WO2024143146A1 - Dispositif de mesure et unité de mesure - Google Patents

Dispositif de mesure et unité de mesure Download PDF

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Publication number
WO2024143146A1
WO2024143146A1 PCT/JP2023/045900 JP2023045900W WO2024143146A1 WO 2024143146 A1 WO2024143146 A1 WO 2024143146A1 JP 2023045900 W JP2023045900 W JP 2023045900W WO 2024143146 A1 WO2024143146 A1 WO 2024143146A1
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WO
WIPO (PCT)
Prior art keywords
flow sensor
heat flow
measuring device
heat
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2023/045900
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English (en)
Japanese (ja)
Inventor
新 高橋
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Topologic
Topologic Inc
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Topologic
Topologic Inc
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Application filed by Topologic, Topologic Inc filed Critical Topologic
Priority to JP2024567706A priority Critical patent/JPWO2024143146A1/ja
Publication of WO2024143146A1 publication Critical patent/WO2024143146A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables

Definitions

  • the present invention relates to a measuring device and a measuring unit.
  • Patent Document 1 discloses a technology that aims to provide a thermal flow sensor that can suppress a decrease in detection accuracy.
  • the thermal flow sensor described in Patent Document 1 includes a first temperature sensor that detects the temperature of a predetermined location on the outer wall surface of the pipe, a heat transfer element that is placed on the outer wall surface of the pipe at a distance from the first temperature sensor and transfers heat to and from the measurement medium by heating or cooling the outer wall surface of the pipe, a second temperature sensor that detects the temperature of the portion of the outer wall surface of the pipe that is heated or cooled by the heat transfer element, and control means that performs predetermined processing.
  • the program for implementing the software used in this embodiment may be provided as a non-transitory computer-readable recording medium, or may be provided so that it can be downloaded from an external server, or may be provided so that the program is started on an external computer and its functions are implemented on a client terminal (so-called cloud computing).
  • a circuit in the broad sense is a circuit that is realized by at least appropriately combining a circuit, circuitry, a processor, and memory.
  • ASICs application specific integrated circuits
  • SPLDs simple programmable logic devices
  • CPLDs complex programmable logic devices
  • FPGAs field programmable gate arrays
  • the heat flow sensor (one example of a device) according to this embodiment is preferably a thin-film type heat flow sensor based on the anomalous Nernst effect.
  • the element (thermoelectric conversion element) of the heat flow sensor i.e., thermoelectric conversion device
  • the element may be composed of, for example, a topological ferromagnet or a topological antiferromagnet called a Weyl semimetal, or may be composed of a ferrimagnetic material, or may be a combination of these.
  • the compound constituting the element may be, for example, an alloy containing a transition metal, and the alloy may be a compound having a crystal structure with a kagome lattice plane of the transition metal, and may exhibit the anomalous Nernst effect.
  • the composition ratio of the alloy constituting the topological ferromagnet or topological antiferromagnet is not necessarily limited to the above-mentioned stoichiometric composition ratio, and may be any composition ratio as long as it has a partially stoichiometric structure.
  • the ferrimagnetic material is also not particularly limited as long as it exhibits the anomalous Nernst effect.
  • the structure of the element is not particularly limited, and any known structure may be used.
  • the element according to this embodiment may be provided by sputtering, deposition, MBE, plating, sintering, printing, pasting, or the like.
  • the substrate 21 is a member that functions as a substrate, and is made of, for example, a material having electrical insulation.
  • the substrate 21 may be a rigid substrate or a bendable flexible substrate.
  • the substrate 21 of this embodiment is formed in a plate shape having a thickness direction in the z-axis direction.
  • the substrate 21 includes a connection surface 211 and a measurement surface 212.
  • the connection surface 211 is connected to a member such as a heat bath, and is configured so that the position of the substrate 21 is fixed.
  • the measurement surface 212 is configured to face a fluid.
  • the measurement surface 212 is located opposite the connection surface 211 in the thickness direction of the substrate 21 (i.e., the z-axis direction).
  • the measurement surface 212 is formed in a planar shape with the x-direction as the first direction and the y-direction as the second direction as in-plane directions.
  • the x-direction and the y-direction are defined to be perpendicular to each other.
  • the measurement surface 212 is configured so that the z-axis direction is the normal direction.
  • the heating element 22 as a temperature adjustment unit is configured to heat a fluid that can move along the measurement surface 212 based on an external signal.
  • the heating element 22 is provided on the substrate 21.
  • the heating element 22 is provided on the substrate 21 so as to directly exchange heat with the fluid by being exposed from the measurement surface 212 of the substrate 21. This promotes heat exchange with the fluid and increases the temperature change of the fluid caused by the heating element 22.
  • the specific configuration of the heating element 22 is arbitrary, for example, a resistor, a coil heater, etc., as long as it is possible to heat the fluid based on an external signal.
  • the temperature adjustment unit is not limited to the heating element 22, and may be a cooling element such as a Peltier element.
  • the temperature adjustment unit is configured to cool a fluid that can move along the measurement surface 212 based on an external signal.
  • the fluid may include any object that can cause heat transfer by flow, such as a liquid, a gas, a deformed body such as a gel or sol, or a powder.
  • the fluid is a gas.
  • Each of the at least one heat flow sensor 23 is provided on the measurement surface 212 and is configured to generate an electromotive force due to a temperature gradient including a component in the normal direction of the measurement surface 212.
  • the at least one heat flow sensor 23 may include a first heat flow sensor 23a.
  • the at least one heat flow sensor 23 may further include a second heat flow sensor 23b. With this configuration, the measurement device 2 can measure more information.
  • each heat flow sensor 23 includes at least one (in this embodiment, multiple) thermoelectric conversion element 231, wiring 232, and a pair of output terminals 233.
  • Thermoelectric conversion elements 231 include a material that exhibits the anomalous Nernst effect, and are configured to generate an electromotive force along the y-axis direction due to a temperature gradient in the z-axis direction.
  • Each of the thermoelectric conversion elements 231 is a ferromagnetic material that is magnetized in the x-axis direction. This makes it possible to adjust the polarity of the thermoelectric coefficient tensor of the thermoelectric conversion elements 231 by controlling the magnetization direction of the thermoelectric conversion elements 231.
  • the wiring 232 is configured to connect the multiple thermoelectric conversion elements 231 in series. This allows the electromotive forces generated from the multiple thermoelectric conversion elements 231 based on the temperature gradient in the same direction to be transmitted via the wiring 232 and added up as a whole for the multiple thermoelectric conversion elements 231.
  • the output terminal 233 is a terminal configured to output the total value of the electromotive forces output from the entire plurality of thermoelectric conversion elements 231.
  • the output terminal 233 does not have to be actually implemented as a terminal for connection, and may be a virtual terminal connected to an external element.
  • the heat flow sensor 23 has a pair of output terminals 233, and a total electromotive force V, which is the total value of the electromotive forces of the thermoelectric conversion elements 231, is output from the pair of output terminals 233.
  • the total electromotive force V output from the output terminal 233 of the first heat flow sensor 23a is referred to as the first total electromotive force V1
  • the total electromotive force V output from the output terminal 233 of the second heat flow sensor 23b is referred to as the second total electromotive force V2.
  • the first total electromotive force V1 and the second total electromotive force V2 are output from the measuring device 2 as the first output signal S1 and the second output signal S2.
  • the first heat flow sensor 23a is disposed on the measurement surface 212 at a position away from the heating element 22 in the x-axis direction, which is one of the in-plane directions of the measurement surface 212.
  • the second heat flow sensor 23b is also disposed on the measurement surface 212 at a position away from the heating element 22 in the x-axis direction.
  • the heating element 22 is disposed between the first heat flow sensor 23a and the second heat flow sensor 23b along the x-axis direction.
  • the distance between the heating element 22 and the first heat flow sensor 23a in the x-axis direction is equal to the distance between the heating element 22 and the second heat flow sensor 23b in the x-axis direction.
  • the outputs of the first total electromotive force V1 and the second total electromotive force V2 are reversed, so that, for example, even if the flow direction is reversed by taking the difference between V1 and V2, it is easy to obtain symmetric linear characteristics regarding the flow rate.
  • the distance between the heating element 22 and the first heat flow sensor 23a in the x-axis direction may be different from the distance between the heating element 22 and the second heat flow sensor 23b in the x-axis direction.
  • ⁇ Information processing device 3> 3 is a block diagram showing a hardware configuration of the information processing device 3.
  • the information processing device 3 includes a communication unit 31, a storage unit 32, at least one processor 33 as an example of a control circuit, a display unit 34, and an input unit 35, and these components are electrically connected via a communication bus 30 inside the information processing device 3.
  • the communication unit 31 is preferably a wired communication means such as USB, IEEE 1394, Thunderbolt (registered trademark), wired LAN network communication, etc., but may also include wireless LAN network communication, mobile communication such as 3G/LTE/5G, BLUETOOTH (registered trademark) communication, etc. as necessary. In other words, it is more preferable to implement it as a collection of multiple communication means. In other words, the information processing device 3 may communicate various information from the outside via the communication unit 31 and the network.
  • the memory unit 32 stores various information defined by the above description. This can be implemented, for example, as a storage device such as a solid state drive (SSD) that stores various programs and the like related to the information processing device 3 executed by the processor 33, or as a memory such as a random access memory (RAM) that stores temporarily required information (arguments, arrays, etc.) related to the program calculations.
  • the memory unit 32 stores various programs, variables, etc. related to the information processing device 3 executed by the processor 33.
  • the processor 33 processes and controls the overall operations related to the information processing device 3.
  • the processor 33 is, for example, a central processing unit (CPU) not shown.
  • the processor 33 realizes various functions related to the information processing device 3 by reading out a specific program stored in the memory unit 32. That is, information processing by software stored in the memory unit 32 can be specifically realized by the processor 33, which is an example of hardware, and executed as each functional unit included in the processor 33. These will be described in more detail in the next section.
  • the processor 33 is not limited to being single, and may be implemented with multiple processors 33 for each function. A combination of these may also be used.
  • the display unit 34 may be included in the housing of the information processing device 3 or may be attached externally.
  • the display unit 34 displays a screen of a Graphical User Interface (GUI) that can be operated by the user.
  • GUI Graphical User Interface
  • This is preferably implemented by using display devices such as a CRT display, a liquid crystal display, an organic EL display, and a plasma display, depending on the type of information processing device 3.
  • the input unit 35 is configured to be able to accept input from the user.
  • the input unit 35 may be included in the housing of the information processing device 3, or may be externally attached.
  • the input unit 35 may be implemented as a touch panel integrated with the display unit 34. If it is a touch panel, the user can input tapping operations, swiping operations, and the like.
  • a switch button, a mouse, a QWERTY keyboard, a voice recognition device, a gesture measurement device, a gaze measurement device, a biosignal measurement device, an imaging device, and the like may be used. That is, the input unit 35 accepts an operation input made by the user. In response, the input unit 35 transfers a signal corresponding to the operation input to the processor 33 via the communication bus 30.
  • the processor 33 can execute predetermined control and calculations as necessary.
  • the processor 33 is configured to be able to acquire information from the information processing device 3 or other devices.
  • the processor 33 is configured to acquire the measurement results of the first output signal S1 and the second output signal S2 output from the measuring device 2.
  • the processor 33 is configured to acquire various pieces of information by reading out various pieces of information stored in a storage area that is at least a part of the memory unit 32 and writing the read out information in a working area that is at least a part of the memory unit 32.
  • the storage area is, for example, an area of the memory unit 32 that is implemented as a storage device such as an SSD.
  • the working area is, for example, an area that is implemented as a memory such as a RAM. Note that acquisition by the processor 33 includes acquiring the output results of each functional unit included in the processor 33.
  • the processor 33 generates an external signal S0 for the heating element 22, thereby causing the heating element 22 to generate heat.
  • the external signal S0 may be generated in any manner, but the processor 33 is configured, for example, to output the external signal S0 in accordance with a predetermined timing.
  • the processor 33 is configured to generate the external signal S0 at a constant period according to a specific frequency fc in accordance with a predetermined clock frequency, thereby causing the heating element 22 to generate heat periodically.
  • the processor 33 is configured as a drive unit to drive the heating element 22 based on the specific frequency.
  • the value of the specific frequency fc may be any value, but it is preferably set so that noise from the outside world can be removed by a frequency filter or the like.
  • Processor 33 is configured to extract a specific frequency component from the acquired information.
  • processor 33 may convert the signal contained in the acquired information into a frequency spectrum using a Fourier transform or the like, and selectively extract the signal strength of a specific frequency from the frequency spectrum.
  • processor 33 extracts a component of a specific frequency fc from the detection results of electromotive forces V1, V2 generated by heat flow sensors 23a, 23b.
  • the processor 33 is configured to be able to display various information.
  • the information can be presented to the user via the display unit 34 of the information processing device 3 or other devices.
  • the processor 33 controls the display unit 34 of the information processing device 3 to display visual information such as screens, images including still images or videos, icons, messages, etc.
  • the processor 33 may generate only rendering information for displaying the visual information on the display unit 34.
  • FIG. 4 is an activity diagram showing an example of the flow of information processing executed in the measurement system 1.
  • the information processing may include any exception processing not shown. Exception processing includes interruption of the information processing and omission of each process. Selection or input performed in the information processing may be based on a user operation or may be performed automatically without relying on a user operation.
  • activity A2 the processor 33 operates based on the output external signal S0. This causes the heating element 22 to generate heat, and the temperature of the fluid around the heating element 22, which is exchanging heat with the heating element 22, changes at least in accordance with the distance from the heating element 22. As the fluid flows along the measurement surface 212, heat transfer occurs around the heating element 22 and the heat flow sensor 23 via the fluid. This causes the temperature distribution around the heating element 22 and the heat flow sensor 23 to change in accordance with the flow velocity W of the fluid, and the heat flow of each heat flow sensor 23 changes accordingly. As a result, the change in the flow velocity W of the fluid is reflected as a change in the total electromotive force V of each heat flow sensor 23.
  • the processor 33 detects output signals (first output signal S1 and second output signal S2) related to electromotive forces from each heat flow sensor 23.
  • the processor 33 may detect the output signals S1 and S2 from each heat flow sensor 23 by acquiring the detection results of an external voltmeter or the like.
  • the component of the specific frequency fc may be extracted using an analog circuit including a filter that can transmit the specific frequency fc, such as a low-pass filter, a band-pass filter, a high-pass filter, or the like.
  • the control circuit is not limited to a digital circuit such as the processor 33, and may include an analog circuit.
  • the component of the specific frequency fc may be extracted by a lock-in method. This is because, according to this configuration, the extraction accuracy of the component of the specific frequency fc can be improved and the influence of noise can be further reduced.
  • activity A6 the processor 33 outputs information about the flow velocity W based on the calculation result in activity A5.
  • the output result may be presented to a user via the display unit 34, for example, or may be used to control other devices.
  • the information about the flow velocity W may be the flow velocity W itself, or any information that may be affected by the flow velocity W, such as the number of particles contained in the fluid, the amount of heat transfer by the fluid, or the behavior of a device contained in the flow path of the fluid.
  • the temperature of the contact area between the first heat flow sensor 23a and the heating element 22 and the temperature of the contact area between the second heat flow sensor 23b and the heating element 22 are each set to the substrate temperature Tsub, which is lower than the temperature of the heating element 22 that is generating heat, and is constant regardless of the driving state of the heating element 22.
  • Tsub substrate temperature
  • the first output signal S1 has a linear relationship with the first total electromotive force V1
  • the second output signal S2 has a linear relationship with the second total electromotive force V2.
  • the temperature of the fluid near the heating element 22 decreases in the order of first temperature Ta1, second temperature Ta2, and third temperature Ta3 as it moves away from the heating element 22 due to the heat generated by the heating element 22.
  • the heat of the heating element 22 is isotropically transferred to each of the first heat flow sensor 23a and the second heat flow sensor 23b via the fluid.
  • the temperature of the fluid transferred to the first heat flow sensor 23a and the temperature of the fluid transferred to the second heat flow sensor 23b become almost equal. Therefore, the temperature gradient along the z-axis direction of the first heat flow sensor 23a and the temperature gradient along the z-axis direction of the second heat flow sensor 23b become almost equal.
  • the above heat quantity Q1 will be referred to as the first transferred heat quantity Q1
  • the above heat quantity Q2 will be referred to as the second transferred heat quantity Q2.
  • FIG. 6 is a diagram showing an example of the temperature distribution around the measurement device 2 in a steady state when the flow of the fluid is finite and the heating element 22 is operating.
  • the fluid flows along the x-axis direction from the first heat flow sensor 23a to the second heat flow sensor 23b.
  • the x-axis direction from the first heat flow sensor 23a to the second heat flow sensor 23b will be treated as the positive x-axis direction.
  • the flow velocity W has a component in the positive direction of the x-axis, so that the amount of heat moving from the heating element 22 in the positive direction of the x-axis is greater than the amount of heat moving from the heating element 22 in the negative direction of the x-axis. Therefore, the temperature of the contact area between the second heat flow sensor 23b and the fluid is in the range of the second temperature Ta2 to the first temperature Ta1, and the temperature of the contact area between the first heat flow sensor 23a and the fluid is equal to or lower than the third temperature Ta3.
  • the first opening 102 and the second opening 103 are opening ends of the peripheral wall 101.
  • the flow path P1 is defined so as to communicate from the first opening 102 to the second opening 103 through a space defined by the inner circumferential surface of the peripheral wall 101.
  • a fluid flowing in from the first opening 102 flows through the inside of the peripheral wall 101 toward the second opening 103.
  • the flowing fluid exchanges heat with the heating element 22 and the heat flow sensor 23 connected to the inner circumferential surface of the peripheral wall 101, and information regarding the flow velocity W of the fluid is obtained from the measuring device 2.
  • the heat transfer by the fluid can be measured separately as contributions of each first direction (the x-axis direction and the z-axis direction in this embodiment) corresponding to the measuring device 2, so that multidimensional information on the heat transfer mode of the fluid can be obtained as a highly reliable measurement result.
  • a measuring device according to any one of (1) to (4) above, in which the temperature control unit is incorporated inside the substrate.
  • the measuring device further including at least one control circuit, the at least one control circuit being configured to be able to execute each of the following steps: in a drive step, driving the temperature adjustment unit based on a specific frequency; and in an extraction step, extracting the specific frequency component from the detection result of the electromotive force generated by the heat flow sensor.
  • a measuring device according to any one of (1) to (6) above, wherein the heat flow sensor is configured to generate the electromotive force based on the anomalous Nernst effect.
  • the housing further includes a first opening, a second opening, and a flow path for the fluid that connects the first opening and the second opening, and the temperature adjustment unit and the heat flow sensor are arranged so that the first in-plane direction is aligned with the extension direction of the flow path.
  • the housing can align the flow of the fluid in the first in-plane direction, improving the reliability of the measurement results of heat transfer by the fluid along the first in-plane direction.
  • k, off1, and off2 may have temperature characteristics. They can be corrected by analog or digital circuits by measuring the temperature. Depending on the system, other parameters may also change, but they can be adjusted appropriately. Also, linear correction may be applied to the sensor output, and analog and/or digital signal processing may be performed to make the output linear to the wind speed.
  • the flow rate system is composed of a heater constructed on a substrate such as Si, and a heat flow sensor that uses thermoelectric conversion based on the anomalous Nernst effect. This allows for a smaller size than conventional systems. Furthermore, by arranging the heat flow sensor along two axial directions, for example, it is possible to detect wind speed in two dimensions. Furthermore, in addition to the above-mentioned configuration, the substrate such as Si may also be provided with a configuration that realizes the functions of a heater control unit, an amplification/detection unit/communication unit for the heat flow sensor, etc.

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  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

Un aspect de la présente invention concerne un dispositif de mesure. Le dispositif de mesure comprend une base, une partie réglage de température et au moins un capteur de flux de chaleur. La base comprend une surface de mesure qui fait face à un fluide. La partie réglage de température est disposée dans la base. Le dispositif de mesure est conçu pour chauffer ou refroidir le fluide, qui peut se déplacer le long de la surface de mesure, sur la base d'un signal externe. Le ou les capteurs de flux de chaleur sont disposés sur la surface de mesure et conçus pour générer une force électromotrice suite à un gradient de température qui comprend une composante dans une direction de ligne normale de la surface de mesure. Le ou les capteurs de flux de chaleur comprennent un premier capteur de flux de chaleur. Le premier capteur de flux de chaleur est disposé dans une position sur la surface de mesure qui est séparée de la partie réglage de température dans une première direction dans le plan, qui est une direction dans le plan de la surface de mesure.
PCT/JP2023/045900 2022-12-29 2023-12-21 Dispositif de mesure et unité de mesure Ceased WO2024143146A1 (fr)

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JP2022212811 2022-12-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026018346A1 (fr) * 2024-07-17 2026-01-22 ＴｏｐｏＬｏｇｉｃ株式会社 Dispositif de commande de chaleur, procédé de commande et support d'enregistrement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428522A (en) * 1987-07-22 1989-01-31 Shimadzu Corp Flow rate sensor
JP2015087250A (ja) * 2013-10-30 2015-05-07 株式会社デンソー 風向風速計
JP2016011949A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 質量流量計および速度計
JP2016011948A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 風向計、風向風量計および移動方向測定計
JP2017067643A (ja) * 2015-09-30 2017-04-06 ミツミ電機株式会社 流量センサ
JP2020153668A (ja) * 2019-03-18 2020-09-24 三菱マテリアル株式会社 複合センサ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428522A (en) * 1987-07-22 1989-01-31 Shimadzu Corp Flow rate sensor
JP2015087250A (ja) * 2013-10-30 2015-05-07 株式会社デンソー 風向風速計
JP2016011949A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 質量流量計および速度計
JP2016011948A (ja) * 2014-06-03 2016-01-21 株式会社デンソー 風向計、風向風量計および移動方向測定計
JP2017067643A (ja) * 2015-09-30 2017-04-06 ミツミ電機株式会社 流量センサ
JP2020153668A (ja) * 2019-03-18 2020-09-24 三菱マテリアル株式会社 複合センサ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026018346A1 (fr) * 2024-07-17 2026-01-22 ＴｏｐｏＬｏｇｉｃ株式会社 Dispositif de commande de chaleur, procédé de commande et support d'enregistrement

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