WO2023155407A1 - Appareil de retournement d'élément semi-conducteur - Google Patents
Appareil de retournement d'élément semi-conducteur Download PDFInfo
- Publication number
- WO2023155407A1 WO2023155407A1 PCT/CN2022/115662 CN2022115662W WO2023155407A1 WO 2023155407 A1 WO2023155407 A1 WO 2023155407A1 CN 2022115662 W CN2022115662 W CN 2022115662W WO 2023155407 A1 WO2023155407 A1 WO 2023155407A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module
- semiconductor element
- loading
- frame body
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
- B65G15/22—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising a series of co-operating units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/88—Separating or stopping elements, e.g. fingers
- B65G47/8807—Separating or stopping elements, e.g. fingers with one stop
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to the technical field of semiconductor element production, processing and transfer equipment, in particular to a semiconductor element flipping equipment.
- the existing semiconductor component transfer equipment cannot be modularized to meet the needs of different production processes, nor can the workshop fully automate the operation of the product line, and the cleanliness level does not meet higher requirements, which affects the production and processing of products and prolongs processing Due to the transportation cycle, the accuracy of the construction period cannot be guaranteed, so a semiconductor element flipping device is designed for this.
- a semiconductor element flipping device including:
- the loading and unloading module is connected to the frame body and is used for loading and unloading external workpieces
- the jacking module which is connected with the loading and unloading module, is used to lift the workpiece;
- the overturning module is connected with the frame body and used for overturning the workpiece.
- the loading and unloading module includes:
- the first Z-axis linear module is connected to the frame body, and is used to provide a driving force for moving along the Z-axis direction;
- a box body, the box body is connected to the output end of the first Z-axis linear module
- a pair of conveyor belts, a pair of conveyor belts are symmetrically arranged on both side walls inside the box;
- the whole row of cylinders, the whole row of cylinders are connected with the box, and are used for the whole row positioning of the workpiece.
- the loading and unloading module also includes:
- the adjusting rod is connected with the box body and is used for adjusting the width of both sides of the box body.
- the jacking module includes:
- the second Z-axis linear module is connected with the casing, and is used to provide a driving force moving along the Z-axis direction;
- the storage table is located between the two side walls inside the cabinet, the bottom of the storage table runs through the bottom of the cabinet and is connected to the output end of the second Z-axis linear module;
- the material stopper is connected with the storage table, and is used to block and limit the workpiece when there are workpieces on the storage table.
- the retaining component includes:
- a pair of stoppers, a pair of stoppers are located on both sides of the storage table;
- the stopper driving mechanism is connected with the storage table, and the output end of the stopper driving mechanism is connected with a pair of stoppers for driving the stoppers to rotate 90 degrees.
- the flipping module contains:
- a pair of overturning assemblies are arranged on both sides of the top of the frame body, and are used for overturning the workpiece.
- one of the rollover components contains:
- Linear cylinder the linear cylinder is arranged on the top side of the frame body, and is used to provide the driving force to move along the X-axis direction;
- a turning motor which is connected to the output end of the linear cylinder
- the clamping cylinder is connected to the output end of the turning motor
- the gripper is connected to the output end of the clamping cylinder;
- the guide assembly is connected with the turning motor and the frame body.
- the guide component contains:
- Guide rails, the guide rails are arranged on the frame body;
- the guide block is connected with the turning motor, and the guide block is slidably arranged on the guide rail.
- the semiconductor element flipping device of the embodiment of the present invention different positions can be allocated according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, realize intelligent workpiece processing and transportation, without manual operation, and the transfer process is smooth. And the speed is fast and the efficiency is high, which can ensure the stability of the processing cycle and save labor costs. It can realize the flipping of workpieces during transfer and transportation, and solve the problem that special workpieces need to be flipped.
- FIG. 1 is a first perspective structural view of a semiconductor element flipping device according to an embodiment of the present invention.
- FIG. 2 is a second perspective structural view of a semiconductor element flipping device according to an embodiment of the present invention.
- Fig. 3 is a three-dimensional structure diagram of a material ejecting module of a semiconductor device overturning device according to an embodiment of the present invention.
- FIG. 4 is a first perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.
- FIG. 5 is a second perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.
- FIG. 6 is a third perspective structural view of a flipping module of a semiconductor element flipping device according to an embodiment of the present invention.
- FIGS. 1 to 6 which is used to transfer semiconductor elements (such as wafers, PCB boards, etc.) and flip the transferred workpieces. It has a wide range of application scenarios .
- the semiconductor element flipping device has a frame body 1 , a loading and unloading module, a jacking module and a flipping module.
- the loading and unloading module is connected to the frame body 1 for loading and unloading external workpieces
- the jacking module is connected to the loading and unloading module for jacking up the workpiece
- the turning module is connected with the frame body 1, and is used to turn over the workpiece.
- the loading and unloading module includes: a first Z-axis linear module 21 , a box body 22 , a pair of conveyor belts 23 and an array of cylinders 24 .
- the first Z-axis linear module 21 is connected to the frame body 1 for providing driving force to move along the Z-axis direction
- the box body 22 is connected to the output end of the first Z-axis linear module 21 for supporting the Parts
- a pair of conveyor belts 23 are symmetrically arranged on the inner side walls of the box body 22, and a pair of conveyor belts 23 are used for docking external workpieces
- the whole row of cylinders 24 is connected with the box body 22 for aligning the workpieces.
- the loading and unloading module also includes: an adjustment rod 25, which is connected to the box body 22, and is used to adjust the width of both sides of the box body 22, and is suitable for different widths. workpieces, increasing the utility of the equipment.
- the ejecting module includes: a second Z-axis linear module 31 , a storage table 32 and a stopper.
- the second Z-axis linear module 31 is connected to the box body 22, and is used to provide a driving force for moving along the Z-axis direction.
- the storage table 32 is located between the inner side walls of the box body 22, and the bottom of the storage table 32 runs through the box body.
- the bottom of 22 is connected to the output end of the second Z-axis linear module 31 for supporting the workpiece, and the stopper is connected to the storage table 32 for blocking the workpiece when there is a workpiece on the storage table 32 bit.
- the stopper assembly includes: a pair of stoppers 331 and a stopper driving mechanism 332 .
- a pair of stoppers 331 are located on both sides of the storage platform 32, the stopper drive mechanism 332 is connected with the storage platform 32, the output end of the stopper drive mechanism 332 is connected with a pair of stoppers 331, and the stopper drive mechanism 332 is crank slider drive The mechanism is used to drive the block 331 to rotate 90 degrees, so that the block 331 can stand or lie down.
- the overturning module includes: a pair of overturning assemblies, and a pair of overturning assemblies are arranged on both sides of the top of the frame body 1 for overturning the workpiece, Ensure stability when flipping.
- one of the turning components includes: a linear cylinder 41, a turning motor 42, a clamping cylinder 43, jaws 44 and a guide component.
- the linear cylinder 41 is arranged on the top side of the frame body 1, and is used to provide the driving force for moving along the X-axis direction.
- the turning motor 42 is connected with the output end of the linear cylinder 41 to provide turning force.
- the clamping cylinder 43 and the turning motor 42 The output end is connected, and the clamping claw 44 is connected with the output end of the clamping cylinder 43, and the clamping cylinder 43 drives the clamping jaw 44 to clamp the workpiece.
- the guide assembly is connected with the flipping motor 42 and the frame body 1 for guiding function to ensure accuracy.
- the guide assembly includes: a guide rail 451 and a guide block 452 .
- the guide rail 451 is arranged on the frame body 1
- the guide block 452 is connected with the turning motor 42
- the guide block 452 is slidably arranged on the guide rail 451, by being provided with the guide block 452 and the guide rail 451, good guidance can be provided for the movement of the turning motor 42 Effect.
- the storage table 32 and the pair of conveyor belts 23 are at the same height.
- the stopper driving mechanism 332 drives the stopper 331 at the rear end to rotate forward 90 degrees to lie down, and a Run the conveyor belt 23, dock the workpieces delivered by the external equipment, flow the workpieces into the box body 22 and place them on the top shelf 32, and then use the whole row of cylinders 24 to limit the workpieces in a row.
- the stopper 331 at the end rotates 90 degrees in the opposite direction and stands to block and limit the workpiece.
- the second Z-axis linear module 31 drives the storage table 32 to the flip position.
- the linear cylinder 41 in the pair of flip components drives the flip
- the motor 42 moves toward the workpiece to the clamping position, allowing the clamping cylinder 43 to operate, and the driving jaw 44 can clamp the workpiece, and then the first Z-axis linear module 21 drives the box body 22 and the storage table 32 to a safe low position, It will not interfere with the turning, and then the turning motor 42 runs to drive the workpiece to turn over.
- the storage table 32 rises to catch the workpiece. If the workpiece has an adsorption action subsequently, the storage table 32 falls to the same height as the pair of conveyor belts 23 for adsorption. Wait, if there is no adsorption action, the storage table 32 drops to a height below the pair of conveyor belts 23, and the workpiece falls on the pair of conveyor belts 23, and is transported out of the casing 22 by a pair of conveyors.
- the semiconductor element flipping equipment according to the embodiment of the present invention has been described. Different positions can be assigned according to the production requirements of subsequent processes, so as to achieve modular transfer and transfer, and realize intelligent workpiece processing and transportation. , without manual operation, the transfer process is smooth, fast and efficient, which can ensure the stability of the processing cycle and save labor costs. It can realize the flipping of workpieces during transfer and transportation, and solve the problem of flipping special workpieces.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Specific Conveyance Elements (AREA)
Abstract
Appareil de retournement d'élément semi-conducteur comprenant : un corps de cadre (1) ; un module de chargement et de déchargement, le module de chargement et de déchargement étant relié au corps de cadre (1) et utilisé pour charger et décharger des pièces externes ; un module de levage relié au module de chargement et de déchargement et utilisé pour soulever les pièces ; et un module de retournement relié au corps de cadre (1) et utilisé pour retourner les pièces. L'appareil peut réaliser une distribution au niveau de différentes positions selon des exigences de production de procédures ultérieures de manière à mettre en œuvre un transfert modulaire, ce qui permet d'obtenir un usinage et un transport intelligents de pièces sans opération manuelle ; le processus de transfert est régulier, la vitesse est élevée et l'efficacité est élevée, et la stabilité d'une période d'usinage peut ainsi être garantie, et le coût de main-d'œuvre est réduit ; et des pièces peuvent être retournées lorsqu'elles sont transférées et transportées, de sorte que le problème selon lequel des pièces spéciales doivent être retournées est résolu.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210156858.1 | 2022-02-21 | ||
| CN202210156858.1A CN114506649B (zh) | 2022-02-21 | 2022-02-21 | 半导体元件翻转设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023155407A1 true WO2023155407A1 (fr) | 2023-08-24 |
Family
ID=81551535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2022/115662 Ceased WO2023155407A1 (fr) | 2022-02-21 | 2022-08-30 | Appareil de retournement d'élément semi-conducteur |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114506649B (fr) |
| WO (1) | WO2023155407A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117735215A (zh) * | 2023-12-08 | 2024-03-22 | 苏州华诺志恒智能科技有限公司 | 一种180°翻转机构 |
| CN117735216A (zh) * | 2023-12-22 | 2024-03-22 | 天津昌润鹏科技有限公司 | 产品的自动翻板设备、方法和应用 |
| CN120172063A (zh) * | 2025-03-20 | 2025-06-20 | 东莞市伟强机电设备有限公司 | 镀膜下料设备 |
| CN121358248A (zh) * | 2025-12-16 | 2026-01-16 | 湖南艾科威半导体装备有限公司 | 一种半导体真空环境用托盘夹持翻转机构 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114506649B (zh) * | 2022-02-21 | 2023-12-08 | 上海世禹精密设备股份有限公司 | 半导体元件翻转设备 |
| CN114873263B (zh) * | 2022-06-09 | 2024-09-06 | 广州明珞装备股份有限公司 | 一种侧板上料设备、涂胶以及积放链输送设备 |
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| JP2011219238A (ja) * | 2010-04-12 | 2011-11-04 | Daifuku Co Ltd | 搬送装置 |
| US20150079719A1 (en) * | 2013-09-16 | 2015-03-19 | JiFu Machinery & Equipment Inc. | Systems and methods for flipping semiconductor bodies during a manufacturing process |
| CN106241311A (zh) * | 2016-08-30 | 2016-12-21 | 浙江中智机器人有限公司 | 一种用于电路板自动化生产的自动翻转装置 |
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| CN114506649A (zh) * | 2022-02-21 | 2022-05-17 | 上海世禹精密机械有限公司 | 半导体元件翻转设备 |
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| CN101503146B (zh) * | 2008-12-19 | 2011-07-20 | 王树生 | 随行夹具输送系统 |
| JP2013136442A (ja) * | 2011-12-28 | 2013-07-11 | Toyota Auto Body Co Ltd | ワーク積載装置 |
| CN103274197B (zh) * | 2013-05-30 | 2015-07-22 | 宁波庄宏亿轴承有限公司 | 一种提升式工件翻转装置 |
| CN204823151U (zh) * | 2015-06-29 | 2015-12-02 | 苏州赛腾精密电子股份有限公司 | 一种自动翻转上下料机构 |
| CN105415067A (zh) * | 2015-12-18 | 2016-03-23 | 苏州金逸康自动化设备有限公司 | 一种用于连杆式送料流水线的翻转模组 |
| CN206367853U (zh) * | 2016-11-01 | 2017-08-01 | 无锡先导智能装备股份有限公司 | 电芯翻转上料机构 |
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2022
- 2022-02-21 CN CN202210156858.1A patent/CN114506649B/zh active Active
- 2022-08-30 WO PCT/CN2022/115662 patent/WO2023155407A1/fr not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011219238A (ja) * | 2010-04-12 | 2011-11-04 | Daifuku Co Ltd | 搬送装置 |
| US20150079719A1 (en) * | 2013-09-16 | 2015-03-19 | JiFu Machinery & Equipment Inc. | Systems and methods for flipping semiconductor bodies during a manufacturing process |
| CN106241311A (zh) * | 2016-08-30 | 2016-12-21 | 浙江中智机器人有限公司 | 一种用于电路板自动化生产的自动翻转装置 |
| CN209097533U (zh) * | 2018-09-03 | 2019-07-12 | 珠海博杰电子股份有限公司 | 一种双层皮带线送料装置 |
| CN110012606A (zh) * | 2019-04-24 | 2019-07-12 | 深圳市聚亿鑫电子科技有限公司 | 一种自动传送翻转电路板加工流水线 |
| CN210972953U (zh) * | 2019-09-06 | 2020-07-10 | 东莞市冠佳电子设备有限公司 | 一种pcb板自动上下料设备 |
| CN211162803U (zh) * | 2019-12-20 | 2020-08-04 | 东莞市高贝瑞自动化科技有限公司 | 一种自动锁螺丝机构 |
| CN113816090A (zh) * | 2021-09-10 | 2021-12-21 | 常州科瑞尔科技有限公司 | 一种igbt模块上下料翻转装置 |
| CN114506649A (zh) * | 2022-02-21 | 2022-05-17 | 上海世禹精密机械有限公司 | 半导体元件翻转设备 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117735215A (zh) * | 2023-12-08 | 2024-03-22 | 苏州华诺志恒智能科技有限公司 | 一种180°翻转机构 |
| CN117735216A (zh) * | 2023-12-22 | 2024-03-22 | 天津昌润鹏科技有限公司 | 产品的自动翻板设备、方法和应用 |
| CN120172063A (zh) * | 2025-03-20 | 2025-06-20 | 东莞市伟强机电设备有限公司 | 镀膜下料设备 |
| CN121358248A (zh) * | 2025-12-16 | 2026-01-16 | 湖南艾科威半导体装备有限公司 | 一种半导体真空环境用托盘夹持翻转机构 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114506649A (zh) | 2022-05-17 |
| CN114506649B (zh) | 2023-12-08 |
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