WO2020143121A1 - Échangeur de chaleur à puce et climatiseur inverseur - Google Patents

Échangeur de chaleur à puce et climatiseur inverseur Download PDF

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Publication number
WO2020143121A1
WO2020143121A1 PCT/CN2019/080329 CN2019080329W WO2020143121A1 WO 2020143121 A1 WO2020143121 A1 WO 2020143121A1 CN 2019080329 W CN2019080329 W CN 2019080329W WO 2020143121 A1 WO2020143121 A1 WO 2020143121A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
section
heat exchanger
exchanger according
condensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/080329
Other languages
English (en)
Chinese (zh)
Inventor
董旭
王飞
王定远
徐佳
罗荣邦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Air Conditioner Gen Corp Ltd
Haier Smart Home Co Ltd
Original Assignee
Qingdao Haier Air Conditioner Gen Corp Ltd
Haier Smart Home Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Air Conditioner Gen Corp Ltd, Haier Smart Home Co Ltd filed Critical Qingdao Haier Air Conditioner Gen Corp Ltd
Publication of WO2020143121A1 publication Critical patent/WO2020143121A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/24—Cooling of electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the field of chip heat dissipation technology, for example, to a chip heat exchanger and an inverter air conditioner.
  • the chip of the computer board of the inverter air conditioner has poor heat dissipation, resulting in slow and difficult cooling frequency increase, easy to report errors in the control logic, insufficient cooling capacity, and large operating power consumption, causing user complaints.
  • T3 working condition 53°C or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68 ⁇ 120°C) and the ambient temperature (5 ⁇ 57°C) It becomes smaller, the heat dissipation power becomes smaller, and even burns the computer board and the system is down, causing hardware failure.
  • Embodiments of the present disclosure provide a chip heat exchanger and an inverter air conditioner to solve at least one of the technical problems in the related art.
  • a brief summary is given below. This summary section is not a general comment, nor is it to determine key/important constituent elements or to describe the scope of protection of these embodiments. Its sole purpose is to present some concepts in a simple form as a preface to the detailed description that follows.
  • a chip heat exchanger is provided;
  • the chip heat exchanger includes a heat pipe, and further includes: an inflation plate condenser and a capillary tube;
  • the evaporation section of the heat pipe is arranged under the chip of the computer board of the air conditioner, the condensation section of the heat pipe and the evaporation section are connected through the capillary tube, and the condensation section is connected with the inflation plate condenser.
  • the capillary tube is disposed on the pipeline between the refrigerant in the condensation section and the evaporation section.
  • a flow path channel is provided on the inflation plate condenser, and the flow path channel communicates with the condensation section.
  • the flow path channel is composed of a plurality of rectangular channels and communicates with the condensation section.
  • a hollow structure is provided at the intersection of each rectangular channel.
  • the flow path channel is composed of a plurality of U-shaped channels, and one end of the U-shaped channel on one side communicates with one end of the condensation section, and the other side One end of the U-shaped channel communicates with the other end of the condensation section.
  • a hollow structure is provided at a connection point adjacent to the U-shaped channel.
  • the evaporation section is provided along the length direction of the chip.
  • the area of the evaporation section is 5/6 of the area of the chip.
  • an inverter air conditioner is provided.
  • the inverter air conditioner includes the chip heat exchanger according to any of the foregoing optional implementations.
  • the evaporation section of the heat pipe is arranged under the chip of the computer board of the air conditioner, the condensation section of the heat pipe and the evaporation section are connected through the capillary tube, and the condensation section is connected with the inflation plate condenser
  • the refrigerant is fully exothermic and condensed.
  • the condensation section and the evaporation section are connected by a capillary section to promote the circulation power of the refrigerant and the heat absorption of the evaporation section to increase the heat dissipation effect.
  • the liquid refrigerant is converted into Gas-liquid two-phase, gaseous refrigerant promotes fluidity, so that the condensing section of the blower plate condenser can be placed at any position relative to the evaporating section, improving the technical short board of the existing heat pipe that the condensing section cannot be lower than the evaporating section.
  • the heat pipe does not need electric drive, which can realize the self-circulation of poor refrigerant density, which reduces the chip operating temperature, and solves the problem of poor heat dissipation of the chip of the inverter air conditioner computer board under the high temperature environment in summer, resulting in slow and difficult cooling frequency increase.
  • the control logic is easy to report errors. Insufficient amount, large power consumption in operation, causing user complaints.
  • Fig. 1 is a schematic structural diagram of a chip heat exchanger according to an exemplary embodiment
  • Fig. 2 is a schematic structural diagram of a chip heat exchanger according to another exemplary embodiment.
  • a chip heat exchanger is provided;
  • the chip heat exchanger includes a heat pipe 5, and further includes; a blown plate condenser 4 and a capillary tube 3;
  • the evaporation section 51 of the heat pipe 5 is disposed under the chip 2 of the computer board 1 of the air conditioner, the condensation section 52 of the heat pipe 5 and the evaporation section 51 are connected by the capillary tube 3, and the condensation section 52 is connected to the The expansion plate condenser 4 is connected.
  • the condensing section 52 and the evaporating section 51 of the heat pipe 5 are connected through the capillary tube 3, the condensing section 52 is connected to the blower plate condenser 4 to allow the refrigerant to fully radiate heat and condense, and the condensing section 52 and the evaporating section 51 It is connected by three sections of capillary tube to promote the circulation power of the refrigerant and the heat absorption of the evaporation section 51 is increased, and the heat dissipation effect is improved. Due to the throttling effect of the three sections of the capillary tube, the liquid refrigerant is converted into two phases of gas and liquid, and the gaseous refrigerant promotes fluidity.
  • the capillary tube 3 is disposed on the pipeline between the refrigerant in the condensation section 52 and the evaporation section 51.
  • the condensing section 52 and the evaporating section 51 are connected by three sections of capillaries, which promotes the improvement of the circulating power of the refrigerant and the increase in the amount of heat absorbed by the evaporating section 51. Since the diameter of the capillary 3 section is very small, the refrigerant in the evaporation section 51 is difficult to enter the capillary 3 section, and can only enter the inflation plate condenser 4 through the connecting pipe, so the check valve is saved, and the refrigerant in the heat pipe 5 is naturally formed. To flow.
  • a flow path channel is provided on the inflation plate condenser 4, and the flow path channel communicates with the condensation section 52.
  • the arrangement of the flow path channels increases the flow space of the refrigerant, so that the condensation section 52 sufficiently exotherms and condenses.
  • the flow path channel is composed of a plurality of rectangular channels, and communicates with the condensation section 52.
  • the flow path channels may be formed by connecting a plurality of rectangular channels, which can further increase the heat release effect of the refrigerant and make it condense faster.
  • a hollow structure is provided at the intersection of each rectangular channel.
  • the provision of the hollow structure increases the heat release space when the refrigerant flows, so that the heat release and condensation are faster and the condensation efficiency is improved.
  • the flow path channel is composed of a plurality of U-shaped channels, and one end of the U-shaped channel on one side and one end of the condensation section 52 In communication, one end of the U-shaped channel on the other side communicates with the other end of the condensation section 52.
  • a plurality of U-shaped channels can also be used for the flow channel, which can further increase the heat release effect of the refrigerant and make it condense faster.
  • a hollow structure is provided at a connection place adjacent to the U-shaped channel.
  • the provision of the hollow structure increases the heat release space when the refrigerant flows, so that the heat release and condensation are faster and the condensation efficiency is improved.
  • the evaporation section 51 is disposed along the length direction of the chip 2.
  • the evaporation section 51 is provided along the length direction of the chip 2 so that the contact area of the evaporation section 51 and the chip 2 is increased, thereby improving the heat dissipation efficiency for the chip 2.
  • the area of the evaporation section 51 is 5/6 of the area of the chip 2.
  • the arrangement of the evaporation section 51 is close to the area of the chip 2, thereby increasing the heat absorption to the chip 2 during evaporation, thereby improving the heat dissipation effect.
  • the evaporation section 51 of the heat pipe 5 is disposed under the chip 2 of the computer board 1 of the air conditioner, and the condensation section 52 of the heat pipe 5 passes through the evaporation section 51
  • the capillary tube 3 is connected, and the condensing section 52 is connected to the inflation plate condenser 4.
  • the inflation plate condenser 4 is provided with a flow path channel, and the flow path channel and the condensation Section 52 communicates with each other, the flow path channel is composed of a plurality of rectangular channels, and communicates with the condensation section 52, a hollow structure is provided at the intersection of each rectangular channel, and the evaporation section 51 is along the
  • the chip 2 is arranged in the longitudinal direction.
  • the condensing section 52 is connected to the expansion plate condenser 4 to allow the refrigerant to fully radiate heat and condense.
  • the condensing section 52 and the evaporating section 51 are connected by three sections of capillaries to promote the circulation power of the refrigerant and the evaporating section 51 to absorb heat Increase, improve the heat dissipation effect, due to the throttling effect of the three sections of the capillary, the liquid refrigerant is converted into two phases of gas and liquid, and the gaseous refrigerant promotes fluidity, so that the condensation section 52 of the blower plate condenser 4 can be placed in the relative evaporation section Any position of 51 improves the technical short board of the condensation section 52 of the existing heat pipe 5 which cannot be lower than that of the evaporation section 51, and at the same time, the heat pipe 5 does not need electric drive, and can realize self-circulation with poor refrigerant density.
  • an inverter air conditioner is provided.
  • the inverter air conditioner includes the chip heat exchanger according to any of the foregoing optional implementations.
  • the inverter air conditioner provided in the second aspect has the chip heat exchanger provided in the first aspect, and therefore has all the beneficial effects of the chip heat exchanger provided in the first aspect, which will not be repeated here.
  • any one of the claimed embodiments can be used in any combination.
  • the information disclosed in this background section is only intended to deepen the understanding of the overall background of the disclosure, and should not be taken as an acknowledgement or in any way suggesting that this information constitutes prior art that is well known to those skilled in the art.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un échangeur de chaleur à puce et un climatiseur inverseur. L'échangeur de chaleur à puce comprend un caloduc (5), un condenseur à plaque de gonflage (4) et un tube capillaire (3). Une section d'évaporation (51) du caloduc (5) est disposée au-dessous d'une puce (2) d'une carte d'ordinateur de climatiseur (1), une section de condensation (52) du caloduc (5) est reliée à la section d'évaporation (51) par le biais du tube capillaire (3) et la section de condensation (52) est reliée au condenseur à plaque de gonflage (4). De cette manière, la puissance de circulation d'un fluide frigorigène peut être améliorée, la quantité d'absorption de chaleur de la section d'évaporation peut être augmentée et la température de fonctionnement de la puce peut être abaissée.
PCT/CN2019/080329 2019-01-11 2019-03-29 Échangeur de chaleur à puce et climatiseur inverseur Ceased WO2020143121A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910027565.1A CN110160384B (zh) 2019-01-11 2019-01-11 芯片换热器及变频空调器
CN201910027565.1 2019-01-11

Publications (1)

Publication Number Publication Date
WO2020143121A1 true WO2020143121A1 (fr) 2020-07-16

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PCT/CN2019/080329 Ceased WO2020143121A1 (fr) 2019-01-11 2019-03-29 Échangeur de chaleur à puce et climatiseur inverseur

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CN (1) CN110160384B (fr)
WO (1) WO2020143121A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112611026A (zh) * 2020-12-01 2021-04-06 青岛海尔空调电子有限公司 空调室外机及空调器

Citations (8)

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CN1355415A (zh) * 2000-11-30 2002-06-26 国际商业机器公司 高密度芯片载装设备中用于冷却热源的装置和方法
US20020139517A1 (en) * 2001-03-30 2002-10-03 Samsung Electronics Co., Ltd. Capillary pumped loop system
CN1393678A (zh) * 2001-06-22 2003-01-29 李嘉豪 环路型热管热交换组件
US20100307721A1 (en) * 2009-06-05 2010-12-09 Young Green Energy Co. Loop heat pipe and manufacturing method thereof
CN101943532A (zh) * 2009-07-03 2011-01-12 富准精密工业(深圳)有限公司 回路热管
WO2014102402A1 (fr) * 2012-12-28 2014-07-03 Ibérica Del Espacio, S.A. Système de boucle fluide diphasique de type lhp pour la transmission de chaleur et la régulation thermique
CN105814389A (zh) * 2013-12-13 2016-07-27 富士通株式会社 环型热管及其制造方法、以及电子设备
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CN106468515B (zh) * 2015-08-21 2019-01-08 青岛经济技术开发区海尔热水器有限公司 一种中部镂空的太阳能热泵蒸发器及热水器
CN106051956A (zh) * 2016-06-17 2016-10-26 上海嘉熙科技有限公司 基于热超导散热板的电控器及空调室外机
CN107027278A (zh) * 2017-06-07 2017-08-08 珠海格力电器股份有限公司 一种空调及其控制器散热总成
CN107166564B (zh) * 2017-06-20 2023-05-19 珠海格力电器股份有限公司 热管换热器、空调控制散热组件、空调室外机和空调器
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1355415A (zh) * 2000-11-30 2002-06-26 国际商业机器公司 高密度芯片载装设备中用于冷却热源的装置和方法
US20020139517A1 (en) * 2001-03-30 2002-10-03 Samsung Electronics Co., Ltd. Capillary pumped loop system
CN1393678A (zh) * 2001-06-22 2003-01-29 李嘉豪 环路型热管热交换组件
US20100307721A1 (en) * 2009-06-05 2010-12-09 Young Green Energy Co. Loop heat pipe and manufacturing method thereof
CN101943532A (zh) * 2009-07-03 2011-01-12 富准精密工业(深圳)有限公司 回路热管
WO2014102402A1 (fr) * 2012-12-28 2014-07-03 Ibérica Del Espacio, S.A. Système de boucle fluide diphasique de type lhp pour la transmission de chaleur et la régulation thermique
CN105814389A (zh) * 2013-12-13 2016-07-27 富士通株式会社 环型热管及其制造方法、以及电子设备
CN107890289A (zh) * 2017-11-16 2018-04-10 宁波长发电器科技有限公司 一种一体式饮水机冷胆

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112611026A (zh) * 2020-12-01 2021-04-06 青岛海尔空调电子有限公司 空调室外机及空调器

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CN110160384A (zh) 2019-08-23
CN110160384B (zh) 2020-04-24

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