WO2018097518A1 - Procédé de fabrication de câble plat - Google Patents

Procédé de fabrication de câble plat Download PDF

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Publication number
WO2018097518A1
WO2018097518A1 PCT/KR2017/012625 KR2017012625W WO2018097518A1 WO 2018097518 A1 WO2018097518 A1 WO 2018097518A1 KR 2017012625 W KR2017012625 W KR 2017012625W WO 2018097518 A1 WO2018097518 A1 WO 2018097518A1
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WO
WIPO (PCT)
Prior art keywords
base substrate
masking
layer
substrate
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/012625
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English (en)
Korean (ko)
Inventor
단성백
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amogreentech Co Ltd
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Amogreentech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amogreentech Co Ltd filed Critical Amogreentech Co Ltd
Publication of WO2018097518A1 publication Critical patent/WO2018097518A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables

Definitions

  • the present invention relates to a flat cable manufacturing method, and more particularly, to a flat cable manufacturing method (FAT CABLE MANUFACTURING METHOD) connected to a circuit board mounted in a home appliance for transmitting power.
  • a flat cable manufacturing method FAT CABLE MANUFACTURING METHOD
  • a plurality of circuit boards are mounted in home appliances such as televisions.
  • Circuit boards are connected by various types of cables for power supply or signal transmission. That is, the circuit board is a cable such as a flexible printed circuit board (FPC), a flexible flat cable (FFC), a wire (Wire), etc. according to the voltage required for power supply or signal transmission .
  • the flexible printed circuit board cable is mainly used for a circuit board requiring a low voltage.
  • Flexible flat cable is used for circuit boards requiring medium voltage.
  • Wire is used for circuit boards that require high voltage.
  • a flexible flat cable mainly used for medium voltage circuit boards has a width of about 3 cm and a maximum length of about 30 cm, which makes it difficult to connect circuit boards embedded in large televisions.
  • the present invention has been proposed to solve the above-mentioned conventional problems, and a method of manufacturing a flat cable having a length of approximately 50 cm by forming a metal pattern on a base substrate on which a masking substrate having a metal pattern region is opened by a roll-to-roll process is laminated.
  • the purpose is to provide.
  • Another object of the present invention is to provide a flat cable manufacturing method having a length of approximately 50 cm or more by continuously manufacturing a flat cable having a metal pattern formed by a roll-to-roll process.
  • a flat cable manufacturing method comprises the steps of preparing a base substrate in the form of a roll, preparing a masking substrate in the form of a roll open the metal pattern formation region, the base substrate and masking Laminating the substrate, forming a seed layer on the base substrate on which the masking substrate is laminated, forming a plating layer on the seed layer, and removing the masking substrate from the base substrate.
  • a method for manufacturing a flat cable includes preparing a base substrate having a metal layer formed on at least one surface thereof, and removing a part of the metal layer through a roll-to-roll process to form a metal pattern on the base substrate. It may include the step.
  • the method of manufacturing a flat cable has the effect of forming a flat cable having a length of approximately 50 cm or more by forming a metal pattern on a base substrate on which a masking substrate having an open metal pattern region is laminated in a roll-to-roll process.
  • the flat cable manufacturing method is a roll-to-roll process to form a metal pattern on the base substrate on which the masking substrate with the metal pattern region is opened, thereby manufacturing a flat cable without a photo resist process and etching process. And it is possible to minimize the product cost by simplifying the manufacturing process.
  • the flat cable manufacturing method has an effect of producing a flat cable having a length of approximately 50 cm or more by continuously manufacturing a flat cable having a metal pattern formed in a roll-to-roll process.
  • the flat cable manufacturing method by removing a portion of the metal layer of the base substrate to form a metal pattern through the photoresist layer forming, laser exposure, development, etching and peeling process while transferring the base substrate in a roll-to-roll process when forming the metal pattern, There is an effect that a flat cable having a length of about 50 cm or more can be produced.
  • the flat cable manufacturing method removes a portion of the metal layer of the base substrate by forming a metal pattern through a masking layer forming, etching, and peeling process while transferring the base substrate by a roll-to-roll process when forming the metal pattern, thereby forming a length of about 50 cm or more.
  • FIG 1 and 2 are views for explaining a flat cable manufacturing method according to a first embodiment of the present invention.
  • 3 and 4 are views for explaining the lamination step of FIG.
  • FIG. 5 is a view for explaining a flat cable manufacturing method according to a first embodiment of the present invention.
  • FIG. 6 and 7 are views for explaining a flat cable manufacturing method according to a second embodiment of the present invention.
  • FIG. 8 and 9 are views for explaining the metal pattern forming step of FIG.
  • FIG. 10 is a view for explaining a flat cable manufacturing method according to a second embodiment of the present invention.
  • 11 and 12 are views for explaining a flat cable manufacturing method according to a third embodiment of the present invention.
  • FIG. 13 and 14 are views for explaining the metal pattern forming step of FIG.
  • 15 is a view for explaining a flat cable manufacturing method according to a third embodiment of the present invention.
  • a method of manufacturing a flat cable includes preparing a base substrate 110 (S110), preparing a masking substrate 120 (S120), and a base. Stacking the masking substrate 120 on the substrate 110 (S130), forming the seed layer 130 on the base substrate 110 (S140), and forming the plating layer 140 on the seed layer 130. Step S150 and removing the masking substrate 120 from the base substrate 110 (S160).
  • the flat cable manufacturing method to manufacture a flat cable through a continuous roll to roll (Roll To Roll) process.
  • FIG. 2 is demonstrated with reference to the short side side cross section of a flat cable in order to demonstrate the flat cable manufacturing method easily.
  • the base substrate 110 Preparing the base substrate 110 (S110) prepares the base substrate 110 in the form of a film to be the base of the flat cable.
  • the base substrate 110 may be formed of a flexible or elastic material such as polyimide (PI), polyethylene phthalate (PET), and thermoplastic polyurethane (TPU).
  • PI polyimide
  • PET polyethylene phthalate
  • TPU thermoplastic polyurethane
  • Preparing the base substrate 110 prepares the base substrate 110 in a roll form for a roll-to-roll process. That is, in the preparing of the base substrate 110 (S110), the base substrate 110 in a roll form is prepared by winding the base substrate 110 on a roll.
  • the masking substrate 120 having a region where the metal pattern is to be opened is prepared.
  • the masking substrate 120 may form a region (hereinafter, the metal pattern forming region 221) on which the metal pattern is to be formed on the masking film (or tape) through a process such as mold punching, laser processing, and wheel cutting.
  • the masking substrate 120 is prepared by removing (opening).
  • the masking film (or tape) may be any one of paper, silicone, and PET.
  • the preparing of the masking substrate 120 prepares the masking substrate 120 in a roll form for a roll-to-roll process. That is, in the preparing of the masking substrate 120 (S120), the masking substrate 120 is wound on a roll to prepare the masking substrate 120 in a roll shape.
  • the masking substrate 120 may be prepared by winding a plurality of masking films (or tapes) formed in a ribbon shape so as to be spaced apart from each other. At this time, the spacing between the masking substrate 120 is preferably to correspond to the width of the metal pattern.
  • step S130 of laminating the masking substrate 120 to the base substrate 110 the masking substrate 120 is laminated to at least one surface of the base substrate 110 through a roll-to-roll process.
  • the step (S130) of laminating the masking substrate 120 to the base substrate 110 is the step of applying the adhesive 150 to the masking substrate 120 (S132) and laminating (S134).
  • step S132 Applying the adhesive 150 to the masking substrate 120 (S132) to apply the adhesive 150 to one surface of the masking substrate 120. That is, in step S132, the adhesive 150 is applied to the masking substrate 120, the masking substrate 120 in a roll form is supplied to the printing roll, and the adhesive 150 is applied to one surface of the masking substrate 120 in the printing roll. do. In this case, the adhesive 150 is applied to the masking substrate 120 (S132) to apply the adhesive 150 to one surface of the masking substrate 120 to be bonded to the base substrate 110.
  • the adhesive 150 is applied to the masking substrate 120 (S132) in step (S160) of removing the masking substrate 120 to be described later to facilitate the removal of the masking substrate 120, the adhesive having a low adhesive force ( 150 is applied to the masking substrate 120.
  • the adhesive sheet may be adhered to one surface of the masking substrate 120. That is, in step S132, the adhesive 150 is applied to the masking substrate 120, and the rolled masking substrate 120 is supplied to the printing roll, and the adhesive sheet in the roll form is printed on one surface of the masking substrate 120. Glue. In this case, in the step of applying the adhesive 150 to the masking substrate 120 (S132), the adhesive sheet is adhered to one surface of the masking substrate 120 to be bonded to the base substrate 110.
  • the masking substrate 120 is laminated on at least one surface of the base substrate 110. That is, in the step of laminating (S134), the masking substrate 120 and the base substrate 110 to which the adhesive 150 is applied (or the adhesive sheet is attached) are supplied to the lamination rolls, and the masking substrate is provided on at least one surface of the base substrate 110. Laminate 120. At this time, the step of laminating (S134) may apply a pressure through the lamination roll, or may apply the pressure and heat to the masking substrate 120 to the base substrate 110.
  • the seed layer 130 is formed on the base substrate 110 through a physical deposition process.
  • the physical vapor deposition process may be any one of vacuum deposition, evaporation, ebeam deposition, laser deposition, sputtering, arc ion plating.
  • the seed layer 130 In the forming of the seed layer 130 (S140), the seed layer may be formed only in a region exposed by the open region of the masking substrate 120 (that is, the metal pattern forming region 221) of the entire region of the base substrate 110. 130).
  • the seed layer 130 which is a metal including nickel copper (NiCu) or copper (Cu), is formed.
  • the seed layer 130 may be formed to a thickness of about 15nm when formed of nickel copper, and may be formed to a thickness of about 20nm to 100nm when formed of copper.
  • the plating layer 140 is formed on the seed layer 130 through a physical deposition process.
  • the physical vapor deposition process may be any one of vacuum deposition, evaporation, ebeam deposition, laser deposition, sputtering, arc ion plating.
  • the plating layer 140 is formed only in a region exposed by the open region of the masking substrate 120 (that is, the top surface of the seed layer 130).
  • Forming the plating layer 140 (S150) forms a plating layer 140 which is a metal including at least one of copper (Cu) and silver (Ag). At this time, the plating layer 140 may be formed to a thickness of about 15 ⁇ m.
  • Removing the masking substrate 120 removes the masking substrate 120 from the base substrate 110.
  • a coating layer 162 is formed on the base substrate 110 on which the seed layer 130 and the plating layer 140 are formed.
  • terminals 166 connected to both ends of the metal pattern 164 (that is, the seed layer 130 and the plating layer 140) formed on the base substrate 110 are formed.
  • the flat cable manufacturing method produces a flat cable 160 having a length of approximately 50cm or more.
  • the plating layer 140 may be formed on the seed layer 130 after the masking substrate 120 is removed from the base substrate 110 (S160). In this case, in the method of manufacturing a flat cable, the plating layer 140 is formed on the seed layer 130 by forming the plating layer 140 on the seed layer 130 after removing the masking substrate 120.
  • a method of manufacturing a flat cable according to a second embodiment of the present invention includes preparing a base substrate 210 (S210). Forming a metal pattern 220 on the base substrate 210 (S220) and forming a protective coating layer 230 (S230). At this time, the flat cable manufacturing method is performed continuously through the roll-to-roll process step S200 and S300.
  • the base film 214 on which the metal layer 212 is formed is prepared as the base substrate 210.
  • the base substrate 210 having a roll shape may be prepared by winding the substrate on which the metal layer 212 is formed on at least one surface of the substrate film 214.
  • the metal layer 212 may be any one of copper (Cu) and silver (Ag), and the base film 214 may include polyimide (PI), polyethylene phthalate (PET), and thermoplastic polyurethane (TPU); Thermoplastic Poly Urethane).
  • PI polyimide
  • PET polyethylene phthalate
  • TPU thermoplastic polyurethane
  • a flexible copper clad laminate (FCCL) in which copper (Cu) is laminated on the surface may be wound to prepare a base substrate 210 in a roll form.
  • FCCL flexible copper clad laminate
  • Cu copper
  • the metal pattern 220 In the forming of the metal pattern 220 (S220), a part of the metal layer 212 of the base substrate 210 is removed to form the metal pattern 220. In this case, in the forming of the metal pattern 220 (S220), the metal pattern 220 is formed on at least one surface of the base substrate 210 which is continuously supplied through a roll-to-roll process.
  • the photoresist layer 240 is formed on at least one surface of the base substrate 210.
  • the photoresist layer 240 may be formed on the base substrate 210 by laminating the photosensitive dry film or applying a photoresist liquid.
  • the step (S221) of forming the photoresist layer 240 may form the photoresist layer 240 by any one of spin coating, laminating, comma roll coating, gravure coating, doctor blade method, spray method and electrospinning. have.
  • the exposing step S223 a region of the photoresist layer 240 on which the metal pattern 220 is to be formed is exposed and cured.
  • the exposing step S223 exposes the photoresist layer 240 through a laser exposure (LDI) process to form fine gaps between the metal patterns 220.
  • LPI laser exposure
  • the developing step S225 a region in which the metal pattern 220 is not formed in the photoresist layer 240 is developed. That is, the developing step S225 develops and removes the uncured photoresist layer 240 in the exposing step S223. At this time, the developing step (S225) is removed by melting the uncured photoresist layer 240 with a developer.
  • the metal layer 212 of the base substrate 210 is etched using the cured photoresist layer 240 to form a metal pattern 220.
  • the photoresist layer 240 remaining on the metal pattern 220 (that is, the metal layer 212) is removed.
  • the photoresist layer 240 on the metal pattern 220 is removed through a stripping process.
  • the protective coating layer 230 is formed on the base substrate 210 on which the metal pattern 220 is formed.
  • the forming of the protective coating layer 230 (S230) is a roll base roll coating the coating liquid on the surface (that is, at least one of the upper and lower surfaces) of the base substrate 210, the metal pattern 220 is formed through a base substrate ( After applying to the coating 210 to cure or to coat the coating sheet on the base substrate 210 to form a protective coating 230 to protect the metal pattern 220.
  • the protective coating layer 230 is an example of a PI coating layer or a PAI coating layer.
  • the flat cable manufacturing method cuts the base substrate 210 continuously produced through a roll-to-roll process at predetermined intervals.
  • terminals 262 connected to both ends of the metal pattern 220 are formed to manufacture the flat cable 260.
  • the flat cable manufacturing method produces a flat cable 260 having a length of approximately 50cm or more.
  • the base film 314 on which the metal layer 312 is formed is prepared as the base substrate 310.
  • the base substrate 310 having a roll shape is prepared by winding the substrate on which the metal layer 312 is formed on at least one surface of the substrate film 314.
  • the metal layer 312 may be any one of copper (Cu) and silver (Ag), and the base film 314 may include polyimide (PI), polyethylene phthalate (PET), and thermoplastic polyurethane (TPU); Thermoplastic Poly Urethane).
  • PI polyimide
  • PET polyethylene phthalate
  • TPU thermoplastic polyurethane
  • FCCL flexible copper clad laminate
  • Cu copper
  • the metal pattern 320 In the forming of the metal pattern 320 (S320), a part of the metal layer 312 of the base substrate 310 is removed to form the metal pattern 320. In this case, in the forming of the metal pattern 320 (S320), the metal pattern 320 is formed on at least one surface of the base substrate 310 which is continuously supplied through a roll-to-roll process.
  • the forming of the metal pattern 320 may include forming the masking layer 340 (S322) and etching the base substrate 310 (S324). In operation S326, the masking layer 340 is removed.
  • the masking layer 340 is formed on at least one surface of the base substrate 310. That is, in operation S322, the masking layer 340 may be formed by forming a masking layer 340 having a shape corresponding to the metal pattern 320 on at least one surface of the upper and lower surfaces of the base substrate 310. Form.
  • an etching resist is applied to at least one surface of the base substrate 310 to form the masking layer 340.
  • the forming of the masking layer 340 (S322) is an example in which the masking layer 340 is formed by applying (printing) an etching resist to at least one surface of the base substrate 310 using a roll printer.
  • the etching of the base substrate 310 may be performed by etching part of the metal layer 312 of the base substrate 310 by using a masking layer 340 formed on the metal layer 312 of the base substrate 310 as a barrier.
  • the metal pattern 320 is formed.
  • Removing the masking layer 340 removes the masking layer 340 remaining on the metal pattern 320 (that is, the metal layer 312). In this case, in step S326 of removing the masking layer 340, the masking layer 340 remaining on the metal pattern 320 is removed through a stripping process.
  • the protective coating layer 330 is formed on the base substrate 310 on which the metal pattern 320 is formed.
  • the forming of the protective coating layer 330 (S330) is a base substrate (the coating liquid on the surface (that is, at least one of the upper and lower surfaces) of the base substrate 310, the metal pattern 320 is formed through a roll-to-roll process After coating to 310 to cure, or to coat the coating sheet on the base substrate 310 to form a protective coating layer 330 to protect the metal pattern (320).
  • the protective coating layer 330 is an example of a PI coating layer or a PAI coating layer.
  • the flat cable manufacturing method cuts the base substrate 310 continuously produced through a roll-to-roll process at predetermined intervals.
  • the flat cable manufacturing method forms the flat cable 350 by forming terminals 352 connected to both ends of the metal pattern 320. Through this, the flat cable manufacturing method produces a flat cable 350 having a length of approximately 50cm or more.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un câble plat ayant une longueur supérieure ou égale à environ 50 cm par formation, par un procédé rouleau à rouleau, de motifs métalliques sur un substrat de base sur lequel est stratifié un substrat de masquage dont une région de motif métallique est ouverte. Le procédé de fabrication de câble plat selon l'invention comprend les étapes consistant à : préparer le substrat de base de type rouleau; préparer le substrat de masquage de type rouleau dont une région de formation de motif métallique est ouverte; stratifier le substrat de base et le substrat de masquage; former une couche germe sur le substrat de base sur lequel est stratifié le substrat de masquage; former une couche de revêtement métallique sur la couche germe; et retirer le substrat de masquage du substrat de base.
PCT/KR2017/012625 2016-11-24 2017-11-08 Procédé de fabrication de câble plat Ceased WO2018097518A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20160157719 2016-11-24
KR10-2016-0157720 2016-11-24
KR20160157720 2016-11-24
KR10-2016-0157721 2016-11-24
KR20160157721 2016-11-24
KR10-2016-0157719 2016-11-24

Publications (1)

Publication Number Publication Date
WO2018097518A1 true WO2018097518A1 (fr) 2018-05-31

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Application Number Title Priority Date Filing Date
PCT/KR2017/012625 Ceased WO2018097518A1 (fr) 2016-11-24 2017-11-08 Procédé de fabrication de câble plat

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KR (1) KR20180058626A (fr)
WO (1) WO2018097518A1 (fr)

Cited By (1)

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CN116482938A (zh) * 2022-01-17 2023-07-25 北京小米移动软件有限公司 金属件的制作方法、金属件及电子设备

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KR102423487B1 (ko) 2020-04-14 2022-07-20 한양대학교 에리카산학협력단 플렉시블 플랫 케이블의 제조방법 및 이를 통해 제조된 플렉시블 플랫 케이블
KR20230026581A (ko) * 2021-08-17 2023-02-27 주식회사 커버써먼 발열체 필름 및 이의 제조 방법

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US20090151980A1 (en) * 2007-12-14 2009-06-18 P-Two Industries Inc. Flexible flat cable and manufacturing method thereof
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116482938A (zh) * 2022-01-17 2023-07-25 北京小米移动软件有限公司 金属件的制作方法、金属件及电子设备

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