WO2020082717A1 - Machine d'exposition de bord et procédé d'exposition de bord de substrat - Google Patents

Machine d'exposition de bord et procédé d'exposition de bord de substrat Download PDF

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Publication number
WO2020082717A1
WO2020082717A1 PCT/CN2019/085582 CN2019085582W WO2020082717A1 WO 2020082717 A1 WO2020082717 A1 WO 2020082717A1 CN 2019085582 W CN2019085582 W CN 2019085582W WO 2020082717 A1 WO2020082717 A1 WO 2020082717A1
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WO
WIPO (PCT)
Prior art keywords
substrate
machine
exposure
edge exposure
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/085582
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English (en)
Chinese (zh)
Inventor
王威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Publication of WO2020082717A1 publication Critical patent/WO2020082717A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position

Definitions

  • the invention relates to the technical field of display, in particular to an edge exposure machine and a substrate exposure method.
  • TFT Thin Film Transistor
  • LCD Liquid Crystal Display
  • AMOLED Active Matrix Organic Light-Emitting
  • LCD Liquid Crystal Display
  • AMOLED Active Matrix Organic Light-Emitting
  • liquid crystal displays which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is based on the thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter, CF) is filled with liquid crystal molecules between the substrates, and pixel voltage and common voltage are applied to the two substrates respectively.
  • the electric field formed between the pixel voltage and the common voltage controls the rotation direction of the liquid crystal molecules to change the backlight module ’s
  • the light is transmitted out to produce the picture.
  • the machine of the existing edge exposure machine has an alignment sensor (alignment sensor), after the substrate is fed into the edge exposure machine from the upstream, the cylinder of the edge exposure machine starts to move, and then the probe of the positioning sensor is pushed to the edge of the substrate, and the position of the substrate is sensed through the feedback of the positioning sensor, which is normal in a certain range Edge washing is performed, but the positioning sensor can only feed back the position without compensating and adjusting the position, resulting in no guarantee of edge washing accuracy. And once the position of the substrate exceeds the sensing range of the positioning sensor, the machine cannot recognize the substrate and cause a direct shutdown. After the shutdown, the operator needs to enter the machine and manually pull the substrate to reset the substrate.
  • alignment sensor alignment sensor
  • the substrate is easy to reset during the reset process Broken in the middle, and because the probe is connected with a loose spring and the cylinder, the positioning sensor is easy to be touched by the operator during the board reset process, which causes the position deviation of the positioning sensor, which leads to abnormal edge washing.
  • the object of the present invention is to provide an edge-exposure machine, which can improve the accuracy of edge-exposure and ensure the removal of residual photoresist around the edges of the substrate.
  • the object of the present invention is also to provide a substrate edge exposure method, which can improve the edge exposure accuracy and ensure that the photoresist remaining on the periphery of the substrate is removed.
  • the present invention provides an edge exposure machine, including: a machine platform, a plurality of shooting devices provided on the machine platform, and a control unit connected to the machine platform and the plurality of shooting devices;
  • the machine is used for placing substrates
  • the shooting device is used to obtain the position of the substrate and calculate the position compensation value according to the preset exposure position;
  • the control unit is used to control the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.
  • the shooting device has exposure coordinates corresponding to preset exposure positions.
  • An alignment mark corresponding to the exposure coordinates is provided on the substrate; the photographing device aligns the alignment mark with the exposure coordinates and calculates the position compensation value.
  • the number of the shooting devices is three, and the number of the alignment marks is three.
  • the exposure coordinates corresponding to the three shooting devices correspond to the three alignment marks one-to-one.
  • the control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.
  • the invention also provides a substrate edge exposure method, including the following steps:
  • Step S1 Provide an edge exposure machine;
  • the edge exposure machine includes: a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices;
  • Step S2 Place the substrate on the machine table, the photographing device obtains the position of the substrate and calculates the position compensation value according to the preset exposure position;
  • Step S3 The control unit controls the machine to adjust the position of the substrate to a preset exposure position according to the position compensation value.
  • the shooting device has exposure coordinates corresponding to preset exposure positions.
  • step S2 An alignment mark corresponding to the exposure coordinates is provided on the substrate; in step S2, the photographing device aligns the alignment mark with the exposure coordinates and calculates a position compensation value.
  • the number of the shooting devices is three, and the number of the alignment marks is three.
  • the exposure coordinates corresponding to the three shooting devices correspond to the three alignment marks one-to-one.
  • control unit controls the machine to adjust the position of the substrate to a preset exposure position by rotation.
  • the edge exposure machine of the present invention includes a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices.
  • the shooting device obtains the position of the substrate, calculates the position compensation value according to the position of the substrate and the preset exposure position, and then feeds back the position compensation value to the control unit.
  • the control unit controls the machine to adjust the position of the substrate according to the position compensation value.
  • the edge exposure machine of the present invention can improve the edge exposure accuracy, ensure that the photoresist remaining around the edges of the substrate is removed, and the operator does not need to enter the edge exposure machine to manually adjust the position of the substrate to avoid There is a risk of chipping of the substrate and damage to the edge exposure machine.
  • the camera is installed above the machine, and there will be no damage or deviation of the camera by human touch.
  • the substrate edge exposure method of the invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of the substrate is removed.
  • Figure 1 is a schematic top view of the edge exposure machine of the present invention
  • FIG. 2 is a schematic side view of the edge exposure machine of the present invention.
  • FIG. 3 is a flowchart of the substrate edge exposure method of the present invention.
  • the present invention provides an edge exposure machine, including: a machine 10, a plurality of shooting devices 20 provided on the machine 10, and the machine 10 and the multiple shooting devices 20 Control unit 30 all connected;
  • the machine 10 is used to place the substrate 40;
  • the shooting device 20 is used to obtain the position of the substrate 40 and calculate the position compensation value according to the preset exposure position;
  • the control unit 30 is used to control the machine 10 to adjust the position of the substrate 40 to a preset exposure position according to the position compensation value.
  • the imaging device 20 by setting a plurality of imaging devices 20 on the machine 10, when the substrate 40 enters the edge exposure machine, the imaging device 20 obtains the position of the substrate 40, and according to the position of the substrate 40 and the preset exposure The position compensation value is calculated, and then the position compensation value is fed back to the control unit 30.
  • the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to the preset exposure position according to the position compensation value, so the edge exposure machine of the present invention can be improved
  • the edge exposure accuracy ensures that the photoresist remaining on the edges of the substrate is removed, and the operator is not required to enter the edge exposure machine to manually adjust the position of the substrate 40, thereby avoiding the risk of chipping of the substrate 40 and damage to the edge exposure machine.
  • the photographing device 20 is installed above the machine table 10, and there is no possibility that the photographing device 20 is damaged or deviated due to human touch.
  • the photographing device 20 has exposure coordinates corresponding to preset exposure positions.
  • the substrate 40 is provided with an alignment mark corresponding to the exposure coordinates.
  • the photographing device 20 aligns the alignment mark with the exposure coordinates and calculates the position compensation value.
  • the edge exposure machine uses a three-point alignment method to align the imaging device 20 with the substrate 40, that is, the number of the imaging device 20 is three, and the number of alignment marks of the substrate 40 is also three, three
  • the exposure coordinates corresponding to the two shooting devices 20 correspond to the three alignment marks, respectively.
  • two of the three alignment marks of the substrate 40 are located on the long side of the substrate 40, and the remaining one is located on the short side of the substrate 40.
  • control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position by rotation.
  • the present invention also provides a substrate edge exposure method, including the following steps:
  • Step S1 Provide an edge exposure machine;
  • the edge exposure machine includes: a machine 10, a plurality of shooting devices 20 provided on the machine 10, and a control connected to the machine 10 and the plurality of shooting devices 20 Unit 30;
  • Step S2 Place the substrate 40 on the machine table 10, the photographing device 20 obtains the position of the substrate 40 and calculates the position compensation value according to the preset exposure position;
  • Step S3. The control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position according to the position compensation value.
  • the shooting device 20 obtains the position of the substrate 40, calculates the position compensation value according to the position of the substrate 40 and the preset exposure position, and then feeds back the position compensation value to the control Unit 30, the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to the preset exposure position according to the position compensation value, so the edge exposure machine of the present invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of the substrate is removed And, the operator is not required to enter the edge exposure machine to manually adjust the position of the substrate 40, so as to avoid the risk of chipping of the substrate 40 and damage to the edge exposure machine.
  • the photographing device 20 is installed above the machine table 10, and there is no possibility that the photographing device 20 is damaged or deviated due to human touch.
  • the photographing device 20 has exposure coordinates corresponding to preset exposure positions.
  • step S2 the photographing device 20 performs alignment with the alignment mark through the exposure coordinates, and calculates a position compensation value.
  • the edge exposure machine uses a three-point alignment method to align the imaging device 20 with the substrate 40, that is, the number of the imaging device 20 is three, and the number of alignment marks of the substrate 40 is also three, three
  • the exposure coordinates corresponding to the two shooting devices 20 correspond to the three alignment marks, respectively.
  • two of the three alignment marks of the substrate 40 are located on the long side of the substrate 40, and the remaining one is located on the short side of the substrate 40.
  • step S3 the control unit 30 controls the machine 10 to adjust the position of the substrate 40 to a preset exposure position by rotation.
  • the edge exposure machine of the present invention includes a machine, a plurality of shooting devices provided on the machine, and a control unit connected to the machine and the plurality of shooting devices.
  • the shooting device obtains the position of the substrate, calculates the position compensation value according to the position of the substrate and the preset exposure position, and then feeds back the position compensation value to the control unit, and the control unit controls the machine to adjust the position of the substrate according to the position compensation value To the preset exposure position, so the edge exposure machine of the present invention can improve the edge exposure accuracy, ensure that the photoresist remaining around the edges of the substrate is removed, and the operator does not need to enter the edge exposure machine to manually adjust the position of the substrate to avoid the substrate Fragmentation and the risk of damage to the edge exposure machine.
  • the camera is installed above the machine, and there will be no damage or deviation of the camera by human touch.
  • the substrate edge exposure method of the invention can improve the edge exposure accuracy and ensure that the photoresist remaining around the edges of

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne une machine d'exposition de bord et un procédé d'exposition de bord de substrat. La machine d'exposition de bord comprend une plateforme de machine (10), une pluralité d'appareils photographiques (20) disposés sur la plateforme de machine (10), et une unité de commande (30) connectée à la fois à la plateforme de machine (10) et à la pluralité d'appareils photographiques (20) ; lorsque le substrat (40) entre dans la machine d'exposition de bord, les appareils photographiques (20) acquièrent la position du substrat (40), calculent une valeur de compensation de position sur la base de la position du substrat (40) et une position d'exposition prédéfinie, et transmettent la valeur de compensation de position à l'unité de commande (30) ; et l'unité de commande (30), sur la base de la valeur de compensation de position, commande la plateforme de machine (10) de façon à ce qu'elle ajuste la position du substrat (40) à la position d'exposition prédéfinie ; la précision d'exposition de bord est ainsi améliorée, ce qui garantit que la résine photosensible résiduelle se trouvant sur les quatre bords du substrat (40) soit retirée sans nécessiter que l'opérateur ne doive aller à l'intérieur de la machine d'exposition pour ajuster la position du substrat (40), empêchant le risque que le substrat (40) se brise et que la machine d'exposition de bord soit endommagée ; de plus, les appareils photographiques (20) sont montés au-dessus de la plateforme de machine (10), et les appareils photographiques (20) ne seront ni endommagés ni déplacés en étant touchés par l'opérateur.
PCT/CN2019/085582 2018-10-23 2019-05-05 Machine d'exposition de bord et procédé d'exposition de bord de substrat Ceased WO2020082717A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811240142.XA CN109375472A (zh) 2018-10-23 2018-10-23 曝边机及基板曝边方法
CN201811240142.X 2018-10-23

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WO2020082717A1 true WO2020082717A1 (fr) 2020-04-30

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WO (1) WO2020082717A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109375472A (zh) * 2018-10-23 2019-02-22 武汉华星光电技术有限公司 曝边机及基板曝边方法
CN120085518B (zh) * 2025-04-28 2025-07-29 北京北旭电子材料有限公司 一种用于光刻胶的涂布控制方法、系统及设备

Citations (5)

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JPH09153538A (ja) * 1995-11-30 1997-06-10 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101136315A (zh) * 2006-08-31 2008-03-05 株式会社迅动 基板处理装置
CN203385993U (zh) * 2013-04-11 2014-01-08 常熟晶悦半导体设备有限公司 一种具有自动对准系统的四曝光头光学曝光机
CN105372941A (zh) * 2014-08-28 2016-03-02 上海微电子装备有限公司 一种提供玻璃基板边缘曝光的多功能曝光机
CN109375472A (zh) * 2018-10-23 2019-02-22 武汉华星光电技术有限公司 曝边机及基板曝边方法

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JP3169068B2 (ja) * 1997-12-04 2001-05-21 日本電気株式会社 電子線露光方法及び半導体ウエハ
US7067931B1 (en) * 2000-12-14 2006-06-27 Koninklijke Philips Electronics N.V. Self-compensating mark design for stepper alignment
JP4834947B2 (ja) * 2001-09-27 2011-12-14 株式会社トッパンＮｅｃサーキットソリューションズ 位置合わせ方法
JP4269258B2 (ja) * 2003-05-30 2009-05-27 豊和工業株式会社 露光マスクと内層基板の位置合わせ方法
CN102841505B (zh) * 2011-06-22 2015-06-17 上海微电子装备有限公司 一种可精确定位基板的工件台
CN105116571B (zh) * 2015-09-17 2018-09-28 京东方科技集团股份有限公司 一种基板对位检测校准装置和方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153538A (ja) * 1995-11-30 1997-06-10 Dainippon Screen Mfg Co Ltd 基板処理装置
CN101136315A (zh) * 2006-08-31 2008-03-05 株式会社迅动 基板处理装置
CN203385993U (zh) * 2013-04-11 2014-01-08 常熟晶悦半导体设备有限公司 一种具有自动对准系统的四曝光头光学曝光机
CN105372941A (zh) * 2014-08-28 2016-03-02 上海微电子装备有限公司 一种提供玻璃基板边缘曝光的多功能曝光机
CN109375472A (zh) * 2018-10-23 2019-02-22 武汉华星光电技术有限公司 曝边机及基板曝边方法

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