WO2024255520A1 - Optical shaping unit, lidar, and optical transceiver module - Google Patents
Optical shaping unit, lidar, and optical transceiver module Download PDFInfo
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- WO2024255520A1 WO2024255520A1 PCT/CN2024/093620 CN2024093620W WO2024255520A1 WO 2024255520 A1 WO2024255520 A1 WO 2024255520A1 CN 2024093620 W CN2024093620 W CN 2024093620W WO 2024255520 A1 WO2024255520 A1 WO 2024255520A1
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- light
- laser radar
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- optical
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
Definitions
- the present disclosure relates to the field of laser radar, and in particular to an optical shaping unit for laser radar, a laser radar chip, a laser radar, and a transceiver optical module for laser radar.
- LiDAR is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of a target. It is an advanced detection method that combines laser technology with photoelectric detection technology. LiDAR is widely used in autonomous driving, transportation communications, drones, intelligent robots, resource exploration and other fields due to its advantages such as high resolution, good concealment, strong anti-active interference ability, good low-altitude detection performance, small size and light weight.
- the laser radar transmits a detection beam through the transmitting unit, receives the echo reflected by the target object through the receiving unit, and calculates the position and distance of the target object relative to the laser radar based on the echo signal.
- the laser radar has a large number of optical components, a complex structure, and is difficult to arrange, which makes it impossible to further reduce the size of the laser radar, limiting the miniaturization of the laser radar and its application in small devices.
- the traditional structure makes the production cost of the laser radar too high, which is not conducive to the large-scale production and application of the laser radar. Therefore, it is necessary to improve the laser radar.
- LiDAR the high-precision alignment between the transmitting field of view and the receiving field of view directly affects the important performance of LiDAR, such as the distance measurement capability and ranging accuracy.
- LiDAR has the problem of difficulty in ensuring the alignment of the transmitting field of view and the receiving field of view, mainly because the production process, temperature changes, mechanical deformation and other factors cause the transmitting field of view and the receiving field of view to offset and cannot overlap.
- one of the methods currently used is the electronic aperture technology based on the receiving end array photosensitive device.
- the receiving field of view can be dynamically adjusted so that the receiving field of view always coincides with the transmitting field of view.
- the present disclosure provides an optical shaping unit for a laser radar, comprising a first lens and a second lens.
- the first lens is used to receive a detection beam emitted by a transmitting unit of the laser radar, the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface.
- the second lens wherein the first lens is located in the optical path between the transmitting unit and the second lens, and the first lens and the second lens are configured to form a reduced light-emitting surface of the light-emitting surface of the transmitting unit.
- the optical axes of the first lens and the second lens are non-parallel.
- the first lens and the second lens are both convex lenses.
- the focal length of the first lens is greater than the focal length of the second lens.
- the reduced light-emitting surface is formed on a side of the second lens opposite to the first lens.
- the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
- the optical shaping unit further includes a reflecting portion, which is disposed between the first lens and the second lens.
- the reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
- the first lens, the second lens and the reflective portion are integrally formed.
- the first lens, the second lens and the reflective portion are separately formed.
- the optical axes of the first lens and the second lens are perpendicular.
- the angle between the reflective portion and the optical axis of the first lens is 45°, and the angle between the reflective portion and the optical axis of the second lens is 45°.
- the ratio of the focal lengths of the first lens and the second lens is determined according to the size of the reduced light-emitting surface, and the optical shaping unit is configured to increase the power density of the detection beam emitted from the laser radar.
- the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
- the optical shaping unit further includes a reflecting portion, wherein the reflecting portion is disposed between the first lens and the second lens, and wherein the reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
- the present disclosure also provides a laser radar chip, comprising: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body.
- the array of light emitting devices is located on the substrate.
- the array of light receiving devices is located on the substrate on one side of the array of light emitting devices.
- the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices.
- the detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices.
- the packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
- the light emitting device driving module and the light receiving device driving module are located between the light emitting device array and the light receiving device array.
- the light emitting device array and the light receiving device array are located between the light emitting device driving module and the light receiving device driving module.
- the laser radar chip further comprises: a light-transmitting adhesive portion, the light-transmitting adhesive portion being located on a side of the light-splitting unit facing the substrate.
- the light-splitting unit is fixed to the light-receiving device array and the light-emitting device array via the light-transmitting adhesive portion.
- the beam splitter element is a polarization beam splitter.
- the detection light is emitted from the light emitting device array along a direction perpendicular to the substrate surface; the echo light is incident on the light receiving device array along a direction perpendicular to the substrate surface.
- the spectroscopic unit further includes a light deflection element. The light deflection element is located in the optical path of the detection light, and the light deflection element is configured to deflect the detection light to the spectroscopic element.
- the spectroscopic unit further includes: a focusing element, the focusing element is located in the optical path of the detection light, and the focusing element is configured so that the light emitting device array and the light receiving device array are both arranged on the substrate.
- the focusing element includes a first lens and a second lens.
- the first lens is located upstream of the light deflection element in the optical path of the detection light to transmit the detection light to be incident on the light deflection element.
- the second lens is located downstream of the light deflection element in the optical path of the detection light, and the detection light deflected by the light deflection element is transmitted through the second lens and then incident on the spectroscopic element.
- the first lens, the light deflection element and the second lens are integrally formed.
- the first lens is a convex lens or a gradient refractive index lens.
- the second lens is a convex lens or a gradient refractive index lens.
- the second lens is a gradient refractive index lens.
- the first lens, the light deflection element, the second lens and the light splitting element are integrally formed.
- the present disclosure also provides a laser radar, including: a laser radar chip, an optical component and a scanning device.
- the laser radar chip includes: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body.
- the array of light emitting devices is located on the substrate.
- the array of light receiving devices is located on the substrate on one side of the array of light emitting devices.
- the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices.
- the packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
- the optical component transmits the detection light emitted by the laser radar chip, and the detection light transmitted by the optical component is reflected by the scanning device and then emitted. The echo light reflected by the scanning device is transmitted to the laser radar chip via the optical component.
- the laser radar further includes a circuit board, and the circuit board is electrically connected to the laser radar chip.
- the plurality of laser radar chips are fixed and electrically connected to the same circuit board.
- the plurality of laser radar chips share the optical component and the scanning device.
- the scanning device causes the detection light to scan along a first direction.
- a plurality of the laser radar chips are arranged in an array along a second direction, and the second direction is perpendicular to the first direction.
- the laser radar includes a plurality of laser radar chipsets arranged along the first direction.
- the laser radar chipset includes a plurality of laser radar chips, and the plurality of laser radar chips in the same laser radar chipset are arranged along the second direction.
- the plurality of laser radar chips in one laser radar chipset are staggered with the plurality of laser radar chips in an adjacent laser radar chipset along the second direction.
- the laser radar includes a plurality of laser radar chipsets arranged along the first direction.
- the laser radar chipset includes a plurality of laser radar chips.
- the plurality of laser radar chips in the same laser radar chipset are arranged along the second direction. At least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of one of the laser radar chipsets are staggered along the second direction with at least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of the adjacent laser radar chipset.
- the present invention provides an optical shaping unit for a laser radar, which reduces the size of the light-emitting surface by using the cooperation of a first lens and a second lens, can flexibly control the size of the light-emitting surface, improves the power density of the detection beam emitted by the laser radar, and reduces the laser radar's requirement for the laser power density;
- the first lens and the second lens fold the light path, changing the position of the light-emitting surface, which facilitates the optimization of the layout of other components inside the lidar.
- the present disclosure also includes an embodiment of a laser radar, which utilizes an optical shaping unit to form a reduced light-emitting surface of a transmitting unit, thereby reducing the requirements for the size of the laser light-emitting surface and shaping the detection beam.
- a spectroscopic unit is utilized to simultaneously guide the detection beam and the echo, thereby providing a structural basis for a lens group shared by the transmitting unit and the receiving unit, thereby reducing the number of laser radar components and reducing the size of the laser radar, thereby reducing costs, simplifying the structure, and facilitating mass production.
- the present disclosure also includes another embodiment of a laser radar, which uses a spectroscopic unit to simultaneously guide the detection beam and the echo, and the transmitting unit and the receiving unit are integrated on a circuit board, which can reduce the occupied space, has a simple structure, and is conducive to the installation and field of view alignment of the transmitting unit and the receiving unit, reducing the difficulty of mass production and improving production efficiency.
- the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate and are packaged in a package to form the laser radar chip. Since the light emitting device array and the light receiving device array are sealed in the same chip, based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array on the substrate can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation, etc. on the emission field of view and the receiving field of view during the use of the laser radar.
- the light emitting device array and the light receiving device array share the optical assembly and the scanning device, which can effectively overcome the influence of the optical axis offset of the lens group in the optical assembly, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy between the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
- FIG1 is a schematic structural diagram of an optical shaping unit in one embodiment of the present disclosure.
- FIG2 is a schematic structural diagram of an optical shaping unit in another embodiment of the present disclosure.
- FIG3 is a system block diagram of a laser radar in one embodiment of the present disclosure.
- FIG4 is a schematic diagram of a laser radar including a transceiver optical unit in one embodiment of the present disclosure
- FIG5 is a schematic diagram of a laser radar including an optical shaping unit in one embodiment of the present disclosure
- FIG8 is a schematic diagram of an optical path of a transceiver optical module in one embodiment of the present disclosure.
- FIGS. 9A and 9B are schematic diagrams of structures of transceiver optical modules in different embodiments of the present disclosure.
- FIG10 is a schematic diagram of a cross-sectional structure of an embodiment of a laser radar chip disclosed herein;
- FIG11 is a schematic diagram of a top view of the structure of an embodiment of a laser radar chip disclosed herein;
- FIG12 is a schematic diagram of the optical path structure of a light splitting unit in one embodiment of a laser radar chip disclosed herein;
- FIG13 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in an embodiment of a laser radar chip disclosed herein;
- FIG14 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in another embodiment of the laser radar chip disclosed herein;
- FIG15 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention.
- FIG16 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention.
- FIG17 is a schematic diagram of the optical path structure of a light splitting unit in another embodiment of the laser radar chip disclosed herein;
- FIG18 is a schematic diagram of the structure of an embodiment of a laser radar disclosed herein;
- FIG19 is a schematic diagram of an enlarged structure of a plurality of laser radar chips in the laser radar embodiment shown in FIG18 ;
- FIG20 is a schematic diagram of a top view of the structure of multiple laser radar chips on the circuit board in the laser radar embodiment shown in FIG18 ;
- Figure 21 is a schematic diagram of the top view structure of multiple laser radar chips on a circuit board in another embodiment of the laser radar disclosed in the present invention.
- first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
- the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
- the meaning of “multiple” is two or more, unless otherwise clearly and specifically defined.
- the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them.
- a first feature being “above”, “above” and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
- a first feature being “below”, “below” and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
- each module, unit, module, and component may include one or more physical parts in whole or in part.
- a module, unit, module, or component may include a hardware component that realizes the emission of a light beam, photoelectric conversion, light beam refraction or reflection, and control of light beam transmission or reflection.
- a module, unit, module, or component may include one or more hardware components and one or more software components.
- a module, unit, module, or component may include a processor (for example, a digital signal processor, a microcontroller, a field programmable gate array, a central processing unit, an application-specific integrated circuit, etc.) and a computer program, and when the computer program runs on the processor, the function of the module, unit, module, or component can be realized.
- the computer program may be stored in a memory (for example, a random access memory, a flash memory, a read-only memory, a programmable read-only memory, a register, a hard disk, a removable hard disk, or any other form of storage medium) or a server.
- the optical shaping unit may include multiple optical elements to reflect or refract the light beam so that the light beam changes its propagation direction or converges (or diverges).
- the light-emitting unit may include a light-emitting circuit, a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a distributed feedback laser (DFB), a fiber laser, etc.
- FIG1 shows an optical shaping unit 100 for a laser radar according to an embodiment of the present disclosure, which includes a first lens and a second lens.
- the first lens is used to receive a detection light beam emitted by a light-emitting surface of a transmitting unit of the laser radar.
- the first lens is located in the optical path between the transmitting unit and the second lens.
- the light-emitting surface of the transmitting unit is formed into a reduced light-emitting surface by the first lens and the second lens.
- the size of the (reduced) light-emitting surface after imaging can be flexibly controlled by the first lens and the second lens, thereby improving the power density of the detection light beam emitted by the laser radar and reducing the laser radar's requirement for laser power density.
- the optical axes of the first lens and the second lens are non-parallel, and the light beam emitted by the transmitting unit can be folded by the first lens and the second lens.
- the position of the transmitting unit can be flexibly set, which is convenient for optimizing the arrangement of other components inside the laser radar.
- the optical shaping unit 100 is described in detail below in conjunction with FIG1 .
- an optical shaping unit 100 for a laser radar includes a first lens 110 and a second lens 120 , wherein a transmitting unit (or light transmitting device) 200 of the laser radar is also schematically shown. It has a light-emitting surface (the upper surface of the transmitting unit 200 in the figure), and the detection beam (or referred to as detection light) is emitted by the light-emitting surface.
- the transmitting unit 200 can be, for example, a vertical cavity surface emitting laser VCSEL.
- the first lens 110 is used to receive the detection beam emitted by the transmitting unit 200 of the laser radar.
- the detection beam emitted by the transmitting unit 200 can be directly incident on the first lens 110, or it can be incident on the first lens 110 after being shaped by other optical components (such as a microlens or a microlens array).
- the first lens 110 is disposed in the optical path between the emitting unit 200 and the second lens 120.
- the original size of the light-emitting surface of the emitting unit 200 is set to L 1
- N is less than 1 (also called compression coefficient). Therefore, the size of the light-emitting surface of the emitting unit 200 is compressed, and correspondingly, the power density of the detection light beam emitted by the reduced light-emitting surface 200' is increased to 1/N 2 times of the original power density.
- the size of the light-emitting surface is changed after the light-emitting surface is imaged by the first lens 110 and the second lens 120, so as to form a reduced light-emitting surface 200'.
- the optical axes of the first lens 110 and the second lens 120 in this embodiment are non-parallel.
- the optical axis of the first lens 110 is approximately in the vertical direction in FIG1
- the optical axis of the second lens 120 is approximately in the horizontal direction in FIG1 .
- the angle between the optical axis of the first lens 110 and the optical axis of the second lens 120 may be other angles.
- an optical element for changing the propagation direction of the detection light beam such as a reflective element, a diffraction element or a grating, may be provided between the first lens 110 and the second lens 120 to achieve a non-parallel arrangement of the optical axes of the first lens 110 and the second lens 120.
- the position of the transmitting unit 200 and the reduced light-emitting surface 200' and the size of the reduced light-emitting surface 200' can be changed.
- the size of the reduced light-emitting surface 200' is smaller than the size of the light-emitting surface of the transmitting unit 200, the power density of the detection beam emitted by the reduced light-emitting surface 200' is increased, that is, the power density of the detection beam emitted by the laser radar is increased, which is conducive to improving the distance measurement capability of the laser radar.
- the optical shaping unit 100 allows the position of the optical components such as the splitter unit and the lens group located downstream of the optical path to be adjusted more flexibly, which is convenient for optimizing the arrangement of other components inside the laser radar, which is conducive to reducing the number of laser radar components and reducing the volume of the laser radar, reducing costs, and having a simple structure and facilitating mass production. It will be described in detail below.
- the light-emitting surface of the laser needs to be set to a circle and have a rectangular distribution of divergence angles.
- This laser Optical devices are difficult to realize through engineering methods, and the processing costs are not easy to control. Therefore, in order to reduce the cost of lidar and realize mass production, a laser with a rectangular light-emitting surface can be used in the transmitting unit, and the transmitting unit can be imaged by lens twice to ensure effective matching between the laser's transmitting field of view and the detector's receiving field of view.
- this embodiment proposes to perform two lens imaging on the transmitting unit.
- the first lens 110 and the second lens 120 are both convex lenses, and the focal length of the first lens 110 is greater than the focal length of the second lens 120, and the reduced light-emitting surface 200' is formed on the side of the second lens 120 opposite to the first lens 110, that is, the detection beam emitted by the transmitting unit 200 passes through the first lens 110 and the second lens 120 in sequence, and converges on the other side of the second lens 120.
- the emitting unit 11 includes a laser array composed of a plurality of lasers, and the laser array is arranged on a circuit board 15.
- the laser is, for example, a vertical cavity surface emitting laser VCSEL.
- the VCSEL may be a large-size planar array laser (such as 3mm*5mm) and has light-emitting points arranged in a planar array.
- the large planar array VCSEL can be individually selected and lit in different areas (for example, rows/columns in the planar array VCSEL are individually controlled to light up), thereby forming different light-emitting areas according to actual needs and emitting detection beams.
- the laser radar includes two transmitting units 1, each transmitting unit 1 includes three large-area array VCSELs, and the three VCSELs in the transmitting unit 1 on the left and the three VCSELs in the transmitting unit 1 on the right are interlaced in the vertical direction.
- the six interlaced VCSELs detect different areas of the vertical field of view of the laser radar respectively, and the detection of the entire vertical field of view of the laser radar is achieved through the six interlaced VCSELs.
- the SPAD in the corresponding area of the SAPD array is activated, so that multiple selection areas in the VCSEL and the corresponding multiple activation areas in the SPAD array correspond one by one to form multiple detection channels.
- Each detection channel corresponds to a detection direction, for example, to cover the detection range of the laser radar 10.
- the optical shaping unit 100 and the spectroscopic unit 13 correspond one-to-one to the selection area of the laser and the activation area of the detector, that is, the detection light beam emitted from a selection area of the laser increases its power density after passing through the optical shaping unit 100 and is incident on the spectroscopic unit 13.
- the spectroscopic unit 13 guides the detection light beam to the outside of the laser radar 10. After being reflected by an obstacle, the detection light beam forms an echo, which is guided by the spectroscopic unit 13 to the activation area of the corresponding receiver, completing a detection process.
- the laser radar 10 includes a transmitting unit 11, an optical shaping unit 100, a receiving unit 12, a spectroscopic unit 13 and a data processing unit 14.
- the transmitting unit 11 and the receiving unit 12 are like the transmitting unit and the receiving unit in the aforementioned embodiment, which are respectively used to transmit a detection light beam and receive an echo generated by reflection on an obstacle, and convert them into electrical signals, which will not be repeated here.
- the laser radar 10 in this embodiment uses the optical shaping unit 100 to shape the detection light beam emitted by the light-emitting surface of the transmitting unit 11.
- the optical shaping unit in the aforementioned embodiment can improve the power density of the detection light beam emitted by the laser radar, thereby enabling the transmitting unit 11 and the receiving unit 12 to share the same transceiver optical unit 16.
- the optical shaping unit 100 and the spectroscopic unit 13 cooperate with each other, so that the transmitting unit 11 and the receiving unit 12 can use the same lens, simplifying the structure of optical components in the laser radar 10.
- the optical shaping unit 100 can also be used to change the optical path of the detection light beam, and can adjust the setting position of the transmitting unit 11, which helps to optimize the internal structural layout of the laser radar 10.
- the transmitting unit 11 and the receiving unit 12 can be set in the same circuit.
- the transmitting unit 11 may also be disposed at other appropriate positions inside the laser radar 10 , thereby increasing the flexibility of the arrangement of components inside the laser radar 10 .
- a transceiver optical module includes an optical shaping unit 100 and a spectroscopic unit 13.
- a transceiver optical module corresponds to a laser and a detector, that is, a laser, an optical shaping unit 100, a spectroscopic unit 13 and a detector constitute a detection channel, and the laser radar includes multiple detection channels to meet the requirements of the detection range.
- a transceiver optical module corresponds to multiple detection channels at the same time, for example, a transceiver optical module covers a group of laser arrays including multiple lasers and a group of detector arrays including multiple detectors, a group of laser arrays corresponds to an optical shaping unit 100, and a group of detector arrays corresponds to a spectroscopic unit 13, which together constitute multiple detection channels.
- the transmitting unit 11 includes a planar array VCSEL having multiple individually selectable light-emitting areas, each selected light-emitting area can emit a detection light beam
- the receiving unit 12 includes a SPAD array, each SPAD can be individually selected and activated
- a transceiver optical module corresponds to a selected area in the planar array VCSEL and an activated area in the SPAD array
- a selected area of the laser corresponds to an optical shaping unit 100
- an activated area of the detector corresponds to a spectroscopic unit 13, which together constitute multiple detection channels.
- FIG8 shows an embodiment of a transceiver optical module 30 that can be used for a laser radar, wherein the transceiver optical module 30 includes an optical shaping unit 31 and a spectroscopic unit 32.
- the optical shaping unit 31 and the spectroscopic unit 32 can be structures as described in the above embodiments, and the optical shaping unit 31 is configured to receive a detection beam emitted by a transmitting unit 1 of the laser radar and emit the detection beam to the spectroscopic unit 32.
- the optical shaping unit 31 can also form a reduced light-emitting surface of the transmitting unit 1 to improve the power density of the detection beam emitted by the laser radar.
- the optical shaping unit 31 in this embodiment can be the optical shaping unit 100 in the above embodiments.
- the spectroscopic unit 32 is configured to receive the detection beam from the optical shaping unit 31 and guide the detection beam to the outside of the laser radar, and the spectroscopic unit 32 also receives the echo and guides the echo to the receiving unit 2 of the laser radar.
- the spectroscopic unit 32 can take the form of any one or more spectroscopic units 32 provided in the aforementioned embodiments.
- the optical shaping unit 31 corresponds to the laser or the laser gating area in the transmitting unit 1 of the laser radar, and the spectroscopic unit 32 is also set to correspond to the detector or the activation area of the detector in the receiving unit 2 of the laser radar.
- an optical shaping unit 31 corresponds to a group of multiple lasers or multiple gating areas of a laser in the transmitting unit 1 of the laser radar, and a spectroscopic unit 32 corresponds to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2 of the laser radar.
- a group of multiple lasers in the transmitting unit 1 are arranged in strips, and the light incident surface in the optical shaping unit 31 can also be set as a continuous surface to cover the corresponding multiple lasers or multiple gating areas of a laser.
- the light exit surface of the optical shaping unit 31 can also be set as a continuous surface, and the spectroscopic unit 32 can also be set as a strip to correspond to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2.
- the spectroscopic unit 32 can be set as a whole or a combination of multiple split structures.
- the transmitting unit 1 includes multiple groups of laser arrays arranged on a circuit board, each group of laser arrays includes multiple lasers, and similarly, the receiving unit 2 includes multiple groups of detector arrays arranged on a circuit board, each group of detector arrays includes multiple detectors.
- the optical shaping unit 31 and the light splitting unit 32 also have multiple, and a transceiver optical module 30 includes an optical shaping unit 31 and a light splitting unit 32, One transceiver optical module 30 corresponds to a group of laser arrays and a group of detector arrays. That is, in this embodiment, one optical shaping unit 31 and its corresponding light splitting unit 32, a group of laser arrays and a group of detector arrays form a detection channel.
- each transceiver optical module includes an optical shaping unit 31 and a light splitting unit 32 ) are shown, and the two transceiver optical modules 30 are staggered.
- the laser of the transmitting unit 11 and the detector of the receiving unit 12 and the corresponding optical shaping unit 100 and the spectroscopic unit 13 can be packaged together, and the packaged structure is set as a whole on the circuit board 15.
- the laser of the transmitting unit 11 and the detector of the receiving unit 12 can also be set on the circuit board 15 respectively, and positioned and installed, and the optical shaping unit 100 and the spectroscopic unit 13 are set at a preset position, so that the transceiver optical module corresponds to the laser and the detector.
- the laser of the transmitting unit 11 and the detector of the receiving unit 12 are first set at different positions of the circuit board 15, and then the optical shaping unit 100 and the spectroscopic unit 13 are installed at positions corresponding to the laser of the transmitting unit 11 and the detector of the receiving unit 13.
- the present disclosure provides a laser radar chip, including: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices; a package body, the package body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
- the light emitting device array and the light receiving device array are sealed in the same chip.
- the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the light splitting unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
- the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.
- FIG10 there is shown a schematic cross-sectional structure diagram of an embodiment of a laser radar chip disclosed herein.
- the laser radar chip includes: a substrate 300; a light emitting device array 310 (the light emitting device may be, for example, the emitting unit 11 in the laser radar 10 in the aforementioned embodiment), the light emitting device array 310 being located on the substrate 300; a light receiving device array 320 (the light receiving device array 320 may be, for example, the receiving unit 12 in the laser radar 10 in the aforementioned embodiment), the light receiving device array 320 being located on one side of the substrate 300 of the light emitting device array 310 on; a spectroscopic unit 330, wherein the spectroscopic unit 330 is configured to transmit the detection light 301 generated by the light emitting device array 310 (the spectroscopic unit 330 in this embodiment may, for example, include the spectroscopic unit 13 in the laser radar 10 in the aforementioned embodiment, and in other embodiments of the present disclosure, the spectroscopic unit 330 may also include other optical elements, such as the optical shaping unit in the aforementioned embodiment, which will be specifically described in subsequent embodiments); the
- optical paths of the detection light 301 and the echo light 302 shown in FIG10 are only an example, and the present disclosure does not limit this.
- the light emitting device array 310 and the light receiving device array 320 are sealed in the same chip. Based on the chip packaging process, the mounting accuracy of the light emitting device array 310 and the light receiving device array 320 on the substrate can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of each channel laser and the receiving field of view of the detector; and the light emitting device array 310, the light receiving device array 320 and the spectrometer unit 330 are all located on the same substrate 300, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
- the scheme disclosed in the present invention can effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is beneficial to reducing the cost of the laser radar, improving the reliability of the laser radar, and realizing high-line-count laser radar.
- the substrate 300 is used to carry the devices disposed thereon, and is also used to realize electrical connection between the devices and external circuits and circuit boards.
- the substrate 300 has a conductive structure, and the conductive structure is used to achieve electrical connection.
- the light emitting device array 310 is located on one surface of the substrate 300 to generate detection light 301.
- the light receiving device array 320 is located on the substrate 300 at one side of the light emitting device array 310 to receive echo light 302.
- the light emitting device array 310 and the light receiving device array 320 are located between the light emitting device driving module 312 and the light receiving device driving module 322. As shown in FIG10 and FIG11 , the light emitting device array 310 and the light receiving device array 320 are arranged in parallel on the surface of the substrate 300; the light emitting device driving module 312 is located on the side of the light emitting device array 310 away from the light receiving device array 320; the light receiving device driving module 322 is located on the side of the light receiving device array 320 away from the light emitting device array 310, that is, the light emitting device driving module 312, the light emitting device array 310, the light receiving device array 320 and the light receiving device driving module 322 are arranged on the surface of the substrate 300 in sequence.
- electrical connection between devices is achieved by means of bonding wires. Specifically, electrical connection is achieved between the light emitting device array 310 and the light emitting device driver module 312, between the light emitting device driver module 312 and the substrate 300, between the light receiving device array 320 and the light receiving device driver module 322, and between the light receiving device driver module 322 and the substrate 300 by means of bonding wires.
- the multiple lasers 311 of the light emitting device array 310, the multiple detectors 321 of the light receiving device array 320, and the light emitting device driving module 312 and the light receiving device driving module 322 are respectively mounted on the surface of the substrate 300; then, the pads of the multiple lasers 311 and the light emitting device driving module 312 and the pads (bonding pads) of the multiple detectors 121 and the light receiving device driving module 322 are respectively connected through bonding wires; similarly, the light emitting device driving module 312 and the substrate 300, and the light receiving device driving module 322 and the substrate 300 are respectively connected through bonding wires.
- the light emitting surface of the light emitting device array 310 is arranged to face away from the substrate 300, and the photosensitive surface of the light receiving device array 320 is also arranged to face away from the substrate 300; the detection light 301 generated by the light emitting device array 310 is emitted from the light emitting surface along a direction A facing away from the substrate 300, and the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the photosensitive surface along a direction toward the substrate 300; the spectroscopic unit 330 is located at a distance between the light emitting device array 310 and the light receiving device array 320, away from the substrate 300.
- the laser radar chip further includes: a light-transmitting adhesive portion 350, wherein the light-transmitting adhesive portion 350 is located on the side of the spectroscopic unit 330 facing the substrate 300; the spectroscopic unit 330 is fixedly connected to the light receiving device array 320 and the light emitting device array 310 via the light-transmitting adhesive portion 350.
- the light-transmitting adhesive portion 350 is located between the light receiving device array 320 and the light emitting device array 310 to achieve fixed connection between the light splitting unit 330, the light receiving device array 320 and the light emitting device array 310.
- the material of the light-transmitting adhesive portion 350 can be a light-transmitting adhesive material.
- the spectroscopic unit 330 includes: a spectroscopic element 331 (the spectroscopic element 331 can be, for example, the spectroscopic unit 13 in the laser radar 10 in the embodiment shown in the aforementioned FIG. 1 to FIG. 7D ), the spectroscopic element 331 is configured to separate the optical path of the detection light 301 (indicated by the white arrow in FIG. 12 ) from the optical path of the echo light 302 (indicated by the black arrow in FIG.
- the optical path of the detection light 301 between the light emitting device array 310 and the spectroscopic element 331 is separated from the optical path of the echo light 302 between the light receiving device array 320 and the spectroscopic element 331, and the spectroscopic element 331 is a polarization spectrometer.
- the spectroscopic element 331 can also be a polarization spectroscopic prism (FIG. 7A), polarizer spectroscopic (FIG. 7B), pinhole spectroscopic (FIG. 7C), local reflector spectroscopic (FIG. 7D), and other different methods.
- the detection light 301 is emitted from the light emitting device array 310 along a direction perpendicular to the surface of the substrate 300; the echo light 302 is incident on the light receiving device array 320 along a direction perpendicular to the surface of the substrate 300;
- the spectrometer unit 330 also includes: a light deflection element 332 (for example, it can be the reflection part 130 in the aforementioned embodiment), the light deflection element 332 is located in the optical path of the detection light 301, and the light deflection element 332 is configured to deflect the detection light 301 to the spectrometer element 331.
- the light deflection element 332 is located on one side of the light splitting element 331, and the light deflection element 332 is used to deflect the detection light 301, so that the optical path of the detection light 301 and the optical path of the echo light 302 are partially parallel, specifically, the optical path of the detection light 301 between the light emitting device array 310 and the light deflection element 332 is parallel to the optical path of the echo light 302 between the light receiving device array 320 and the light splitting element 331, and the detection light 301 and the echo light 302 are both perpendicular to the surface of the substrate 300, so that the multiple lasers 311 in the light emitting device array 310 and the multiple detectors 321 in the light receiving device array 320 are arranged on the substrate 300 and are located on the same side of the light splitting element 330.
- the light deflection element 332 is a prism.
- the detection light 301 incident on the optical deflection element 332 is totally reflected on the surface 332a to be projected onto the spectroscopic element 331; the spectroscopic element 331 folds the detection light 301 again to achieve the emission of the detection light 301; the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the spectroscopic element 331 along an optical path coaxial with the emitted detection light 301, and the echo light 302 directly transmits the spectroscopic element 331 and is projected onto the optical receiving device array 320 to achieve detection.
- the light deflection element 332 is located in the optical path of the detection light 301 to deflect the detection light 301, so the position of the light deflection element 332 corresponds to the position of the plurality of lasers 311 in the light emitting device array 310.
- the light deflection element 332 is located in the The optical element 331 is located above the laser 311 in the optical emitting device array 310; the echo light 302 directly transmits the spectroscopic element 331, that is, the optical path direction of the echo light 302 does not change, so the position of the spectroscopic element 331 corresponds to the position of the detector 321 of the optical receiving device array 320.
- the spectroscopic element 331 is located above the detector 321 of the optical receiving device array 320.
- the spectroscopic element 331 deflects part of the detection light 301 to achieve the emission of the detection light 301; a light absorbing layer is provided on the surface of the spectroscopic element 331 facing away from the light deflection element 332 to absorb the detection light 301 transmitting the spectroscopic element 331.
- the spectroscopic unit 330 further includes: a focusing element (the focusing element may be, for example, the first lens 110 and/or the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the focusing element being located in the optical path of the detection light 301 and suitable for adjusting the focal length, and the focusing element being configured so that the light emitting device array 310 and the light receiving device array 320 are both disposed on the substrate 300 .
- a focusing element the focusing element may be, for example, the first lens 110 and/or the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment
- the focusing element being located in the optical path of the detection light 301 and suitable for adjusting the focal length
- the focusing element being configured so that the light emitting device array 310 and the light receiving device array 320 are both disposed on the substrate 300 .
- the focal length of the optical system in the optical path of the detection light 301 is changed (specifically extended), so that the focal length of the optical system in the optical path of the detection light 301 (specifically the focal length of the optical system including a common lens group and a focusing element) is different from the focal length of the optical system in the optical path of the echo light 302, and then the focal length is reasonably adjusted through the focusing element, so that the light emitting device array 310 and the light receiving device array 320 are both arranged on the substrate 300.
- the focusing element includes: a first lens 333a (the first lens 333a may be, for example, the first lens 110 in the optical shaping unit 100 in the aforementioned embodiment), the first lens 333a being located upstream of the light deflection element 332 in the optical path of the detection light 301 to transmit the detection light 301 to be incident on the light deflection element 332; a second lens 333b (the second lens 333b may be, for example, the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the second lens 333b being located downstream of the light deflection element 332 in the optical path of the detection light 301, and the detection light 301 deflected by the light deflection element 332 is transmitted through the second lens 333b and then incident on the beam splitting element 331.
- a first lens 333a may be, for example, the first lens 110 in the optical shaping unit 100 in the aforementioned embodiment
- the first lens 333a being located upstream of the light deflection element 332 in the optical path of
- the first lens 333a is a gradient refractive index lens
- the second lens 333b is a gradient refractive index lens.
- a gradient refractive index lens also known as a self-focusing lens, is a cylindrical optical lens whose internal material refractive index distribution gradually changes along the radial direction. Therefore, in some embodiments shown in FIG. 12, in a gradient refractive index lens, the surfaces on which the light beams are incident and emergent are both planes.
- the spectroscopic element 330 is in a combined form, that is, the first lens 333a and the second lens 333b are both gradient refractive index lenses, and the first lens 333a, the light deflection element 332, the second lens 333b and the spectroscopic element 331 are integrally formed.
- the package body 340 is suitable for packaging all components within the laser radar chip to achieve encapsulation, placement, fixation and protection of each component.
- the material of the package body 340 may be a light-proof adhesive. Specifically, in some embodiments as shown in FIG. 10 , the material of the package body 340 may be a polymer.
- the package body 340 may be formed by a T-Mo l d or C-Mo l d process to achieve overall packaging.
- the package body 340 is located on the substrate 300 and covers all components on the substrate 300. As shown in FIG10 , the package body 340 is filled between the light emitting device array 310, the light receiving device array 320, the light splitting unit 330, the light emitting device driving module 312 and the light receiving device driving module 322, and covers their respective surfaces.
- the packaging body 340 encapsulates the light emitting device array 310, the light receiving device array 320, the spectrometer unit 330, the light emitting device driving module 312 and the light receiving device driving module 322; in order to ensure the transmission of the detection light 301 and the echo light 302, the packaging body 340 does not cover the surface of the spectrometer unit 330 used to transmit the detection light 301 and the echo light 302.
- the light emitting device array 310 and the light receiving device array 320 are set on the same substrate 300, and the patch accuracy of the light emitting device array 310 and the light receiving device array 320 is controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; the package body 340 fills the space between the components to fix the distance between the components, and the laser radar chip is used as a whole, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
- the light emitting device array 310 and the light receiving device array 320 are both arranged in a linear array.
- the plurality of lasers (not shown in the figure) of the light emitting device array 410 are arranged in a single row on the surface of a substrate (not shown in the figure), and the light emitting device array 410 is arranged in a linear array; the light emitting device driving modules 412 are located on both sides of the light emitting device array 410, and the light emitting device driving modules 412 on both sides are electrically connected to the two sides of the light emitting device array 410, respectively.
- the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers of the light emitting device array 410 shown in FIG13. Only the arrangement and gating method of the light receiving device driving module and the light emitting device driving module 412 are different.
- the multiple lasers of the light emitting device array and the multiple detectors of the light receiving device array may also be arranged in a planar array.
- the multiple lasers 511 of the light emitting device array 510 constitute a plurality of emitter groups arranged along a first direction X, and each emitter group includes a plurality of lasers 511 arranged along a second direction Y; in the second direction Y, each laser 511 of an emitter group is respectively located between two lasers 511 of adjacent emitter groups.
- the arrangement of the two emitter groups in the array of light emitting devices arranged in a planar array in FIG14 along the first direction X is only an example.
- a larger number of emitter groups may be arranged along the first direction X, and the lasers of adjacent emitter groups along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser of an emitter group is located between two lasers of adjacent emitter groups.
- the two emitter groups in the light emitting device array shown in FIG. 14 and the arrangement of more emitter groups in other embodiments in an interlaced manner to form an irregular matrix are only examples.
- multiple emitter groups in the light emitting device array arranged in a planar array may also be regularly arranged to form a regular matrix.
- the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers 511 of the light emitting device array 510 shown in FIG. 14. The only difference is the arrangement and gating of the light receiving device driving module and the light emitting device driving module 512.
- the multiple detectors of the light receiving device array constitute multiple receiver groups arranged along the first direction X, and each receiver group includes multiple receivers arranged along the second direction X. Detectors arranged in direction Y; in the second direction Y, each detector of a receiver group is located between two detectors of adjacent receiver groups.
- a light emitting device array 310, a light receiving device array 320, a light emitting device driving module 312, and a light receiving device driving module 322 are arranged in a flat structure on a substrate 300.
- the light emitting device array and the light emitting device driving module and the light receiving device array and the light receiving device driving module may also be arranged in a stacked structure.
- the light emitting device driving module 612 and the light emitting device array 610 are stacked sequentially on the surface of the substrate 600 ; the light receiving device driving module 622 and the light receiving device array 620 are stacked sequentially on the surface of the substrate 600 .
- electrical connection between components is achieved through contacting bonding surfaces.
- electrical connection can be achieved between the light emitting device driver module 612 and the light emitting device array 610, between the light emitting device driver module 612 and the substrate 600, between the light receiving device driver module 622 and the light receiving device array 620, and between the light receiving device driver module 622 and the substrate 600 by means of insulating bonding or metal bonding.
- FIG16 there is shown a schematic cross-sectional structure diagram of another embodiment of the laser radar chip disclosed herein.
- the light emitting device array and the light receiving device array are located on both sides of the light emitting device driving module and the light receiving device driving module to increase the distance between the laser of the light emitting device array and the detector of the light receiving device array, thereby reducing the difficulty of chip manufacturing process.
- the light emitting device driving module 712 and the light receiving device driving module 722 are located between the light emitting device array 710 and the light receiving device array 720 .
- the light emitting device array 710 and the light receiving device array 720 are arranged in parallel on the surface of the substrate 700; the light emitting device driving module 712 is located on the side of the light emitting device array 710 close to the light receiving device array 720; the light receiving device driving module 722 is located on the side of the light receiving device array 720 close to the light emitting device array 710, that is, the light emitting device array 710, the light emitting device driving module 712, the light receiving device driving module 722 and the light receiving device array 720 are arranged in sequence on the surface of the substrate 700.
- electrical connection between devices is achieved by bonding wires.
- the light emitting device array 710 and the light emitting device driving module 712 are both provided with bonding wires to achieve electrical connection with the substrate 700; the light receiving device array 720 and the light receiving device driving module 722 are both provided with bonding wires to achieve electrical connection with the substrate 700.
- the light emitting device array 710, the light receiving device array 720, the light emitting device driving module 712, and the light receiving device driving module 722 are respectively mounted on the surface of the substrate 700; then, the bonding pads of the laser, the detector, the light emitting device driving module 712, and the light receiving device driving module 722 are connected to the substrate 700 using bonding wires formed by an ultra-low wire arc bonding (bonding wire low arc bonding) process.
- the laser of the light emitting device array 310 is electrically connected to the light emitting device driving module 312, and then electrically connected to the substrate 300 through the light emitting device driving module 312.
- the laser of the light emitting device array 710 is directly electrically connected to the substrate 700 through a bonding wire.
- the light splitting unit is in a split form.
- the first lens 733 a and the second lens 733 b are convex lenses; the first lens 733 a , the light deflection element 732 and the second lens 733 b are integrally formed and separated from the light splitting element 731 .
- the present disclosure also provides a laser radar.
- the laser radar includes: a laser radar chip 810, an optical component 820, and a scanning device 830, wherein the laser radar chip 810 includes: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form an echo light 302; the spectroscopic unit is also configured to transmit the echo light 302 to the array of light receiving devices; a package body, the package body is located on the substrate and packages the light
- the optical component 820 transmits the detection light emitted by the laser radar chip 810, and the detection light transmitted by the optical component 820 is reflected by the scanning device 830 and then emitted from the laser radar (the
- the laser radar chip includes: a substrate 300; a light emitting device array 310, the light emitting device array 310 is located on the substrate 300; a light receiving device array 320, the light receiving device array 320 is located on the substrate 300 on one side of the light emitting device array 310; a spectroscopic unit 330, the spectroscopic unit 330 is configured to transmit the detection light generated by the light emitting device array 310; the detection light is reflected by the target to form echo light 302; the spectroscopic unit 330 is also configured to transmit the echo light 302 to the light receiving device array 320; a package body 340, the package body 340 is located on the substrate 300 and encapsulates the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330.
- the laser radar chip 810 is the laser radar chip disclosed in the present invention. Therefore, the specific technical solution of the laser radar chip 810 refers to the specific embodiment of the aforementioned laser radar chip, and the present invention will not repeat it here.
- the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330 are all located on the same substrate 300 and are packaged in a package body 340 to form the laser radar chip 810.
- the laser radar chip 810 is used as a whole, which can effectively reduce the impact of the assembly process on the optical path between the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330, effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing a high-line-count laser radar.
- the laser radar further includes: a circuit board 811, and the circuit board 811 is electrically connected to the laser radar chip 810.
- the laser radar chip 810 is fixed to the surface of the circuit board 811 and electrically connected to the circuit board 811. Specifically, the laser radar chip 810 is electrically connected to the circuit board 811 through a solder ball 812 (as shown in FIG. 10 ).
- the laser radar includes a plurality of the laser radar chips 810 ; the plurality of the laser radar chips 810 are fixed and electrically connected to the same circuit board 811 .
- FIG20 a schematic diagram of the top view structure of multiple laser radar chips 810 on the circuit board 811 in the laser radar embodiment shown in FIG18 is shown.
- the laser radar includes: a plurality of laser radar chipsets 813, the plurality of laser radar chipsets 813 are arranged along a first direction X, the laser radar chipset 813 includes a plurality of laser radar chips 810, and the plurality of laser radar chips 810 in the same laser radar chipset 813 are arranged along the second direction Y.
- the plurality of laser radar chips 810 of a laser radar chipset and the plurality of laser radar chips 810 of an adjacent laser radar chipset are arranged alternately along the second direction Y. As shown in FIG.
- the laser radar includes: a laser radar chipset 813a and a laser radar chipset 813b, the laser radar chipset 813a and the laser radar chipset 813b are arranged adjacent to each other along the first direction X, that is, no other laser radar chips are arranged between the laser radar chipset 813a and the laser radar chipset 813b.
- the multiple laser radar chips of the laser radar chips group can also be arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction, that is, the multiple laser radar chips of one laser radar chips group are arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction Y.
- the multiple laser radar chips 810 of the laser radar chips group 813a and the multiple laser radar chips 810 of the laser radar chips group 813b are staggered along the second direction Y, that is, along the second direction Y, the laser radar chip 810 of the laser radar chips group 813a is located between two adjacent laser radar chips 810 of the laser radar chips group 813b, and each laser radar chip 810 of the laser radar chips group 813b is located between two adjacent laser radar chips 810 of the laser radar chips group 813a.
- the arrangement of the two laser radar chipsets in FIG. 20 along the first direction X is only an example. In other embodiments of the present disclosure, a larger number of laser radar chipsets may be arranged along the first direction X. And the laser radar chips of adjacent laser radar chipsets along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser radar chip of one laser radar chipset is located between two laser radar chips of adjacent laser radar chipsets.
- each laser radar chip 810 has 32 lasers, and the light receiving device array has 32 detectors, that is, each laser radar chip 810 has 32 channels.
- Eight laser radar chips 810 constitute 256 channels. Under the premise of ensuring that 256 channels are set on the circuit board, the arrangement shown in FIG. 20 can effectively reduce the size of the circuit board.
- the laser radar is a vehicle-mounted laser radar.
- the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, and the circuit board is arranged vertically to the horizontal plane; the arrangement shown in FIG20 can effectively reduce the height of the laser radar.
- the laser radar further includes: an optical component 820 and a scanning device 830 for transmitting and receiving the detection light and the echo light.
- the detection light emitted by the laser radar chip 810 is transmitted to the scanning device 830 by the optical component 820, and the scanning device 830 reflects the detection light to realize the emission of the detection light; the echo light formed by the reflection of the detection light by the target 840 is received by the scanning device 830, and the scanning device 830 reflects the echo light to the optical component 820, and the echo light is transmitted to the laser radar chip 810 via the optical component 820.
- multiple laser radar chips 810 share an optical component 820 and a scanning device 830.
- the light emitting device array 310 and the light receiving device array 320 share an optical component 820 and a scanning device 830, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the transmitting field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present disclosure can effectively improve the alignment accuracy of the transmitting field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
- a plurality of the laser radar chips 810 share one optical component 820 and one scanning device 830.
- the present disclosure does not limit the number of optical components 820 and scanning devices 830 included in the laser radar.
- the scanning device 830 causes the detection light to scan along the first direction X; the plurality of laser radar chips 810 are arranged in an array along the second direction Y, and the second direction Y is perpendicular to the first direction X.
- the laser radar is a vehicle-mounted laser radar, and the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, the first direction X is parallel to the horizontal plane, and the second direction Y is perpendicular to the horizontal plane.
- the first direction X is the scanning direction of the scanning device 830
- the second direction is the arrangement direction of the plurality of laser radar chips 810.
- the selection of the first direction X and the second direction Y is related to the field of view of the laser radar, that is, when the field of view of the laser radar changes, the scanning direction of the scanning device 830 and the arrangement direction of the plurality of laser radar chips 810 will also change accordingly.
- the present disclosure does not limit the scanning direction of the scanning device and the arrangement direction of the plurality of laser radar chips.
- the plurality of laser radar chips of a laser radar chips group and the plurality of laser radar chips of an adjacent laser radar chips group are staggered along the second direction Y.
- the plurality of laser radar chips groups may also be arranged in other ways, such as arranging more laser radar chips groups along the first direction X, or arranging the plurality of laser radar chips 810 in a row along the second direction, or arranging the plurality of laser radar chips 810 in the same way as the arrangement of the plurality of lasers.
- At least a portion of the lasers in the light emitting device array of the lidar chip of one lidar chips group are staggered along the second direction Y with at least a portion of the lasers in the light emitting device array of the lidar chip of an adjacent lidar chips group.
- At least a portion of the detectors in the light receiving device array of the laser radar chip of one laser radar chips group are staggered along the second direction Y with at least a portion of the detectors in the light receiving device array of the laser radar chip of an adjacent laser radar chips group.
- the laser radar includes: a first laser radar chipset and a second laser radar chipset, the first laser radar chipset and the second laser radar chipset are adjacently arranged along a first direction, that is, no other laser radar chip is arranged between the first laser radar chipset and the second laser radar chipset.
- At least part of the lasers in the multiple laser radar chips 910a of the first laser radar chipset and at least part of the lasers in the multiple laser radar chips 910b of the second laser radar chipset are arranged along the first The two directions Y are staggered, that is, along the second direction Y, each laser of the laser radar chip 910a in the first laser radar chipset is located between two adjacent lasers of the adjacent laser radar chip 910b in the second laser radar chipset.
- the center line 911b of the laser of the laser radar chip 910b in the second laser radar chipset along the second direction Y is located between the center line 911a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y and the center line 912a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y.
- the arrangement of the multiple detectors in the light receiving device array of the laser radar can refer to the arrangement of the multiple lasers in the light emitting device array shown in Figure 21. It’s just that the arrangement and gating method of the light receiving device driver module are different from that of the light emitting device driver module. Specifically, at least part of the detectors in the multiple laser radar chips of the first laser radar chips group and at least part of the detectors in the multiple laser radar chips of the second laser radar chips group are staggered along the second direction Y, that is, along the second direction, the detector of the laser radar chip in the first laser radar chips group is located between two adjacent detectors of the laser radar chips in the second laser radar chips group.
- the light emitting device array and the light receiving device array are sealed in the same chip.
- the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
- the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.
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Abstract
Description
本公开涉及激光雷达领域,尤其是一种用于激光雷达的光学整形单元、激光雷达芯片、激光雷达及用于激光雷达的收发光学模组。The present disclosure relates to the field of laser radar, and in particular to an optical shaping unit for laser radar, a laser radar chip, a laser radar, and a transceiver optical module for laser radar.
激光雷达是以发射激光束来探测目标的位置、速度等特征量的雷达系统,是一种将激光技术与光电探测技术相结合的先进探测方式。激光雷达因其分辨率高、隐蔽性好、抗有源干扰能力强、低空探测性能好、体积小及重量轻等优势,被广泛应用于自动驾驶、交通通讯、无人机、智能机器人、资源勘探等领域。LiDAR is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of a target. It is an advanced detection method that combines laser technology with photoelectric detection technology. LiDAR is widely used in autonomous driving, transportation communications, drones, intelligent robots, resource exploration and other fields due to its advantages such as high resolution, good concealment, strong anti-active interference ability, good low-altitude detection performance, small size and light weight.
激光雷达通过发射单元发射探测光束,通过接收单元接收目标物体反射的回波,根据回波的信号计算获得目标物体相对于激光雷达的位置和距离。受到发射单元和接收单元的数量,以及透镜组和分光结构的配合等因素影响,激光雷达中光学零部件数量众多,结构复杂,布置难度大,导致激光雷达的尺寸无法进一步缩小,限制了激光雷达的小型化发展和在小型设备上的应用,同时传统结构导致激光雷达的生产成本过高,不利于激光雷达的大规模生产和应用,因此有必要对激光雷达进行改进。The laser radar transmits a detection beam through the transmitting unit, receives the echo reflected by the target object through the receiving unit, and calculates the position and distance of the target object relative to the laser radar based on the echo signal. Affected by the number of transmitting units and receiving units, as well as the coordination of lens groups and spectroscopic structures, the laser radar has a large number of optical components, a complex structure, and is difficult to arrange, which makes it impossible to further reduce the size of the laser radar, limiting the miniaturization of the laser radar and its application in small devices. At the same time, the traditional structure makes the production cost of the laser radar too high, which is not conducive to the large-scale production and application of the laser radar. Therefore, it is necessary to improve the laser radar.
另外,激光雷达中,发射视场和接收视场之间的高精度对准,直接影响了激光雷达的测远能力、测距精度等重要性能。目前,激光雷达存在发射视场和接收视场难以保证对准的问题,主要因为生产制程、温度变化、机械形变等因素导致发射视场和接收视场会发生偏移,无法重合。In addition, in LiDAR, the high-precision alignment between the transmitting field of view and the receiving field of view directly affects the important performance of LiDAR, such as the distance measurement capability and ranging accuracy. At present, LiDAR has the problem of difficulty in ensuring the alignment of the transmitting field of view and the receiving field of view, mainly because the production process, temperature changes, mechanical deformation and other factors cause the transmitting field of view and the receiving field of view to offset and cannot overlap.
为了解决上述收发视场偏移问题,目前采用的方法之一是基于接收端面阵感光器件的电子光阑技术。通过这种技术可以动态调整接收视场,从而使接收视场始终保持和发射视场相重合。而且现有技术中为了解决收发视场偏移问题,往往需要设置更大的接收视场,以保证即使发射视场和接收视场之间发生了偏移,光斑依旧位于接收视场内,从而避免激光雷达的测远性能明显劣化。因此更好的实现发射视场和接收视场之间的对准,能够有效提高激光雷达的性能。In order to solve the above-mentioned problem of the offset of the transmitting and receiving fields of view, one of the methods currently used is the electronic aperture technology based on the receiving end array photosensitive device. Through this technology, the receiving field of view can be dynamically adjusted so that the receiving field of view always coincides with the transmitting field of view. Moreover, in order to solve the problem of the offset of the transmitting and receiving fields of view in the prior art, it is often necessary to set a larger receiving field of view to ensure that even if there is an offset between the transmitting field of view and the receiving field of view, the light spot is still located in the receiving field of view, thereby avoiding a significant degradation of the laser radar's far-sighted performance. Therefore, better alignment between the transmitting field of view and the receiving field of view can effectively improve the performance of the laser radar.
背景技术部分的内容仅仅是发明人所知晓的技术,并不当然代表本领域的现有技术。The contents of the background technology section are merely the technologies known to the inventors and do not necessarily represent the prior art in the field.
发明内容Summary of the invention
针对现有技术中的一个或多个缺陷,本公开提供一种用于激光雷达的光学整形单元,包括第一透镜和第二透镜。第一透镜,用于接收所述激光雷达的发射单元发射的探测光束,所述发射单元具有发光面,所述探测光束由所述发光面发射。第二透镜,其中所述第一透镜位于所述发射单元与所述第二透镜之间的光路中,所述第一透镜和所述第二透镜配置成将所述发射单元的发光面形成缩小的发光面。其中所述第一透镜和所述第二透镜的光轴为非平行的。 In view of one or more defects in the prior art, the present disclosure provides an optical shaping unit for a laser radar, comprising a first lens and a second lens. The first lens is used to receive a detection beam emitted by a transmitting unit of the laser radar, the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface. The second lens, wherein the first lens is located in the optical path between the transmitting unit and the second lens, and the first lens and the second lens are configured to form a reduced light-emitting surface of the light-emitting surface of the transmitting unit. The optical axes of the first lens and the second lens are non-parallel.
可选的,所述第一透镜和所述第二透镜均为凸透镜。所述第一透镜的焦距大于所述第二透镜的焦距。所述缩小的发光面形成在所述第二透镜的与所述第一透镜相反的一侧。Optionally, the first lens and the second lens are both convex lenses. The focal length of the first lens is greater than the focal length of the second lens. The reduced light-emitting surface is formed on a side of the second lens opposite to the first lens.
可选的,所述第一透镜和所述第二透镜之间的光学间距为所述第一透镜的焦距与所述第二透镜的焦距之和。Optionally, the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
可选的,所述光学整形单元还包括反射部,所述反射部设置在所述第一透镜和所述第二透镜之间。所述反射部配置成从所述第一透镜接收所述探测光束,并将所述探测光束反射到所述第二透镜。Optionally, the optical shaping unit further includes a reflecting portion, which is disposed between the first lens and the second lens. The reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
可选的,所述第一透镜、所述第二透镜和所述反射部一体成型。或者所述第一透镜、所述第二透镜和所述反射部分体成型。所述第一透镜和所述第二透镜的光轴垂直。所述反射部与所述第一透镜的光轴之间的夹角呈45°角,所述反射部和所述第二透镜的光轴之间的夹角呈45°角。Optionally, the first lens, the second lens and the reflective portion are integrally formed. Alternatively, the first lens, the second lens and the reflective portion are separately formed. The optical axes of the first lens and the second lens are perpendicular. The angle between the reflective portion and the optical axis of the first lens is 45°, and the angle between the reflective portion and the optical axis of the second lens is 45°.
可选的,所述第一透镜和所述第二透镜的焦距的比例根据所述缩小的发光面的大小确定,所述光学整形单元配置成提高从所述激光雷达发射的探测光束的功率密度。Optionally, the ratio of the focal lengths of the first lens and the second lens is determined according to the size of the reduced light-emitting surface, and the optical shaping unit is configured to increase the power density of the detection beam emitted from the laser radar.
本公开还提供一种激光雷达,包括发射单元、光学整形单元、接收单元、分光单元和数据处理单元。所述发射单元配置成发射探测光束,所述发射单元具有发光面,所述探测光束由所述发光面发射。所述光学整形单元配置成将所述发射单元的发光面形成缩小的发光面,所述光学整形单元设置在所述发射单元与分光单元之间的光路中。所述接收单元配置成接收所述探测光束在障碍物上反射产生的回波,并转换为电信号。所述分光单元配置成向激光雷达外部引导所述探测光束,并且将所述回波引导到所述接收单元。所述数据处理单元与所述接收单元耦合,配置成根据所述电信号,获取所述障碍物的信息。The present disclosure also provides a laser radar, including a transmitting unit, an optical shaping unit, a receiving unit, a spectroscopic unit and a data processing unit. The transmitting unit is configured to transmit a detection beam, and the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface. The optical shaping unit is configured to form the light-emitting surface of the transmitting unit into a reduced light-emitting surface, and the optical shaping unit is arranged in the optical path between the transmitting unit and the spectroscopic unit. The receiving unit is configured to receive the echo generated by the reflection of the detection beam on the obstacle and convert it into an electrical signal. The spectroscopic unit is configured to guide the detection beam to the outside of the laser radar and guide the echo to the receiving unit. The data processing unit is coupled to the receiving unit and configured to obtain information about the obstacle based on the electrical signal.
可选的,所述激光雷达还包括收发光学单元。所述收发光学单元配置成从所述分光单元接收所述探测光束并向所述激光雷达的外部发射,并且接收所述回波并引导到所述分光单元。Optionally, the laser radar further comprises a transceiver optical unit, wherein the transceiver optical unit is configured to receive the detection beam from the spectroscopic unit and transmit it to the outside of the laser radar, and receive the echo and guide it to the spectroscopic unit.
可选的,所述光学整形单元包括第一透镜和第二透镜。其中所述第一透镜用于接收所述发射单元发射的探测光束,所述第一透镜位于所述发射单元与所述第二透镜之间的光路中。所述第一透镜和所述第二透镜配置成将所述发射单元的发光面形成所述缩小的发光面。所述第一透镜和所述第二透镜的光轴为非平行的。Optionally, the optical shaping unit includes a first lens and a second lens. The first lens is used to receive the detection light beam emitted by the emitting unit, and the first lens is located in the light path between the emitting unit and the second lens. The first lens and the second lens are configured to form the light-emitting surface of the emitting unit into the reduced light-emitting surface. The optical axes of the first lens and the second lens are non-parallel.
可选的,所述激光雷达还包括电路板,所述发射单元和所述接收单元设置在同一所述电路板上。Optionally, the laser radar also includes a circuit board, and the transmitting unit and the receiving unit are arranged on the same circuit board.
可选的,所述第一透镜和所述第二透镜均为凸透镜。所述第一透镜的焦距大于所述第二透镜的焦距。所述缩小的发光面形成在所述第二透镜的与所述第一透镜相反的一侧。Optionally, the first lens and the second lens are both convex lenses. The focal length of the first lens is greater than the focal length of the second lens. The reduced light-emitting surface is formed on a side of the second lens opposite to the first lens.
可选的,所述第一透镜和所述第二透镜之间的光学间距为所述第一透镜的焦距与所述第二透镜的焦距之和。 Optionally, the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
可选的,所述光学整形单元还包括反射部。所述反射部设置在所述第一透镜和所述第二透镜之间。所述反射部配置成从所述第一透镜接收所述探测光束,并将所述探测光束反射到所述第二透镜。Optionally, the optical shaping unit further includes a reflecting portion, wherein the reflecting portion is disposed between the first lens and the second lens, and wherein the reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
可选的,所述第一透镜、所述第二透镜和所述反射部一体成型。或者所述第一透镜、所述第二透镜和所述反射部分体成型。所述第一透镜和所述第二透镜的光轴垂直。所述反射部与所述第一透镜的光轴之间的夹角呈45°角,所述反射部和所述第二透镜的光轴之间的夹角呈45°角。Optionally, the first lens, the second lens and the reflective portion are integrally formed. Alternatively, the first lens, the second lens and the reflective portion are separately formed. The optical axes of the first lens and the second lens are perpendicular. The angle between the reflective portion and the optical axis of the first lens is 45°, and the angle between the reflective portion and the optical axis of the second lens is 45°.
可选的,所述激光雷达还包括扫描器,所述扫描器配置成从所述收发光学单元接收并扫描所述探测光束,以覆盖激光雷达的视场范围,并且将所述回波反射到所述收发光学单元。Optionally, the laser radar also includes a scanner, which is configured to receive and scan the detection beam from the transceiver optical unit to cover the field of view of the laser radar, and reflect the echo to the transceiver optical unit.
可选的,所述发射单元包括设置在所述电路板上的激光器阵列。所述接收单元包括设置在所述电路板上的探测器阵列。所述激光雷达包括多个所述光学整形单元和多个所述分光单元。一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应所述激光器阵列的一个激光器和所述探测器阵列的一个探测器。Optionally, the transmitting unit includes a laser array arranged on the circuit board. The receiving unit includes a detector array arranged on the circuit board. The laser radar includes a plurality of the optical shaping units and a plurality of the light splitting units. One transceiver optical module includes one optical shaping unit and one light splitting unit. One transceiver optical module corresponds to one laser of the laser array and one detector of the detector array.
可选的,所述发射单元包括设置在所述电路板上的多组激光器阵列。所述接收单元包括设置在所述电路板上的多组探测器阵列。所述激光雷达包括多个所述光学整形单元和多个所述分光单元。一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应一组所述激光器阵列和一组所述探测器阵列。Optionally, the transmitting unit includes multiple groups of laser arrays arranged on the circuit board. The receiving unit includes multiple groups of detector arrays arranged on the circuit board. The laser radar includes multiple optical shaping units and multiple spectroscopic units. One transceiver optical module includes one optical shaping unit and one spectroscopic unit. One transceiver optical module corresponds to one group of laser arrays and one group of detector arrays.
可选的,所述发射单元包括设置在所述电路板上的多组激光器阵列。所述接收单元包括设置在所述电路板上的探测器。所述探测器中的区域可单独激活。所述激光雷达包括多个所述光学整形单元和多个所述分光单元。一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应所述探测器的激活区域、以及一组所述激光器阵列或所述激光器阵列中的一个激光器。Optionally, the transmitting unit includes a plurality of laser arrays arranged on the circuit board. The receiving unit includes a detector arranged on the circuit board. The areas in the detector can be activated individually. The laser radar includes a plurality of optical shaping units and a plurality of light splitting units. A transceiver optical module includes an optical shaping unit and a light splitting unit. A transceiver optical module corresponds to the activation area of the detector, and a group of the laser arrays or a laser in the laser array.
本公开还提供一种激光雷达,包括发射单元、接收单元、分光单元、数据处理单元和电路板。所述发射单元配置成发射探测光束,所述发射单元具有发光面,所述探测光束由所述发光面发射。所述接收单元配置成接收所述探测光束在障碍物上反射产生的回波,并转换为电信号。所述分光单元配置成向激光雷达外部引导所述探测光束,并且将所述回波引导到所述接收单元。所述数据处理单元与所述接收单元耦合,配置成根据所述电信号,获取所述障碍物的信息。所述发射单元和接收单元设置在同一所述电路板上。The present disclosure also provides a laser radar, including a transmitting unit, a receiving unit, a spectroscopic unit, a data processing unit and a circuit board. The transmitting unit is configured to transmit a detection beam, and the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface. The receiving unit is configured to receive the echo generated by the reflection of the detection beam on an obstacle and convert it into an electrical signal. The spectroscopic unit is configured to guide the detection beam to the outside of the laser radar and guide the echo to the receiving unit. The data processing unit is coupled to the receiving unit and is configured to obtain information about the obstacle based on the electrical signal. The transmitting unit and the receiving unit are arranged on the same circuit board.
可选的,所述激光雷达还包括收发光学单元,所述收发光学单元配置成从所述分光单元接收所述探测光束并向激光雷达外部发射,并且接收所述回波并引导到所述分光单元。Optionally, the laser radar further includes a transceiver optical unit, which is configured to receive the detection beam from the spectroscopic unit and transmit it to the outside of the laser radar, and receive the echo and guide it to the spectroscopic unit.
可选的,所述激光雷达还包括光学整形单元。所述光学整形单元设置在所述发射单元与所述分光单元之间的光路中,配置成调节所述发射单元发射的所述探测光束的光斑形状,以将所述发射单元的发光面形成缩小的发光面。 Optionally, the laser radar further includes an optical shaping unit. The optical shaping unit is disposed in the optical path between the transmitting unit and the light splitting unit, and is configured to adjust the spot shape of the detection light beam emitted by the transmitting unit to form a reduced light-emitting surface of the transmitting unit.
可选的,所述光学整形单元包括第一透镜和第二透镜。所述第一透镜位于所述发射单元与所述第二透镜之间的光路中。所述第一透镜接收所述探测光束,并将所述探测光束出射到所述第二透镜。Optionally, the optical shaping unit includes a first lens and a second lens. The first lens is located in the optical path between the emitting unit and the second lens. The first lens receives the detection light beam and emits the detection light beam to the second lens.
可选的,所述第一透镜和所述第二透镜均为凸透镜。所述第一透镜的焦距大于第二透镜的焦距。所述缩小的发光面形成在所述第二透镜的与所述第一透镜相反的一侧。Optionally, the first lens and the second lens are both convex lenses. The focal length of the first lens is greater than the focal length of the second lens. The reduced light-emitting surface is formed on a side of the second lens opposite to the first lens.
可选的,所述第一透镜和所述第二透镜之间的光学间距为所述第一透镜的焦距与所述第二透镜的焦距之和。Optionally, the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
可选的,所述光学整形单元还包括反射部。所述反射部设置在所述第一透镜和所述第二透镜之间的光路中。所述反射部配置成从所述第一透镜接收所述探测光束,并将所述探测光束全反射到所述第二透镜。Optionally, the optical shaping unit further comprises a reflecting portion, wherein the reflecting portion is disposed in an optical path between the first lens and the second lens, and wherein the reflecting portion is configured to receive the detection light beam from the first lens and to totally reflect the detection light beam to the second lens.
可选的,所述第一透镜、所述第二透镜和所述反射部一体成型。或者所述第一透镜、所述第二透镜和所述反射部分体成型。Optionally, the first lens, the second lens and the reflective portion are integrally formed, or the first lens, the second lens and the reflective portion are separately formed.
可选的,所述第一透镜和所述第二透镜的光轴垂直。所述反射部与所述第一透镜的光轴之间的夹角呈45°角,所述反射部和所述第二透镜的光轴之间的夹角呈45°角。Optionally, the optical axes of the first lens and the second lens are perpendicular. The angle between the reflective portion and the optical axis of the first lens is 45°, and the angle between the reflective portion and the optical axis of the second lens is 45°.
可选的,所述第一透镜和所述第二透镜的焦距的比例根据所述缩小的发光面的大小确定。Optionally, the ratio of the focal lengths of the first lens and the second lens is determined according to the size of the reduced light-emitting surface.
可选的,所述光学整形单元配置成提高从所述激光雷达发射的所述探测光束的功率密度。Optionally, the optical shaping unit is configured to increase the power density of the detection beam emitted from the lidar.
可选的,所述分光单元配置成以偏振分光、小孔分光、或局部反射镜分光的方式,引导所述探测光束和所述回波。Optionally, the beam splitting unit is configured to guide the detection beam and the echo in a polarization splitting, pinhole splitting, or partial reflection mirror splitting manner.
可选的,所述激光雷达还包括扫描器。所述扫描器配置成从所述收发光学单元接收并扫描所述探测光束,以覆盖所述激光雷达的视场范围,并且将所述回波反射到所述收发光学单元。Optionally, the laser radar further includes a scanner, wherein the scanner is configured to receive and scan the detection beam from the transceiver optical unit to cover the field of view of the laser radar, and reflect the echo to the transceiver optical unit.
可选的,所述发射单元包括设置在所述电路板上的激光器阵列。所述接收单元包括设置在所述电路板上的探测器阵列。所述激光雷达包括多个所述光学整形单元和多个所述分光单元,一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应所述激光器阵列的一个激光器和所述探测器阵列的一个探测器。Optionally, the transmitting unit includes a laser array arranged on the circuit board. The receiving unit includes a detector array arranged on the circuit board. The laser radar includes a plurality of the optical shaping units and a plurality of the light splitting units, and a transceiver optical module includes one optical shaping unit and one light splitting unit. One transceiver optical module corresponds to one laser of the laser array and one detector of the detector array.
可选的,所述发射单元包括设置在所述电路板上的多组激光器阵列。所述接收单元包括设置在所述电路板上的多组探测器阵列。所述激光雷达包括多个所述光学整形单元和多个所述分光单元。一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应一组所述激光器阵列和一组探测器阵列。Optionally, the transmitting unit includes multiple groups of laser arrays arranged on the circuit board. The receiving unit includes multiple groups of detector arrays arranged on the circuit board. The laser radar includes multiple optical shaping units and multiple spectroscopic units. One transceiver optical module includes one optical shaping unit and one spectroscopic unit. One transceiver optical module corresponds to one group of laser arrays and one group of detector arrays.
可选的,所述发射单元包括设置在所述电路板上的多组激光器阵列。所述接收单元包括设置在所述电路板上的探测器。所述探测器中的区域可单独激活。所述激光雷达包括多个所述光学整形单元和多个所述分光单元,一个收发光学模组包括一个所述光学整形单元和一个所述分光单元。一个所述收发光学模组对应所述探测器的激活区域、以及一组所述激光器阵列或所述激光器阵列的一个激光器。 Optionally, the transmitting unit includes a plurality of laser arrays arranged on the circuit board. The receiving unit includes a detector arranged on the circuit board. The areas in the detector can be activated individually. The laser radar includes a plurality of optical shaping units and a plurality of light splitting units, and a transceiver optical module includes one optical shaping unit and one light splitting unit. One transceiver optical module corresponds to the activation area of the detector, and a group of the laser arrays or one laser of the laser array.
本公开还提供一种用于激光雷达的收发光学模组,包括光学整形单元和分光单元,所述光学整形单元配置成接收所述激光雷达的发射单元发射的探测光束并将所述探测光束发射到所述分光单元,所述发射单元具有发光面,所述探测光束由所述发光面发射,所述分光单元配置成从所述光学整形单元接收所述探测光束并向所述激光雷达外部引导所述探测光束,并且配置成接收回波,将所述回波引导到所述激光雷达的接收单元,其中所述光学整形单元配置成将所述发射单元的发光面形成缩小的发光面。The present disclosure also provides a transceiver optical module for a laser radar, comprising an optical shaping unit and a spectroscopic unit, wherein the optical shaping unit is configured to receive a detection beam emitted by a transmitting unit of the laser radar and transmit the detection beam to the spectroscopic unit, the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface, the spectroscopic unit is configured to receive the detection beam from the optical shaping unit and guide the detection beam to the outside of the laser radar, and is configured to receive an echo and guide the echo to the receiving unit of the laser radar, wherein the optical shaping unit is configured to form the light-emitting surface of the transmitting unit into a reduced light-emitting surface.
可选的,所述光学整形单元一一对应于所述激光雷达中所述发射单元的一个或多个激光器,所述分光单元一一对应于所述激光雷达中所述接收单元的一个探测器、多个探测器和探测器的激活区域其中一个。Optionally, the optical shaping unit corresponds one-to-one to one or more lasers of the transmitting unit in the laser radar, and the spectroscopic unit corresponds one-to-one to one detector, multiple detectors and one of the activation areas of the detector of the receiving unit in the laser radar.
可选的,所述光学整形单元包括如上所述的光学整形单元。Optionally, the optical shaping unit includes the optical shaping unit described above.
本公开还提供一种激光雷达芯片,包括:基板、光发射装置阵列、光接收装置阵列、分光单元和封装体。所述光发射装置阵列位于所述基板上。所述光接收装置阵列位于所述光发射装置阵列一侧的基板上。所述分光单元配置成传输所述光发射装置阵列产生的探测光。所述探测光经目标反射形成回波光;所述分光单元还配置成传输所述回波光至所述光接收装置阵列。所述封装体位于所述基板上并封装所述光发射装置阵列、所述光接收装置阵列和所述分光单元。The present disclosure also provides a laser radar chip, comprising: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body. The array of light emitting devices is located on the substrate. The array of light receiving devices is located on the substrate on one side of the array of light emitting devices. The spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices. The detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices. The packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
可选的,所述光发射装置阵列包括多个激光器,多个所述激光器在所述基板上呈阵列排布。所述光接收装置阵列包括多个探测器,多个所述探测器在所述基板上呈阵列排布。Optionally, the light emitting device array includes a plurality of lasers, and the plurality of lasers are arranged in an array on the substrate. The light receiving device array includes a plurality of detectors, and the plurality of detectors are arranged in an array on the substrate.
可选的,所述激光雷达芯片还包括:光发射装置驱动模块和光接收装置驱动模块。所述光发射装置驱动模块位于所述基板上,与所述光发射装置阵列、所述基板电连接。所述光接收装置驱动模块位于所述基板上,与所述光接收装置阵列、所述基板电连接。Optionally, the laser radar chip further includes: a light emitting device driving module and a light receiving device driving module. The light emitting device driving module is located on the substrate and is electrically connected to the light emitting device array and the substrate. The light receiving device driving module is located on the substrate and is electrically connected to the light receiving device array and the substrate.
可选的,所述光发射装置驱动模块和所述光接收装置驱动模块位于所述光发射装置阵列和所述光接收装置阵列之间。或者,所述光发射装置阵列和所述光接收装置阵列位于所述光发射装置驱动模块和所述光接收装置驱动模块之间。Optionally, the light emitting device driving module and the light receiving device driving module are located between the light emitting device array and the light receiving device array. Alternatively, the light emitting device array and the light receiving device array are located between the light emitting device driving module and the light receiving device driving module.
可选的,所述激光雷达芯片还包括:透光粘接部,所述透光粘接部位于所述分光单元朝向所述基板的一侧。所述分光单元通过所述透光粘接部与所述光接收装置阵列和所述光发射装置阵列固定。Optionally, the laser radar chip further comprises: a light-transmitting adhesive portion, the light-transmitting adhesive portion being located on a side of the light-splitting unit facing the substrate. The light-splitting unit is fixed to the light-receiving device array and the light-emitting device array via the light-transmitting adhesive portion.
可选的,所述分光单元包括分光元件。所述分光元件配置为将所述探测光的光路与所述回波光的光路分离。Optionally, the light splitting unit comprises a light splitting element, and the light splitting element is configured to separate the optical path of the detection light from the optical path of the echo light.
可选的,所述分光元件为偏振分光器。Optionally, the beam splitter element is a polarization beam splitter.
可选的,所述探测光沿垂直基板表面的方向自所述光发射装置阵列出射;所述回波光沿垂直基板表面的方向入射至所述光接收装置阵列。所述分光单元还包括光偏转元件。所述光偏转元件位于所述探测光的光路中,所述光偏转元件配置为将所述探测光偏转至所述分光元件。Optionally, the detection light is emitted from the light emitting device array along a direction perpendicular to the substrate surface; the echo light is incident on the light receiving device array along a direction perpendicular to the substrate surface. The spectroscopic unit further includes a light deflection element. The light deflection element is located in the optical path of the detection light, and the light deflection element is configured to deflect the detection light to the spectroscopic element.
可选的,所述分光单元还包括:调焦元件,所述调焦元件位于所述探测光的光路中,所述调焦元件配置为使所述光发射装置阵列和所述光接收装置阵列均设置在所述基板上。 Optionally, the spectroscopic unit further includes: a focusing element, the focusing element is located in the optical path of the detection light, and the focusing element is configured so that the light emitting device array and the light receiving device array are both arranged on the substrate.
可选的,所述调焦元件包括第一透镜和第二透镜。所述第一透镜位于所述探测光的光路中所述光偏转元件的上游,以透射所述探测光入射至所述光偏转元件。所述第二透镜位于所述探测光的光路中所述光偏转元件的下游,经所述光偏转元件偏转后的所述探测光透射所述第二透镜后入射至所述分光元件。Optionally, the focusing element includes a first lens and a second lens. The first lens is located upstream of the light deflection element in the optical path of the detection light to transmit the detection light to be incident on the light deflection element. The second lens is located downstream of the light deflection element in the optical path of the detection light, and the detection light deflected by the light deflection element is transmitted through the second lens and then incident on the spectroscopic element.
可选的,所述第一透镜、所述光偏转元件和所述第二透镜一体成型。Optionally, the first lens, the light deflection element and the second lens are integrally formed.
可选的,所述第一透镜为凸透镜或渐变折射率透镜。所述第二透镜为凸透镜或渐变折射率透镜。Optionally, the first lens is a convex lens or a gradient refractive index lens. The second lens is a convex lens or a gradient refractive index lens.
可选的,所述第二透镜为渐变折射率透镜。所述第一透镜、所述光偏转元件、所述第二透镜和所述分光元件一体成型。Optionally, the second lens is a gradient refractive index lens. The first lens, the light deflection element, the second lens and the light splitting element are integrally formed.
本公开还提供一种激光雷达,包括:激光雷达芯片、光学组件和扫描装置。所述激光雷达芯片包括:基板、光发射装置阵列、光接收装置阵列、分光单元和封装体。所述光发射装置阵列位于所述基板上。所述光接收装置阵列位于所述光发射装置阵列一侧的基板上。所述分光单元配置成传输所述光发射装置阵列产生的探测光;所述探测光经目标反射形成回波光;所述分光单元还配置成传输所述回波光至所述光接收装置阵列。所述封装体位于所述基板上并封装所述光发射装置阵列、所述光接收装置阵列和所述分光单元。所述光学组件传输所述激光雷达芯片发射的所述探测光,经所述光学组件传输的所述探测光被所述扫描装置反射后出射。所述扫描装置反射的回波光经所述光学组件传输至所述激光雷达芯片。The present disclosure also provides a laser radar, including: a laser radar chip, an optical component and a scanning device. The laser radar chip includes: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body. The array of light emitting devices is located on the substrate. The array of light receiving devices is located on the substrate on one side of the array of light emitting devices. The spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices. The packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit. The optical component transmits the detection light emitted by the laser radar chip, and the detection light transmitted by the optical component is reflected by the scanning device and then emitted. The echo light reflected by the scanning device is transmitted to the laser radar chip via the optical component.
可选的,所述激光雷达还包括电路板。所述电路板与所述激光雷达芯片之间电连接。Optionally, the laser radar further includes a circuit board, and the circuit board is electrically connected to the laser radar chip.
可选的,多个所述激光雷达芯片固定并电连接于同一个电路板。多个所述激光雷达芯片共用所述光学组件和所述扫描装置。Optionally, the plurality of laser radar chips are fixed and electrically connected to the same circuit board. The plurality of laser radar chips share the optical component and the scanning device.
可选的,所述扫描装置使所述探测光沿第一方向扫描。多个所述激光雷达芯片沿第二方向呈阵列排布,所述第二方向垂直所述第一方向。Optionally, the scanning device causes the detection light to scan along a first direction. A plurality of the laser radar chips are arranged in an array along a second direction, and the second direction is perpendicular to the first direction.
可选的,所述激光雷达包括沿所述第一方向设置的多个激光雷达芯片组。所述激光雷达芯片组包括多个所述激光雷达芯片,同一所述激光雷达芯片组中的多个所述激光雷达芯片沿所述第二方向排列。其中一个所述激光雷达芯片组的多个所述激光雷达芯片与相邻激光雷达芯片组的多个所述激光雷达芯片沿所述第二方向交错设置。Optionally, the laser radar includes a plurality of laser radar chipsets arranged along the first direction. The laser radar chipset includes a plurality of laser radar chips, and the plurality of laser radar chips in the same laser radar chipset are arranged along the second direction. The plurality of laser radar chips in one laser radar chipset are staggered with the plurality of laser radar chips in an adjacent laser radar chipset along the second direction.
可选的,所述激光雷达包括沿所述第一方向设置的多个激光雷达芯片组。所述激光雷达芯片组包括多个所述激光雷达芯片。同一所述激光雷达芯片组中的多个所述激光雷达芯片沿所述第二方向排列。其中一个所述激光雷达芯片组的所述激光雷达芯片中所述光发射装置阵列内至少部分数量的激光器或所述光接收装置阵列内至少部分数量的探测器与相邻所述激光雷达芯片组的所述激光雷达芯片中所述光发射装置阵列内至少部分数量的激光器或所述光接收装置阵列内至少部分数量的探测器沿所述第二方向交错设置。Optionally, the laser radar includes a plurality of laser radar chipsets arranged along the first direction. The laser radar chipset includes a plurality of laser radar chips. The plurality of laser radar chips in the same laser radar chipset are arranged along the second direction. At least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of one of the laser radar chipsets are staggered along the second direction with at least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of the adjacent laser radar chipset.
与现有技术相比,本公开提供了一种用于激光雷达的光学整形单元,利用第一透镜和第二透镜的相互配合,缩小了发光面的尺寸,能够灵活控制发光面尺寸大小,提高了激光雷达出射的探测光束的功率密度,降低了激光雷达对激光器功率密度的要求; 同时第一透镜和第二透镜对光路进行折转,改变了发光面的位置,便于优化激光雷达内部其他零部件的布置。Compared with the prior art, the present invention provides an optical shaping unit for a laser radar, which reduces the size of the light-emitting surface by using the cooperation of a first lens and a second lens, can flexibly control the size of the light-emitting surface, improves the power density of the detection beam emitted by the laser radar, and reduces the laser radar's requirement for the laser power density; At the same time, the first lens and the second lens fold the light path, changing the position of the light-emitting surface, which facilitates the optimization of the layout of other components inside the lidar.
本公开还包括一种激光雷达的实施例,利用光学整形单元将发射单元的发光面形成缩小的发光面,能够降低对激光器发光面尺寸的要求,同时还能够对探测光束进行整形,利用分光单元同时引导探测光束和回波,为发射单元和接收单元共用透镜组提供结构基础,有利于减少激光雷达零部件的数量以及减小激光雷达体积,降低成本,结构简单,便于批量化生产。The present disclosure also includes an embodiment of a laser radar, which utilizes an optical shaping unit to form a reduced light-emitting surface of a transmitting unit, thereby reducing the requirements for the size of the laser light-emitting surface and shaping the detection beam. A spectroscopic unit is utilized to simultaneously guide the detection beam and the echo, thereby providing a structural basis for a lens group shared by the transmitting unit and the receiving unit, thereby reducing the number of laser radar components and reducing the size of the laser radar, thereby reducing costs, simplifying the structure, and facilitating mass production.
本公开还包括另一种激光雷达的实施例,利用分光单元同时引导探测光束和回波,并且发射单元和接收单元均集成在电路板上,能够缩小占用的空间,结构简单,并且有利于发射单元和接收单元的装调和视场对准,降低批量化生产难度,提高生产效率。The present disclosure also includes another embodiment of a laser radar, which uses a spectroscopic unit to simultaneously guide the detection beam and the echo, and the transmitting unit and the receiving unit are integrated on a circuit board, which can reduce the occupied space, has a simple structure, and is conducive to the installation and field of view alignment of the transmitting unit and the receiving unit, reducing the difficulty of mass production and improving production efficiency.
本公开还包括一种收发光学模组的实施例,其中光学整形单元和分光单元相互配合集成到收发光学模组,提高了激光雷达内部光学元件的集成度,有利于批量化生产。The present disclosure also includes an embodiment of a transceiver optical module, wherein an optical shaping unit and a light splitting unit cooperate with each other and are integrated into the transceiver optical module, thereby improving the integration of optical elements inside the laser radar and facilitating mass production.
本公开技术方案中,所述光发射装置阵列、所述光接收装置阵列和所述分光单元均位于同一基板上而且被封装于封装体内以构成所述激光雷达芯片。由于所述光发射装置阵列和所述光接收装置阵列合封于同一芯片内,基于芯片封装工艺,可以将所述光发射装置阵列和所述光接收装置阵列在基板上贴片精度控制到微米(μm)量级,能够有效保证各通道中激光器的发射视场和探测器的接收视场的高精度对准;而且所述光发射装置阵列、所述光接收装置阵列和所述分光单元均位于同一基板上,能够有效降低装配精度、以及在激光雷达使用过程中由于温度变化、机械形变等对发射视场和接收视场的影响。In the technical solution disclosed in the present invention, the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate and are packaged in a package to form the laser radar chip. Since the light emitting device array and the light receiving device array are sealed in the same chip, based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array on the substrate can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation, etc. on the emission field of view and the receiving field of view during the use of the laser radar.
激光雷达中,所述光发射装置阵列和所述光接收装置阵列共用光学组件和扫描装置,能够有效克服由于光学组件中透镜组光轴偏移、扫描装置位置偏移等对各通道中激光器的发射视场和探测器的接收视场之间对准精度的影响。所以,本公开的方案能够有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。In the laser radar, the light emitting device array and the light receiving device array share the optical assembly and the scanning device, which can effectively overcome the influence of the optical axis offset of the lens group in the optical assembly, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy between the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
附图用来提供对本公开的进一步理解,并且构成说明书的一部分,与本公开的实施例一起用于解释本公开,并不构成对本公开的限制。在附图中:The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. In the accompanying drawings:
图1是本公开的一个实施例中光学整形单元的结构示意图;FIG1 is a schematic structural diagram of an optical shaping unit in one embodiment of the present disclosure;
图2是本公开的另一实施例中光学整形单元的结构示意图;FIG2 is a schematic structural diagram of an optical shaping unit in another embodiment of the present disclosure;
图3是本公开的一个实施例中激光雷达的系统框图;FIG3 is a system block diagram of a laser radar in one embodiment of the present disclosure;
图4是本公开的一个实施例中包括收发光学单元的激光雷达的示意图;FIG4 is a schematic diagram of a laser radar including a transceiver optical unit in one embodiment of the present disclosure;
图5是本公开的一个实施例中包括光学整形单元的激光雷达的示意图;FIG5 is a schematic diagram of a laser radar including an optical shaping unit in one embodiment of the present disclosure;
图6是本公开的一个实施例中激光雷达的光路示意图;FIG6 is a schematic diagram of an optical path of a laser radar in one embodiment of the present disclosure;
图7A-图7D是本公开的不同实施例中分光单元的示意图;7A-7D are schematic diagrams of light splitting units in different embodiments of the present disclosure;
图8是本公开的一个实施例中收发光学模组的光路示意图; FIG8 is a schematic diagram of an optical path of a transceiver optical module in one embodiment of the present disclosure;
图9A和图9B是本公开的不同实施例中收发光学模组的结构示意图;9A and 9B are schematic diagrams of structures of transceiver optical modules in different embodiments of the present disclosure;
图10是本公开激光雷达芯片一实施例的剖面结构示意图;FIG10 is a schematic diagram of a cross-sectional structure of an embodiment of a laser radar chip disclosed herein;
图11是本公开激光雷达芯片一实施例的俯视结构示意图;FIG11 is a schematic diagram of a top view of the structure of an embodiment of a laser radar chip disclosed herein;
图12是本公开激光雷达芯片一实施例中分光单元的光路结构示意图;FIG12 is a schematic diagram of the optical path structure of a light splitting unit in one embodiment of a laser radar chip disclosed herein;
图13是本公开激光雷达芯片一实施例中光发射装置阵列和光发射装置驱动模块的俯视结构示意图;FIG13 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in an embodiment of a laser radar chip disclosed herein;
图14是本公开激光雷达芯片另一实施例中光发射装置阵列和光发射装置驱动模块的俯视结构示意图;FIG14 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in another embodiment of the laser radar chip disclosed herein;
图15是本公开激光雷达芯片另一实施例的剖面结构示意图;FIG15 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention;
图16是本公开激光雷达芯片另一实施例的剖面结构示意图;FIG16 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention;
图17是本公开激光雷达芯片另一实施例中分光单元的光路结构示意图;FIG17 is a schematic diagram of the optical path structure of a light splitting unit in another embodiment of the laser radar chip disclosed herein;
图18是本公开激光雷达一实施例的结构示意图;FIG18 is a schematic diagram of the structure of an embodiment of a laser radar disclosed herein;
图19是图18所示激光雷达实施例中多个所述激光雷达芯片的放大结构示意图;FIG19 is a schematic diagram of an enlarged structure of a plurality of laser radar chips in the laser radar embodiment shown in FIG18 ;
图20是图18所示激光雷达实施例中所述电路板上多个激光雷达芯片的俯视结构示意图;FIG20 is a schematic diagram of a top view of the structure of multiple laser radar chips on the circuit board in the laser radar embodiment shown in FIG18 ;
图21是本公开激光雷达另一实施例中电路板上多个激光雷达芯片的俯视结构示意图。Figure 21 is a schematic diagram of the top view structure of multiple laser radar chips on a circuit board in another embodiment of the laser radar disclosed in the present invention.
在下文中,仅简单地描述了某些示例性实施例。正如本领域技术人员可认识到的那样,在不脱离本公开的精神或范围的情况下,可通过各种不同方式修改所描述的实施例。因此,附图和描述被认为本质上是示例性的而非限制性的。In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.
在本公开的描述中,需要理解的是,术语"中心"、"纵向"、"横向"、"长度"、"宽度"、"厚度"、"上"、"下"、"前"、"后"、"左"、"右"、"竖直"、"水平"、"顶"、"底"、"内"、"外"、"顺时针"、"逆时针"等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本公开和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本公开的限制。此外,术语"第一"、"第二"仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有"第一"、"第二"的特征可以明示或者隐含地包括一个或者更多个所述特征。在本公开的描述中,"多个"的含义是两个或两个以上,除非另有明确具体地限定。In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
在本公开的描述中,需要说明的是,除非另有明确的规定和限定,术语"安装"、"相连"、"连接"应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接:可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本公开中的具体含义。 In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.
在本公开中,除非另有明确的规定和限定,第一特征在第二特征之"上"或之"下"可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征"之上"、"上方"和"上面"包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征"之下"、"下方"和"下面"包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本公开的不同结构。为了简化本公开的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本公开。此外,本公开可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本公开提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The disclosure below provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and/or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and/or settings discussed. In addition, the present disclosure provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and/or the use of other materials.
以下结合附图对本公开的实施例进行说明,应当理解,此处所描述的实施例仅用于说明和解释本公开,并不用于限定本公开。The embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the embodiments described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.
应当理解,本公开的实施例中每个模块、单元、模组、组件可以全部或部分地包括一个或多个物理零部件。例如模块、单元、模组或组件可以包括实现发射光束、光电转换、光束折射或反射、控制光束发生透射或反射的硬件部件。作为另一些实施例,模块、单元、模组或组件可以包括一个或多个硬件零部件和一个或更多个软件零部件。例如,模块、单元、模组或组件(例如数据处理单元)可以包括处理器(例如,数字信号处理器、微控制器、现场可编程门阵列、中央处理器、专用集成电路等)和计算机程序,当计算机程序在处理器上运行时,可以实现模块、单元、模组或组件的功能。计算机程序可以存储在存储器(例如,随机存取存储器、闪存、只读存储器、可编程只读存储器、寄存器、硬盘、可移动硬盘或任何其他形式的存储介质)或服务器中。作为示例,光学整形单元可以包括多个光学元件,对光束进行反射或折射,以使光束改变传播方向或进行汇聚(或发散),发光单元可以包括发光电路、垂直腔表面发射激光器(VCSEL)、边缘发射激光器(EEL)、分布式反馈激光器(DFB)、光纤激光器等。It should be understood that in the embodiments of the present disclosure, each module, unit, module, and component may include one or more physical parts in whole or in part. For example, a module, unit, module, or component may include a hardware component that realizes the emission of a light beam, photoelectric conversion, light beam refraction or reflection, and control of light beam transmission or reflection. As other embodiments, a module, unit, module, or component may include one or more hardware components and one or more software components. For example, a module, unit, module, or component (such as a data processing unit) may include a processor (for example, a digital signal processor, a microcontroller, a field programmable gate array, a central processing unit, an application-specific integrated circuit, etc.) and a computer program, and when the computer program runs on the processor, the function of the module, unit, module, or component can be realized. The computer program may be stored in a memory (for example, a random access memory, a flash memory, a read-only memory, a programmable read-only memory, a register, a hard disk, a removable hard disk, or any other form of storage medium) or a server. As an example, the optical shaping unit may include multiple optical elements to reflect or refract the light beam so that the light beam changes its propagation direction or converges (or diverges). The light-emitting unit may include a light-emitting circuit, a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a distributed feedback laser (DFB), a fiber laser, etc.
图1示出了根据本公开的一个实施例中用于激光雷达的光学整形单元100,其包括第一透镜和第二透镜,第一透镜用于接收激光雷达的发射单元的发光面发射的探测光束,第一透镜位于发射单元与第二透镜之间的光路中,第一透镜和第二透镜将发射单元的发光面形成缩小的发光面,能够利用第一透镜和第二透镜灵活控制成像后(缩小的)发光面的尺寸大小,提高了由激光雷达发射的探测光束的功率密度,降低了激光雷达对于激光器功率密度的要求,并且第一透镜和第二透镜的光轴为非平行的,可以通过第一透镜和第二透镜对发射单元发射的光束进行折转,能够灵活地设置发射单元的位置,便于优化激光雷达内部其他零部件的布置,下面结合图1对光学整形单元100进行详细描述。FIG1 shows an optical shaping unit 100 for a laser radar according to an embodiment of the present disclosure, which includes a first lens and a second lens. The first lens is used to receive a detection light beam emitted by a light-emitting surface of a transmitting unit of the laser radar. The first lens is located in the optical path between the transmitting unit and the second lens. The light-emitting surface of the transmitting unit is formed into a reduced light-emitting surface by the first lens and the second lens. The size of the (reduced) light-emitting surface after imaging can be flexibly controlled by the first lens and the second lens, thereby improving the power density of the detection light beam emitted by the laser radar and reducing the laser radar's requirement for laser power density. The optical axes of the first lens and the second lens are non-parallel, and the light beam emitted by the transmitting unit can be folded by the first lens and the second lens. The position of the transmitting unit can be flexibly set, which is convenient for optimizing the arrangement of other components inside the laser radar. The optical shaping unit 100 is described in detail below in conjunction with FIG1 .
如图1所示,用于激光雷达的光学整形单元100包括第一透镜110和第二透镜120,其中还示意性示出了激光雷达的发射单元(或称为光发射装置)200,所述发射单元200 具有发光面(图中发射单元200的上表面),探测光束(或称为探测光)由所述发光面发射。所述发射单元200例如可以是垂直腔面发射激光器VCSEL。第一透镜110用于接收激光雷达的发射单元200发射的探测光束。另外,发射单元200发射的探测光束可以直接入射到第一透镜110上,也可以经过其他的光学组件(例如微透镜或微透镜阵列)进行整形之后入射到第一透镜110上。As shown in FIG. 1 , an optical shaping unit 100 for a laser radar includes a first lens 110 and a second lens 120 , wherein a transmitting unit (or light transmitting device) 200 of the laser radar is also schematically shown. It has a light-emitting surface (the upper surface of the transmitting unit 200 in the figure), and the detection beam (or referred to as detection light) is emitted by the light-emitting surface. The transmitting unit 200 can be, for example, a vertical cavity surface emitting laser VCSEL. The first lens 110 is used to receive the detection beam emitted by the transmitting unit 200 of the laser radar. In addition, the detection beam emitted by the transmitting unit 200 can be directly incident on the first lens 110, or it can be incident on the first lens 110 after being shaped by other optical components (such as a microlens or a microlens array).
第一透镜110设置在发射单元200和第二透镜120之间的光路中,第一透镜110和第二透镜120相互配合,以将发射单元200的发光面形成缩小的发光面200′(实像),等效于减小了发光面尺寸。因此根据“发射功率=发光面尺寸*功率密度”的关系,在发射单元200的发射功率保持稳定的情况下,通过缩小发光面尺寸的方式可以提高缩小的发光面200′(等效为虚拟光源或虚拟的发射单元)发射的探测光束的功率密度。The first lens 110 is disposed in the optical path between the emitting unit 200 and the second lens 120. The first lens 110 and the second lens 120 cooperate with each other to form the light-emitting surface of the emitting unit 200 into a reduced light-emitting surface 200' (real image), which is equivalent to reducing the size of the light-emitting surface. Therefore, according to the relationship of "transmitting power = light-emitting surface size * power density", when the transmitting power of the emitting unit 200 remains stable, the power density of the detection light beam emitted by the reduced light-emitting surface 200' (equivalent to a virtual light source or a virtual emitting unit) can be increased by reducing the size of the light-emitting surface.
具体的,发射单元200的发光面原始尺寸设为L1,经过第一透镜110和第二透镜120成像后的缩小的发光面200′的尺寸为L2,通过下式计算:
L2=N×L1。Specifically, the original size of the light-emitting surface of the emitting unit 200 is set to L 1 , and the size of the reduced light-emitting surface 200 ′ after imaging by the first lens 110 and the second lens 120 is L 2 , which is calculated by the following formula:
L2 = N × L1 .
其中N小于1(也称为压缩系数)。因此,把发射单元200的发光面尺寸进行了压缩,与此相对应的,缩小的发光面200′发射的探测光束的功率密度提升为原有功率密度的1/N2倍。上述实施例中,通过第一透镜110和第二透镜120对发光面成像后改变发光面的尺寸,形成缩小的发光面200′。Where N is less than 1 (also called compression coefficient). Therefore, the size of the light-emitting surface of the emitting unit 200 is compressed, and correspondingly, the power density of the detection light beam emitted by the reduced light-emitting surface 200' is increased to 1/N 2 times of the original power density. In the above embodiment, the size of the light-emitting surface is changed after the light-emitting surface is imaged by the first lens 110 and the second lens 120, so as to form a reduced light-emitting surface 200'.
并且本实施例中的第一透镜110和第二透镜120的光轴为非平行的,例如图1中所示,第一透镜110的光轴大致为图1中的竖直方向,第二透镜120的光轴大致为图1中的水平方向,当然,在本公开的不同实施例中,第一透镜110的光轴和第二透镜120的光轴之间的角度可以是其他角度。优选的,可以在第一透镜110和第二透镜120之间设置用于改变探测光束的传播方向的光学元件,例如反射元件、衍射元件或者光栅,实现第一透镜110和第二透镜120的光轴非平行设置。In addition, the optical axes of the first lens 110 and the second lens 120 in this embodiment are non-parallel. For example, as shown in FIG1 , the optical axis of the first lens 110 is approximately in the vertical direction in FIG1 , and the optical axis of the second lens 120 is approximately in the horizontal direction in FIG1 . Of course, in different embodiments of the present disclosure, the angle between the optical axis of the first lens 110 and the optical axis of the second lens 120 may be other angles. Preferably, an optical element for changing the propagation direction of the detection light beam, such as a reflective element, a diffraction element or a grating, may be provided between the first lens 110 and the second lens 120 to achieve a non-parallel arrangement of the optical axes of the first lens 110 and the second lens 120.
根据激光雷达具体的结构设计,通过调整第一透镜110和第二透镜120的位置,以及两者光轴之间的角度,能够改变发射单元200和缩小的发光面200′的位置以及缩小的发光面200′的尺寸,同时由于缩小的发光面200′的尺寸小于发射单元200的发光面尺寸,提高了缩小的发光面200′发射的探测光束的功率密度,即激光雷达出射的探测光束的功率密度,有利于提高激光雷达的测远能力。另外,当应用于激光雷达中时,该光学整形单元100允许对位于光路下游的分光单元、透镜组等光学部件的位置更加灵活地进行调整,便于优化激光雷达内部其他零部件的布置,有利于减少激光雷达零部件的数量以及减小激光雷达体积,降低成本,结构简单,便于批量化生产。下文将详细描述。According to the specific structural design of the laser radar, by adjusting the position of the first lens 110 and the second lens 120, and the angle between the optical axes of the two, the position of the transmitting unit 200 and the reduced light-emitting surface 200' and the size of the reduced light-emitting surface 200' can be changed. At the same time, since the size of the reduced light-emitting surface 200' is smaller than the size of the light-emitting surface of the transmitting unit 200, the power density of the detection beam emitted by the reduced light-emitting surface 200' is increased, that is, the power density of the detection beam emitted by the laser radar is increased, which is conducive to improving the distance measurement capability of the laser radar. In addition, when applied to the laser radar, the optical shaping unit 100 allows the position of the optical components such as the splitter unit and the lens group located downstream of the optical path to be adjusted more flexibly, which is convenient for optimizing the arrangement of other components inside the laser radar, which is conducive to reducing the number of laser radar components and reducing the volume of the laser radar, reducing costs, and having a simple structure and facilitating mass production. It will be described in detail below.
另外,物体在经过透镜一次成像后,会进行空间域和角度域的互换,例如发光面为矩形、发散角为圆形对称分布的激光器,在经过透镜的一次成像后,其发光面将变换为圆形,其发散角变换为矩形分布。而在激光雷达的应用中,发射单元中激光器的发光面通常设置为矩形或正方形,为实现激光雷达激光器的发射视场和探测器的接收视场有效匹配,优选将探测光束的发散角设置为圆形对称分布,如果仅通过一次透镜成像,则需要将激光器的发光面设置为圆形,并使其具有矩形分布的发散角,这种激 光器很难通过工程方法实现,并且加工成本不易控制,因此,为了降低激光雷达成本,实现批量化生产,发射单元中可以采用发光面为矩形的激光器,并对发射单元进行两次透镜成像,以满足激光器的发射视场和探测器的接收视场有效匹配。In addition, after an object is imaged once through a lens, the spatial domain and the angular domain will be interchanged. For example, a laser with a rectangular light-emitting surface and a circular symmetrical divergence angle will transform into a circular shape and a rectangular distribution after being imaged once through a lens. In the application of LiDAR, the light-emitting surface of the laser in the transmitting unit is usually set to a rectangle or square. In order to effectively match the emission field of view of the LiDAR laser and the receiving field of view of the detector, it is preferred to set the divergence angle of the detection beam to a circular symmetrical distribution. If the image is only formed through a lens once, the light-emitting surface of the laser needs to be set to a circle and have a rectangular distribution of divergence angles. This laser Optical devices are difficult to realize through engineering methods, and the processing costs are not easy to control. Therefore, in order to reduce the cost of lidar and realize mass production, a laser with a rectangular light-emitting surface can be used in the transmitting unit, and the transmitting unit can be imaged by lens twice to ensure effective matching between the laser's transmitting field of view and the detector's receiving field of view.
为便于提供激光雷达所需的探测光束,本实施例提出对发射单元进行两次透镜成像。根据本公开的一个优选实施例,其中第一透镜110和第二透镜120均为凸透镜,并且第一透镜110的焦距大于第二透镜120的焦距,缩小的发光面200′形成在第二透镜120中相对于第一透镜110相反的一侧,即发射单元200发射的探测光束依次穿过第一透镜110和第二透镜120后,在第二透镜120的另一侧汇聚。In order to facilitate the provision of the detection beam required by the laser radar, this embodiment proposes to perform two lens imaging on the transmitting unit. According to a preferred embodiment of the present disclosure, the first lens 110 and the second lens 120 are both convex lenses, and the focal length of the first lens 110 is greater than the focal length of the second lens 120, and the reduced light-emitting surface 200' is formed on the side of the second lens 120 opposite to the first lens 110, that is, the detection beam emitted by the transmitting unit 200 passes through the first lens 110 and the second lens 120 in sequence, and converges on the other side of the second lens 120.
进一步的,第一透镜110和第二透镜120之间的光学间距为第一透镜110的焦距和第二透镜120的焦距之和,其中光学间距表示第一透镜110的光心与第二透镜120的光心之间沿着二者的光轴方向的距离。例如第一透镜110的焦距为f1,第二透镜120的焦距为f2,第一透镜110和第二透镜120之间的光学间距为f1+f2。第二透镜120的焦距f2小于第一透镜110的焦距f1,在经过两次透镜成像后,发射单元200的缩小的发光面200′尺寸更小,提高了激光雷达发射的探测光束的功率密度。在本实施例中,上文的压缩系数N通过下式计算获得:
Furthermore, the optical spacing between the first lens 110 and the second lens 120 is the sum of the focal length of the first lens 110 and the focal length of the second lens 120, wherein the optical spacing represents the distance between the optical center of the first lens 110 and the optical center of the second lens 120 along the optical axis direction of the two. For example, the focal length of the first lens 110 is f1, the focal length of the second lens 120 is f2, and the optical spacing between the first lens 110 and the second lens 120 is f1+f2. The focal length f2 of the second lens 120 is smaller than the focal length f1 of the first lens 110. After two lens imaging, the reduced light-emitting surface 200′ of the transmitting unit 200 is smaller in size, thereby improving the power density of the detection beam emitted by the laser radar. In this embodiment, the compression coefficient N above is obtained by calculating the following formula:
等效于将发射单元200的全部发光功率从一个更小的发光面发射,激光雷达发射的探测光束的功率密度将增大为原来的1/N2倍。This is equivalent to emitting the entire luminous power of the transmitting unit 200 from a smaller luminous surface, and the power density of the detection beam emitted by the laser radar will increase to 1/ N2 times of the original.
如图1所示,根据本公开的优选实施例,光学整形单元100还包括反射部130,反射部130设置在第一透镜110和第二透镜120之间的光路中,根据第一透镜110与第二透镜120之间光轴方向的夹角进行设置,反射部130设置成从第一透镜110接收探测光束,并将探测光束反射至第二透镜120。As shown in FIG. 1 , according to a preferred embodiment of the present disclosure, the optical shaping unit 100 further includes a reflecting portion 130 , which is disposed in the optical path between the first lens 110 and the second lens 120 , and is disposed according to the angle between the first lens 110 and the second lens 120 in the direction of the optical axis. The reflecting portion 130 is configured to receive a detection beam from the first lens 110 and reflect the detection beam to the second lens 120 .
根据本公开的实施例,第一透镜110、第二透镜120和反射部130可以集成为一个整体的光学部件(例如通过一体成型的方式),并设置在镜筒中,其中第一透镜110和第二透镜120可以分别设置成该光学部件在入光位置和出光位置处的凸面,从而起到汇聚光束的作用,反射部130的位置处贴附有反射膜。或者可替换的,反射部130通过介质内部的全反射来形成,例如通过选择光学整形单元100的材质,并且通过调整发射单元200发射的探测光束经过第一透镜110后入射到反射部130上的角度,使得入射角均大于临界角(该临界角与材质的折射率和外部介质(例如空气)的折射率有关),因此入射到反射部130上的探测光束将被全反射到第二透镜120。在这种情况下,无需设置单独的反射膜。According to an embodiment of the present disclosure, the first lens 110, the second lens 120 and the reflective portion 130 can be integrated into an integral optical component (for example, by an integral molding method) and arranged in a lens barrel, wherein the first lens 110 and the second lens 120 can be respectively arranged as convex surfaces of the optical component at the light entrance position and the light exit position, so as to play a role in converging light beams, and a reflective film is attached to the position of the reflective portion 130. Alternatively, the reflective portion 130 is formed by total reflection inside the medium, for example, by selecting the material of the optical shaping unit 100, and by adjusting the angle at which the detection light beam emitted by the emitting unit 200 is incident on the reflective portion 130 after passing through the first lens 110, so that the incident angle is greater than the critical angle (the critical angle is related to the refractive index of the material and the refractive index of the external medium (for example, air)), so the detection light beam incident on the reflective portion 130 will be totally reflected to the second lens 120. In this case, there is no need to provide a separate reflective film.
在本公开的不同实施例中,如图2所示,第一透镜110、第二透镜120和反射部130也可以分体成型,分离地设置在镜筒140中,例如第一透镜110和第二透镜120分别为独立的凸透镜,分别固定在镜筒140的入光位置和出光位置,反射部130可以是固定在镜筒140中特定位置的反射镜。In different embodiments of the present disclosure, as shown in FIG. 2 , the first lens 110, the second lens 120 and the reflecting portion 130 may also be formed separately and separately disposed in the lens barrel 140. For example, the first lens 110 and the second lens 120 are independent convex lenses, respectively fixed at the light incident position and the light emitting position of the lens barrel 140, and the reflecting portion 130 may be a reflecting mirror fixed at a specific position in the lens barrel 140.
进一步的,第一透镜110的光轴和第二透镜120的光轴设置成相互垂直,如图1和图2所示,反射部130设置成与第一透镜110的光轴之间的夹角成45°角,反射部130设置 成与第二透镜120的光轴之间的夹角成45°角。第一透镜110和第二透镜120设置成光轴相互垂直仅为一种优选实施例,第一透镜110、第二透镜120和反射部130也可以设置为其他角度,以适应具体的光路需求以及在激光雷达中的安装需求。另外,反射部130也可以设置成曲面的反射镜,以进一步优化光学整形效果,配合第一透镜110和第二透镜120将发射单元200的发光面形成缩小的发光面200′。Furthermore, the optical axis of the first lens 110 and the optical axis of the second lens 120 are arranged to be perpendicular to each other. As shown in FIG. 1 and FIG. 2 , the reflector 130 is arranged to form an angle of 45° with the optical axis of the first lens 110. The angle between the optical axis of the second lens 120 and the optical axis of the second lens 120 is 45°. The first lens 110 and the second lens 120 are arranged so that the optical axes are perpendicular to each other, which is only a preferred embodiment. The first lens 110, the second lens 120 and the reflector 130 can also be arranged at other angles to meet the specific optical path requirements and installation requirements in the laser radar. In addition, the reflector 130 can also be arranged as a curved reflector to further optimize the optical shaping effect, and cooperate with the first lens 110 and the second lens 120 to form a reduced light-emitting surface 200′ from the light-emitting surface of the transmitting unit 200.
在本公开的具体实施例中,第一透镜110的焦距和第二透镜120的焦距的比值关系根据发射单元200的发光面和其缩小的发光面200′的大小确定。当应用于激光雷达时,根据激光雷达的发射单元200的实际发光面尺寸,并将对于发射单元所期望的理想发光面尺寸作为缩小的发光面200′的尺寸,然后根据上述公式即可确定第一透镜110的焦距和第二透镜120的焦距的比值关系。In a specific embodiment of the present disclosure, the ratio of the focal length of the first lens 110 to the focal length of the second lens 120 is determined according to the size of the light-emitting surface of the transmitting unit 200 and the reduced light-emitting surface 200' thereof. When applied to a laser radar, the ratio of the focal length of the first lens 110 to the focal length of the second lens 120 can be determined according to the above formula based on the actual light-emitting surface size of the transmitting unit 200 of the laser radar and the ideal light-emitting surface size expected for the transmitting unit as the size of the reduced light-emitting surface 200'.
当应用于激光雷达中时,由于光学整形单元可以缩小发射单元的发光面尺寸,提高功率密度,因此将能够显著提高激光雷达的测远性能。另外,在激光雷达中,发射单元200的发光面尺寸影响后续对探测光束进行整形的发射透镜组(实际发射单元和接收单元共用该透镜组)的焦距,发射镜头的焦距=发光面尺寸/远场光斑角度,以发射单元200缩小的发光面200′的尺寸作为发光面尺寸,设置在缩小的发光面200′下游的发射透镜组的焦距也相应的做出调整。具体的,根据发射透镜组的焦距和位置,确定缩小的发光面200′的预定位置以及尺寸,然后根据发射单元200的发光面的实际尺寸,确定第一透镜110和第二透镜120各自的焦距以及位置,从而将发射单元200的发光面形成所述预定位置处的缩小的发光面200′。最终可实现发射单元和接收单元可以共用一组透镜,能够减少激光雷达中光学元器件的数量,简化激光雷达的结构。另外,在确定收发透镜或收发透镜组的焦距的情况下,可以将发射单元200和接收单元集成在同一电路板上,进一步简化激光雷达的内部结构,降低激光雷达的设计和加工难度。When applied to laser radar, since the optical shaping unit can reduce the size of the light-emitting surface of the transmitting unit and improve the power density, it will be able to significantly improve the distance measurement performance of the laser radar. In addition, in the laser radar, the size of the light-emitting surface of the transmitting unit 200 affects the focal length of the transmitting lens group (the actual transmitting unit and the receiving unit share the lens group) that subsequently shapes the detection beam. The focal length of the transmitting lens = the size of the light-emitting surface/the angle of the far-field spot. The size of the reduced light-emitting surface 200' of the transmitting unit 200 is used as the size of the light-emitting surface, and the focal length of the transmitting lens group set downstream of the reduced light-emitting surface 200' is also adjusted accordingly. Specifically, according to the focal length and position of the transmitting lens group, the predetermined position and size of the reduced light-emitting surface 200' are determined, and then according to the actual size of the light-emitting surface of the transmitting unit 200, the focal lengths and positions of the first lens 110 and the second lens 120 are determined, so that the light-emitting surface of the transmitting unit 200 is formed into the reduced light-emitting surface 200' at the predetermined position. Finally, the transmitting unit and the receiving unit can share a set of lenses, which can reduce the number of optical components in the laser radar and simplify the structure of the laser radar. In addition, when the focal length of the transmitting and receiving lens or the transmitting and receiving lens group is determined, the transmitting unit 200 and the receiving unit can be integrated on the same circuit board, further simplifying the internal structure of the laser radar and reducing the difficulty of designing and processing the laser radar.
图3示出了根据本公开的一个实施例中激光雷达10的系统结构,下面结合图3对激光雷达10进行说明。FIG3 shows a system structure of a laser radar 10 according to an embodiment of the present disclosure. The laser radar 10 will be described below in conjunction with FIG3 .
如图3所示,在本实施例中,激光雷达10包括发射单元11、接收单元12、分光单元13、数据处理单元14和电路板15,其中发射单元11用于发射探测光束L,接收单元12用于接收探测光束L在障碍物(或称为目标)上反射产生的回波(或称为回波光)L′,并将回波信号L′转换为电信号,接收单元12例如具有光电转换元件。As shown in Figure 3, in this embodiment, the laser radar 10 includes a transmitting unit 11, a receiving unit 12, a spectroscopic unit 13, a data processing unit 14 and a circuit board 15, wherein the transmitting unit 11 is used to transmit the detection light beam L, and the receiving unit 12 is used to receive the echo (or echo light) L′ generated by the detection light beam L being reflected on an obstacle (or target), and convert the echo signal L′ into an electrical signal. The receiving unit 12, for example, has a photoelectric conversion element.
如图3所示,其中较粗的箭头表示探测光束L,较细的箭头表示回波L′,分光单元13用于向激光雷达10外部引导探测光束L,并且将回波L′引导至接收单元12,即分光单元13能够接收探测光束L和回波L′,并将探测光束L和回波L′引导至不同的方向,探测光束L和回波L′均经过分光单元13,光路部分重合,有利于缩小激光雷达的体积。As shown in Figure 3, the thicker arrow represents the detection beam L, and the thinner arrow represents the echo L′. The spectroscopic unit 13 is used to guide the detection beam L to the outside of the laser radar 10, and guide the echo L′ to the receiving unit 12, that is, the spectroscopic unit 13 can receive the detection beam L and the echo L′, and guide the detection beam L and the echo L′ to different directions. The detection beam L and the echo L′ both pass through the spectroscopic unit 13, and the optical paths partially overlap, which is beneficial to reducing the volume of the laser radar.
数据处理单元14与接收单元12耦合,设置成根据回波的电信号,获取障碍物的信息,具体的,例如根据接收到回波的时间确定障碍物与激光雷达10之间的距离,以及根据回波确定障碍物的反射率等信息。The data processing unit 14 is coupled to the receiving unit 12 and is configured to obtain information about the obstacle based on the electrical signal of the echo. Specifically, for example, the distance between the obstacle and the laser radar 10 is determined based on the time when the echo is received, and information such as the reflectivity of the obstacle is determined based on the echo.
在本实施例中,激光雷达10包括电路板15,其中发射单元11和接收单元12设置在同一电路板15上,能够进一步压缩激光雷达10内部光学元器件占用的空间,有利于缩小体积。 In this embodiment, the laser radar 10 includes a circuit board 15, wherein the transmitting unit 11 and the receiving unit 12 are arranged on the same circuit board 15, which can further compress the space occupied by the optical components inside the laser radar 10 and help reduce the volume.
现有的设计中,发射单元和接收单元通常设置在分光单元13不同方向的两侧,例如发射单元和接收单元以90°的夹角设置在分光单元13的不同侧面,即发射单元11和接收单元12分别设置在不同的位置,并且发射单元11和接收单元12均需要设置在电路板上,因此,需要为发射单元和接收单元设置单独的电路板,导致占用空间大,集成度差,并且生产过程较为复杂。本实施例中的发射单元11和接收单元12均集成在同一电路板15上,其中发射单元11或接收单元12可以利用具有整形、引导等功能的光学整形单元优化光路,以使探测光束入射到分光单元13,由分光单元13将探测光束引导至激光雷达10外部进行探测,并使回波通过分光单元13引导至接收单元12。In the existing design, the transmitting unit and the receiving unit are usually arranged on both sides of the spectrometer unit 13 in different directions. For example, the transmitting unit and the receiving unit are arranged on different sides of the spectrometer unit 13 at an angle of 90°, that is, the transmitting unit 11 and the receiving unit 12 are respectively arranged at different positions, and the transmitting unit 11 and the receiving unit 12 need to be arranged on the circuit board. Therefore, it is necessary to set up separate circuit boards for the transmitting unit and the receiving unit, resulting in large occupied space, poor integration, and a relatively complicated production process. The transmitting unit 11 and the receiving unit 12 in this embodiment are both integrated on the same circuit board 15, wherein the transmitting unit 11 or the receiving unit 12 can optimize the optical path by using an optical shaping unit with shaping, guiding and other functions, so that the detection beam is incident on the spectrometer unit 13, and the spectrometer unit 13 guides the detection beam to the outside of the laser radar 10 for detection, and the echo is guided to the receiving unit 12 through the spectrometer unit 13.
根据本公开的优选实施例,如图4所示,激光雷达10还包括收发光学单元16(例如上文描述的由发射单元和接收单元共用的透镜组),其中收发光学单元16设置成从分光单元13接收探测光束L,并向激光雷达10的外部发射探测光束L,同时收发光学单元16还用于接收回波L′,并且将回波L′引导至分光单元13。收发光学单元16可以是透镜或透镜组,用于对探测光束和回波进行准直、汇聚等整形,以满足激光雷达10的探测和回波接收要求。相对于现有的设置相互独立的发射镜头和接收镜头的激光雷达,本实施例中探测光束和回波共用收发光学单元16,能够减少激光雷达10中光学元件的数量,进一步减小激光雷达的体积。According to a preferred embodiment of the present disclosure, as shown in FIG4 , the laser radar 10 further includes a transceiver optical unit 16 (e.g., the lens group shared by the transmitting unit and the receiving unit described above), wherein the transceiver optical unit 16 is configured to receive the detection beam L from the spectroscopic unit 13, and transmit the detection beam L to the outside of the laser radar 10, and the transceiver optical unit 16 is also used to receive the echo L′, and guide the echo L′ to the spectroscopic unit 13. The transceiver optical unit 16 can be a lens or a lens group, which is used to collimate, converge, and other shaping of the detection beam and the echo to meet the detection and echo reception requirements of the laser radar 10. Compared with the existing laser radars with independent transmitting lenses and receiving lenses, the detection beam and the echo share the transceiver optical unit 16 in this embodiment, which can reduce the number of optical elements in the laser radar 10 and further reduce the size of the laser radar.
在本公开的优选实施例中,如图5所示,激光雷达10还包括如上参考图1和图2描述的光学整形单元100,光学整形单元100设置在发射单元11和分光单元13之间的光路中,本实施例中发射单元11具有发光面,探测光束L由发光面发射,并且光学整形单元100设置成调节发射单元11发射的探测光束的光斑形状,以将发射单元11的发光面形成缩小的发光面11′,上文参考图1和图2描述的光学整形单元100的特征均可以单独地或者以任意组合的方式结合到本实施例中。关于光学整形单元100的特征不再赘述。In a preferred embodiment of the present disclosure, as shown in FIG5 , the laser radar 10 further includes an optical shaping unit 100 as described above with reference to FIG1 and FIG2 , and the optical shaping unit 100 is arranged in the optical path between the transmitting unit 11 and the light splitting unit 13 , and in this embodiment, the transmitting unit 11 has a light emitting surface, and the detection light beam L is emitted by the light emitting surface, and the optical shaping unit 100 is arranged to adjust the light spot shape of the detection light beam emitted by the transmitting unit 11 to form the light emitting surface of the transmitting unit 11 into a reduced light emitting surface 11 ′, and the features of the optical shaping unit 100 described above with reference to FIG1 and FIG2 can be combined into this embodiment individually or in any combination. The features of the optical shaping unit 100 are not repeated here.
图6示出了根据本公开的具体实施例的激光雷达10的发射单元11、光学整形单元100、分光单元13以及接收单元12,其中光学整形单元100包括第一透镜110、第二透镜120和反射部130,第一透镜110位于发射单元11与第二透镜120之间的光路中,其中第一透镜110用于接收发射单元11发射的探测光束,并将探测光束出射到第二透镜120处,探测光束经第二透镜120出射,并在光路下游形成发射单元11的缩小的发光面11′,将缩小的发光面11′视为虚拟的发射单元,缩小了发射单元的发光面尺寸,提高了功率密度。从第二透镜120处出射的探测光束可以经过分光单元13,向激光雷达10的外部发射。根据本公开的不同实施例,探测光束由第一透镜110向第二透镜120传输的过程中,可以通过用于改变光束方向的光学器件改变其传播方向,例如通过反射部130。本实施例中,在发射单元11的发光功率不发生变化的情况下,光学整形单元100用于形成发射单元11缩小的发光面11′,即缩小发光面尺寸,相应的,光学整形单元100能够提高激光雷达发射的探测光束的功率密度。FIG6 shows a transmitting unit 11, an optical shaping unit 100, a spectroscopic unit 13, and a receiving unit 12 of a laser radar 10 according to a specific embodiment of the present disclosure, wherein the optical shaping unit 100 includes a first lens 110, a second lens 120, and a reflector 130, wherein the first lens 110 is located in the optical path between the transmitting unit 11 and the second lens 120, wherein the first lens 110 is used to receive the detection beam emitted by the transmitting unit 11, and emit the detection beam to the second lens 120, wherein the detection beam is emitted through the second lens 120, and forms a reduced light-emitting surface 11′ of the transmitting unit 11 downstream of the optical path, and the reduced light-emitting surface 11′ is regarded as a virtual transmitting unit, thereby reducing the size of the light-emitting surface of the transmitting unit and improving the power density. The detection beam emitted from the second lens 120 can pass through the spectroscopic unit 13 and be emitted to the outside of the laser radar 10. According to different embodiments of the present disclosure, during the transmission of the detection beam from the first lens 110 to the second lens 120, its propagation direction can be changed by an optical device for changing the direction of the beam, for example, by the reflector 130. In this embodiment, when the luminous power of the transmitting unit 11 does not change, the optical shaping unit 100 is used to form a reduced luminous surface 11′ of the transmitting unit 11, that is, to reduce the size of the luminous surface. Accordingly, the optical shaping unit 100 can increase the power density of the detection beam emitted by the laser radar.
在图6的实施例中,第一透镜110的光轴和第二透镜120的光轴相互垂直,反射部130设置成与第一透镜110的光轴之间的夹角成45°角,反射部130设置成与第二透镜120的光轴之间的夹角成45°角,以使发射单元11发射的探测光束经过反射部130后传播方向偏转90°。本实施例中探测光束的偏转角度与激光雷达10中的分光单元13的位置和设 置形式相对应,例如分光单元13的分光面设置为45°角度倾斜,如图6所示,其中探测光束经过分光单元13偏转90°后向激光雷达10的外部引导,回波经过分光单元13后,沿原方向继续延伸至接收单元12。当然,分光单元13相对于发射单元11和接收单元12的角度也可以其他数值,例如使图6中所示的分光单元13旋转一定的角度,相应的,探测光束入射到分光单元13的角度进行调整,第一透镜110和第二透镜120光轴之间的角度和反射部130的位置也随之进行调整。In the embodiment of FIG. 6 , the optical axis of the first lens 110 and the optical axis of the second lens 120 are perpendicular to each other, and the reflector 130 is set to form an angle of 45° with the optical axis of the first lens 110, and the reflector 130 is set to form an angle of 45° with the optical axis of the second lens 120, so that the detection beam emitted by the transmitting unit 11 deflects 90° after passing through the reflector 130. The deflection angle of the detection beam in this embodiment is related to the position and setting of the spectroscopic unit 13 in the laser radar 10. For example, the splitting surface of the splitting unit 13 is set to be inclined at an angle of 45°, as shown in FIG6 , wherein the detection beam is deflected 90° after passing through the splitting unit 13 and guided to the outside of the laser radar 10, and the echo continues to extend to the receiving unit 12 along the original direction after passing through the splitting unit 13. Of course, the angle of the splitting unit 13 relative to the transmitting unit 11 and the receiving unit 12 can also be other values, for example, the splitting unit 13 shown in FIG6 is rotated by a certain angle, and accordingly, the angle at which the detection beam is incident on the splitting unit 13 is adjusted, and the angle between the optical axes of the first lens 110 and the second lens 120 and the position of the reflecting part 130 are also adjusted accordingly.
本公开的不同实施例中可以选择不同结构的分光单元13,例如图7A-图7D所示,分光单元13可以设置为偏振分光棱镜(图7A)、偏振片分光(图7B)、小孔分光(图7C)、局部反射镜分光(图7D)等不同的方式,以将探测光束向激光雷达10的外部引导,并将回波引导至接收单元12。在选择不同分光单元13结构时,探测光束和回波的光路也会发生相应的改变,分光单元13的结构形式与发射单元11、发射单元11缩小的发光面11′和接收单元12的位置匹配即可,在本公开的不同实施例中不限制分光单元13的具体结构。In different embodiments of the present disclosure, different structures of the spectroscopic unit 13 can be selected. For example, as shown in FIG. 7A-FIG. 7D, the spectroscopic unit 13 can be set to different methods such as polarization spectroscopic prism (FIG. 7A), polarizing plate spectroscopic (FIG. 7B), pinhole spectroscopic (FIG. 7C), and local reflector spectroscopic (FIG. 7D) to guide the detection beam to the outside of the laser radar 10 and guide the echo to the receiving unit 12. When different structures of the spectroscopic unit 13 are selected, the optical paths of the detection beam and the echo will also change accordingly. The structural form of the spectroscopic unit 13 can be matched with the position of the transmitting unit 11, the reduced light-emitting surface 11′ of the transmitting unit 11, and the receiving unit 12. The specific structure of the spectroscopic unit 13 is not limited in different embodiments of the present disclosure.
进一步的,如图5所示,根据本公开的优选实施例,激光雷达10还包括扫描器18,所述扫描器18用于接收来自收发光学单元16发射的探测光束,通过扫描器18对激光雷达的视场范围进行覆盖,同时扫描器18还用于将回波反射到收发光学单元16处。扫描器18设置在收发光学单元16朝向激光雷达10外的一侧,例如通过可控的转动,以改变探测光束的出射角度,实现对激光雷达视场范围的探测,具体可以是振镜、摆镜、电流计镜和多面转镜中的一种,进一步的,扫描器18在水平方向上进行扫描,同时记录反射镜的旋转角度,即可对应计算产生回波的障碍物相对于激光雷达10的角度。Further, as shown in FIG5 , according to a preferred embodiment of the present disclosure, the laser radar 10 further includes a scanner 18, and the scanner 18 is used to receive the detection beam emitted from the transceiver optical unit 16, and the field of view of the laser radar is covered by the scanner 18, and the scanner 18 is also used to reflect the echo to the transceiver optical unit 16. The scanner 18 is arranged on the side of the transceiver optical unit 16 facing the outside of the laser radar 10, for example, by controllable rotation to change the emission angle of the detection beam, so as to detect the field of view of the laser radar, and specifically can be one of a galvanometer mirror, a swing mirror, a galvanometer mirror and a multi-faceted rotating mirror. Further, the scanner 18 scans in the horizontal direction and records the rotation angle of the reflector at the same time, so as to calculate the angle of the obstacle generating the echo relative to the laser radar 10.
在本公开的优选实施例中,发射单元11包括由多个激光器组成的激光器阵列,激光器阵列设置在电路板15上,所述激光器可以是VCSEL(垂直腔面发射激光器),相应的,接收单元12也包括多个探测器组成的探测器阵列,同样设置在电路板15上。所述探测器可以是单光子探测器,如SPAD(单光子雪崩二极管)或Si PM(硅光电倍增管)。激光雷达10包括多个光学整形单元100和多个分光单元13,其中一个收发光学模组包括一个光学整形单元100和一个分光单元13,一个收发光学模组与激光器阵列中的一个激光器和探测器阵列中的一个探测器对应。为提高激光雷达10的探测范围和探测效率,发射单元11中的多个激光器可以和接收单元12中的多个探测器一一对应,组成多个探测通道,每个探测通道例如对应一个探测方向,以此覆盖激光雷达10的探测范围。In a preferred embodiment of the present disclosure, the transmitting unit 11 includes a laser array composed of a plurality of lasers, and the laser array is arranged on a circuit board 15. The laser may be a VCSEL (vertical cavity surface emitting laser). Correspondingly, the receiving unit 12 also includes a detector array composed of a plurality of detectors, which are also arranged on the circuit board 15. The detector may be a single photon detector, such as a SPAD (single photon avalanche diode) or a Si PM (silicon photomultiplier tube). The laser radar 10 includes a plurality of optical shaping units 100 and a plurality of light splitting units 13, wherein one of the transceiver optical modules includes an optical shaping unit 100 and a light splitting unit 13, and one of the transceiver optical modules corresponds to a laser in the laser array and a detector in the detector array. In order to improve the detection range and detection efficiency of the laser radar 10, the plurality of lasers in the transmitting unit 11 may correspond one-to-one with the plurality of detectors in the receiving unit 12 to form a plurality of detection channels, each detection channel corresponding to a detection direction, for example, to cover the detection range of the laser radar 10.
在本实施例中,光学整形单元100和分光单元13与激光器和探测器一一对应,即一个激光器发射的探测光束经过光学整形单元100后,提高功率密度,并入射到分光单元13,由分光单元13向激光雷达10的外部引导探测光束,探测光束在被障碍物反射后形成回波,回波被分光单元13引导至对应的接收器,完成一次探测过程。In this embodiment, the optical shaping unit 100 and the spectroscopic unit 13 correspond to the laser and the detector one by one, that is, the detection beam emitted by a laser increases its power density after passing through the optical shaping unit 100 and is incident on the spectroscopic unit 13. The spectroscopic unit 13 guides the detection beam to the outside of the laser radar 10. After being reflected by an obstacle, the detection beam forms an echo, which is guided by the spectroscopic unit 13 to the corresponding receiver, completing a detection process.
根据本公开的另一些实施例,其中发射单元11包括设置在电路板15上的多组激光器阵列,接收单元12包括设置在电路板15上的多组探测器阵列。激光雷达10中同样包括多个光学整形单元100和多个分光单元13,一个收发光学模组包括一个光学整形单元100和一个分光单元13。分光单元13设置在其对应的光学整形单元100的(探测)光路下游,一个收发光学模组对应一组激光器阵列和一组探测器阵列,例如一组激光器阵 列中的多个激光器共同对应一个光学整形单元100,发射的探测光束经过该光学整形单元100后,形成多个缩小的发光面,并通过分光单元13向激光雷达的外部出射,相应的回波被该分光单元13接收引导至对应的探测器阵列,例如对应探测器阵列中多个探测器,完成一次探测过程。另外,一组激光器阵列中的多个激光器也可以分时发射,并由相应的探测器接收对应的回波,完成一次探测过程。According to other embodiments of the present disclosure, the transmitting unit 11 includes multiple groups of laser arrays arranged on the circuit board 15, and the receiving unit 12 includes multiple groups of detector arrays arranged on the circuit board 15. The laser radar 10 also includes multiple optical shaping units 100 and multiple light splitting units 13. One transceiver optical module includes one optical shaping unit 100 and one light splitting unit 13. The light splitting unit 13 is arranged downstream of the (detection) optical path of the corresponding optical shaping unit 100. One transceiver optical module corresponds to a group of laser arrays and a group of detector arrays, for example, a group of laser arrays. The multiple lasers in the column correspond to one optical shaping unit 100. After the emitted detection beam passes through the optical shaping unit 100, it forms multiple reduced light-emitting surfaces and is emitted to the outside of the laser radar through the light splitting unit 13. The corresponding echo is received by the light splitting unit 13 and guided to the corresponding detector array, for example, to the multiple detectors in the corresponding detector array, to complete a detection process. In addition, multiple lasers in a group of laser arrays can also be emitted in time division, and the corresponding echo is received by the corresponding detector to complete a detection process.
根据本公开的另一些实施例,发射单元11包括由多个激光器组成的激光器阵列,激光器阵列设置在电路板15上,所述激光器例如为垂直腔面发射激光器VCSEL,所述VCSEL可以是大尺寸面阵激光器(如3mm*5mm),且具有面阵排布的发光点,大面阵VCSEL可以分区域单独选通点亮(例如面阵VCSEL中行/列单独受控点亮),从而根据实际需求形成不同的发光区域,发射探测光束。具体地,如图9A所示,激光雷达包括2个发射单元1,每个发射单元1包括3个大面阵VCSEL,图中左侧发射单元1中的3个VCSEL与右侧发射单元1中的3个VCSEL沿垂直方向相互交错,相互交错的6个VCSEL分别探测激光雷达的垂直视场的不同区域,通过相互交错的6个VCSEL,实现激光雷达整个垂直视场的探测,当然,图9A中所示的6个VCSEL仅为示例,在具体应用中可以根据实际的工作需求,选择不同数量的VCSEL;相应地,如图9A所示,激光雷达包括1个接收单元2,该接收单元2包括设置在电路板上的探测器,所述探测器例如可以为SPAD阵列,该SPAD阵列中各SPAD可以单独选通激活。探测器中的区域可单独激活,具体的,SPAD阵列中一个或多个SPAD激活,形成激活的区域。根据上述大面阵VCSEL的发光区域激活SAPD阵列中的对应区域中的SPAD,从而VCSEL中的多个选通区域与SPAD阵列中对应的多个激活区域一一对应组成多个探测通道,每个探测通道例如对应一个探测方向,以此覆盖激光雷达10的探测范围。According to some other embodiments of the present disclosure, the emitting unit 11 includes a laser array composed of a plurality of lasers, and the laser array is arranged on a circuit board 15. The laser is, for example, a vertical cavity surface emitting laser VCSEL. The VCSEL may be a large-size planar array laser (such as 3mm*5mm) and has light-emitting points arranged in a planar array. The large planar array VCSEL can be individually selected and lit in different areas (for example, rows/columns in the planar array VCSEL are individually controlled to light up), thereby forming different light-emitting areas according to actual needs and emitting detection beams. Specifically, as shown in FIG9A , the laser radar includes two transmitting units 1, each transmitting unit 1 includes three large-area array VCSELs, and the three VCSELs in the transmitting unit 1 on the left and the three VCSELs in the transmitting unit 1 on the right are interlaced in the vertical direction. The six interlaced VCSELs detect different areas of the vertical field of view of the laser radar respectively, and the detection of the entire vertical field of view of the laser radar is achieved through the six interlaced VCSELs. Of course, the six VCSELs shown in FIG9A are only examples, and different numbers of VCSELs can be selected according to actual work requirements in specific applications; accordingly, as shown in FIG9A , the laser radar includes a receiving unit 2, and the receiving unit 2 includes a detector arranged on a circuit board, and the detector can be, for example, a SPAD array, and each SPAD in the SPAD array can be individually gated and activated. The area in the detector can be activated individually, and specifically, one or more SPADs in the SPAD array are activated to form an activated area. According to the light-emitting area of the large-array VCSEL, the SPAD in the corresponding area of the SAPD array is activated, so that multiple selection areas in the VCSEL and the corresponding multiple activation areas in the SPAD array correspond one by one to form multiple detection channels. Each detection channel corresponds to a detection direction, for example, to cover the detection range of the laser radar 10.
在本实施例中,光学整形单元100和分光单元13与激光器的选通区域和探测器的激活区域一一对应,即激光器的一个选通区域发射的探测光束经过光学整形单元100后,提高功率密度,并入射到分光单元13,由分光单元13向激光雷达10的外部引导探测光束,探测光束在被障碍物反射后形成回波,回波被分光单元13引导至对应的接收器的激活区域,完成一次探测过程。In this embodiment, the optical shaping unit 100 and the spectroscopic unit 13 correspond one-to-one to the selection area of the laser and the activation area of the detector, that is, the detection light beam emitted from a selection area of the laser increases its power density after passing through the optical shaping unit 100 and is incident on the spectroscopic unit 13. The spectroscopic unit 13 guides the detection light beam to the outside of the laser radar 10. After being reflected by an obstacle, the detection light beam forms an echo, which is guided by the spectroscopic unit 13 to the activation area of the corresponding receiver, completing a detection process.
根据本公开的另一实施例中激光雷达10的具体结构,其中激光雷达10包括发射单元11、光学整形单元100、接收单元12、分光单元13和数据处理单元14,发射单元11和接收单元12如前述实施例中的发射单元和接收单元,分别用于发射探测光束和接收障碍物上反射产生的回波,并转换为电信号,在此不再赘述。According to the specific structure of the laser radar 10 in another embodiment of the present disclosure, the laser radar 10 includes a transmitting unit 11, an optical shaping unit 100, a receiving unit 12, a spectroscopic unit 13 and a data processing unit 14. The transmitting unit 11 and the receiving unit 12 are like the transmitting unit and the receiving unit in the aforementioned embodiment, which are respectively used to transmit a detection light beam and receive an echo generated by reflection on an obstacle, and convert them into electrical signals, which will not be repeated here.
本实施例中的激光雷达10利用光学整形单元100对发射单元11的发光面发射的探测光束进行整形,具体例如前述实施例中的光学整形单元,能够提高激光雷达发射的探测光束的功率密度,进而实现发射单元11和接收单元12共用同一收发光学单元16。光学整形单元100和分光单元13相互配合,能够使发射单元11和接收单元12使用同一镜头,简化激光雷达10中的光学元器件结构。同时,根据本公开的优选实施例,光学整形单元100还可以用于改变探测光束的光路,可以调整发射单元11的设置位置,有助于优化激光雷达10内部的结构布置,例如发射单元11和接收单元12可以设置在同一电路 板上,如图5所示,也可以将发射单元11设置在激光雷达10内部适当的其他位置,提高了激光雷达10内部元器件设置的灵活性。The laser radar 10 in this embodiment uses the optical shaping unit 100 to shape the detection light beam emitted by the light-emitting surface of the transmitting unit 11. For example, the optical shaping unit in the aforementioned embodiment can improve the power density of the detection light beam emitted by the laser radar, thereby enabling the transmitting unit 11 and the receiving unit 12 to share the same transceiver optical unit 16. The optical shaping unit 100 and the spectroscopic unit 13 cooperate with each other, so that the transmitting unit 11 and the receiving unit 12 can use the same lens, simplifying the structure of optical components in the laser radar 10. At the same time, according to the preferred embodiment of the present disclosure, the optical shaping unit 100 can also be used to change the optical path of the detection light beam, and can adjust the setting position of the transmitting unit 11, which helps to optimize the internal structural layout of the laser radar 10. For example, the transmitting unit 11 and the receiving unit 12 can be set in the same circuit. As shown in FIG. 5 , the transmitting unit 11 may also be disposed at other appropriate positions inside the laser radar 10 , thereby increasing the flexibility of the arrangement of components inside the laser radar 10 .
在本公开的一些实施例中,一个收发光学模组包括一个光学整形单元100和一个分光单元13。具体的,一个收发光学模组对应一个激光器和一个探测器,即一个激光器、一个光学整形单元100、一个分光单元13和一个探测器组成一个探测通道,激光雷达中包括多个探测通道,以满足探测范围的要求。或者,一个收发光学模组同时对应多个探测通道,例如一个收发光学模组覆盖包括多个激光器的一组激光器阵列和包括多个探测器的一组探测器阵列,一组激光器阵列对应一个光学整形单元100,一组探测器阵列对应一个分光单元13,共同组成多个探测通道。或者,发射单元11包括面阵VCSEL,其中具有多个可单独选通的发光区域,每个选通的发光区域可以发射一束探测光束,接收单元12包括SPAD阵列,其中各SPAD可以单独选通激活,一个收发光学模组对应面阵VCSEL中的一个选通区域和SPAD阵列中的一个激活区域,激光器的一个选通区域对应一个光学整形单元100,探测器的一个激活区域对应一个分光单元13,共同组成多个探测通道。In some embodiments of the present disclosure, a transceiver optical module includes an optical shaping unit 100 and a spectroscopic unit 13. Specifically, a transceiver optical module corresponds to a laser and a detector, that is, a laser, an optical shaping unit 100, a spectroscopic unit 13 and a detector constitute a detection channel, and the laser radar includes multiple detection channels to meet the requirements of the detection range. Alternatively, a transceiver optical module corresponds to multiple detection channels at the same time, for example, a transceiver optical module covers a group of laser arrays including multiple lasers and a group of detector arrays including multiple detectors, a group of laser arrays corresponds to an optical shaping unit 100, and a group of detector arrays corresponds to a spectroscopic unit 13, which together constitute multiple detection channels. Alternatively, the transmitting unit 11 includes a planar array VCSEL having multiple individually selectable light-emitting areas, each selected light-emitting area can emit a detection light beam, the receiving unit 12 includes a SPAD array, each SPAD can be individually selected and activated, a transceiver optical module corresponds to a selected area in the planar array VCSEL and an activated area in the SPAD array, a selected area of the laser corresponds to an optical shaping unit 100, and an activated area of the detector corresponds to a spectroscopic unit 13, which together constitute multiple detection channels.
图8示出了可用于激光雷达的收发光学模组30的实施例,其中收发光学模组30包括光学整形单元31和分光单元32,具体的,光学整形单元31和分光单元32可以如前述实施例中所述的结构,光学整形单元31设置成接收激光雷达的发射单元1发射的探测光束并将探测光束发射到分光单元32处。同时光学整形单元31还能够将发射单元1的发光面形成缩小的发光面,以提高激光雷达发射的探测光束的功率密度,具体的,本实施例中的光学整形单元31可以是前述实施例中的光学整形单元100。FIG8 shows an embodiment of a transceiver optical module 30 that can be used for a laser radar, wherein the transceiver optical module 30 includes an optical shaping unit 31 and a spectroscopic unit 32. Specifically, the optical shaping unit 31 and the spectroscopic unit 32 can be structures as described in the above embodiments, and the optical shaping unit 31 is configured to receive a detection beam emitted by a transmitting unit 1 of the laser radar and emit the detection beam to the spectroscopic unit 32. At the same time, the optical shaping unit 31 can also form a reduced light-emitting surface of the transmitting unit 1 to improve the power density of the detection beam emitted by the laser radar. Specifically, the optical shaping unit 31 in this embodiment can be the optical shaping unit 100 in the above embodiments.
分光单元32设置成从光学整形单元31接收探测光束并向激光雷达外部引导探测光束,并且分光单元32还接收回波,将回波引导到激光雷达的接收单元2处。分光单元32可以采用前述实施例中提供的任意一种或多种分光单元32的形式。The spectroscopic unit 32 is configured to receive the detection beam from the optical shaping unit 31 and guide the detection beam to the outside of the laser radar, and the spectroscopic unit 32 also receives the echo and guides the echo to the receiving unit 2 of the laser radar. The spectroscopic unit 32 can take the form of any one or more spectroscopic units 32 provided in the aforementioned embodiments.
如图9A所示,在本公开的一个实施例中光学整形单元31和激光雷达的发射单元1中的激光器或激光器的选通区域一一对应,分光单元32同样设置为与激光雷达的接收单元2中的探测器或探测器的激活区域一一对应。或者如图9B所示,在本公开的另一实施例中,一个光学整形单元31对应于激光雷达的发射单元1中的一组多个激光器或一个激光器的多个选通区域,一个分光单元32对应于激光雷达的接收单元2中的一组多个探测器或一个探测器的多个激活区域。例如发射单元1中一组多个激光器排列为条状,光学整形单元31中的入光面也可以设置成连续的表面,以覆盖对应的多个激光器或一个激光器的多个选通区域。同样的,光学整形单元31的出光面同样可以设置为连续表面,分光单元32同样可以设置为条状,以与接收单元2中的一组多个探测器或一个探测器的多个激活区域对应,分光单元32可以设置成一个整体,也可以是多个分体结构组合而成。As shown in FIG9A, in one embodiment of the present disclosure, the optical shaping unit 31 corresponds to the laser or the laser gating area in the transmitting unit 1 of the laser radar, and the spectroscopic unit 32 is also set to correspond to the detector or the activation area of the detector in the receiving unit 2 of the laser radar. Or as shown in FIG9B, in another embodiment of the present disclosure, an optical shaping unit 31 corresponds to a group of multiple lasers or multiple gating areas of a laser in the transmitting unit 1 of the laser radar, and a spectroscopic unit 32 corresponds to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2 of the laser radar. For example, a group of multiple lasers in the transmitting unit 1 are arranged in strips, and the light incident surface in the optical shaping unit 31 can also be set as a continuous surface to cover the corresponding multiple lasers or multiple gating areas of a laser. Similarly, the light exit surface of the optical shaping unit 31 can also be set as a continuous surface, and the spectroscopic unit 32 can also be set as a strip to correspond to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2. The spectroscopic unit 32 can be set as a whole or a combination of multiple split structures.
在本公开的另一些实施例中,发射单元1中包括设置在电路板上的多组激光器阵列,每一组激光器阵列中包括多个激光器,同样的,接收单元2中包括设置在电路板上的多组探测器阵列,每一组探测器阵列中包括多个探测器。光学整形单元31和分光单元32同样具有多个,一个收发光学模组30包括一个光学整形单元31和一个分光单元32, 一个收发光学模组30对应一组激光器阵列、一组探测器阵列相对应。即在本实施例中,一个光学整形单元31以及其对应的分光单元32,与一组激光器阵列和一组探测器阵列组成一个探测通道。In some other embodiments of the present disclosure, the transmitting unit 1 includes multiple groups of laser arrays arranged on a circuit board, each group of laser arrays includes multiple lasers, and similarly, the receiving unit 2 includes multiple groups of detector arrays arranged on a circuit board, each group of detector arrays includes multiple detectors. The optical shaping unit 31 and the light splitting unit 32 also have multiple, and a transceiver optical module 30 includes an optical shaping unit 31 and a light splitting unit 32, One transceiver optical module 30 corresponds to a group of laser arrays and a group of detector arrays. That is, in this embodiment, one optical shaping unit 31 and its corresponding light splitting unit 32, a group of laser arrays and a group of detector arrays form a detection channel.
如图9B所示,其中示出了两组激光器阵列、两组探测器阵列以及两个收发光学模组30(每个收发光学模组包括一个光学整形单元31和一个分光单元32),两个收发光学模组30错位设置。As shown in FIG. 9B , two groups of laser arrays, two groups of detector arrays and two transceiver optical modules 30 (each transceiver optical module includes an optical shaping unit 31 and a light splitting unit 32 ) are shown, and the two transceiver optical modules 30 are staggered.
根据本公开的具体实施例,发射单元11的激光器和接收单元12的探测器以及对应的光学整形单元100、分光单元13可以封装在一起,将封装后的结构整体设置在电路板15上。也可以在电路板15上分别设置发射单元11的激光器和接收单元12的探测器,进行定位安装,并将光学整形单元100和分光单元13设置在预设位置处,使收发光学模组与激光器、探测器对应,例如首先在电路板15的不同位置上设置发射单元11的激光器和接收单元12的探测器,然后将光学整形单元100和分光单元13安装在与发射单元11的激光器和接收单元13的探测器对应的位置处。According to a specific embodiment of the present disclosure, the laser of the transmitting unit 11 and the detector of the receiving unit 12 and the corresponding optical shaping unit 100 and the spectroscopic unit 13 can be packaged together, and the packaged structure is set as a whole on the circuit board 15. The laser of the transmitting unit 11 and the detector of the receiving unit 12 can also be set on the circuit board 15 respectively, and positioned and installed, and the optical shaping unit 100 and the spectroscopic unit 13 are set at a preset position, so that the transceiver optical module corresponds to the laser and the detector. For example, the laser of the transmitting unit 11 and the detector of the receiving unit 12 are first set at different positions of the circuit board 15, and then the optical shaping unit 100 and the spectroscopic unit 13 are installed at positions corresponding to the laser of the transmitting unit 11 and the detector of the receiving unit 13.
另外,由背景技术可知,现有技术的激光雷达存在收发对准的问题。为解决所述技术问题,本公开提供一种激光雷达芯片,包括:基板;光发射装置阵列,所述光发射装置阵列位于所述基板上;光接收装置阵列,所述光接收装置阵列位于所述光发射装置阵列一侧的基板上;分光单元,所述分光单元配置成传输所述光发射装置阵列产生的探测光;所述探测光经目标反射形成回波光;所述分光单元还配置成传输所述回波光至所述光接收装置阵列;封装体,所述封装体位于所述基板上并封装所述光发射装置阵列、所述光接收装置阵列和所述分光单元。In addition, it can be known from the background technology that the laser radar of the prior art has the problem of alignment between transmission and reception. In order to solve the technical problem, the present disclosure provides a laser radar chip, including: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices; a package body, the package body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
所述激光雷达芯片中,所述光发射装置阵列和所述光接收装置阵列合封于同一芯片内,基于芯片封装工艺,可以将所述光发射装置阵列、所述光接收装置阵列贴片精度控制到微米(μm)量级,能够有效保证各通道中激光器的发射视场和探测器的接收视场之间的高精度对准;而且所述光发射装置阵列、所述光接收装置阵列和所述分光单元均位于同一基板上,能够有效降低装配精度、以及在激光雷达使用过程中由于温度变化、机械形变等过程对发射视场和接收视场的影响。激光雷达中,所述光发射装置阵列和所述光接收装置阵列共用光学组件和扫描装置,能够有效克服由于光学组件中透镜组光轴偏移、扫描装置位置偏移等对各通道中激光器的发射视场和探测器的接收视场之间对准精度的影响。所以,本公开的方案能够有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。In the laser radar chip, the light emitting device array and the light receiving device array are sealed in the same chip. Based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the light splitting unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar. In the laser radar, the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.
为使本公开的上述目的、特征和优点能够更为明显易懂,下面结合附图10-21对本公开的具体实施例做详细的说明。In order to make the above-mentioned objects, features and advantages of the present disclosure more obvious and understandable, the specific embodiments of the present disclosure are described in detail below with reference to Figures 10-21.
参考图10,示出了本公开激光雷达芯片一实施例的剖面结构示意图。Referring to FIG10 , there is shown a schematic cross-sectional structure diagram of an embodiment of a laser radar chip disclosed herein.
所述激光雷达芯片包括:基板300;光发射装置阵列310(光发射装置例如可以是前述实施例中激光雷达10中的发射单元11),所述光发射装置阵列310位于所述基板300上;光接收装置阵列320(光接收装置阵列320例如可以是前述实施例中激光雷达10中的接收单元12),所述光接收装置阵列320位于所述光发射装置阵列310一侧的基板300 上;分光单元330,所述分光单元330配置成传输所述光发射装置阵列310产生的探测光301(本实施例中的分光单元330例如可以包括前述实施例中激光雷达10中的分光单元13,在本公开的另一些实施例中分光单元330还可以包括其他的光学元件,例如前述实施例中的光学整形单元,具体在后续实施例中说明);所述探测光301经目标反射形成回波光302;所述分光单元330还配置成传输所述回波光302至所述光接收装置阵列320;封装体340,所述封装体340位于所述基板300上并封装所述光发射装置阵列310、所述光接收装置阵列320和所述分光单元330。The laser radar chip includes: a substrate 300; a light emitting device array 310 (the light emitting device may be, for example, the emitting unit 11 in the laser radar 10 in the aforementioned embodiment), the light emitting device array 310 being located on the substrate 300; a light receiving device array 320 (the light receiving device array 320 may be, for example, the receiving unit 12 in the laser radar 10 in the aforementioned embodiment), the light receiving device array 320 being located on one side of the substrate 300 of the light emitting device array 310 on; a spectroscopic unit 330, wherein the spectroscopic unit 330 is configured to transmit the detection light 301 generated by the light emitting device array 310 (the spectroscopic unit 330 in this embodiment may, for example, include the spectroscopic unit 13 in the laser radar 10 in the aforementioned embodiment, and in other embodiments of the present disclosure, the spectroscopic unit 330 may also include other optical elements, such as the optical shaping unit in the aforementioned embodiment, which will be specifically described in subsequent embodiments); the detection light 301 is reflected by the target to form an echo light 302; the spectroscopic unit 330 is also configured to transmit the echo light 302 to the light receiving device array 320; a package body 340, wherein the package body 340 is located on the substrate 300 and encapsulates the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330.
需要说明的是,图10所示探测光301和回波光302的光路仅为一示例。本公开对此不作限制。It should be noted that the optical paths of the detection light 301 and the echo light 302 shown in FIG10 are only an example, and the present disclosure does not limit this.
所述光发射装置阵列310和所述光接收装置阵列320合封于同一芯片内,基于芯片封装工艺,可以将所述光发射装置阵列310、所述光接收装置阵列320在基板上贴片精度控制到微米(μm)量级,能够有效保证各通道激光器的发射视场和探测器的接收视场高精度对准;而且所述光发射装置阵列310、所述光接收装置阵列320和所述分光单元330均位于同一基板300上,能够有效降低装配精度、以及在激光雷达使用过程中由于温度变化、机械形变等过程对发射视场和接收视场的影响。The light emitting device array 310 and the light receiving device array 320 are sealed in the same chip. Based on the chip packaging process, the mounting accuracy of the light emitting device array 310 and the light receiving device array 320 on the substrate can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of each channel laser and the receiving field of view of the detector; and the light emitting device array 310, the light receiving device array 320 and the spectrometer unit 330 are all located on the same substrate 300, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
应用于激光雷达时,本公开的方案能够有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。When applied to laser radar, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is beneficial to reducing the cost of the laser radar, improving the reliability of the laser radar, and realizing high-line-count laser radar.
下面结合附图详细说明本公开激光雷达芯片实施例的技术方案。The technical solution of the laser radar chip embodiment of the present invention is described in detail below with reference to the accompanying drawings.
所述基板300用于承载其上设置的器件,还用以实现器件与外部电路以及电路板之间的电连接。The substrate 300 is used to carry the devices disposed thereon, and is also used to realize electrical connection between the devices and external circuits and circuit boards.
需要说明的是,一些实施例中,所述基板300具有导电结构,所述导电结构用以实现电连接。It should be noted that, in some embodiments, the substrate 300 has a conductive structure, and the conductive structure is used to achieve electrical connection.
所述光发射装置阵列310位于所述基板300的一个表面上,用以产生探测光301。所述光接收装置阵列320位于所述光发射装置阵列310一侧的基板300上,用以接收回波光302。The light emitting device array 310 is located on one surface of the substrate 300 to generate detection light 301. The light receiving device array 320 is located on the substrate 300 at one side of the light emitting device array 310 to receive echo light 302.
结合参考图11,本公开一些实施例中,所述光发射装置阵列310包括多个呈阵列排布的光发射装置,光发射装置包括激光器311,多个所述激光器311在所述基板300上呈阵列排布;所述光接收装置阵列320包括多个探测器321,多个所述探测器321在所述基板300上呈阵列排布。With reference to Figure 11, in some embodiments of the present disclosure, the light emitting device array 310 includes a plurality of light emitting devices arranged in an array, the light emitting device includes a laser 311, and the plurality of lasers 311 are arranged in an array on the substrate 300; the light receiving device array 320 includes a plurality of detectors 321, and the plurality of detectors 321 are arranged in an array on the substrate 300.
需要说明的是,本公开一些实施例中,所述激光器311为垂直腔面发射激光器,即Vertical Cavity Surface Emitting Laser,VCSEL。本公开一些实施例中,所述探测器321为单光子探测器,例如单光子雪崩二极管(Single Photon Avalanche Diode,SPAD)、硅光电倍增管(Silicon photomultiplier,SiPM)。It should be noted that, in some embodiments of the present disclosure, the laser 311 is a vertical cavity surface emitting laser, that is, Vertical Cavity Surface Emitting Laser, VCSEL. In some embodiments of the present disclosure, the detector 321 is a single photon detector, such as a single photon avalanche diode (SPAD) or a silicon photomultiplier (SiPM).
如图11所示,多个所述激光器311在所述基板300的表面呈一维阵列排布,所述光发射装置阵列310呈线阵排列;多个所述探测器321在所述基板300的表面呈一维阵列排布,所述光接收装置阵列320呈线阵排列。 As shown in FIG. 11 , the plurality of lasers 311 are arranged in a one-dimensional array on the surface of the substrate 300 , and the light emitting device array 310 is arranged in a linear array; the plurality of detectors 321 are arranged in a one-dimensional array on the surface of the substrate 300 , and the light receiving device array 320 is arranged in a linear array.
继续参考图10和图11,本公开一些实施例中,所述激光雷达芯片还包括:光发射装置驱动模块312,所述光发射装置驱动模块312位于所述基板300上,与所述光发射装置阵列310、所述基板300电连接;光接收装置驱动模块322,所述光接收装置驱动模块322位于所述基板300上,与所述光接收装置阵列320、所述基板300电连接。Continuing to refer to Figures 10 and 11, in some embodiments of the present disclosure, the laser radar chip also includes: a light emitting device driving module 312, the light emitting device driving module 312 is located on the substrate 300, and is electrically connected to the light emitting device array 310 and the substrate 300; a light receiving device driving module 322, the light receiving device driving module 322 is located on the substrate 300, and is electrically connected to the light receiving device array 320 and the substrate 300.
图10和图11所示的一些实施例中,采用平铺结构在基板300上设置所述光发射装置阵列310和所述光发射装置驱动模块312。具体的,所述光发射装置阵列310和所述光发射装置驱动模块312设置于所述基板300的同一表面,所述光发射装置驱动模块312位于所述光发射装置阵列310的一侧。In some embodiments shown in FIGS. 10 and 11 , the light emitting device array 310 and the light emitting device driving module 312 are arranged on the substrate 300 in a tiled structure. Specifically, the light emitting device array 310 and the light emitting device driving module 312 are arranged on the same surface of the substrate 300, and the light emitting device driving module 312 is located on one side of the light emitting device array 310.
类似的,采用平铺结构在基板300上设置所述光接收装置阵列320和所述光接收装置驱动模块322。具体的,所述光接收装置阵列320和所述光接收装置驱动模块322设置于所述基板300的同一表面,所述光接收装置驱动模块322位于所述光接收装置阵列320的一侧。Similarly, the light receiving device array 320 and the light receiving device driving module 322 are arranged on the substrate 300 in a tiled structure. Specifically, the light receiving device array 320 and the light receiving device driving module 322 are arranged on the same surface of the substrate 300, and the light receiving device driving module 322 is located on one side of the light receiving device array 320.
本公开一些实施例中,所述光发射装置阵列310和所述光接收装置阵列320位于所述光发射装置驱动模块312和所述光接收装置驱动模块322之间。如图10和图11所示,所述光发射装置阵列310和所述光接收装置阵列320平行设置于所述基板300的表面;所述光发射装置驱动模块312位于所述光发射装置阵列310远离所述光接收装置阵列320的一侧;所述光接收装置驱动模块322位于所述光接收装置阵列320远离所述光发射装置阵列310的一侧,也就是说,所述光发射装置驱动模块312、所述光发射装置阵列310、所述光接收装置阵列320和所述光接收装置驱动模块322依次排列于所述基板300的表面。In some embodiments of the present disclosure, the light emitting device array 310 and the light receiving device array 320 are located between the light emitting device driving module 312 and the light receiving device driving module 322. As shown in FIG10 and FIG11 , the light emitting device array 310 and the light receiving device array 320 are arranged in parallel on the surface of the substrate 300; the light emitting device driving module 312 is located on the side of the light emitting device array 310 away from the light receiving device array 320; the light receiving device driving module 322 is located on the side of the light receiving device array 320 away from the light emitting device array 310, that is, the light emitting device driving module 312, the light emitting device array 310, the light receiving device array 320 and the light receiving device driving module 322 are arranged on the surface of the substrate 300 in sequence.
本公开一些实施例中,通过键合线(bonding wire)的方式实现器件之间的电连接,具体的,所述光发射装置阵列310和所述光发射装置驱动模块312之间、所述光发射装置驱动模块312和所述基板300之间、所述光接收装置阵列320和所述光接收装置驱动模块322之间以及所述光接收装置驱动模块322和所述基板300之间通过键合线实现电连接。In some embodiments of the present disclosure, electrical connection between devices is achieved by means of bonding wires. Specifically, electrical connection is achieved between the light emitting device array 310 and the light emitting device driver module 312, between the light emitting device driver module 312 and the substrate 300, between the light receiving device array 320 and the light receiving device driver module 322, and between the light receiving device driver module 322 and the substrate 300 by means of bonding wires.
具体的,所述光发射装置阵列310的多个所述激光器311、所述光接收装置阵列320的多个所述探测器321以及所述光发射装置驱动模块312和所述光接收装置驱动模块322分别贴片到所述基板300的表面;然后通过键合线分别连接多个激光器311和光发射装置驱动模块312的焊盘以及多个探测器121和光接收装置驱动模块322的焊盘(bonding pad);同样通过键合线分别连接所述光发射装置驱动模块312和基板300以及所述光接收装置驱动模块322与基板300。Specifically, the multiple lasers 311 of the light emitting device array 310, the multiple detectors 321 of the light receiving device array 320, and the light emitting device driving module 312 and the light receiving device driving module 322 are respectively mounted on the surface of the substrate 300; then, the pads of the multiple lasers 311 and the light emitting device driving module 312 and the pads (bonding pads) of the multiple detectors 121 and the light receiving device driving module 322 are respectively connected through bonding wires; similarly, the light emitting device driving module 312 and the substrate 300, and the light receiving device driving module 322 and the substrate 300 are respectively connected through bonding wires.
继续参考图10和图11,所述激光雷达芯片的分光单元330用以传输探测光301和回波光302并使探测光301和回波光302的光路分离。Continuing to refer to FIG. 10 and FIG. 11 , the optical splitting unit 330 of the laser radar chip is used to transmit the detection light 301 and the echo light 302 and to separate the optical paths of the detection light 301 and the echo light 302 .
本公开一些实施例中,所述光发射装置阵列310的出光面背向所述基板300设置,所述光接收装置阵列320的感光面也背向所述基板300设置;所述光发射装置阵列310所产生的探测光301自所述出光面沿背向所述基板300的方向A出射,所述探测光301经激光雷达外部的目标反射所形成的回波光302沿朝向所述基板300的方向入射至所述感光面;所述分光单元330位于所述光发射装置阵列310和所述光接收装置阵列320远离所述 基板300的一侧,用以传输所述探测光301和回波光302,且覆盖所述光发射装置阵列310的出光面和所述光接收装置阵列320的感光面,即在所述基板300的表面,所述出光面的投影和所述感光面的投影均位于所述分光单元330的投影范围内。In some embodiments of the present disclosure, the light emitting surface of the light emitting device array 310 is arranged to face away from the substrate 300, and the photosensitive surface of the light receiving device array 320 is also arranged to face away from the substrate 300; the detection light 301 generated by the light emitting device array 310 is emitted from the light emitting surface along a direction A facing away from the substrate 300, and the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the photosensitive surface along a direction toward the substrate 300; the spectroscopic unit 330 is located at a distance between the light emitting device array 310 and the light receiving device array 320, away from the substrate 300. One side of the substrate 300 is used to transmit the detection light 301 and the echo light 302, and covers the light emitting surface of the light emitting device array 310 and the photosensitive surface of the light receiving device array 320, that is, on the surface of the substrate 300, the projection of the light emitting surface and the projection of the photosensitive surface are both located within the projection range of the spectroscopic unit 330.
需要说明的是,如图10所示的一些具体实施例中,所述激光雷达芯片还包括:透光粘接部350,所述透光粘接部350位于所述分光单元330朝向所述基板300的一侧;所述分光单元330通过所述透光粘接部350与所述光接收装置阵列320和所述光发射装置阵列310固定连接。It should be noted that, in some specific embodiments as shown in FIG. 10 , the laser radar chip further includes: a light-transmitting adhesive portion 350, wherein the light-transmitting adhesive portion 350 is located on the side of the spectroscopic unit 330 facing the substrate 300; the spectroscopic unit 330 is fixedly connected to the light receiving device array 320 and the light emitting device array 310 via the light-transmitting adhesive portion 350.
所述透光粘接部350位于所述光接收装置阵列320和所述光发射装置阵列310之间,用以实现所述分光单元330、所述光接收装置阵列320和所述光发射装置阵列310之间的固定连接。具体的,所述透光粘接部350的材料可以是透光胶材。The light-transmitting adhesive portion 350 is located between the light receiving device array 320 and the light emitting device array 310 to achieve fixed connection between the light splitting unit 330, the light receiving device array 320 and the light emitting device array 310. Specifically, the material of the light-transmitting adhesive portion 350 can be a light-transmitting adhesive material.
继续参考图10,结合参考图12,所述分光单元330包括:分光元件331(分光元件331例如可以是前述图1-图7D所示实施例中的激光雷达10中的分光单元13),所述分光元件331配置为将所述探测光301(图12中白色箭头所示)的光路与所述回波光302(图12中黑色箭头所示)的光路分离,具体的,所述光发射装置阵列310和分光元件331之间探测光301的光路与所述光接收装置阵列320和分光元件331之间回波光302的光路分离,所述分光元件331为偏振分光器。根据本公开的另一个实施例,所述分光元件331也可以是偏振分光棱镜(图7A)、偏振片分光(图7B)、小孔分光(图7C)、局部反射镜分光(图7D)等不同的方式。Continuing to refer to FIG. 10 , in combination with FIG. 12 , the spectroscopic unit 330 includes: a spectroscopic element 331 (the spectroscopic element 331 can be, for example, the spectroscopic unit 13 in the laser radar 10 in the embodiment shown in the aforementioned FIG. 1 to FIG. 7D ), the spectroscopic element 331 is configured to separate the optical path of the detection light 301 (indicated by the white arrow in FIG. 12 ) from the optical path of the echo light 302 (indicated by the black arrow in FIG. 12 ), specifically, the optical path of the detection light 301 between the light emitting device array 310 and the spectroscopic element 331 is separated from the optical path of the echo light 302 between the light receiving device array 320 and the spectroscopic element 331, and the spectroscopic element 331 is a polarization spectrometer. According to another embodiment of the present disclosure, the spectroscopic element 331 can also be a polarization spectroscopic prism (FIG. 7A), polarizer spectroscopic (FIG. 7B), pinhole spectroscopic (FIG. 7C), local reflector spectroscopic (FIG. 7D), and other different methods.
如图12所示的一些实施例中,所述探测光301沿垂直基板300表面的方向自所述光发射装置阵列310出射;所述回波光302沿垂直基板300表面的方向入射至所述光接收装置阵列320;所述分光单元330还包括:光偏转元件332(例如可以是前述实施例中的反射部130),所述光偏转元件332位于所述探测光301的光路中,所述光偏转元件332配置为将所述探测光301偏转至所述分光元件331。In some embodiments as shown in Figure 12, the detection light 301 is emitted from the light emitting device array 310 along a direction perpendicular to the surface of the substrate 300; the echo light 302 is incident on the light receiving device array 320 along a direction perpendicular to the surface of the substrate 300; the spectrometer unit 330 also includes: a light deflection element 332 (for example, it can be the reflection part 130 in the aforementioned embodiment), the light deflection element 332 is located in the optical path of the detection light 301, and the light deflection element 332 is configured to deflect the detection light 301 to the spectrometer element 331.
所述光偏转元件332位于所述分光元件331的一侧,利用所述光偏转元件332偏折所述探测光301,使所述探测光301的光路和回波光302的光路部分平行,具体的,使所述光发射装置阵列310和所述光偏转元件332之间探测光301的光路与所述光接收装置阵列320和分光元件331之间回波光302的光路平行,且所述探测光301和回波光302均垂直所述基板300表面,从而使光发射装置阵列310中多个激光器311和光接收装置阵列320中多个探测器321设置于基板300上,并位于所述分光元件330的同侧。具体的,所述光偏转元件332为棱镜。The light deflection element 332 is located on one side of the light splitting element 331, and the light deflection element 332 is used to deflect the detection light 301, so that the optical path of the detection light 301 and the optical path of the echo light 302 are partially parallel, specifically, the optical path of the detection light 301 between the light emitting device array 310 and the light deflection element 332 is parallel to the optical path of the echo light 302 between the light receiving device array 320 and the light splitting element 331, and the detection light 301 and the echo light 302 are both perpendicular to the surface of the substrate 300, so that the multiple lasers 311 in the light emitting device array 310 and the multiple detectors 321 in the light receiving device array 320 are arranged on the substrate 300 and are located on the same side of the light splitting element 330. Specifically, the light deflection element 332 is a prism.
如图12所示,入射至所述光偏转元件332的探测光301在表面332a发生全反射,以投射至所述分光元件331;所述分光元件331再次折转所述探测光301,从而实现所述探测光301的出射;所述探测光301经激光雷达外部的目标反射所形成的回波光302沿与出射的探测光301共轴的光路入射至所述分光元件331,所述回波光302直接透射所述分光元件331,投射至所述光接收装置阵列320以实现探测。As shown in FIG12 , the detection light 301 incident on the optical deflection element 332 is totally reflected on the surface 332a to be projected onto the spectroscopic element 331; the spectroscopic element 331 folds the detection light 301 again to achieve the emission of the detection light 301; the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the spectroscopic element 331 along an optical path coaxial with the emitted detection light 301, and the echo light 302 directly transmits the spectroscopic element 331 and is projected onto the optical receiving device array 320 to achieve detection.
需要说明的是,如图12所示的一些实施例中,所述光偏转元件332位于所述探测光301的光路中以偏转所述探测光301,所以所述光偏转元件332的位置与所述光发射装置阵列310中的多个激光器311的位置对应,具体如图所示,所述光偏转元件332位于所述 光发射装置阵列310中的激光器311的上方;所述回波光302直接透射所述分光元件331,即所述回波光302的光路方向并不改变,所以所述分光元件331的位置与所述光接收装置阵列320的探测器321的位置对应,具体如图所示,所述分光元件331位于所述光接收装置阵列320的探测器321的上方。It should be noted that, in some embodiments as shown in FIG. 12 , the light deflection element 332 is located in the optical path of the detection light 301 to deflect the detection light 301, so the position of the light deflection element 332 corresponds to the position of the plurality of lasers 311 in the light emitting device array 310. Specifically, as shown in the figure, the light deflection element 332 is located in the The optical element 331 is located above the laser 311 in the optical emitting device array 310; the echo light 302 directly transmits the spectroscopic element 331, that is, the optical path direction of the echo light 302 does not change, so the position of the spectroscopic element 331 corresponds to the position of the detector 321 of the optical receiving device array 320. Specifically, as shown in the figure, the spectroscopic element 331 is located above the detector 321 of the optical receiving device array 320.
还需要说明的是,所述分光元件331折转部分所述探测光301,以实现所述探测光301的出射;所述分光元件331背向所述光偏转元件332的一侧表面上设置有吸光层,以吸收透射所述分光元件331的探测光301。It should also be noted that the spectroscopic element 331 deflects part of the detection light 301 to achieve the emission of the detection light 301; a light absorbing layer is provided on the surface of the spectroscopic element 331 facing away from the light deflection element 332 to absorb the detection light 301 transmitting the spectroscopic element 331.
继续参考图12,本公开一些实施例中,所述分光单元330还包括:调焦元件(调焦元件例如可以是前述实施例中光学整形单元100中的第一透镜110和/或第二透镜120),所述调焦元件位于所述探测光301的光路中,适宜于调整焦距,所述调焦元件配置为使所述光发射装置阵列310和光接收装置阵列320均设置在所述基板300上。Continuing to refer to FIG. 12 , in some embodiments of the present disclosure, the spectroscopic unit 330 further includes: a focusing element (the focusing element may be, for example, the first lens 110 and/or the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the focusing element being located in the optical path of the detection light 301 and suitable for adjusting the focal length, and the focusing element being configured so that the light emitting device array 310 and the light receiving device array 320 are both disposed on the substrate 300 .
通过在探测光301光路中设置调焦元件,改变(具体是延长)探测光301光路中光学系统的焦距,使得探测光301光路中光学系统焦距(具体为包括共用镜头组和调焦元件的光学系统焦距)与回波光302光路中光学系统焦距不同,进而通过调焦元件合理调整焦距,使得所述光发射装置阵列310和光接收装置阵列320均设置在所述基板300上。By setting a focusing element in the optical path of the detection light 301, the focal length of the optical system in the optical path of the detection light 301 is changed (specifically extended), so that the focal length of the optical system in the optical path of the detection light 301 (specifically the focal length of the optical system including a common lens group and a focusing element) is different from the focal length of the optical system in the optical path of the echo light 302, and then the focal length is reasonably adjusted through the focusing element, so that the light emitting device array 310 and the light receiving device array 320 are both arranged on the substrate 300.
如图12所示的一些具体实施例中,所述调焦元件包括:第一透镜333a(第一透镜333a例如可以是前述实施例中光学整形单元100中的第一透镜110),所述第一透镜333a位于所述探测光301的光路中所述光偏转元件332的上游,以透射所述探测光301入射至所述光偏转元件332;第二透镜333b(第二透镜333b例如可以是前述实施例中光学整形单元100中的第二透镜120),所述第二透镜333b位于所述探测光301的光路中所述光偏转元件332的下游,经所述光偏转元件332偏转后的探测光301透射所述第二透镜333b后入射至所述分光元件331。In some specific embodiments as shown in FIG. 12 , the focusing element includes: a first lens 333a (the first lens 333a may be, for example, the first lens 110 in the optical shaping unit 100 in the aforementioned embodiment), the first lens 333a being located upstream of the light deflection element 332 in the optical path of the detection light 301 to transmit the detection light 301 to be incident on the light deflection element 332; a second lens 333b (the second lens 333b may be, for example, the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the second lens 333b being located downstream of the light deflection element 332 in the optical path of the detection light 301, and the detection light 301 deflected by the light deflection element 332 is transmitted through the second lens 333b and then incident on the beam splitting element 331.
具体的,所述第一透镜333a为渐变折射率透镜;所述第二透镜333b为渐变折射率透镜。渐变折射率透镜又名自聚焦透镜,是一种内部材料折射率分布沿径向渐变的柱状光学透镜。因此如图12所示的一些实施例中,渐变折射率透镜中,光束入射和出射的表面均为平面。Specifically, the first lens 333a is a gradient refractive index lens; the second lens 333b is a gradient refractive index lens. A gradient refractive index lens, also known as a self-focusing lens, is a cylindrical optical lens whose internal material refractive index distribution gradually changes along the radial direction. Therefore, in some embodiments shown in FIG. 12, in a gradient refractive index lens, the surfaces on which the light beams are incident and emergent are both planes.
所以一些具体的实施例中,所述分光元件330为合体形式,即所述第一透镜333a和所述第二透镜333b均为渐变折射率透镜,所述第一透镜333a、所述光偏转元件332、所述第二透镜333b和所述分光元件331一体成型。Therefore, in some specific embodiments, the spectroscopic element 330 is in a combined form, that is, the first lens 333a and the second lens 333b are both gradient refractive index lenses, and the first lens 333a, the light deflection element 332, the second lens 333b and the spectroscopic element 331 are integrally formed.
继续参考图10,所述封装体340适宜于对所述激光雷达芯片内的所有元件进行封装,实现各元件的包封、安放、固定和保护等。Continuing to refer to FIG. 10 , the package body 340 is suitable for packaging all components within the laser radar chip to achieve encapsulation, placement, fixation and protection of each component.
所述封装体340的材料可以是不透光粘结剂。具体如图10所示的一些实施例中,所述封装体340的材料可以为聚合物。所述封装体340可以通过T-Mo l d或C-Mo l d工艺形成以实现整体封装。The material of the package body 340 may be a light-proof adhesive. Specifically, in some embodiments as shown in FIG. 10 , the material of the package body 340 may be a polymer. The package body 340 may be formed by a T-Mo l d or C-Mo l d process to achieve overall packaging.
具体的,所述封装体340位于所述基板300上,且覆盖所述基板300上所有元件。如图10所示,所述封装体340填充于所述光发射装置阵列310、所述光接收装置阵列320、所述分光单元330、光发射装置驱动模块312和光接收装置驱动模块322之间,且覆盖其各自的表面。 Specifically, the package body 340 is located on the substrate 300 and covers all components on the substrate 300. As shown in FIG10 , the package body 340 is filled between the light emitting device array 310, the light receiving device array 320, the light splitting unit 330, the light emitting device driving module 312 and the light receiving device driving module 322, and covers their respective surfaces.
需要说明的是,所述封装体340包封所述光发射装置阵列310、所述光接收装置阵列320、所述分光单元330、光发射装置驱动模块312和光接收装置驱动模块322;为了保证探测光301和回波光302的传输,所述封装体340并不覆盖所述分光单元330用于传输探测光301和回波光302的表面。It should be noted that the packaging body 340 encapsulates the light emitting device array 310, the light receiving device array 320, the spectrometer unit 330, the light emitting device driving module 312 and the light receiving device driving module 322; in order to ensure the transmission of the detection light 301 and the echo light 302, the packaging body 340 does not cover the surface of the spectrometer unit 330 used to transmit the detection light 301 and the echo light 302.
通过所述封装体340封装所有元件,实现所述光发射装置阵列310和所述光接收装置阵列320设置于同一基板300上,将所述光发射装置阵列310、所述光接收装置阵列320贴片精度控制到微米(μm)量级,能够有效保证各通道中激光器的发射视场和探测器的接收视场高精度对准;所述封装体340填充各元件之间以固定各元件之间的距离,所述激光雷达芯片整体使用,能够有效降低装配精度、以及在激光雷达使用过程中由于温度变化、机械形变等过程对发射视场和接收视场的影响。By encapsulating all components through the package body 340, the light emitting device array 310 and the light receiving device array 320 are set on the same substrate 300, and the patch accuracy of the light emitting device array 310 and the light receiving device array 320 is controlled to the micron (μm) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; the package body 340 fills the space between the components to fix the distance between the components, and the laser radar chip is used as a whole, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
需要说明的是,如图11和13所示的一些实施例中,所述光发射装置阵列310和所述光接收装置阵列320均呈线阵排列。It should be noted that, in some embodiments as shown in FIGS. 11 and 13 , the light emitting device array 310 and the light receiving device array 320 are both arranged in a linear array.
如图12所示的一些实施例中,所述光发射装置阵列410的多个所述激光器(图中未标示)在基板(图中未示出)的表面按单列排布,所述光发射装置阵列410呈线阵排列;所述光发射装置驱动模块412位于所述光发射装置阵列410的两侧,两侧的所述光发射装置驱动模块412与所述光发射装置阵列410的两侧分别电连接。In some embodiments as shown in FIG. 12 , the plurality of lasers (not shown in the figure) of the light emitting device array 410 are arranged in a single row on the surface of a substrate (not shown in the figure), and the light emitting device array 410 is arranged in a linear array; the light emitting device driving modules 412 are located on both sides of the light emitting device array 410, and the light emitting device driving modules 412 on both sides are electrically connected to the two sides of the light emitting device array 410, respectively.
需要说明的是,一些实施例中,所述光接收装置阵列的多个探测器的排布方式可以参考图13中示出的光发射装置阵列410的多个所述激光器的排布方式。只是光接收装置驱动模块与所述光发射装置驱动模块412的排布以及选通方式不同。It should be noted that, in some embodiments, the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers of the light emitting device array 410 shown in FIG13. Only the arrangement and gating method of the light receiving device driving module and the light emitting device driving module 412 are different.
本公开其他实施例中,所述光发射装置阵列的多个所述激光器和光接收装置阵列的多个所述探测器也可以呈面阵排列。In other embodiments of the present disclosure, the multiple lasers of the light emitting device array and the multiple detectors of the light receiving device array may also be arranged in a planar array.
如图14所示的一些具体实施例中,所述光发射装置阵列510的多个激光器511构成多个沿第一方向X排列的发射器组,每个发射器组包括多个沿第二方向Y排列的激光器511;在第二方向Y上,一发射器组的各激光器511分别位于相邻发射器组的2个激光器511之间。In some specific embodiments as shown in FIG. 14 , the multiple lasers 511 of the light emitting device array 510 constitute a plurality of emitter groups arranged along a first direction X, and each emitter group includes a plurality of lasers 511 arranged along a second direction Y; in the second direction Y, each laser 511 of an emitter group is respectively located between two lasers 511 of adjacent emitter groups.
需要说明的是,图14中呈面阵排列的所述光发射装置阵列中2个所述发射器组沿所述第一方向X排列的设置方式仅为一示例。本公开其他实施例中,沿所述第一方向X可以设置更多数量的发射器组,并且沿第一方向X相邻发射器组的激光器沿第二方向Y交错设置,即沿所述第二方向Y,一发射器组的各激光器位于相邻发射器组的2个激光器之间。It should be noted that the arrangement of the two emitter groups in the array of light emitting devices arranged in a planar array in FIG14 along the first direction X is only an example. In other embodiments of the present disclosure, a larger number of emitter groups may be arranged along the first direction X, and the lasers of adjacent emitter groups along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser of an emitter group is located between two lasers of adjacent emitter groups.
此外,图14中示出的所述光发射装置阵列中2个所述发射器组以及其他实施例中更多数量的发射器组交错排布以构成不规则矩阵的设置方式仅为实例。本公开另一些实施例中,呈面阵排列的所述光发射装置阵列中多个所述发射器组也可以规则排布以构成规则矩阵。In addition, the two emitter groups in the light emitting device array shown in FIG. 14 and the arrangement of more emitter groups in other embodiments in an interlaced manner to form an irregular matrix are only examples. In other embodiments of the present disclosure, multiple emitter groups in the light emitting device array arranged in a planar array may also be regularly arranged to form a regular matrix.
一些实施例中,所述光接收装置阵列的多个探测器的排布方式可以参考图14中示出的光发射装置阵列510的多个所述激光器511的排布方式。只是光接收装置驱动模块与所述光发射装置驱动模块512的排布以及选通方式不同。具体的,所述光接收装置阵列的多个探测器构成多个沿第一方向X排列的接收器组,每个接收器组包括多个沿第二 方向Y排列的探测器;在第二方向Y上,一接收器组的各探测器位于相邻接收器组的2个探测器之间。In some embodiments, the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers 511 of the light emitting device array 510 shown in FIG. 14. The only difference is the arrangement and gating of the light receiving device driving module and the light emitting device driving module 512. Specifically, the multiple detectors of the light receiving device array constitute multiple receiver groups arranged along the first direction X, and each receiver group includes multiple receivers arranged along the second direction X. Detectors arranged in direction Y; in the second direction Y, each detector of a receiver group is located between two detectors of adjacent receiver groups.
还需要说明的是,图10和图11所示的一些具体实施例中,在基板300上采用平铺结构设置光发射装置阵列310、光接收装置阵列320、光发射装置驱动模块312和光接收装置驱动模块322。本公开其他实施例中,也可以采用堆叠结构设置所述光发射装置阵列和所述光发射装置驱动模块以及设置所述光接收装置阵列和所述光接收装置驱动模块。It should also be noted that in some specific embodiments shown in Figures 10 and 11, a light emitting device array 310, a light receiving device array 320, a light emitting device driving module 312, and a light receiving device driving module 322 are arranged in a flat structure on a substrate 300. In other embodiments of the present disclosure, the light emitting device array and the light emitting device driving module and the light receiving device array and the light receiving device driving module may also be arranged in a stacked structure.
如图15所示的一些实施例中,所述光发射装置驱动模块612和所述光发射装置阵列610依次堆叠于基板600的表面;所述光接收装置驱动模块622和所述光接收装置阵列620依次堆叠于基板600的表面。In some embodiments as shown in FIG. 15 , the light emitting device driving module 612 and the light emitting device array 610 are stacked sequentially on the surface of the substrate 600 ; the light receiving device driving module 622 and the light receiving device array 620 are stacked sequentially on the surface of the substrate 600 .
本公开一些实施例中,堆叠结构中,通过相接触的键合面实现元件之间的电连接。具体如图15所示,所述光发射装置驱动模块612和所述光发射装置阵列610之间、所述光发射装置驱动模块612和所述基板600之间、所述光接收装置驱动模块622和所述光接收装置阵列620之间、所述光接收装置驱动模块622和所述基板600之间均可以通过绝缘键合或金属键合的方式实现电连接。In some embodiments of the present disclosure, in a stacked structure, electrical connection between components is achieved through contacting bonding surfaces. Specifically, as shown in FIG. 15 , electrical connection can be achieved between the light emitting device driver module 612 and the light emitting device array 610, between the light emitting device driver module 612 and the substrate 600, between the light receiving device driver module 622 and the light receiving device array 620, and between the light receiving device driver module 622 and the substrate 600 by means of insulating bonding or metal bonding.
参考图16,示出了本公开激光雷达芯片另一实施例的剖面结构示意图。Referring to FIG16 , there is shown a schematic cross-sectional structure diagram of another embodiment of the laser radar chip disclosed herein.
与前述实施例相同之处,本公开再次不再赘述。与前述实施例不同之处在于,一些实施例中,所述光发射装置阵列和所述光接收装置阵列位于所述光发射装置驱动模块和所述光接收装置驱动模块的两侧,以增大所述光发射装置阵列的激光器和所述光接收装置阵列的探测器之间的距离,降低芯片制程难度。The present disclosure will not repeat the same points as the above embodiments. The difference from the above embodiments is that in some embodiments, the light emitting device array and the light receiving device array are located on both sides of the light emitting device driving module and the light receiving device driving module to increase the distance between the laser of the light emitting device array and the detector of the light receiving device array, thereby reducing the difficulty of chip manufacturing process.
本公开一些实施例中,所述光发射装置驱动模块712和所述光接收装置驱动模块722位于所述光发射装置阵列710和所述光接收装置阵列720之间。In some embodiments of the present disclosure, the light emitting device driving module 712 and the light receiving device driving module 722 are located between the light emitting device array 710 and the light receiving device array 720 .
具体如图16所示,所述光发射装置阵列710和所述光接收装置阵列720平行设置于所述基板700的表面;所述光发射装置驱动模块712位于所述光发射装置阵列710靠近所述光接收装置阵列720的一侧;所述光接收装置驱动模块722位于所述光接收装置阵列720靠近所述光发射装置阵列710的一侧,也就是说,所述光发射装置阵列710、所述光发射装置驱动模块712、所述光接收装置驱动模块722和所述光接收装置阵列720依次排列于所述基板700的表面。Specifically, as shown in Figure 16, the light emitting device array 710 and the light receiving device array 720 are arranged in parallel on the surface of the substrate 700; the light emitting device driving module 712 is located on the side of the light emitting device array 710 close to the light receiving device array 720; the light receiving device driving module 722 is located on the side of the light receiving device array 720 close to the light emitting device array 710, that is, the light emitting device array 710, the light emitting device driving module 712, the light receiving device driving module 722 and the light receiving device array 720 are arranged in sequence on the surface of the substrate 700.
此外,图16所示的一些具体实施例中,通过键合线(bonding wire)的方式实现器件之间的电连接。所述光发射装置阵列710、所述光发射装置驱动模块712均与基板700之间设置有键合线以实现电连接;所述光接收装置阵列720、所述光接收装置驱动模块722均与基板700之间设置有键合线以实现电连接。In addition, in some specific embodiments shown in FIG. 16 , electrical connection between devices is achieved by bonding wires. The light emitting device array 710 and the light emitting device driving module 712 are both provided with bonding wires to achieve electrical connection with the substrate 700; the light receiving device array 720 and the light receiving device driving module 722 are both provided with bonding wires to achieve electrical connection with the substrate 700.
具体的,所述光发射装置阵列710、所述光接收装置阵列720以及所述光发射装置驱动模块712和所述光接收装置驱动模块722分别贴片到所述基板700的表面;然后采用超低线弧键合(键合线低弧键合)工艺形成的键合线将激光器、探测器、所述光发射装置驱动模块712和所述光接收装置驱动模块722的焊盘(bonding pad)与基板700连接。 Specifically, the light emitting device array 710, the light receiving device array 720, the light emitting device driving module 712, and the light receiving device driving module 722 are respectively mounted on the surface of the substrate 700; then, the bonding pads of the laser, the detector, the light emitting device driving module 712, and the light receiving device driving module 722 are connected to the substrate 700 using bonding wires formed by an ultra-low wire arc bonding (bonding wire low arc bonding) process.
需要说明的是,图10所示的一些实施例中,所述光发射装置阵列310的激光器通过与所述光发射装置驱动模块312电连接后,通过所述光发射装置驱动模块312与基板300电连接。与图10所示的一些实施例不同,图16所示的一些实施例中,所述光发射装置阵列710的激光器通过键合线直接与所述基板700电连接。It should be noted that, in some embodiments shown in FIG10, the laser of the light emitting device array 310 is electrically connected to the light emitting device driving module 312, and then electrically connected to the substrate 300 through the light emitting device driving module 312. Different from some embodiments shown in FIG10, in some embodiments shown in FIG16, the laser of the light emitting device array 710 is directly electrically connected to the substrate 700 through a bonding wire.
另外,与前述实施例另一不同之处在于,所述分光单元为分体形式。如图17所示,所述分光单元730中,所述第一透镜733a和所述第二透镜733b为凸透镜;所述第一透镜733a、所述光偏转元件732和所述第二透镜733b一体成型,且与所述分光元件731相分离。In addition, another difference from the previous embodiment is that the light splitting unit is in a split form. As shown in FIG17 , in the light splitting unit 730 , the first lens 733 a and the second lens 733 b are convex lenses; the first lens 733 a , the light deflection element 732 and the second lens 733 b are integrally formed and separated from the light splitting element 731 .
相应的,本公开还提供一种激光雷达。参考图18,所述激光雷达包括:激光雷达芯片810、光学组件820和扫描装置830,其中所述激光雷达芯片810包括:基板;光发射装置阵列,所述光发射装置阵列位于所述基板上;光接收装置阵列,所述光接收装置阵列位于所述光发射装置阵列一侧的基板上;分光单元,所述分光单元配置成传输所述光发射装置阵列产生的探测光;所述探测光经目标反射形成回波光302;所述分光单元还配置成传输所述回波光302至所述光接收装置阵列;封装体,所述封装体位于所述基板上并封装所述光发射装置阵列、所述光接收装置阵列和所述分光单元;所述光学组件820传输所述激光雷达芯片810发射的探测光,经所述光学组件820传输的所述探测光被所述扫描装置830反射后从激光雷达出射(光学组件820例如可以是前述实施例中激光雷达10中的收发光学单元16);目标840反射所述探测光形成回波光302,所述扫描装置830反射的回波光302经所述光学组件820传输至所述激光雷达芯片810(扫描装置830例如可以是前述实施例中激光雷达10中的扫描器18)。Correspondingly, the present disclosure also provides a laser radar. Referring to FIG18 , the laser radar includes: a laser radar chip 810, an optical component 820, and a scanning device 830, wherein the laser radar chip 810 includes: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form an echo light 302; the spectroscopic unit is also configured to transmit the echo light 302 to the array of light receiving devices; a package body, the package body is located on the substrate and packages the light The optical component 820 transmits the detection light emitted by the laser radar chip 810, and the detection light transmitted by the optical component 820 is reflected by the scanning device 830 and then emitted from the laser radar (the optical component 820 can be, for example, the transceiver optical unit 16 in the laser radar 10 in the aforementioned embodiment); the target 840 reflects the detection light to form an echo light 302, and the echo light 302 reflected by the scanning device 830 is transmitted to the laser radar chip 810 via the optical component 820 (the scanning device 830 can be, for example, the scanner 18 in the laser radar 10 in the aforementioned embodiment).
结合参考图10至图12,示出了图18所示激光雷达实施例中所述激光雷达芯片的结构示意图。With reference to Figures 10 to 12, a schematic diagram of the structure of the laser radar chip described in the laser radar embodiment shown in Figure 18 is shown.
如图10至图12所示,所述激光雷达芯片包括:基板300;光发射装置阵列310,所述光发射装置阵列310位于所述基板300上;光接收装置阵列320,所述光接收装置阵列320位于所述光发射装置阵列310一侧的基板300上;分光单元330,所述分光单元330配置成传输所述光发射装置阵列310产生的探测光;所述探测光经目标反射形成回波光302;所述分光单元330还配置成传输所述回波光302至所述光接收装置阵列320;封装体340,所述封装体340位于所述基板300上并封装所述光发射装置阵列310、所述光接收装置阵列320和所述分光单元330。As shown in Figures 10 to 12, the laser radar chip includes: a substrate 300; a light emitting device array 310, the light emitting device array 310 is located on the substrate 300; a light receiving device array 320, the light receiving device array 320 is located on the substrate 300 on one side of the light emitting device array 310; a spectroscopic unit 330, the spectroscopic unit 330 is configured to transmit the detection light generated by the light emitting device array 310; the detection light is reflected by the target to form echo light 302; the spectroscopic unit 330 is also configured to transmit the echo light 302 to the light receiving device array 320; a package body 340, the package body 340 is located on the substrate 300 and encapsulates the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330.
一些具体实施例中,所述激光雷达芯片810为本公开激光雷达芯片,因此,所述激光雷达芯片810的具体技术方案参考前述激光雷达芯片的具体实施例,本公开在此不再赘述。In some specific embodiments, the laser radar chip 810 is the laser radar chip disclosed in the present invention. Therefore, the specific technical solution of the laser radar chip 810 refers to the specific embodiment of the aforementioned laser radar chip, and the present invention will not repeat it here.
所述光发射装置阵列310、所述光接收装置阵列320和所述分光单元330均位于同一基板300上而且被封装于封装体340内以构成所述激光雷达芯片810,所述激光雷达芯片810整体使用,能够有效降低装配过程对所述光发射装置阵列310、所述光接收装置阵列320和所述分光单元330之间光路的影响,有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。 The light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330 are all located on the same substrate 300 and are packaged in a package body 340 to form the laser radar chip 810. The laser radar chip 810 is used as a whole, which can effectively reduce the impact of the assembly process on the optical path between the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330, effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing a high-line-count laser radar.
所述激光雷达还包括:电路板811,所述电路板611与所述激光雷达芯片810之间电连接。所述激光雷达芯片810固定于所述电路板811表面,并与所述电路板811电连接。具体的,所述激光雷达芯片810通过焊球812(如图10所示)与所述电路板811电连接。The laser radar further includes: a circuit board 811, and the circuit board 811 is electrically connected to the laser radar chip 810. The laser radar chip 810 is fixed to the surface of the circuit board 811 and electrically connected to the circuit board 811. Specifically, the laser radar chip 810 is electrically connected to the circuit board 811 through a solder ball 812 (as shown in FIG. 10 ).
如图19所示的一些具体实施例中,所述激光雷达包括多个所述激光雷达芯片810;多个所述激光雷达芯片810固定并电连接于同一个电路板811。In some specific embodiments as shown in FIG. 19 , the laser radar includes a plurality of the laser radar chips 810 ; the plurality of the laser radar chips 810 are fixed and electrically connected to the same circuit board 811 .
结合参考图20,示出了图18所示激光雷达实施例中所述电路板811上多个激光雷达芯片810的俯视结构示意图。With reference to FIG20 , a schematic diagram of the top view structure of multiple laser radar chips 810 on the circuit board 811 in the laser radar embodiment shown in FIG18 is shown.
一些具体实施例中,所述激光雷达包括:多个激光雷达芯片组813,多个所述激光雷达芯片组813沿第一方向X排列,所述激光雷达芯片组813包括多个所述激光雷达芯片810,同一激光雷达芯片组813中的多个所述激光雷达芯片810沿所述第二方向Y排列。其中,一个激光雷达芯片组的多个所述激光雷达芯片810与相邻激光雷达芯片组的多个所述激光雷达芯片810沿所述第二方向Y交错设置。如图20所示,所述激光雷达包括:激光雷达芯片组813a和激光雷达芯片组813b,所述激光雷达芯片组813a和所述激光雷达芯片组813b沿第一方向X相邻设置,即所述激光雷达芯片组813a和所述激光雷达芯片组813b之间并未设置其他激光雷达芯片。In some specific embodiments, the laser radar includes: a plurality of laser radar chipsets 813, the plurality of laser radar chipsets 813 are arranged along a first direction X, the laser radar chipset 813 includes a plurality of laser radar chips 810, and the plurality of laser radar chips 810 in the same laser radar chipset 813 are arranged along the second direction Y. Among them, the plurality of laser radar chips 810 of a laser radar chipset and the plurality of laser radar chips 810 of an adjacent laser radar chipset are arranged alternately along the second direction Y. As shown in FIG. 20 , the laser radar includes: a laser radar chipset 813a and a laser radar chipset 813b, the laser radar chipset 813a and the laser radar chipset 813b are arranged adjacent to each other along the first direction X, that is, no other laser radar chips are arranged between the laser radar chipset 813a and the laser radar chipset 813b.
需要说明的,本公开其他实施例中,所述激光雷达芯片组的多个激光雷达芯片也可以与相邻激光雷达芯片组的多个所述激光雷达芯片沿所述第二方向齐平排布,即一个激光雷达芯片组的多个所述激光雷达芯片与相邻激光雷达芯片组的多个所述激光雷达芯片沿所述第二方向Y齐平排布。It should be noted that in other embodiments of the present disclosure, the multiple laser radar chips of the laser radar chips group can also be arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction, that is, the multiple laser radar chips of one laser radar chips group are arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction Y.
所述激光雷达芯片组813a的多个激光雷达芯片810和所述激光雷达芯片组813b的多个激光雷达芯片810,沿所述第二方向Y交错设置,即沿第二方向Y,所述激光雷达芯片组813a的激光雷达芯片810位于相邻的2个所述激光雷达芯片组813b的激光雷达芯片810之间,所述激光雷达芯片组813b的各激光雷达芯片810位于相邻的2个所述激光雷达芯片组813a的激光雷达芯片810之间。The multiple laser radar chips 810 of the laser radar chips group 813a and the multiple laser radar chips 810 of the laser radar chips group 813b are staggered along the second direction Y, that is, along the second direction Y, the laser radar chip 810 of the laser radar chips group 813a is located between two adjacent laser radar chips 810 of the laser radar chips group 813b, and each laser radar chip 810 of the laser radar chips group 813b is located between two adjacent laser radar chips 810 of the laser radar chips group 813a.
需要说明的是,图20中的2个所述激光雷达芯片组沿所述第一方向X排列的设置方式仅为一示例。本公开其他实施例中,沿所述第一方向X可以设置更多数量的激光雷达芯片组。并且沿第一方向X相邻激光雷达芯片组的激光雷达芯片沿第二方向Y交错设置,即沿所述第二方向Y,一个激光雷达芯片组的各激光雷达芯片位于相邻激光雷达芯片组的2个激光雷达芯片之间。It should be noted that the arrangement of the two laser radar chipsets in FIG. 20 along the first direction X is only an example. In other embodiments of the present disclosure, a larger number of laser radar chipsets may be arranged along the first direction X. And the laser radar chips of adjacent laser radar chipsets along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser radar chip of one laser radar chipset is located between two laser radar chips of adjacent laser radar chipsets.
如图18和图20所示的一些实施例中,每个激光雷达芯片810的光发射装置阵列具有32个激光器,光接收装置阵列具有32个探测器,即每个激光雷达芯片810具有32个通道。8个激光雷达芯片810构成256个通道。在保证电路板上设置256个通道的前提下,图20所示的设置方式能够有效减小电路板的尺寸。In some embodiments shown in FIG. 18 and FIG. 20 , the light emitting device array of each laser radar chip 810 has 32 lasers, and the light receiving device array has 32 detectors, that is, each laser radar chip 810 has 32 channels. Eight laser radar chips 810 constitute 256 channels. Under the premise of ensuring that 256 channels are set on the circuit board, the arrangement shown in FIG. 20 can effectively reduce the size of the circuit board.
具体的一些实施例中,所述激光雷达为车载激光雷达。车载激光雷达的探测范围主要集中在地面及其附近的区域,所述电路板垂直水平面设置;图20所示的设置方式能够有效降低所述激光雷达的高度。In some specific embodiments, the laser radar is a vehicle-mounted laser radar. The detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, and the circuit board is arranged vertically to the horizontal plane; the arrangement shown in FIG20 can effectively reduce the height of the laser radar.
继续参考图18,所述激光雷达还包括:光学组件820和扫描装置830,用以发射和接收所述探测光和回波光。 Continuing to refer to FIG. 18 , the laser radar further includes: an optical component 820 and a scanning device 830 for transmitting and receiving the detection light and the echo light.
具体的,所述激光雷达芯片810所发射的探测光被所述光学组件820传输至所述扫描装置830,所述扫描装置830反射所述探测光以实现所述探测光的出射;所述探测光经目标840反射所形成的回波光被所述扫描装置830接收,所述扫描装置830将回波光反射至光学组件820,回波光经所述光学组件820传输至所述激光雷达芯片810。Specifically, the detection light emitted by the laser radar chip 810 is transmitted to the scanning device 830 by the optical component 820, and the scanning device 830 reflects the detection light to realize the emission of the detection light; the echo light formed by the reflection of the detection light by the target 840 is received by the scanning device 830, and the scanning device 830 reflects the echo light to the optical component 820, and the echo light is transmitted to the laser radar chip 810 via the optical component 820.
本公开一些实施例中,多个所述激光雷达芯片810共用光学组件820和扫描装置830。所述光发射装置阵列310和所述光接收装置阵列320共用光学组件820和扫描装置830,能够有效克服光学组件中透镜组光轴偏移、扫描装置位置偏移等对各通道中激光器的发射视场和探测器的接收视场之间对准精度的影响。所以,本公开的方案能够有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。In some embodiments of the present disclosure, multiple laser radar chips 810 share an optical component 820 and a scanning device 830. The light emitting device array 310 and the light receiving device array 320 share an optical component 820 and a scanning device 830, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the transmitting field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present disclosure can effectively improve the alignment accuracy of the transmitting field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
具体的一些实施例中,多个所述激光雷达芯片810共用1个光学组件820和扫描装置830。但是本公开对所述激光雷达所包括光学组件820和扫描装置830的数量不做限制。In some specific embodiments, a plurality of the laser radar chips 810 share one optical component 820 and one scanning device 830. However, the present disclosure does not limit the number of optical components 820 and scanning devices 830 included in the laser radar.
本公开一些实施例中,所述扫描装置830使所述探测光沿所述第一方向X扫描;多个所述激光雷达芯片810沿所述第二方向Y呈阵列排布,所述第二方向Y垂直所述第一方向X。具体的一些实施例中,所述激光雷达为车载激光雷达,车载激光雷达的探测范围主要集中在地面及其附近的区域,所述第一方向X平行水平面;所述第二方向Y垂直水平面。In some embodiments of the present disclosure, the scanning device 830 causes the detection light to scan along the first direction X; the plurality of laser radar chips 810 are arranged in an array along the second direction Y, and the second direction Y is perpendicular to the first direction X. In some specific embodiments, the laser radar is a vehicle-mounted laser radar, and the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, the first direction X is parallel to the horizontal plane, and the second direction Y is perpendicular to the horizontal plane.
需要说明的是,所述第一方向X为所述扫描装置830的扫描方向,所述第二方向为多个所述激光雷达芯片810的排布方向。所述第一方向X和所述第二方向Y的选择与所述激光雷达的视场范围相关,即所述激光雷达的视场范围变化时,所述扫描装置830的扫描方向和多个所述激光雷达芯片810的排布方向也会随之变化。本公开对所述扫描装置的扫描方向和多个所述激光雷达芯片的排布方向并不限定。还需要说明的是,图18和图20所示的一些实施例中,一个激光雷达芯片组的多个所述激光雷达芯片与相邻激光雷达芯片组的多个所述激光雷达芯片沿所述第二方向Y交错设置。本公开其他实施例中,多个激光雷达芯片组也可以采用其他的设置方式,比如沿第一方向X设置更多激光雷达芯片组,或者沿第二方向多个所述激光雷达芯片810排布成一列,亦或者多个所述激光雷达芯片810排布方式与上述多个激光器的排布方式一致。It should be noted that the first direction X is the scanning direction of the scanning device 830, and the second direction is the arrangement direction of the plurality of laser radar chips 810. The selection of the first direction X and the second direction Y is related to the field of view of the laser radar, that is, when the field of view of the laser radar changes, the scanning direction of the scanning device 830 and the arrangement direction of the plurality of laser radar chips 810 will also change accordingly. The present disclosure does not limit the scanning direction of the scanning device and the arrangement direction of the plurality of laser radar chips. It should also be noted that in some embodiments shown in Figures 18 and 20, the plurality of laser radar chips of a laser radar chips group and the plurality of laser radar chips of an adjacent laser radar chips group are staggered along the second direction Y. In other embodiments of the present disclosure, the plurality of laser radar chips groups may also be arranged in other ways, such as arranging more laser radar chips groups along the first direction X, or arranging the plurality of laser radar chips 810 in a row along the second direction, or arranging the plurality of laser radar chips 810 in the same way as the arrangement of the plurality of lasers.
如图21所示的一些具体实施例中,一个激光雷达芯片组的所述激光雷达芯片中光发射装置阵列内至少部分数量的激光器与相邻激光雷达芯片组的所述激光雷达芯片中光发射装置阵列内至少部分数量的激光器沿所述第二方向Y交错设置。In some specific embodiments as shown in Figure 21, at least a portion of the lasers in the light emitting device array of the lidar chip of one lidar chips group are staggered along the second direction Y with at least a portion of the lasers in the light emitting device array of the lidar chip of an adjacent lidar chips group.
在本公开的另一些实施例中,一个激光雷达芯片组的所述激光雷达芯片中的光接收装置阵列内至少部分数量的探测器与相邻激光雷达芯片组的激光雷达芯片中的光接收装置阵列内至少部分数量的探测器沿第二方向Y交错设置。In some other embodiments of the present disclosure, at least a portion of the detectors in the light receiving device array of the laser radar chip of one laser radar chips group are staggered along the second direction Y with at least a portion of the detectors in the light receiving device array of the laser radar chip of an adjacent laser radar chips group.
具体的,所述激光雷达包括:第一激光雷达芯片组和第二激光雷达芯片组,所述第一激光雷达芯片组和所述第二激光雷达芯片组沿第一方向相邻设置,即所述第一激光雷达芯片组和所述第二激光雷达芯片组之间并未设置其他激光雷达芯片。Specifically, the laser radar includes: a first laser radar chipset and a second laser radar chipset, the first laser radar chipset and the second laser radar chipset are adjacently arranged along a first direction, that is, no other laser radar chip is arranged between the first laser radar chipset and the second laser radar chipset.
所述第一激光雷达芯片组的多个激光雷达芯片910a内至少部分数量的激光器和所述第二激光雷达芯片组的多个激光雷达芯片910b内至少部分数量的激光器,沿所述第 二方向Y交错设置,即沿第二方向Y,所述第一激光雷达芯片组内激光雷达芯片910a的各激光器位于相邻的所述第二激光雷达芯片组内激光雷达芯片910b的相邻2个激光器之间。At least part of the lasers in the multiple laser radar chips 910a of the first laser radar chipset and at least part of the lasers in the multiple laser radar chips 910b of the second laser radar chipset are arranged along the first The two directions Y are staggered, that is, along the second direction Y, each laser of the laser radar chip 910a in the first laser radar chipset is located between two adjacent lasers of the adjacent laser radar chip 910b in the second laser radar chipset.
具体的,图21所示的一些实施例中,所述第二激光雷达芯片组内激光雷达芯片910b的激光器沿第二方向Y的中心线911b位于所述第一激光雷达芯片组内激光雷达芯片910a的激光器沿第二方向Y的中心线911a和所述第一激光雷达芯片组内激光雷达芯片910a的激光器沿第二方向Y的中心线912a之间。Specifically, in some embodiments shown in Figure 21, the center line 911b of the laser of the laser radar chip 910b in the second laser radar chipset along the second direction Y is located between the center line 911a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y and the center line 912a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y.
需要说明的是,一些实施例中,所述激光雷达的光接收装置阵列内多个探测器的排布方式可以参考图21中示出的光发射装置阵列的多个所述激光器的排布方式。只是光接收装置驱动模块与所述光发射装置驱动模块的排布以及选通方式不同。具体的,所述第一激光雷达芯片组的多个激光雷达芯片内至少部分数量的探测器和所述第二激光雷达芯片组的多个激光雷达芯片内至少部分数量的探测器,沿所述第二方向Y交错设置,即沿第二方向,所述第一激光雷达芯片组内激光雷达芯片的探测器位于相邻的所述第二激光雷达芯片组内激光雷达芯片的相邻2个探测器之间。It should be noted that, in some embodiments, the arrangement of the multiple detectors in the light receiving device array of the laser radar can refer to the arrangement of the multiple lasers in the light emitting device array shown in Figure 21. It’s just that the arrangement and gating method of the light receiving device driver module are different from that of the light emitting device driver module. Specifically, at least part of the detectors in the multiple laser radar chips of the first laser radar chips group and at least part of the detectors in the multiple laser radar chips of the second laser radar chips group are staggered along the second direction Y, that is, along the second direction, the detector of the laser radar chip in the first laser radar chips group is located between two adjacent detectors of the laser radar chips in the second laser radar chips group.
综上,所述光发射装置阵列和所述光接收装置阵列合封于同一芯片内,基于芯片封装工艺,可以将所述光发射装置阵列、所述光接收装置阵列贴片精度控制到微米(μm)量级,能够有效保证各通道中激光器的发射视场和探测器的接收视场之间的高精度对准;而且所述光发射装置阵列、所述光接收装置阵列和所述分光单元均位于同一基板上,能够有效降低装配精度、以及在激光雷达使用过程中由于温度变化、机械形变等过程对发射视场和接收视场的影响。激光雷达中,所述光发射装置阵列和所述光接收装置阵列共用光学组件和扫描装置,能够有效克服由于光学组件中透镜组光轴偏移、扫描装置位置偏移等对各通道中激光器的发射视场和探测器的接收视场之间对准精度的影响。所以,本公开的方案能够有效提高激光雷达的发射视场和接收视场的对准精度,便于激光雷达组装和生产,有利于降低激光雷达的成本、提高激光雷达可靠性以及高线数激光雷达的实现。In summary, the light emitting device array and the light receiving device array are sealed in the same chip. Based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron (μm) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar. In the laser radar, the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.
最后应说明的是:以上所述仅为本公开的实施例而已,并不用于限制本公开,尽管参照前述实施例对本公开进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换。凡在本公开的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本公开的保护范围之内。 Finally, it should be noted that the above is only an embodiment of the present disclosure and is not intended to limit the present disclosure. Although the present disclosure is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.
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| CN202310700387.0A CN119126059A (en) | 2023-06-13 | 2023-06-13 | Optical shaping unit, laser radar and transceiver optical module |
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| CN202310700711.9 | 2023-06-13 | ||
| CN202310700711.9A CN119126129A (en) | 2023-06-13 | 2023-06-13 | LiDAR Chip and LiDAR |
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