WO2020031379A1 - Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré - Google Patents

Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré Download PDF

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Publication number
WO2020031379A1
WO2020031379A1 PCT/JP2018/030115 JP2018030115W WO2020031379A1 WO 2020031379 A1 WO2020031379 A1 WO 2020031379A1 JP 2018030115 W JP2018030115 W JP 2018030115W WO 2020031379 A1 WO2020031379 A1 WO 2020031379A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
photosensitive resin
colored pattern
photosensitive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/030115
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English (en)
Japanese (ja)
Inventor
吉田　英樹
山崎　宏
雅彦 海老原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to PCT/JP2018/030115 priority Critical patent/WO2020031379A1/fr
Publication of WO2020031379A1 publication Critical patent/WO2020031379A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Definitions

  • FIG. 1 is a schematic sectional view showing one embodiment of the photosensitive film according to the present invention.
  • FIG. 2 is a schematic cross-sectional view showing one embodiment of a method for forming a colored pattern according to the present invention.
  • FIG. 2 is a schematic cross-sectional view showing one embodiment of a method for forming a colored pattern according to the present invention.
  • FIG. 1 is a schematic sectional view showing one embodiment of the photosensitive film according to the present invention.
  • the photosensitive film 10 of the present embodiment includes a support film 1, a photosensitive resin layer 2 provided on the support film 1, and a protective film 3 provided on the photosensitive resin layer 2 on the side opposite to the support film.
  • the protective film 3 can be provided as needed or can be omitted.
  • Examples of the 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane include, for example, 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) propane, 2,2 -Bis (4-((meth) acryloxytriethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxytetraethoxy) phenyl) propane, 2,2-bis (4-((meta ) Acryloxypentaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyhexaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxyheptaethoxy) phenyl) Propane, 2,2-bis (4-((meth) acryloxyoctaethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxynona (Toxi) phenyl) propane, 2,2-bis
  • PO indicates propylene oxide
  • the PO-modified compound has a block structure of a propylene oxide group.
  • Examples of the EO-modified urethane di (meth) acrylate include “UA-11” (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
  • Examples of the EO, PO-modified urethane di (meth) acrylate include “UA-13” (product name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
  • the above-mentioned compounds can be used alone or in combination of two or more.
  • the content ratio of the photopolymerizable compound in the photosensitive resin layer is preferably 30 to 80 parts by mass, and more preferably 40 to 70 parts by mass based on 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound. More preferred.
  • the content of the photopolymerizable compound is 30 parts by mass or more, the photocurability of the photosensitive resin layer and the formability by coating tend to be good, and when the content is 80 parts by mass or less, the film is wound up as a film. In such a case, the storage stability tends to be excellent.
  • the content ratio of the photopolymerization initiator in the photosensitive resin layer is 0.1 to 20 with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound from the viewpoint of achieving both photosensitivity and internal photocurability. It is preferably 1 part by mass, more preferably 1 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass.
  • Leuco dye is a compound that develops color upon contact with an acid and is a component that imparts coloring properties to the photosensitive resin layer.
  • This leuco dye can be colored depending on the type, such as black, blue, green, and red.However, when the formed colored pattern is a bezel or a black matrix of a display body in which black is preferred, black Leuco dyes that produce color are preferred.
  • photoacid generator examples include onium salts such as diazonium salts, iodonium salts, bromonium salts, chloronium salts, sulfonium salts, selenonium salts, pyrylium salts, thiapyrylium salts, and pyridinium salts; tris (trihalomethyl) -s-triazine ( For example, 2,4,6-tris (trichloromethyl) -s-triazine), 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s Halogenated compounds such as -triazine, 2-methyl-4,6-bis
  • the thickness of the protective film is preferably from 1 to 100 ⁇ m, more preferably from 5 to 50 ⁇ m, still more preferably from 5 to 30 ⁇ m, from the viewpoint of achieving a balance between mechanical strength and cost to make the film difficult to break. Particularly preferably, the thickness is 15 to 30 ⁇ m.
  • the second method of forming a colored pattern includes a step S1 of laminating the above-described photosensitive resin layer of the photosensitive film of the present embodiment on a substrate, and a step of laminating the photosensitive resin layer provided on the substrate.
  • the method for producing a substrate with a colored pattern of the present embodiment is a method for producing a substrate with a colored pattern comprising a substrate and a colored pattern provided on the substrate, Forming a colored pattern according to the embodiment.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)

Abstract

Un film photosensible comprend un film de support et une couche de résine photosensible qui est disposée sur le film de support et est développable en milieu alcalin, la couche de résine photosensible comprenant un polymère liant, un composé photopolymérisable, un colorant leuco, et un composé qui génère de l'acide lorsqu'il est exposé à la lumière ou à la chaleur.
PCT/JP2018/030115 2018-08-10 2018-08-10 Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré Ceased WO2020031379A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/030115 WO2020031379A1 (fr) 2018-08-10 2018-08-10 Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/030115 WO2020031379A1 (fr) 2018-08-10 2018-08-10 Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré

Publications (1)

Publication Number Publication Date
WO2020031379A1 true WO2020031379A1 (fr) 2020-02-13

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Application Number Title Priority Date Filing Date
PCT/JP2018/030115 Ceased WO2020031379A1 (fr) 2018-08-10 2018-08-10 Film photosensible, procédé de formation d'un motif coloré, et procédé de fabrication de substrat avec motif coloré

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WO (1) WO2020031379A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000258911A (ja) * 1999-03-11 2000-09-22 Hitachi Chem Co Ltd 感光性着色性樹脂組成物、着色画像形成用感光液、感光性エレメント、着色画像の製造法、カラーフィルター用パネルの製造法及びカラーフィルターの製造法
JP2000305263A (ja) * 1999-04-26 2000-11-02 Hitachi Chem Co Ltd 着色画像形成用感光性樹脂組成物、着色画像形成用感光性エレメント及びブラックマトリックスの製造法
WO2005022260A1 (fr) * 2003-08-28 2005-03-10 Hitachi Chemical Co., Ltd. Composition de resine photosensible, element photosensible faisant appel a cette composition, methode de formation d'un motif de resist, methode pour produire un tableau de connexions imprime, et une methode de suppression du produit photodurci
JP2014197324A (ja) * 2013-03-29 2014-10-16 凸版印刷株式会社 カバーガラス一体型タッチパネルセンサー基板、及び表示装置
JP2016004120A (ja) * 2014-06-16 2016-01-12 帝人株式会社 離型フィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000258911A (ja) * 1999-03-11 2000-09-22 Hitachi Chem Co Ltd 感光性着色性樹脂組成物、着色画像形成用感光液、感光性エレメント、着色画像の製造法、カラーフィルター用パネルの製造法及びカラーフィルターの製造法
JP2000305263A (ja) * 1999-04-26 2000-11-02 Hitachi Chem Co Ltd 着色画像形成用感光性樹脂組成物、着色画像形成用感光性エレメント及びブラックマトリックスの製造法
WO2005022260A1 (fr) * 2003-08-28 2005-03-10 Hitachi Chemical Co., Ltd. Composition de resine photosensible, element photosensible faisant appel a cette composition, methode de formation d'un motif de resist, methode pour produire un tableau de connexions imprime, et une methode de suppression du produit photodurci
JP2014197324A (ja) * 2013-03-29 2014-10-16 凸版印刷株式会社 カバーガラス一体型タッチパネルセンサー基板、及び表示装置
JP2016004120A (ja) * 2014-06-16 2016-01-12 帝人株式会社 離型フィルム

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