface d'application (18) à la première surface d'application (11). Il est prévu de munir le moyen (20) d'au moins une buse d'air comprimé (21) disposée sous la deuxième surface d'application (18) de manière à ce qu'un flux d'air comprimé, généré par ladite buse, s'écoule en direction d'un substrat (19), placé sur la deuxième surface d'application, pour soulever le substrat (19) en direction de la première surface d'application (11).
PCT/EP2017/069390 2016-08-01 2017-08-01 Système de transport et système d'usinage de substrats Ceased WO2018024707A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP17755427.6A EP3490916A1 (fr) 2016-08-01 2017-08-01 Système de transport et système d'usinage de substrats
CN201780048605.XA CN109689541A (zh) 2016-08-01 2017-08-01 用于基板的传输系统和加工系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016214184.8A DE102016214184A1 (de) 2016-08-01 2016-08-01 Transportsystem und Bearbeitungssystem für Substrate
DE102016214184.8 2016-08-01

Publications (1)

Publication Number Publication Date
WO2018024707A1 true WO2018024707A1 (fr) 2018-02-08

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ID=59686906

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PCT/EP2017/069390 Ceased WO2018024707A1 (fr) 2016-08-01 2017-08-01 Système de transport et système d'usinage de substrats

Country Status (4)

Country Link
EP (1) EP3490916A1 (fr)
CN (1) CN109689541A (fr)
DE (1) DE102016214184A1 (fr)
WO (1) WO2018024707A1 (fr)

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DE102019217033B4 (de) * 2019-11-05 2022-06-30 Asys Automatisierungssysteme Gmbh Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem

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