WO2024257916A1 - Procédé de fabrication d'une carte de circuit imprimé souple double face - Google Patents

Procédé de fabrication d'une carte de circuit imprimé souple double face Download PDF

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Publication number
WO2024257916A1
WO2024257916A1 PCT/KR2023/008211 KR2023008211W WO2024257916A1 WO 2024257916 A1 WO2024257916 A1 WO 2024257916A1 KR 2023008211 W KR2023008211 W KR 2023008211W WO 2024257916 A1 WO2024257916 A1 WO 2024257916A1
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WO
WIPO (PCT)
Prior art keywords
conductive
flexible printed
circuit board
printed circuit
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2023/008211
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English (en)
Korean (ko)
Inventor
한병채
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/KR2023/008211 priority Critical patent/WO2024257916A1/fr
Publication of WO2024257916A1 publication Critical patent/WO2024257916A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the present invention relates to a method for manufacturing a double-sided flexible printed circuit board having circuit boards formed on both sides of an insulating film.
  • a flexible printed circuit board is a flexible substrate that forms a circuit pattern on a thin insulating film and can be bent flexibly. It is widely used in cases where bending and flexibility are required when mounting components, such as mobile devices such as smartphones and display devices.
  • FCCL flexible copper clad laminate
  • a copper layer is laminated on a polyimide film layer as a substrate (raw material)
  • the circuit pattern is mainly formed by performing operations such as laminating, exposing, developing, and etching of a dry film on the FCCL.
  • a double-sided FCCL substrate is generally used.
  • the double-sided FCCL substrate is in the form of a copper layer laminated on both sides of a polyimide film layer.
  • Through holes are formed in these double-sided FCCLs, and the inner walls of the through holes are plated using electroless copper plating or other methods to electrically connect the copper layers on both sides, thereby enabling circuit connection on both sides of the flexible printed circuit board.
  • Through holes are usually formed through a drilling process using an NC drill or laser. Precision machining is required to avoid damage to both the film and the copper layer, and the more through holes there are, the longer the process takes and the more costly it becomes.
  • a separate process of plating the inner wall of the through hole must be performed for electrical connection of the inner hole, and this process is performed by first conducting current on both sides of the inside of the through hole using a method such as electroless plating, and then performing electrolytic plating to increase the thickness of the plating layer inside the through hole.
  • the upper and lower surfaces of the FCCL with the copper layer have the total thickness of the sum of the thickness of the existing copper layer, the thickness of the electroless plating layer, and the thickness of the electrolytic plating layer, and the thickness of the inner side wall of the through hole has the total thickness of the sum of the thickness of the electroless plating layer and the thickness of the electrolytic plating layer, so there is a difference in the thickness.
  • a discontinuous connection may occur at the connection portion of the upper and lower surfaces where the copper layer is located and the plating layer on the inner side wall of the through hole, which may cause a defect.
  • the present invention is intended to solve the problems of the conventional double-sided flexible printed circuit board manufacturing method as described above, and provides a method for manufacturing a double-sided flexible printed circuit board capable of forming a circuit connected on both sides in a cheaper and simpler manner than the conventional method.
  • a method for manufacturing a double-sided flexible printed circuit board according to the present invention is characterized by including the steps of: forming a hole in a non-conductive film; covering the non-conductive film in which the hole is formed with a conductive seed material; applying a dry film to each of both surfaces of the non-conductive film covered with the conductive seed material; removing a portion corresponding to a through-hole region and a circuit pattern region to be plated from the dry film; plating the non-conductive film with a conductive material to form a plated through-hole and a circuit pattern; and removing a remaining dry film and a conductive seed material positioned below the remaining dry film.
  • the step of removing the residual dry film and the conductive seed material positioned below the residual dry film is characterized in that the residual dry film and the conductive seed material positioned below the residual dry film are removed through etching.
  • the present invention is characterized in that at least a portion of the conductive material plated by the etching is etched away.
  • the present invention is characterized in that plating of the conductive material is performed taking into consideration the thickness to which the conductive material is to be cut.
  • the present invention is characterized in that removal of a portion corresponding to a through-hole area and a circuit pattern area where plating is to be performed in the dry film is performed in consideration of the width by which the conductive material is to be cut.
  • the step of covering the non-conductive film with a conductive seed material is characterized by covering the non-conductive film with the conductive seed material through dry plating.
  • the step of removing a portion corresponding to the through-hole region and the circuit pattern region is characterized by removing a portion corresponding to the through-hole region and the circuit pattern region from the dry film through exposure and development of the dry film.
  • the step of forming the plated through hole and circuit pattern is characterized by performing plating of the conductive material through electroplating.
  • the conductive seed material is characterized by being one of titanium, nickel, chromium and copper, or an alloy of at least two of titanium, nickel, chromium and copper.
  • the conductive seed material is characterized by being composed of a plurality of layers.
  • the conductive material is copper.
  • the non-conductive film is characterized by being a polyimide film.
  • the method for manufacturing a double-sided flexible printed circuit board according to the present invention covers a non-conductive film having holes formed therein with a conductive material, forms an area to be plated, and then forms plated through holes and a circuit pattern together through a single plating process, thereby omitting a separate hole plating process, thereby having the effect of reducing the time and cost required for manufacturing a double-sided flexible printed circuit board.
  • the method for manufacturing a double-sided flexible printed circuit board according to the present invention has the effect of improving the reliability of the through-hole portion by forming plated through-holes and circuit patterns together through a single plating process, thereby preventing the occurrence of discontinuous connection patterns, etc.
  • the method for manufacturing a double-sided flexible printed circuit board according to the present invention has the effect of enabling a simpler method than the drilling process used in the case of using a double-sided FCCL for forming through holes or achieving high precision by first forming holes only in a non-conductive film.
  • FIG. 1 is a flow chart for explaining a method for manufacturing a double-sided flexible printed circuit board according to one embodiment of the present invention.
  • FIGS. 2 to 7 are exemplary diagrams for explaining a method for manufacturing a double-sided flexible printed circuit board according to one embodiment of the present invention.
  • FIGS. 8 to 10 are exemplary views for explaining a method for manufacturing a multilayer flexible printed circuit board by laminating intermediate products of a double-sided flexible printed circuit board manufactured by a method for manufacturing a double-sided flexible printed circuit board according to one embodiment of the present invention.
  • FIG. 1 is a flow chart for explaining a method for manufacturing a double-sided flexible printed circuit board according to an embodiment of the present invention
  • FIGS. 2 to 7 are exemplary diagrams for explaining a method for manufacturing a double-sided flexible printed circuit board according to an embodiment of the present invention.
  • the method for manufacturing a double-sided flexible printed circuit board according to an embodiment of the present invention will be explained as follows.
  • a method for manufacturing a double-sided flexible printed circuit board first forms a hole (2) in a non-conductive film (1) (S100). That is, as illustrated in FIG. 2, an area where a through hole is to be formed is formed in advance in the non-conductive film (1).
  • the formation of the hole (2) can be performed in various ways, such as processing by drilling or processing by laser, and unlike the processing of double-sided FCCL, since only the non-conductive film (1) is processed, there are fewer restrictions on the processing method compared to the drilling process when using double-sided FCCL, and it can be performed in a simpler process.
  • the non-conductive film (1) may be, for example, a polyimide film, but may also be a film of another insulating material.
  • Fig. 2 (a) is a drawing of a non-conductive film (1) viewed from above
  • Fig. 2 (b) is a drawing in which only the dotted line portion of Fig. 2 (a) is cut out for explanation and a cross-section thereof (a cross-section in the thickness direction of the non-conductive film (1), i.e., a plane perpendicular to the plane of Fig. 2 (a)) is depicted.
  • the manufacturing process will be described based on this cross-section, and the implementation of a conventional circuit pattern in which a circuit pattern viewed from above is connected in a circular or linear manner corresponds to a matter widely known in the technical field of the present invention, and therefore a detailed description thereof will be omitted.
  • a process of covering the film (1) in which the hole (2) is formed with a conductive seed material (3) is performed (S200). At this time, as shown in Fig. 3, the entire exposed area of the film (1), including the inner wall of the through hole, can be covered with the conductive seed material (3).
  • the conductive seed material (3) may be a conductive material such as titanium, nickel, chromium, copper, or an alloy thereof.
  • the conductive seed material (3) may be composed of multiple layers, for example, may be composed of two layers.
  • the lower layer of the conductive seed material (3) may be made of one of titanium, nickel, chromium, and copper, or an alloy thereof, in order to improve bonding strength with the non-conductive film (1) and cleanly remove it in the soft etching process described later.
  • the upper layer of the conductive seed material (3) may use copper or a copper alloy in order to secure bonding strength with the lower layer, facilitate smooth plating of the conductive material (5) described later, and secure adhesion of the dry film (4).
  • the direction facing outward from the non-conductive film (1) is referred to as upward. That is, when explaining with reference to FIGS. 3 and 4, etc., the conductive seed material (3) can be referred to as being located above the non-conductive film (1) and below the dry film (4). Since the upper and lower surfaces can be described symmetrically with reference to the drawings, the same criterion can be applied.
  • the application of the conductive seed material (3) can be performed by a dry plating method, and can be performed by, for example, an E-Beam, Evaporation, CVD, PVD method, etc. However, it is not limited thereto, and various methods capable of plating the conductive material on the insulating film can be used.
  • a dry film (4) is applied to both sides of the film (1) covered with the conductive seed material (3) (S300). That is, as shown in Fig. 4, laminating or the like is performed so that the dry film (4) is attached to both sides of the film (1) covered with the conductive seed material (3).
  • the dry film corresponding to the areas (6, 7) where plating is to be performed can be removed, as shown in Fig. 5.
  • the pattern of the dry film (4) to be removed can be determined by considering the width of the circuit pattern to be cut (reduced) in the etching (soft etching) process described later. That is, the width of the pattern of the dry film (4) to be removed can be determined by adding the width reduced in the soft etching process to the width of the circuit pattern to be manufactured.
  • step (S400) copper plating is performed to form a circuit pattern and through-hole plating is performed (S500).
  • plating can be performed by electroplating (electroplating) to perform the circuit pattern and through-hole plating at the same time.
  • a circuit pattern (5) with both sides electrically connected is formed on both sides of the film (1) (on the conductive seed material (3)). That is, according to the present invention, even without performing a separate plating process to plate through holes for connecting the circuit patterns on both sides of the film (1), plating of through holes can be performed simultaneously with the formation of the circuit pattern.
  • conductive seed material (3) may also be applied to the side of the film (1), so that copper may also be plated on that part.
  • an external processing process such as an altar exists during the actual product manufacturing process, it does not affect the actual product.
  • copper is described as being plated, but if necessary, a conductive material other than copper may be plated to form a circuit pattern (5).
  • the residual dry film (4) remaining on the conductive seed material (3) and the conductive seed material (3) underneath the residual dry film (4) are removed (S600).
  • the residual dry film (4) can be removed using an alkaline chemical agent, etc.
  • the conductive seed material (3) located below the residual dry film (4) is also removed.
  • This can be achieved by selecting a chemical agent for etching (soft etching) in consideration of the properties of the conductive seed material (3), etc.
  • a chemical agent for etching soft etching
  • an acid chemical agent can be used.
  • a part of the surface of the circuit pattern (5) may be shaved off, and by performing the plating of the step (S500) (by controlling the time of electroplating, etc.) in consideration of the thickness of the circuit pattern (5) shaved off in this manner, a circuit pattern (5) having a thickness of a desired specification can be formed.
  • the thickness of the conductive layer formed on the non-conductive film (1) is the sum of the thickness of the circuit pattern (5) from which a part is shaved off and the thickness of the conductive seed material (3), so that a conductive layer having a desired specification can be formed in consideration of this.
  • the reduction in the width of the circuit pattern (5) can be reflected by changing the width of the pattern of the dry film (4).
  • a circuit pattern (5) is formed on both sides of an insulating film (1), and a double-sided flexible printed circuit board intermediate product in the form of a plated through-hole for electrical connection of the circuit pattern (5) formed on both sides can be obtained.
  • the thickness of the circuit pattern (5) formed on both sides and the thickness of the side wall of the through-hole are the same because they are plating layers formed in one process, and they are integrally formed so that no problems occur at the connection part.
  • the product can be completed through processes such as terminal plating and external processing, and components can be mounted as needed.
  • This process can be the same as the manufacturing method of a typical flexible printed circuit board.
  • FIGS. 8 to 10 are exemplary views for explaining a method for manufacturing a multilayer flexible printed circuit board by laminating intermediate products of a double-sided flexible printed circuit board manufactured by a method for manufacturing a double-sided flexible printed circuit board according to one embodiment of the present invention.
  • the intermediate product of the double-sided flexible printed circuit board can be laminated with a non-conductive layer (9) therebetween.
  • the non-conductive layer (9) can be a polyimide film, and in this case, the intermediate product of the double-sided flexible printed circuit board can be attached to the non-conductive layer (9) by utilizing an adhesive material (8).
  • the non-conductive layer can be formed by utilizing the non-conductive adhesive itself.
  • a hole (10) may be formed to perform a multi-layer connection, and plating of the inner wall of the hole (10) may be performed.
  • this process can be used as is in a method used in manufacturing a double-sided printed circuit board using a conventional double-sided FCCL substrate, a detailed description thereof will be omitted.
  • cross-section + double-sided + cross-section is also possible, and various other deformations such as cross-section + double-sided + double-sided + cross-section are also possible.
  • the product can be completed through processes such as terminal plating and external processing, and components can be mounted as needed.
  • This process can be the same as the manufacturing method of a typical flexible printed circuit board.
  • the present invention can be performed in a flexible printed circuit board manufacturing facility configured to perform each process such as hole processing, dry plating, laminating, exposure, development, etching, electroplating, and attachment, and a control device of such manufacturing facility can control the operation of each process.
  • a control device of such manufacturing facility can control the operation of each process.
  • Such manufacturing facility can additionally be equipped with a robot arm, a transfer belt, etc. for transferring a product between each process, and various other equipment can be added in addition.
  • the control device can include a computer-readable storage medium that stores commands for controlling the manufacturing facility to perform each process, and such storage medium can be coupled with a processor and configured to cause the processor to perform each step of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé souple double face, le procédé comprenant les étapes consistant à : former un trou dans un film non conducteur ; recouvrir le film non conducteur ayant le trou avec un matériau de germe conducteur ; appliquer des films secs sur les deux côtés du film non conducteur recouvert du matériau de germe conducteur ; retirer des parties des films secs correspondant à une zone de trou traversant et une zone de motif de circuit qui doivent être plaquées ; former un trou traversant plaqué et un motif de circuit par placage du film non conducteur avec un matériau conducteur ; et retirer les films secs restants et le matériau de germe conducteur sous les films secs restants.
PCT/KR2023/008211 2023-06-14 2023-06-14 Procédé de fabrication d'une carte de circuit imprimé souple double face Ceased WO2024257916A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2023/008211 WO2024257916A1 (fr) 2023-06-14 2023-06-14 Procédé de fabrication d'une carte de circuit imprimé souple double face

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2023/008211 WO2024257916A1 (fr) 2023-06-14 2023-06-14 Procédé de fabrication d'une carte de circuit imprimé souple double face

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WO2024257916A1 true WO2024257916A1 (fr) 2024-12-19

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0261301A2 (fr) * 1986-09-22 1988-03-30 Ube Industries, Ltd. Procédé de fabrication d'une plaque de circuit imprimé comportant des trous métallisés en travers
KR100771352B1 (ko) * 2006-09-19 2007-10-29 삼성전기주식회사 인쇄회로기판의 제조방법
KR20130051124A (ko) * 2011-11-09 2013-05-20 엘지이노텍 주식회사 폴리이미드 코어를 이용한 박형 다층 인쇄회로기판 및 그 제조방법
KR20130078441A (ko) * 2011-12-30 2013-07-10 영풍전자 주식회사 인쇄회로기판 제조방법
JP2013219337A (ja) * 2012-03-16 2013-10-24 Sumitomo Bakelite Co Ltd 積層板及びプリント配線板の製造方法
KR20230093958A (ko) * 2021-12-20 2023-06-27 한병채 양면 연성인쇄회로기판 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0261301A2 (fr) * 1986-09-22 1988-03-30 Ube Industries, Ltd. Procédé de fabrication d'une plaque de circuit imprimé comportant des trous métallisés en travers
KR100771352B1 (ko) * 2006-09-19 2007-10-29 삼성전기주식회사 인쇄회로기판의 제조방법
KR20130051124A (ko) * 2011-11-09 2013-05-20 엘지이노텍 주식회사 폴리이미드 코어를 이용한 박형 다층 인쇄회로기판 및 그 제조방법
KR20130078441A (ko) * 2011-12-30 2013-07-10 영풍전자 주식회사 인쇄회로기판 제조방법
JP2013219337A (ja) * 2012-03-16 2013-10-24 Sumitomo Bakelite Co Ltd 積層板及びプリント配線板の製造方法
KR20230093958A (ko) * 2021-12-20 2023-06-27 한병채 양면 연성인쇄회로기판 제조 방법

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