WO2020083781A1 - Dispositif d'éclairage et projecteur - Google Patents

Dispositif d'éclairage et projecteur Download PDF

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Publication number
WO2020083781A1
WO2020083781A1 PCT/EP2019/078393 EP2019078393W WO2020083781A1 WO 2020083781 A1 WO2020083781 A1 WO 2020083781A1 EP 2019078393 W EP2019078393 W EP 2019078393W WO 2020083781 A1 WO2020083781 A1 WO 2020083781A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat dissipation
printed circuit
light source
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/078393
Other languages
German (de)
English (en)
Inventor
Maximilian KOSIN
Christoph DIRR
Alexander Neher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2020083781A1 publication Critical patent/WO2020083781A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to a lamp according to the preamble of claim 1 and a headlight.
  • LEDs Light-emitting diodes
  • a heat sink which can be a heat sink, or an environment, for example ambient air.
  • a heat path therefore runs from a heat source, for example the LED to the heat sink.
  • Intermediate components or layers, such as paints, represent thermal resistances, for example due to their shape and / or their material.
  • the object of the present invention is to provide a cost-effective and simply designed luminaire with optimized heat dissipation, and a cost-effective and simply designed headlight with optimized heat dissipation.
  • a lamp is provided.
  • This can have at least one printed circuit board.
  • the circuit board can have a fastening side and a rear side.
  • at least one light source can be attached to the fastening side.
  • solder mask can be applied in sections.
  • the back of the circuit board can be covered at least in sections with a layer of solder resist.
  • Solder resists are usually made from epoxy resins, to which other additives, such as a hardener, may be added, and form a thermosetting plastic.
  • This solution has the advantage that a high protection against corrosion, as well as against breakdown, can be guaranteed by the solder mask, while in places that are not covered by solder mask, an optimized heat dissipation, for example away from the light source, is guaranteed. This is possible because heat dissipation at these points is not impaired by a thermal barrier layer or a thermal resistance of the solder mask.
  • the light source can preferably be cooled better, which can increase the life and / or performance of the light source.
  • a heat path or resistance line that has previously arisen in comparable luminaires can extend from the light source, for example, via a possible adhesive for the light source, via the printed circuit board, via the solder mask, via a possible adhesive for a possible heat sink to the possible heat sink thus at least partially around the solder resist be wrested.
  • operating temperatures for the at least one light source can advantageously be reduced, as a result of which an efficiency and a service life of the light source can be increased.
  • the solder resist can preferably be applied in such a way that the back of the printed circuit board has at least one heat dissipation surface section to which no solder resist is applied. Improved heat dissipation can thus advantageously be made possible in the area of the heat dissipation surface section, since there the soldering resist acting as a thermal barrier layer is eliminated.
  • a saved thermal resistance can be, in particular, approximately 2.5 K / W.
  • the heat dissipation section can preferably be provided at the position of the at least one light source. Optimized heat dissipation from the light source can thus be made possible.
  • the heat dissipation surface section is advantageously arranged on a rear side of the circuit board at the position at which the at least one light source is arranged on the fastening side of the circuit board.
  • the heat dissipation section or a further heat dissipation section can additionally be seen at a position of a load point or a hotspot of the electronics.
  • a load point can be generated, for example, by a further waste heat, for example a further electronic component.
  • a heat dissipation surface section is provided at the load point, heat dissipation from the load point can be improved.
  • the heat dissipation surface section is advantageously on a rear side of the circuit board at the position at which the load point is arranged on the fastening side of the circuit board. In other words, an area of the solder resist under relevant areas or hotspots, for example the light source, can be left free.
  • the heat dissipation section can be seen in such a way that it has at least one size of a respective contact surface of the LED or the component on the fastening supply side.
  • the solder resist can cover the circuit board, in particular on its rear side, almost completely, with the exception of the at least one heat dissipation surface section.
  • solder mask can be applied at locations that are less relevant for heat dissipation. This can advantageously ensure an increase in the dielectric strength of the circuit board and / or protection of the circuit board from corrosion by the solder resist.
  • the heat dissipation section can at the same time optimize the heat dissipation.
  • the light source can be designed, for example, as: an incandescent lamp; a halogen lamp, a halogen retrofit LED lamp, an LED lamp for vehicle applications, such as the OSRAM XLS LED lamp (as described, for example, in DE 20 2014 002 809 Ul); a light emitting diode (LED); a pixelated LED (such as, for example, the OSRAM EVIYOS COB matrix light source) or generally a semiconductor light source with matrix arrangements; a laser (such as a system based on the Laser Activated Remote Phosphor (LARP) principle (out- knows: the term phosphorus also includes phosphorus-free phosphors)); an IR radiation source, in particular an IR laser diode; or another device which emits, reproduces and / or generates electromagnetic radiation in and / or partially in and / or close to and / or partially close to the visible range.
  • an incandescent lamp such as the OSRAM XLS LED lamp (as described, for example, in DE
  • a light-emitting diode Under a light-emitting diode, in particular an LED with a downstream phosphor for partial conversion of primary light (emission light of the LED) into secondary light (conversion light of the phosphor); a warm white light emitting LED; a cool white light emitting LED; an LED, which is operated in full conversion; an LED without a downstream phosphor; a pixelated LED matrix arrangement; an organic LED (OLED) and / or the like can be understood.
  • the LEDs preferably emit white light in the standardized ECE white field of the automotive industry, for example implemented by a blue emitter and a yellow / green converter.
  • the light source can be provided, for example, for an additional light function in a vehicle, such as for a fog light function, a daytime running light function, a low beam function, a high beam function or a similar function.
  • the light-emitting diode (LED) or light-emitting diode can be in the form of at least one individually packaged LED or in the form of at least one LED chip which has one or more light-emitting diodes, or in the form of a micro-LED or a nano-LED (smart dust), are available.
  • the at least one LED can be equipped with at least one of its own and / or common optics for beam guidance, for example with at least one Fresnel lens or with a collimator.
  • organic LEDs can generally also be used.
  • the LED chips can be directly emitting or have an upstream phosphor.
  • the light-emitting component can be a laser diode or a laser diode arrangement. It is also conceivable to provide an OLED luminescent layer or a plurality of OLED luminescent layers or an OLED luminescent area.
  • the emission wavelengths of the light-emitting components can be in the ultraviolet, visible or infrared spectral range.
  • the light-emitting components can also be equipped with their own converter.
  • the LED chips can emit white light in the standardized ECE white field of the automotive industry, for example implemented by a blue emitter and a yellow / green converter.
  • the light source can preferably be attached to the circuit board by means of an adhesive.
  • the light source can advantageously be mounted on the printed circuit board in a particularly simple and inexpensive manner in terms of production technology.
  • the light source it is also possible for the light source to be soldered onto the printed circuit board. It is also possible that the light source is and / or is positively connected to the circuit board.
  • a heat sink can be provided in the at least one heat dissipation surface section, through which a waste heat, in particular the waste heat of the light source, can be absorbed and released, for example, to an environment. If the heat sink is in thermal contact with the at least one heat dissipation section, heat dissipation via the heat sink is not impaired by a thermal barrier layer of the solder resist.
  • thermal contacting of the heat sink is not limited to a heat dissipation section. Areas where solder resist can be attached can also be thermally contacted with the heat sink. This advantageously allows heat to be dissipated easily and inexpensively.
  • the at least one heat sink for example a copper heat sink or a heat pipe
  • the adhesive can be formed, for example, as a ceramic adhesive. It is also possible for further components to be arranged between the heat sink and the printed circuit board. It is also conceivable that the adhesive is provided in the area of the solder resist and the at least one heat dissipation surface section is at least partially or essentially completely or completely free of adhesive. This can then Rich of the heat dissipation section, the heat flows unhindered into the heat sink.
  • At least one further heat-emitting component can be provided.
  • This component can preferably also be fastened on the printed circuit board, in particular on the fastening side of the printed circuit board.
  • the component can be, for example, a transistor and / or an electrical resistor.
  • a thermal and / or an electronic via is provided as a component, which is then advantageously formed continuously through the printed circuit board.
  • a via can be a via, for example, a bore, which can transport heat with a high conductance from one side of the circuit board to the other, for example through a copper jacket, similar to a highly conductive sleeve. In other words, thermal power of the light source can be conducted through the via through the circuit board. If the circuit board has several layers, it is advantageous if the thermal via penetrates all layers.
  • a respective heat dissipation surface section can be provided on the back of the circuit board, to which no solder resist is applied is.
  • a heat dissipation can then take place, for example, waste heat from the light source and / or from the further component via the appropriate adhesive for the light source or the component via the printed circuit board via an adhesive for the heat sink to the heat sink.
  • the heat sink can then advantageously give off the waste heat, for example, to the environment, for example the ambient air.
  • the thermal barrier layer of the solder resist can advantageously be eliminated.
  • a headlight with the lamp according to one or more of the preceding aspects is also provided.
  • the headlight is preferably used in a vehicle.
  • the vehicle can be an air vehicle or a waterborne vehicle or a landborne vehicle.
  • the land vehicle can be a motor vehicle or a rail vehicle or a bicycle.
  • the vehicle is particularly preferably a truck or a passenger car or a motorcycle.
  • the vehicle can also be configured as a non-autonomous or partially autonomous or autonomous vehicle. If the headlight is used for a vehicle, then this is preferably a headlight. Further areas of application for the headlights can be effect lighting, entertainment lighting, architectural lighting, general lighting, medical and therapeutic lighting or lighting for horticulture (horticulture).
  • FIG. 1 is a perspective view of a lamp ge according to the single embodiment
  • FIG. 2 shows a perspective view of a printed circuit board with a fastening side
  • FIG. 3 shows a rear side of the printed circuit board in a perspective view
  • Fig. 4 is a schematic view of the back of the
  • Fig. 6 in a schematic view a Temperaturver distribution on the back of the circuit board
  • Fig. 7 is a schematic view of a heat flow distribution on the back of the Lei terplatte.
  • FIG. 1 shows a lamp 1.
  • Luminaire 1 is designed, for example, as an XLS luminaire.
  • This has a circuit board 2 on which three light sources 4, which are designed as light-emitting diodes (LED), are attached.
  • LED light-emitting diodes
  • the light sources 4 are attached to a mounting side 8 of the circuit board 2, for example with adhesive.
  • the fastening side 8 at least partially or completely solder mask (not shown) is applied, for example to protect the electronic lines 6.
  • the printed circuit board 2 is mounted on a base 10 for a housing with a heat sink 12.
  • the luminaire 1 is preferably part of a headlight 14, which is shown schematically using a dashed line.
  • FIG. 2 shows the fastening side 8 of the printed circuit board 2 from FIG. 1 in detail.
  • the three light sources 4, as well as the lines 6 and the further solder pads 7 of electronic components can be seen.
  • FIG. 3 shows a rear side 16 of the printed circuit board 2, which is arranged on the side of the printed circuit board 2 facing away from the fastening side 8 (not shown in FIG. 3; see also FIGS. 1 and 2).
  • the back 16 is covered with solder mask 24 except for a heat dissipation section 18 and two further sections 20, 22.
  • the sections 20 and 22 are preferably provided for electrical contacting.
  • a pin can be soldered to the circuit board 2, for example in the case of an XLS light.
  • the heat dissipation surface section 18 they can also be provided for heat dissipation.
  • the heat dissipation section 18 has a particularly circular surface and an additional section.
  • the heat dissipation surface section 18 is arranged approximately in the middle of the circular printed circuit board 2 at the position on which the light sources 4 are arranged on the fastening side 8, see FIG. 2, in order to enable optimized heat dissipation thereof.
  • the white direct heat dissipation sections 20 and 22 each surround a through opening 26 and 28. These can be used for example for a power connection. It is also possible that the through openings 26 and 28 serve as a thermal via and thus conduct thermal energy from one side of the printed circuit board 2, for example the fastening side 8, to the other side, for example the rear side 16, see FIG. 2. It can be seen that the solder resist 24 is cut out via a copper line 6 or line. This is advantageous because, as a result of this, heat can be given off particularly well via the heat dissipation section 18, for example to the heat sink 12 (see FIG. 1).
  • FIG. 4 schematically shows the rear side 16 of printed circuit board 2.
  • These clearances 32 can serve as a test point, for example.
  • the releases 32 are located at a thermal via, they can also be provided as a heat dissipation section. These can, for example, at the respective position of the further components or the solder pads 7 of electronic components, see FIG. 1, which is on the fastening side 8 of the circuit board. te 2 are attached, be provided to prevent heat dissipation from them by solder mask.
  • FIG. 5 shows a solid body temperature of the fastening side 8 of the printed circuit board 2 with the components 4. It can be seen that the components 4 have a significantly higher temperature than the majority of the remaining printed circuit board 4. A region 34 around the components 4 also has an increased temperature on. A further component or a solder pad 7 of an electronic component, see FIG. 1, can be provided in an area 36, which also has a higher temperature than the surroundings.
  • FIG. 6 shows a solid body temperature of the rear side 16 of the printed circuit board 2.
  • An elevated temperature can be seen, for example, in the area of the components 4, see FIG. 1, or additional solder pads 7 for electronic components.
  • FIG. 7 shows a heat flow density on a rear side 16 of the printed circuit board 2. It can be seen that the heat flow density in the area of the heat dissipation surface section 18 is significantly increased compared to the remaining areas of the printed circuit board 2, to which solder mask is applied. Also visible are circular vias 38 (for the sake of simplicity, only one via 38 is provided with a reference number), which have an increased heat flow density in comparison to their immediate surroundings.
  • a lamp is disclosed with a printed circuit board with at least one light source, the back of the printed circuit board being covered at least in sections with solder resist.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un dispositif d'éclairage (1) comprenant une carte de circuit imprimé (2) pourvue d'au moins une source de lumière (4), la face arrière (16) de la carte de circuit imprimé (2) étant recouverte au moins par endroits d'une réserve de soudure (24), et la face arrière (16) de la carte de circuit imprimé (2) comprenant au moins une partie de surface de dissipation de chaleur (18) sur laquelle aucune réserve de soudure (24) n'est appliquée.
PCT/EP2019/078393 2018-10-24 2019-10-18 Dispositif d'éclairage et projecteur Ceased WO2020083781A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018218175.6A DE102018218175A1 (de) 2018-10-24 2018-10-24 Leuchte und scheinwerfer
DE102018218175.6 2018-10-24

Publications (1)

Publication Number Publication Date
WO2020083781A1 true WO2020083781A1 (fr) 2020-04-30

Family

ID=68342900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/078393 Ceased WO2020083781A1 (fr) 2018-10-24 2019-10-18 Dispositif d'éclairage et projecteur

Country Status (2)

Country Link
DE (1) DE102018218175A1 (fr)
WO (1) WO2020083781A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29919990U1 (de) * 1999-11-15 2000-02-17 TechniSat Digital GmbH, 01462 Mobschatz Elektronischer Schaltungsträger
US20070193773A1 (en) * 2006-02-22 2007-08-23 Au Optronics Corp. Flexible printed circuit board and electronic component assembly
US20090309213A1 (en) * 2008-06-12 2009-12-17 Renesas Technology Corp. Semiconductor device and manufacturing method of the same
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US20130334974A1 (en) * 2012-06-01 2013-12-19 Citizen Electronics Co., Ltd. Lighting device
DE202014002809U1 (de) 2014-03-31 2014-04-11 Osram Gmbh Beleuchtungseinrichtung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI343233B (en) * 2007-10-19 2011-06-01 Au Optronics Corp Circuit board assembly and backlight module comprising the same
DE102013101262A1 (de) * 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul, optoelektronische Leuchtvorrichtung und Kfz-Scheinwerfer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29919990U1 (de) * 1999-11-15 2000-02-17 TechniSat Digital GmbH, 01462 Mobschatz Elektronischer Schaltungsträger
US20070193773A1 (en) * 2006-02-22 2007-08-23 Au Optronics Corp. Flexible printed circuit board and electronic component assembly
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US20090309213A1 (en) * 2008-06-12 2009-12-17 Renesas Technology Corp. Semiconductor device and manufacturing method of the same
US20130334974A1 (en) * 2012-06-01 2013-12-19 Citizen Electronics Co., Ltd. Lighting device
DE202014002809U1 (de) 2014-03-31 2014-04-11 Osram Gmbh Beleuchtungseinrichtung

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Publication number Publication date
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