WO2024242537A1 - High-pressure substrate processing apparatus - Google Patents

Abstract

The present invention provides a high-pressure substrate processing apparatus including: an inner chamber formed to accommodate a substrate to be processed and a reaction gas applied at a first pressure higher than atmospheric pressure; an outer chamber including an outer housing for accommodating the inner chamber, and an outer door formed to be movable between a closed state in which the outer housing is closed and an opened state in which the outer housing is opened, and formed to accommodate a protection gas supplied at a second pressure set in relation to the first pressure; and a fastening module including a support protrusion installed in the outer housing, a rotary member rotatably installed in the outer door, and a locking protrusion protruding from the rotary member and disposed on the support protrusion as the rotary member rotates in the closed state.

Description

High pressure substrate processing equipment

The present invention relates to a processing device used for processing a substrate in a high pressure environment.

In general, various processes are performed on the semiconductor substrate during the manufacturing process of semiconductor devices. Examples of the processes include oxidation, nitridation, silicide, ion implantation, and deposition processes. There is also a hydrogen or deuterium heat treatment process to improve the interface characteristics of the semiconductor device.

The gas used for processing the substrate is supplied to the chamber at high pressure and acts on the semiconductor substrate. In order to maintain the chamber at high pressure, the door to the chamber housing must be securely closed.

If the closed state of the chamber is loosened by high pressure gas, a gap may be created between the housing and the door. This gap may become a passage for gas inside the chamber to escape to the outside.

The background technology described above is technical information that the inventor possessed for deriving embodiments of the present invention or acquired in the process of deriving them, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the present application.

One object of the present invention is to provide a high-pressure substrate processing device capable of firmly maintaining a closed state between a housing and a door even under high pressure within a chamber.

Another object of the present invention is to provide a high-pressure substrate processing device capable of minimizing the power required for fastening between a housing and a door.

According to one aspect of the present invention for achieving the above-described object, a high-pressure substrate processing device may include: an inner chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer housing accommodating the inner chamber; and an outer door formed to be movable between a closed state that closes the outer housing and an open state that opens the outer housing, and an outer chamber formed to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module having a support projection installed on the outer housing, a rotating member rotatably installed on the outer door, and a hooking projection protruding from the rotating member and arranged on the support projection as the rotating member rotates in the closed state.

Here, the rotating member can be positioned within an area defined by the outer housing.

Here, the rotating member may include a rotating ring having a ring shape.

According to another aspect of the present invention, a high-pressure substrate processing device comprises: an inner chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer housing accommodating the inner chamber; and an outer door formed to be movable between a closed state that closes the outer housing and an open state that opens the outer housing, and the outer chamber formed to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module having a support protrusion installed on the outer housing and a catch protrusion arranged on the support protrusion in a state connected to the outer door as the outer door moves in the closed state, wherein the outer door includes an upper plate that contacts the outer housing in the closed state, and the catch protrusion can be arranged on a lower side of the upper plate.

Here, the outer door further includes a lower plate arranged at a different level from the upper plate, and the catch can be arranged between the upper plate and the lower plate.

Here, the catch projection may include one of an upper portion arranged to correspond to a side surface of the upper plate; and a lower portion arranged to correspond to a side surface of the lower plate.

Here, the outer door further includes a sealing material that comes into contact with the outer housing in the closed state, and the engaging projection can be formed to rotate independently of the contact between the sealing material and the outer housing.

Here, the fastening module may further include a driving unit formed to rotate the engaging projection.

Here, the fastening module may further include a rotating member on which the engaging projection is formed, and the driving unit may be formed to rotate the rotating member around a rotating axis arranged along the opening/closing direction of the outer door.

Here, the driving unit may include a driven gear formed on the rotating member; a driving gear meshed with the driven gear; and a motor that rotates the driving gear.

According to another aspect of the present invention, a high-pressure substrate processing device comprises: a chamber having a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure; and a door formed to move between a closed state that closes the housing and an open state that opens the housing; and a fastening module having a support protrusion installed in the housing and a catch protrusion arranged on the support protrusion in a state connected to the door as it moves in the closed state; wherein the door includes an upper plate that contacts the housing in the closed state, and the catch protrusion can be arranged on a lower side of the upper plate.

Here, the door further includes a lower plate arranged at a different level from the upper plate, and the catch can be arranged between the upper plate and the lower plate.

Here, the fastening module further includes a rotating member that is rotatably installed on the door and has the engaging projection formed in a protruding manner, and the engaging projection can be supported by the support projection as the rotating member rotates.

Here, the door further includes a sealing material installed on the upper plate, and the catch projection can be formed to move independently of the contact between the housing and the sealing material in the closed state.

Here, the process gas includes a reaction gas including an active gas and a protective gas which is an inert gas, and the housing includes an inner housing formed to accommodate the substrate to be processed and the reaction gas; and an outer housing which accommodates the inner housing and is coupled to the inner housing to form a closed space that accommodates the protective gas, and the door can be formed to close the inner housing.

According to the high-pressure substrate processing device according to the present invention configured as described above, the housing and the door for accommodating the substrate and the high-pressure gas are maintained in a fastened state by the fastening module, and the fastening module is configured such that the engaging protrusion is moved relative to the support protrusion installed in the housing and is positioned on the support protrusion, so that the closed state between the housing and the door can be firmly maintained even under high pressure within the chamber due to the fastening between the engaging protrusion and the support protrusion.

In addition, since the catch moves independently of the door, only the catch, excluding the door, needs to move to fasten the housing and the door. This minimizes the power required to fasten the housing and the door.

FIG. 1 is a conceptual diagram of a high-pressure substrate processing device (100) according to one embodiment of the present invention.

Figure 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device (100) of Figure 1.

FIG. 3 is a cross-sectional view showing the closed state of the high-pressure substrate processing device (100) of FIG. 2.

FIG. 4 is a cutaway perspective view for explaining the configuration for driving the rotating ring (157) of FIG. 3.

FIG. 5 is a cross-sectional view showing the main part of a high-pressure substrate processing device (100') according to a modified example of the high-pressure substrate processing device (100) of FIG. 3.

FIG. 6 is a cross-sectional view showing the main part of a high-pressure substrate processing device (100”) according to another modified example of the high-pressure substrate processing device (100) of FIG. 3.

FIG. 7 is a cross-sectional view showing a closed state of a high-pressure substrate processing device (200) according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, or substitutes included in the technical spirit and scope of the present invention, as well as substituting or adding the configuration of one embodiment with the configuration of another embodiment.

The attached drawings are only intended to facilitate understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention. In the drawings, the components may be expressed exaggeratedly large or small in size or thickness for convenience of understanding, but the protection scope of the present invention should not be construed as being limited due to this.

The terminology used herein is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expression includes the plural expression unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification. That is, it should be understood that terms such as "comprises" and "consists of" in the specification do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.

When it is said that a component is "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components in between. On the other hand, when it is said that a component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components intervening there.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms defined in commonly used dictionaries, such as those defined in common dictionaries, should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

FIG. 1 is a conceptual diagram of a high-pressure substrate processing device (100) according to one embodiment of the present invention.

Referring to this drawing, the high pressure substrate processing device (100) may include an inner chamber (110), an outer chamber (120), a supply module (130), and an exhaust module (140).

The inner chamber (110) forms a processing space that accommodates an object to be processed. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce contamination in a high temperature and high pressure working environment. Depending on the operation of a heater (not shown) disposed outside the inner chamber (110), the temperature of the inner chamber (110) may reach several hundred to several thousand degrees Celsius. The object may be, for example, a semiconductor substrate (W, see FIG. 2) mounted on a holder. The holder may be a wafer boat (113, see FIG. 2) capable of stacking a plurality of substrates (W) to be processed.

The outer chamber (120) forms an internal space that accommodates the inner chamber (110). The outer chamber (120) is arranged on the outside of the inner chamber (110). Unlike the inner chamber (110), the outer chamber (120) is free from concerns about causing contamination to the object, and thus can be made of a metal material.

The gas supply module (130) is configured to supply gas to the inner chamber (110) and the outer chamber (120). The gas supply module (130) has a gas supplier (131) that serves as a source of gas. The gas supplier (131) can selectively supply hydrogen gas (H ₂ ), deuterium gas (D ₂ ), fluorine gas (F ₂ ), ammonia gas (NH ₃ ), chlorine gas (Cl ₂ ), nitrogen gas (N ₂ ), etc. as a reaction gas for a heat treatment process to the inner chamber (110). The gas supplier (131) can supply nitrogen gas or argon gas (Ar), which is an inert gas, as a protective gas to the outer chamber (120). The reaction gas and the protective gas may be simply referred to as process gas. The above process gas is supplied to the inner chamber (110) or the outer chamber (120) through the reaction gas line (133) or the protective gas line (135), respectively. The protective gas supplied to the outer chamber (120) is specifically supplied to the space (protection space) between the outer chamber (120) and the inner chamber (110).

The above process gas can be supplied so as to form a pressure higher than atmospheric pressure (high pressure), for example, a pressure ranging from several atmospheres to several tens of atmospheres. When the pressure of the reaction gas is a first pressure and the pressure of the protective gas is a second pressure, they can be maintained in a set relationship. For example, the second pressure can be set to be slightly greater than the first pressure. Such a pressure difference provides an advantage in that the reaction gas does not leak from the inner chamber (110).

The exhaust module (140) is configured to exhaust the process gas. In order to exhaust the reaction gas from the inner chamber (110), an exhaust pipe (141) is connected to the upper portion of the inner chamber (110). In order to exhaust the protective gas from the outer chamber (120), an exhaust pipe (145) connected to the outer chamber (120) may be similarly provided. Since these exhaust pipes (141 and 145) are integrated into one, the reaction gas is diluted in the protective gas during the exhaust process, thereby lowering its concentration.

The fastening structure of the external chamber (120) will be described with reference to FIGS. 2 and 3. FIG. 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device (100) of FIG. 1, and FIG. 3 is a cross-sectional view showing the closed state of the high-pressure substrate processing device (100) of FIG. 2.

Referring to these drawings, the inner chamber (110) includes an inner housing (not shown) and an inner door (115). The inner housing forms the processing space for accommodating a substrate to be processed (W), and its lower part may have an open shape. The inner door (115) has a shape that closes the open lower part of the inner housing. The inner door (115) may have a slit shape that is generally open downward.

As the inner door (115) descends, the processing space is opened (open state, see Fig. 2). In the open state, the substrate to be processed is unloaded from the boat (113), and a new substrate to be processed is loaded into the boat (113). As the inner door (115) rises, the processing space is closed (closed state, see Fig. 3). In the closed state, processing, such as heat treatment or deposition, is performed on the substrate to be processed (W).

The outer chamber (120) also includes an outer housing (121) and an outer door (125). The outer housing (121) has a size to accommodate the inner chamber (110). An inner housing (not shown) is mounted on the outer housing (121). The outer door (125) can also open and close the outer housing (121) by moving. The outer door (125) can be connected to the inner door (115) by a support member (119). The support member (119) can have a spring support structure that elastically expands along an opening and closing direction (E). The opening and closing direction (E) is a direction in which the outer door (125) moves to switch between the closed state and the open state. When the outer housing (121) is erected, the opening and closing direction (E) can be substantially the same direction as a lifting or vertical direction. In the process of transitioning from the above open state to the above closed state, the support member (119) allows the outer door (125) to move toward the inner door (115). In an alternative embodiment, the support member (119) may be, for example, an O-ring. In another embodiment, the inner door (115) and the outer door (125) may be integrated with each other to form a single member.

The outer door (125) opens and closes the outer housing (121) while moving up and down together with the inner door (115). Unlike the above, the inner door (115) and the outer door (125) are not connected to each other and can be opened and closed independently.

The high-pressure substrate processing device (100) may further include a fastening module (150) for fastening the outer housing (121) and the outer door (125) in the closed state. Since the inner door (115) is supported by the support member (119) to the outer door (125), the fastening module (150) also causes the inner door (115) to be in close contact with the inner housing. The fastening module (150) causes the protective gas to be maintained at the second pressure within the outer chamber (120). The fastening module (150) also exerts a fastening force so that the reaction gas is maintained at the first pressure within the inner chamber (110).

The fastening module (150) may specifically include a support protrusion (151) and a catch protrusion (155).

The support protrusion (151) is a protrusion installed on the outer housing (121). The support protrusion (151) may be installed on the inner surface of the outer housing (121), as in the present embodiment. The support protrusions (151) may be arranged in multiple numbers along the circumferential direction of the inner surface. The multiple support protrusions (151) may be arranged on the same level or plane along the lifting direction (E).

The catch projection (155) is sized to pass between adjacent pairs of support projections (151) when the outer door (125) moves in the lifting direction (E). The catch projections (155) may be provided in multiple numbers, like the support projections (151). The catch projections (155) are formed to move relative to the outer door (125) in the closed state and to be placed on the support projections (151).

According to the present embodiment, the catch (155) can be moved while being connected to the outer door (125). The catch (155) can be, for example, rotatably installed on the outer door (125).

In contrast to the above, the catch (155) may be movably installed in the outer housing (121). The catch (155) moves from the outer housing (121) toward the outer door (125) and is coupled to the outer door (125). For this purpose, the outer door (125) may have a groove-like configuration (not shown) that accommodates the catch (155).

The catch (155) can be supported by the support projection (151) when positioned on the support projection (151) according to movement (fastened state). As a result, the outer door (125) can be maintained in a state of being firmly fastened to the outer housing (121) even under the high pressure of the process gas.

When a plurality of catch projections (155) are provided, the plurality of catch projections (155) can rotate individually. Alternatively, the catch projections (155) may be integrated with the rotating member (157) and rotate together with the rotating member (157). The rotating member (157) may have a ring shape as illustrated. In this embodiment, the rotating member (157) may be referred to as a rotating ring. The catch projections (155) may be formed to protrude outward from the outer surface of the rotating ring (157). The rotating ring (157) may be arranged to rotate along the rotation direction (R) (centered on the rotation axis along the lifting direction (E)).

The rotating ring (157) can be rotatably coupled to the outer door (125). The outer door (125) has an upper plate (126), and the rotating ring (157) {and the catch (155)} can be located on the lower side of the upper plate (126). If the outer door (125) also has a lower plate (127), the rotating ring (157) can be located between the plates (126 and 127). A bearing (159) can be located between each of the upper plate (126) and the lower plate (127) and the rotating ring (157). A thrust bearing can be used as the bearing (159). The rotating ring (157) can also be located within an area defined by the outer housing (121) {and the support projection (151)}.

The upper plate (126) is arranged to be in contact with the outer housing (121) in the closed state. The upper plate (126) and the lower plate (127) can be connected by a spacer (128). Thereby, the lower plate (127) can be arranged at a different level from the upper plate (126). The spacer (128) can have a smaller diameter or width than the upper plate (126) and/or the lower plate (127). The spacer (128) can be formed as a separate member from the upper plate (126) and the lower plate (127), or can form a single member with one of them. A rotating ring (157) and, further, a catch projection (155) are positioned in the space secured by the spacer (128). The rotating ring (157) can be arranged substantially parallel to the outer door (125) with the spacer (128) inserted into its hollow portion.

While the rotary ring (157) rotates in the closed state, the outer door (125) may not be linked to the rotation of the rotary ring (157). In other words, while the upper plate (126) maintains a state of contact with the outer housing (121) through the sealant (129), the rotary ring (157) may rotate independently of the contact state. The sealant (129) may be an O-ring installed on the upper surface of the upper plate (126).

The configuration for driving the rotating ring (157) will be described with reference to Fig. 4. Fig. 4 is a cutaway perspective view for explaining the configuration for driving the rotating ring (157) of Fig. 3.

With further reference to this drawing, the rotating ring (157) can be driven to rotate by a driving unit (161).

The drive unit (161) may have a driven gear (163), a driving gear (164), and a motor (165). The driven gear (163) may be formed on the inner surface of the rotating ring (157). The driving gear (164) may be a gear that meshes with the driven gear (163). The driving gear (164) may be located between the rotating ring (157) and the spacer (128).

According to this configuration, the rotational power of the motor (165) is transmitted to the driving gear (164). The transmission shaft connecting the output shaft of the motor (165) and the driving gear (164) can be arranged to penetrate the lower plate (127). As the driving gear (164) rotates, the driven gear (163) that is meshed with the driving gear (164) also rotates. As the driven gear (163) rotates, the rotating ring (157) rotates, and the engaging projection (155) also rotates along the rotational direction (R, see FIG. 2). The engaging projection (155) can move on the supporting projection (151) or move to a misaligned position from the supporting projection (151) depending on its rotation.

In the process of rotating the catch (155), the outer door (125) does not rotate together with the catch (155). The power to be output from the motor (165) is sufficient to rotate the catch (155) excluding the outer door (125).

The drive unit (161) has been described as consisting of gears (163 and 164) and a motor (165), but the present invention is not limited thereto. The drive unit may be configured using other actuators such as cylinders.

Another form of the high-pressure substrate processing device (100) will be described with reference to FIGS. 5 and 6. FIG. 5 is a cross-sectional view showing a main part of a high-pressure substrate processing device (100') according to a modified example of the high-pressure substrate processing device (100) of FIG. 3, and FIG. 6 is a cross-sectional view showing a main part of a high-pressure substrate processing device (100”) according to another modified example of the high-pressure substrate processing device (100) of FIG. 3. In these drawings, the same components as those of FIG. 3 are given the same reference numerals, and the bearing (159) is omitted for the simplification of the drawing.

Referring to Fig. 5, the catch projection (155') has, unlike the previous catch projection (155), an upper portion (155a). The upper portion (155a) may be a portion positioned to correspond to the side of the upper plate (126').

The upper surface of the upper portion (155a) may have approximately the same level as the upper surface of the upper plate (126'). Accordingly, the upper surface of the catch projection (155') may be in contact with the outer housing (121'), and the lower surface of the catch projection (155') may be in contact with the support projection (151).

Referring to FIG. 6, the catch projection (155”), unlike the previous catch projection (155), has an upper portion (155a) and a lower portion (155b). The upper portion (155a) may be a portion arranged to correspond to the side surface of the upper plate (126'). The lower portion (155b) may be a portion arranged to correspond to the side surface of the lower plate (127').

The upper surface of the upper portion (155a) may have approximately the same level as the upper surface of the upper plate (126'). The lower surface of the lower portion (155b) may have approximately the same level as the lower surface of the lower plate (127'). Accordingly, the upper surface of the catch projection (155") may be in contact with the outer housing (121"), and the lower surface of the catch projection (155") may be in contact with the support projection (151).

In order to drive the rotation of the rotating ring (157', 157”) as described above, the driving unit (161) described above with reference to FIG. 4 can also be applied to the present modified examples.

In an alternative embodiment, a rotating disk (not shown) may be adopted instead of the rotating ring (157, 157', 157") as the rotating member. The rotating disk is a solid disk and can be rotatably connected to the upper plate (126, 126', 126") and the bottom surface. For the connection, a concave portion may be formed in one of the rotating disk and the upper plate (126, 126', 126") for receiving a protrusion of the other. A bearing may be arranged between the protrusion and the concave portion. A ring gear is installed on the bottom surface of the rotating disk and can be rotationally driven by a motor and a pinion gear.

The above fastening modules (150, 150', 150") can also be applied to a semi-dual chamber having a slightly different form from the above-described dual chamber. In this regard, reference is made to FIG. 7, which illustrates an example in which the fastening module is applied to the above-described semi-dual chamber. FIG. 7 is a cross-sectional view showing a closed state of a high-pressure substrate processing device (200) according to another embodiment of the present invention. Similar reference numerals are given to the same configurations as in the above-described embodiments, and a detailed description thereof is omitted.

Referring to this drawing, the semi-dual chamber may have two housings {inner housing (211) and outer housing (221)} and one door (225). The two housings (211, 221) may correspond to the inner housing and the outer housing (121) of the previous embodiment. The two housings (211, 221) may be combined by their own shapes or by interposing separate members to form a closed space (CS, corresponding to the protective space). Similar to the previous embodiment, the substrate and the reaction gas may be introduced into the inner housing (211). The inner housing (211) may also be protected by the protective gas injected into the closed space (CS). Unlike the previous embodiment, the door (225) is not protected by the protective gas.

The door (225) may correspond to the external door (125) in the previous embodiment. The door (225) may open and close the internal housing (211). A fastening module (250) is applied to the external housing (221) and the door (225). The specific configuration of the fastening module (250) may be substantially the same as the previous fastening modules (150, 150', 150").

In this specification, a high-pressure substrate processing device (100, 100', 100”, 200) having a dual chamber and a semi-dual chamber has been described as an example, but the present invention is not limited thereto. A processing device having a single chamber is also within the scope of the present invention. The single chamber is composed of one housing and one door. A wafer substrate is placed in the chamber, and a process gas for processing the wafer substrate, specifically, a reaction gas, is supplied. The fastening module (150, 150', 150”, 250) can be applied as is to such a single chamber. The fastening module (150, 150', 150”, 250) allows the door to be firmly fastened to the housing despite the pressure of the gas.

Although this specification exemplifies a batch type processing device, the present invention is not limited thereto. The present invention can also be applied to a single wafer type processing device.

The present invention has industrial applicability in the field of manufacturing high-pressure substrate processing devices.

Claims (15)

An internal chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An outer chamber having an outer housing accommodating the inner chamber, and an outer door formed to be movable between a closed state that closes the outer housing and an open state that opens the outer housing, and formed to receive a protective gas supplied at a second pressure set in relation to the first pressure; and A high-pressure substrate processing device comprising a fastening module having a support projection installed on the outer housing, a rotating member rotatably installed on the outer door, and a catch projection formed by protruding from the rotating member and positioned on the support projection as the rotating member rotates in the closed state. In the first paragraph, The above rotating member is, A high pressure substrate processing device located within an area defined by the above outer housing. In the first paragraph, The above rotating member is, A high-pressure substrate processing device comprising a rotating ring having a ring shape. An internal chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An outer chamber having an outer housing accommodating the inner chamber, and an outer door formed to be movable between a closed state that closes the outer housing and an open state that opens the outer housing, and formed to receive a protective gas supplied at a second pressure set in relation to the first pressure; and It includes a fastening module having a support projection installed on the outer housing and a catch projection arranged on the support projection so as to be connected to the outer door as it moves in the closed state. The above outer door, Including an upper plate that contacts the outer housing in the closed state, The above-mentioned stumbling block is, A high pressure substrate processing device positioned on the lower side of the upper plate. In paragraph 4, The above outer door, Further comprising a lower plate arranged at a different level from the upper plate, The above-mentioned stumbling block is, A high pressure substrate processing device disposed between the upper plate and the lower plate. In paragraph 5, The above-mentioned stumbling block is, an upper portion arranged to correspond to the side of the upper plate; and A high pressure substrate processing device, comprising one of the lower portions positioned to correspond to a side of the lower plate. In the first paragraph, The above outer door, Further comprising a sealing material that comes into contact with the outer housing in the closed state; The above-mentioned stumbling block is, A high-pressure substrate processing device formed to rotate independently of contact between the sealing material and the outer housing. In the first paragraph, The above-mentioned fastening module is, A high-pressure substrate processing device further comprising a driving unit formed to rotate the above-mentioned hook. In Article 8, The above-mentioned fastening module is, Further comprising a rotating member having the above-mentioned hook formed thereon, The above driving unit, A high-pressure substrate processing device formed to rotate the rotating member around a rotating axis arranged along the opening/closing direction of the outer door. In Article 9, The above driving unit, A driven gear formed on the above rotating member; a driving gear meshing with the above driven gear; and A high-pressure substrate processing device comprising a motor for rotating the above driving gear. A chamber having a housing formed to receive a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure, and a door formed to move between a closed state that closes the housing and an open state that opens the housing; and It includes a fastening module having a support projection installed in the housing and a catch projection arranged on the support projection so as to be connected to the door as it moves in the closed state. The above door, Including an upper plate that contacts the housing in the closed state, The above-mentioned stumbling block is, A high pressure substrate processing device positioned on the lower side of the upper plate. In Article 11, The above door, Further comprising a lower plate arranged at a different level from the upper plate, The above-mentioned stumbling block is, A high pressure substrate processing device disposed between the upper plate and the lower plate. In Article 11, The above-mentioned fastening module is, It further includes a rotating member that is rotatably installed on the door and has the hanging projection formed protruding therein, The above-mentioned stumbling block is, A high-pressure substrate processing device, wherein the rotating member is supported by the support protrusion as it rotates. In Article 11, The above door, Further comprising a sealing material installed on the upper plate; The above-mentioned stumbling block is, A high-pressure substrate processing device, formed so as to move independently of contact between the housing and the sealing material in the closed state. In Article 11, The above process gas is, Containing a reactive gas containing an active gas and a protective gas which is an inert gas, The above housing, An internal housing formed to accommodate the above-described processing substrate and the above-described reaction gas; and An outer housing is included that accommodates the inner housing and is joined to the inner housing to form a closed space that accommodates the protective gas. The above door, A high pressure substrate processing device formed to close the inner housing.

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