WO2021133455A3 - Procédé pour augmenter l'adhérence de surface dans des substrats de polyétherimide - Google Patents

Procédé pour augmenter l'adhérence de surface dans des substrats de polyétherimide Download PDF

Info

Publication number
WO2021133455A3
WO2021133455A3 PCT/US2020/054495 US2020054495W WO2021133455A3 WO 2021133455 A3 WO2021133455 A3 WO 2021133455A3 US 2020054495 W US2020054495 W US 2020054495W WO 2021133455 A3 WO2021133455 A3 WO 2021133455A3
Authority
WO
WIPO (PCT)
Prior art keywords
polyetherimide
contacting
substrate
dwell time
surface adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2020/054495
Other languages
English (en)
Other versions
WO2021133455A2 (fr
Inventor
Mark Hyman
Leonas NARUŠKEVICIUS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STATE RESEARCH INSTITUTE CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY
Original Assignee
STATE RESEARCH INSTITUTE CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STATE RESEARCH INSTITUTE CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY filed Critical STATE RESEARCH INSTITUTE CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY
Publication of WO2021133455A2 publication Critical patent/WO2021133455A2/fr
Publication of WO2021133455A3 publication Critical patent/WO2021133455A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1848—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by electrochemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un procédé d'amélioration de l'adhérence de surface de polyétherimides pour le placage métallique qui consiste à mettre en contact de l'acide sulfurique avec une surface d'un substrat de polyétherimide pendant un premier temps de séjour pour former un substrat de polyétherimide pré-gravé, mettre en contact le substrat de polyétherimide pré-gravé avec un mélange d'acide sulfurique et d'ions périodate pendant un temps de séjour pour former une surface de polyétherimide oxydée, mettre en contact la surface de polyétherimide oxydée avec une solution d'hydroxyde de métal alcalin pendant un troisième temps de séjour sans rinçage entre les étapes d'application ou entre les étapes d'application et de mise en contact, le polyétherimide étant exempt de ou comprenant un faible pourcentage volumique de particules de renforcement, et le procédé ne comprenant la mise en contact du substrat de polyétherimide avec de l'acide nitrique dans aucune étape.
PCT/US2020/054495 2019-10-07 2020-10-07 Procédé pour augmenter l'adhérence de surface dans des substrats de polyétherimide Ceased WO2021133455A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962911834P 2019-10-07 2019-10-07
US62/911,834 2019-10-07

Publications (2)

Publication Number Publication Date
WO2021133455A2 WO2021133455A2 (fr) 2021-07-01
WO2021133455A3 true WO2021133455A3 (fr) 2021-09-10

Family

ID=75273964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2020/054495 Ceased WO2021133455A2 (fr) 2019-10-07 2020-10-07 Procédé pour augmenter l'adhérence de surface dans des substrats de polyétherimide

Country Status (2)

Country Link
US (1) US20210102296A1 (fr)
WO (1) WO2021133455A2 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
EP0391201B1 (fr) * 1989-04-03 1993-10-20 General Electric Company Procédé pour le traitement de substrats en polyétherimide et articles obtenus à partir de ces substrats
US20040096584A1 (en) * 1998-11-13 2004-05-20 Enthone Inc. Process for metallizing a plastic surface
WO2015183304A1 (fr) * 2014-05-30 2015-12-03 Uab Rekin International Pré-traitement d'adhérence sans chrome pour des matières plastiques

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
EP0391201B1 (fr) * 1989-04-03 1993-10-20 General Electric Company Procédé pour le traitement de substrats en polyétherimide et articles obtenus à partir de ces substrats
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
US20040096584A1 (en) * 1998-11-13 2004-05-20 Enthone Inc. Process for metallizing a plastic surface
WO2015183304A1 (fr) * 2014-05-30 2015-12-03 Uab Rekin International Pré-traitement d'adhérence sans chrome pour des matières plastiques

Also Published As

Publication number Publication date
US20210102296A1 (en) 2021-04-08
WO2021133455A2 (fr) 2021-07-01

Similar Documents

Publication Publication Date Title
WO2008143190A1 (fr) Procédé de prétraitement pour le dépôt autocatalytique d'un corps moulé de résine, procédé de placage de corps moulé de résine et agent de prétraitement
CN103469267B (zh) 一种表面处理电解铜箔的工艺方法及其处理的铜箔
CN103572306A (zh) 用于铜表面退镍的退镀液及其制备方法和用于退去铜表面镍的方法
JP2015518925A5 (fr)
WO2019134208A1 (fr) Procédé de gravure par dorure pour carte génératrice de signaux haute fréquence pour communication 5g
WO2014124773A3 (fr) Procédé de dépôt d'une première couche métallique sur des polymères non conducteurs
TW200728514A (en) Method of coating a surface of a substrate with a metal by electroplating
WO2015027886A1 (fr) Solution pour argenture et procédé d'argenture par remplacement chimique
JP2017101304A (ja) 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法
WO2021133455A3 (fr) Procédé pour augmenter l'adhérence de surface dans des substrats de polyétherimide
CN104593786A (zh) 一种金属表面微孔化处理的方法
JPS63297573A (ja) プラスチツクの付着堅固なメタライジング法
WO2012099466A3 (fr) Procédé pour la fabrication d'un dispositif électronique par dépôt électrolytique à partir d'un liquide ionique
US20160108254A1 (en) Zinc immersion coating solutions, double-zincate method, method of forming a metal plating film, and semiconductor device
EP4561326A3 (fr) Procédé de gravure sélective d'un composant métallique
KR101565523B1 (ko) 고내식성 아노다이징 표면처리방법
TW200632146A (en) Immersion process for electroplating applications
CN108330489A (zh) 一种平滑轮廓铜箔表面粗化处理方法
CN104152872B (zh) 镁合金处理方法及其产品
TW201529885A (zh) 聚亞醯胺基板金屬化的方法
CN114381774B (zh) 一种钕铁硼磁体合金镀层的制备方法
KR20090093122A (ko) 알에프 장비의 도금 방법 및 이에 의해 제조된 알에프 장비
CN108642481A (zh) 一种塑胶化学沉镍的工艺方法
SI1260615T1 (en) Metal coating of graphite
IL42775A (en) Method of improving the bonding capability of polymer surfaces

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20907678

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20907678

Country of ref document: EP

Kind code of ref document: A2

122 Ep: pct application non-entry in european phase

Ref document number: 20907678

Country of ref document: EP

Kind code of ref document: A2