WO2024255520A1 - Unité de mise en forme optique, lidar et module émetteur-récepteur optique - Google Patents

Unité de mise en forme optique, lidar et module émetteur-récepteur optique Download PDF

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Publication number
WO2024255520A1
WO2024255520A1 PCT/CN2024/093620 CN2024093620W WO2024255520A1 WO 2024255520 A1 WO2024255520 A1 WO 2024255520A1 CN 2024093620 W CN2024093620 W CN 2024093620W WO 2024255520 A1 WO2024255520 A1 WO 2024255520A1
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WIPO (PCT)
Prior art keywords
lens
light
laser radar
unit
optical
Prior art date
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Ceased
Application number
PCT/CN2024/093620
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English (en)
Chinese (zh)
Inventor
陶俊
王吉
李超
向少卿
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Hesai Technology Co Ltd
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Hesai Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202310700387.0A external-priority patent/CN119126059A/zh
Priority claimed from CN202310700711.9A external-priority patent/CN119126129A/zh
Application filed by Hesai Technology Co Ltd filed Critical Hesai Technology Co Ltd
Publication of WO2024255520A1 publication Critical patent/WO2024255520A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements

Definitions

  • the present disclosure relates to the field of laser radar, and in particular to an optical shaping unit for laser radar, a laser radar chip, a laser radar, and a transceiver optical module for laser radar.
  • LiDAR is a radar system that emits laser beams to detect the position, speed and other characteristic quantities of a target. It is an advanced detection method that combines laser technology with photoelectric detection technology. LiDAR is widely used in autonomous driving, transportation communications, drones, intelligent robots, resource exploration and other fields due to its advantages such as high resolution, good concealment, strong anti-active interference ability, good low-altitude detection performance, small size and light weight.
  • the laser radar transmits a detection beam through the transmitting unit, receives the echo reflected by the target object through the receiving unit, and calculates the position and distance of the target object relative to the laser radar based on the echo signal.
  • the laser radar has a large number of optical components, a complex structure, and is difficult to arrange, which makes it impossible to further reduce the size of the laser radar, limiting the miniaturization of the laser radar and its application in small devices.
  • the traditional structure makes the production cost of the laser radar too high, which is not conducive to the large-scale production and application of the laser radar. Therefore, it is necessary to improve the laser radar.
  • LiDAR the high-precision alignment between the transmitting field of view and the receiving field of view directly affects the important performance of LiDAR, such as the distance measurement capability and ranging accuracy.
  • LiDAR has the problem of difficulty in ensuring the alignment of the transmitting field of view and the receiving field of view, mainly because the production process, temperature changes, mechanical deformation and other factors cause the transmitting field of view and the receiving field of view to offset and cannot overlap.
  • one of the methods currently used is the electronic aperture technology based on the receiving end array photosensitive device.
  • the receiving field of view can be dynamically adjusted so that the receiving field of view always coincides with the transmitting field of view.
  • the present disclosure provides an optical shaping unit for a laser radar, comprising a first lens and a second lens.
  • the first lens is used to receive a detection beam emitted by a transmitting unit of the laser radar, the transmitting unit has a light-emitting surface, and the detection beam is emitted by the light-emitting surface.
  • the second lens wherein the first lens is located in the optical path between the transmitting unit and the second lens, and the first lens and the second lens are configured to form a reduced light-emitting surface of the light-emitting surface of the transmitting unit.
  • the optical axes of the first lens and the second lens are non-parallel.
  • the first lens and the second lens are both convex lenses.
  • the focal length of the first lens is greater than the focal length of the second lens.
  • the reduced light-emitting surface is formed on a side of the second lens opposite to the first lens.
  • the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
  • the optical shaping unit further includes a reflecting portion, which is disposed between the first lens and the second lens.
  • the reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
  • the first lens, the second lens and the reflective portion are integrally formed.
  • the first lens, the second lens and the reflective portion are separately formed.
  • the optical axes of the first lens and the second lens are perpendicular.
  • the angle between the reflective portion and the optical axis of the first lens is 45°, and the angle between the reflective portion and the optical axis of the second lens is 45°.
  • the ratio of the focal lengths of the first lens and the second lens is determined according to the size of the reduced light-emitting surface, and the optical shaping unit is configured to increase the power density of the detection beam emitted from the laser radar.
  • the optical distance between the first lens and the second lens is the sum of the focal length of the first lens and the focal length of the second lens.
  • the optical shaping unit further includes a reflecting portion, wherein the reflecting portion is disposed between the first lens and the second lens, and wherein the reflecting portion is configured to receive the detection beam from the first lens and reflect the detection beam to the second lens.
  • the present disclosure also provides a laser radar chip, comprising: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body.
  • the array of light emitting devices is located on the substrate.
  • the array of light receiving devices is located on the substrate on one side of the array of light emitting devices.
  • the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices.
  • the detection light is reflected by a target to form an echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices.
  • the packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
  • the light emitting device driving module and the light receiving device driving module are located between the light emitting device array and the light receiving device array.
  • the light emitting device array and the light receiving device array are located between the light emitting device driving module and the light receiving device driving module.
  • the laser radar chip further comprises: a light-transmitting adhesive portion, the light-transmitting adhesive portion being located on a side of the light-splitting unit facing the substrate.
  • the light-splitting unit is fixed to the light-receiving device array and the light-emitting device array via the light-transmitting adhesive portion.
  • the beam splitter element is a polarization beam splitter.
  • the detection light is emitted from the light emitting device array along a direction perpendicular to the substrate surface; the echo light is incident on the light receiving device array along a direction perpendicular to the substrate surface.
  • the spectroscopic unit further includes a light deflection element. The light deflection element is located in the optical path of the detection light, and the light deflection element is configured to deflect the detection light to the spectroscopic element.
  • the spectroscopic unit further includes: a focusing element, the focusing element is located in the optical path of the detection light, and the focusing element is configured so that the light emitting device array and the light receiving device array are both arranged on the substrate.
  • the focusing element includes a first lens and a second lens.
  • the first lens is located upstream of the light deflection element in the optical path of the detection light to transmit the detection light to be incident on the light deflection element.
  • the second lens is located downstream of the light deflection element in the optical path of the detection light, and the detection light deflected by the light deflection element is transmitted through the second lens and then incident on the spectroscopic element.
  • the first lens, the light deflection element and the second lens are integrally formed.
  • the first lens is a convex lens or a gradient refractive index lens.
  • the second lens is a convex lens or a gradient refractive index lens.
  • the second lens is a gradient refractive index lens.
  • the first lens, the light deflection element, the second lens and the light splitting element are integrally formed.
  • the present disclosure also provides a laser radar, including: a laser radar chip, an optical component and a scanning device.
  • the laser radar chip includes: a substrate, an array of light emitting devices, an array of light receiving devices, a spectroscopic unit and a packaging body.
  • the array of light emitting devices is located on the substrate.
  • the array of light receiving devices is located on the substrate on one side of the array of light emitting devices.
  • the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices.
  • the packaging body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
  • the optical component transmits the detection light emitted by the laser radar chip, and the detection light transmitted by the optical component is reflected by the scanning device and then emitted. The echo light reflected by the scanning device is transmitted to the laser radar chip via the optical component.
  • the laser radar further includes a circuit board, and the circuit board is electrically connected to the laser radar chip.
  • the plurality of laser radar chips are fixed and electrically connected to the same circuit board.
  • the plurality of laser radar chips share the optical component and the scanning device.
  • the scanning device causes the detection light to scan along a first direction.
  • a plurality of the laser radar chips are arranged in an array along a second direction, and the second direction is perpendicular to the first direction.
  • the laser radar includes a plurality of laser radar chipsets arranged along the first direction.
  • the laser radar chipset includes a plurality of laser radar chips, and the plurality of laser radar chips in the same laser radar chipset are arranged along the second direction.
  • the plurality of laser radar chips in one laser radar chipset are staggered with the plurality of laser radar chips in an adjacent laser radar chipset along the second direction.
  • the laser radar includes a plurality of laser radar chipsets arranged along the first direction.
  • the laser radar chipset includes a plurality of laser radar chips.
  • the plurality of laser radar chips in the same laser radar chipset are arranged along the second direction. At least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of one of the laser radar chipsets are staggered along the second direction with at least a portion of the number of lasers in the light emitting device array or at least a portion of the number of detectors in the light receiving device array in the laser radar chip of the adjacent laser radar chipset.
  • the present invention provides an optical shaping unit for a laser radar, which reduces the size of the light-emitting surface by using the cooperation of a first lens and a second lens, can flexibly control the size of the light-emitting surface, improves the power density of the detection beam emitted by the laser radar, and reduces the laser radar's requirement for the laser power density;
  • the first lens and the second lens fold the light path, changing the position of the light-emitting surface, which facilitates the optimization of the layout of other components inside the lidar.
  • the present disclosure also includes an embodiment of a laser radar, which utilizes an optical shaping unit to form a reduced light-emitting surface of a transmitting unit, thereby reducing the requirements for the size of the laser light-emitting surface and shaping the detection beam.
  • a spectroscopic unit is utilized to simultaneously guide the detection beam and the echo, thereby providing a structural basis for a lens group shared by the transmitting unit and the receiving unit, thereby reducing the number of laser radar components and reducing the size of the laser radar, thereby reducing costs, simplifying the structure, and facilitating mass production.
  • the present disclosure also includes another embodiment of a laser radar, which uses a spectroscopic unit to simultaneously guide the detection beam and the echo, and the transmitting unit and the receiving unit are integrated on a circuit board, which can reduce the occupied space, has a simple structure, and is conducive to the installation and field of view alignment of the transmitting unit and the receiving unit, reducing the difficulty of mass production and improving production efficiency.
  • the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate and are packaged in a package to form the laser radar chip. Since the light emitting device array and the light receiving device array are sealed in the same chip, based on the chip packaging process, the patch accuracy of the light emitting device array and the light receiving device array on the substrate can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation, etc. on the emission field of view and the receiving field of view during the use of the laser radar.
  • the light emitting device array and the light receiving device array share the optical assembly and the scanning device, which can effectively overcome the influence of the optical axis offset of the lens group in the optical assembly, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy between the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
  • FIG1 is a schematic structural diagram of an optical shaping unit in one embodiment of the present disclosure.
  • FIG2 is a schematic structural diagram of an optical shaping unit in another embodiment of the present disclosure.
  • FIG3 is a system block diagram of a laser radar in one embodiment of the present disclosure.
  • FIG4 is a schematic diagram of a laser radar including a transceiver optical unit in one embodiment of the present disclosure
  • FIG5 is a schematic diagram of a laser radar including an optical shaping unit in one embodiment of the present disclosure
  • FIG8 is a schematic diagram of an optical path of a transceiver optical module in one embodiment of the present disclosure.
  • FIGS. 9A and 9B are schematic diagrams of structures of transceiver optical modules in different embodiments of the present disclosure.
  • FIG10 is a schematic diagram of a cross-sectional structure of an embodiment of a laser radar chip disclosed herein;
  • FIG11 is a schematic diagram of a top view of the structure of an embodiment of a laser radar chip disclosed herein;
  • FIG12 is a schematic diagram of the optical path structure of a light splitting unit in one embodiment of a laser radar chip disclosed herein;
  • FIG13 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in an embodiment of a laser radar chip disclosed herein;
  • FIG14 is a schematic diagram of a top view of a light emitting device array and a light emitting device driving module in another embodiment of the laser radar chip disclosed herein;
  • FIG15 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention.
  • FIG16 is a schematic diagram of the cross-sectional structure of another embodiment of the laser radar chip disclosed in the present invention.
  • FIG17 is a schematic diagram of the optical path structure of a light splitting unit in another embodiment of the laser radar chip disclosed herein;
  • FIG18 is a schematic diagram of the structure of an embodiment of a laser radar disclosed herein;
  • FIG19 is a schematic diagram of an enlarged structure of a plurality of laser radar chips in the laser radar embodiment shown in FIG18 ;
  • FIG20 is a schematic diagram of a top view of the structure of multiple laser radar chips on the circuit board in the laser radar embodiment shown in FIG18 ;
  • Figure 21 is a schematic diagram of the top view structure of multiple laser radar chips on a circuit board in another embodiment of the laser radar disclosed in the present invention.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “multiple” is two or more, unless otherwise clearly and specifically defined.
  • the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
  • installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
  • a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them.
  • a first feature being “above”, “above” and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • a first feature being “below”, “below” and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
  • each module, unit, module, and component may include one or more physical parts in whole or in part.
  • a module, unit, module, or component may include a hardware component that realizes the emission of a light beam, photoelectric conversion, light beam refraction or reflection, and control of light beam transmission or reflection.
  • a module, unit, module, or component may include one or more hardware components and one or more software components.
  • a module, unit, module, or component may include a processor (for example, a digital signal processor, a microcontroller, a field programmable gate array, a central processing unit, an application-specific integrated circuit, etc.) and a computer program, and when the computer program runs on the processor, the function of the module, unit, module, or component can be realized.
  • the computer program may be stored in a memory (for example, a random access memory, a flash memory, a read-only memory, a programmable read-only memory, a register, a hard disk, a removable hard disk, or any other form of storage medium) or a server.
  • the optical shaping unit may include multiple optical elements to reflect or refract the light beam so that the light beam changes its propagation direction or converges (or diverges).
  • the light-emitting unit may include a light-emitting circuit, a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), a distributed feedback laser (DFB), a fiber laser, etc.
  • FIG1 shows an optical shaping unit 100 for a laser radar according to an embodiment of the present disclosure, which includes a first lens and a second lens.
  • the first lens is used to receive a detection light beam emitted by a light-emitting surface of a transmitting unit of the laser radar.
  • the first lens is located in the optical path between the transmitting unit and the second lens.
  • the light-emitting surface of the transmitting unit is formed into a reduced light-emitting surface by the first lens and the second lens.
  • the size of the (reduced) light-emitting surface after imaging can be flexibly controlled by the first lens and the second lens, thereby improving the power density of the detection light beam emitted by the laser radar and reducing the laser radar's requirement for laser power density.
  • the optical axes of the first lens and the second lens are non-parallel, and the light beam emitted by the transmitting unit can be folded by the first lens and the second lens.
  • the position of the transmitting unit can be flexibly set, which is convenient for optimizing the arrangement of other components inside the laser radar.
  • the optical shaping unit 100 is described in detail below in conjunction with FIG1 .
  • an optical shaping unit 100 for a laser radar includes a first lens 110 and a second lens 120 , wherein a transmitting unit (or light transmitting device) 200 of the laser radar is also schematically shown. It has a light-emitting surface (the upper surface of the transmitting unit 200 in the figure), and the detection beam (or referred to as detection light) is emitted by the light-emitting surface.
  • the transmitting unit 200 can be, for example, a vertical cavity surface emitting laser VCSEL.
  • the first lens 110 is used to receive the detection beam emitted by the transmitting unit 200 of the laser radar.
  • the detection beam emitted by the transmitting unit 200 can be directly incident on the first lens 110, or it can be incident on the first lens 110 after being shaped by other optical components (such as a microlens or a microlens array).
  • the first lens 110 is disposed in the optical path between the emitting unit 200 and the second lens 120.
  • the original size of the light-emitting surface of the emitting unit 200 is set to L 1
  • N is less than 1 (also called compression coefficient). Therefore, the size of the light-emitting surface of the emitting unit 200 is compressed, and correspondingly, the power density of the detection light beam emitted by the reduced light-emitting surface 200' is increased to 1/N 2 times of the original power density.
  • the size of the light-emitting surface is changed after the light-emitting surface is imaged by the first lens 110 and the second lens 120, so as to form a reduced light-emitting surface 200'.
  • the optical axes of the first lens 110 and the second lens 120 in this embodiment are non-parallel.
  • the optical axis of the first lens 110 is approximately in the vertical direction in FIG1
  • the optical axis of the second lens 120 is approximately in the horizontal direction in FIG1 .
  • the angle between the optical axis of the first lens 110 and the optical axis of the second lens 120 may be other angles.
  • an optical element for changing the propagation direction of the detection light beam such as a reflective element, a diffraction element or a grating, may be provided between the first lens 110 and the second lens 120 to achieve a non-parallel arrangement of the optical axes of the first lens 110 and the second lens 120.
  • the position of the transmitting unit 200 and the reduced light-emitting surface 200' and the size of the reduced light-emitting surface 200' can be changed.
  • the size of the reduced light-emitting surface 200' is smaller than the size of the light-emitting surface of the transmitting unit 200, the power density of the detection beam emitted by the reduced light-emitting surface 200' is increased, that is, the power density of the detection beam emitted by the laser radar is increased, which is conducive to improving the distance measurement capability of the laser radar.
  • the optical shaping unit 100 allows the position of the optical components such as the splitter unit and the lens group located downstream of the optical path to be adjusted more flexibly, which is convenient for optimizing the arrangement of other components inside the laser radar, which is conducive to reducing the number of laser radar components and reducing the volume of the laser radar, reducing costs, and having a simple structure and facilitating mass production. It will be described in detail below.
  • the light-emitting surface of the laser needs to be set to a circle and have a rectangular distribution of divergence angles.
  • This laser Optical devices are difficult to realize through engineering methods, and the processing costs are not easy to control. Therefore, in order to reduce the cost of lidar and realize mass production, a laser with a rectangular light-emitting surface can be used in the transmitting unit, and the transmitting unit can be imaged by lens twice to ensure effective matching between the laser's transmitting field of view and the detector's receiving field of view.
  • this embodiment proposes to perform two lens imaging on the transmitting unit.
  • the first lens 110 and the second lens 120 are both convex lenses, and the focal length of the first lens 110 is greater than the focal length of the second lens 120, and the reduced light-emitting surface 200' is formed on the side of the second lens 120 opposite to the first lens 110, that is, the detection beam emitted by the transmitting unit 200 passes through the first lens 110 and the second lens 120 in sequence, and converges on the other side of the second lens 120.
  • the emitting unit 11 includes a laser array composed of a plurality of lasers, and the laser array is arranged on a circuit board 15.
  • the laser is, for example, a vertical cavity surface emitting laser VCSEL.
  • the VCSEL may be a large-size planar array laser (such as 3mm*5mm) and has light-emitting points arranged in a planar array.
  • the large planar array VCSEL can be individually selected and lit in different areas (for example, rows/columns in the planar array VCSEL are individually controlled to light up), thereby forming different light-emitting areas according to actual needs and emitting detection beams.
  • the laser radar includes two transmitting units 1, each transmitting unit 1 includes three large-area array VCSELs, and the three VCSELs in the transmitting unit 1 on the left and the three VCSELs in the transmitting unit 1 on the right are interlaced in the vertical direction.
  • the six interlaced VCSELs detect different areas of the vertical field of view of the laser radar respectively, and the detection of the entire vertical field of view of the laser radar is achieved through the six interlaced VCSELs.
  • the SPAD in the corresponding area of the SAPD array is activated, so that multiple selection areas in the VCSEL and the corresponding multiple activation areas in the SPAD array correspond one by one to form multiple detection channels.
  • Each detection channel corresponds to a detection direction, for example, to cover the detection range of the laser radar 10.
  • the optical shaping unit 100 and the spectroscopic unit 13 correspond one-to-one to the selection area of the laser and the activation area of the detector, that is, the detection light beam emitted from a selection area of the laser increases its power density after passing through the optical shaping unit 100 and is incident on the spectroscopic unit 13.
  • the spectroscopic unit 13 guides the detection light beam to the outside of the laser radar 10. After being reflected by an obstacle, the detection light beam forms an echo, which is guided by the spectroscopic unit 13 to the activation area of the corresponding receiver, completing a detection process.
  • the laser radar 10 includes a transmitting unit 11, an optical shaping unit 100, a receiving unit 12, a spectroscopic unit 13 and a data processing unit 14.
  • the transmitting unit 11 and the receiving unit 12 are like the transmitting unit and the receiving unit in the aforementioned embodiment, which are respectively used to transmit a detection light beam and receive an echo generated by reflection on an obstacle, and convert them into electrical signals, which will not be repeated here.
  • the laser radar 10 in this embodiment uses the optical shaping unit 100 to shape the detection light beam emitted by the light-emitting surface of the transmitting unit 11.
  • the optical shaping unit in the aforementioned embodiment can improve the power density of the detection light beam emitted by the laser radar, thereby enabling the transmitting unit 11 and the receiving unit 12 to share the same transceiver optical unit 16.
  • the optical shaping unit 100 and the spectroscopic unit 13 cooperate with each other, so that the transmitting unit 11 and the receiving unit 12 can use the same lens, simplifying the structure of optical components in the laser radar 10.
  • the optical shaping unit 100 can also be used to change the optical path of the detection light beam, and can adjust the setting position of the transmitting unit 11, which helps to optimize the internal structural layout of the laser radar 10.
  • the transmitting unit 11 and the receiving unit 12 can be set in the same circuit.
  • the transmitting unit 11 may also be disposed at other appropriate positions inside the laser radar 10 , thereby increasing the flexibility of the arrangement of components inside the laser radar 10 .
  • a transceiver optical module includes an optical shaping unit 100 and a spectroscopic unit 13.
  • a transceiver optical module corresponds to a laser and a detector, that is, a laser, an optical shaping unit 100, a spectroscopic unit 13 and a detector constitute a detection channel, and the laser radar includes multiple detection channels to meet the requirements of the detection range.
  • a transceiver optical module corresponds to multiple detection channels at the same time, for example, a transceiver optical module covers a group of laser arrays including multiple lasers and a group of detector arrays including multiple detectors, a group of laser arrays corresponds to an optical shaping unit 100, and a group of detector arrays corresponds to a spectroscopic unit 13, which together constitute multiple detection channels.
  • the transmitting unit 11 includes a planar array VCSEL having multiple individually selectable light-emitting areas, each selected light-emitting area can emit a detection light beam
  • the receiving unit 12 includes a SPAD array, each SPAD can be individually selected and activated
  • a transceiver optical module corresponds to a selected area in the planar array VCSEL and an activated area in the SPAD array
  • a selected area of the laser corresponds to an optical shaping unit 100
  • an activated area of the detector corresponds to a spectroscopic unit 13, which together constitute multiple detection channels.
  • FIG8 shows an embodiment of a transceiver optical module 30 that can be used for a laser radar, wherein the transceiver optical module 30 includes an optical shaping unit 31 and a spectroscopic unit 32.
  • the optical shaping unit 31 and the spectroscopic unit 32 can be structures as described in the above embodiments, and the optical shaping unit 31 is configured to receive a detection beam emitted by a transmitting unit 1 of the laser radar and emit the detection beam to the spectroscopic unit 32.
  • the optical shaping unit 31 can also form a reduced light-emitting surface of the transmitting unit 1 to improve the power density of the detection beam emitted by the laser radar.
  • the optical shaping unit 31 in this embodiment can be the optical shaping unit 100 in the above embodiments.
  • the spectroscopic unit 32 is configured to receive the detection beam from the optical shaping unit 31 and guide the detection beam to the outside of the laser radar, and the spectroscopic unit 32 also receives the echo and guides the echo to the receiving unit 2 of the laser radar.
  • the spectroscopic unit 32 can take the form of any one or more spectroscopic units 32 provided in the aforementioned embodiments.
  • the optical shaping unit 31 corresponds to the laser or the laser gating area in the transmitting unit 1 of the laser radar, and the spectroscopic unit 32 is also set to correspond to the detector or the activation area of the detector in the receiving unit 2 of the laser radar.
  • an optical shaping unit 31 corresponds to a group of multiple lasers or multiple gating areas of a laser in the transmitting unit 1 of the laser radar, and a spectroscopic unit 32 corresponds to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2 of the laser radar.
  • a group of multiple lasers in the transmitting unit 1 are arranged in strips, and the light incident surface in the optical shaping unit 31 can also be set as a continuous surface to cover the corresponding multiple lasers or multiple gating areas of a laser.
  • the light exit surface of the optical shaping unit 31 can also be set as a continuous surface, and the spectroscopic unit 32 can also be set as a strip to correspond to a group of multiple detectors or multiple activation areas of a detector in the receiving unit 2.
  • the spectroscopic unit 32 can be set as a whole or a combination of multiple split structures.
  • the transmitting unit 1 includes multiple groups of laser arrays arranged on a circuit board, each group of laser arrays includes multiple lasers, and similarly, the receiving unit 2 includes multiple groups of detector arrays arranged on a circuit board, each group of detector arrays includes multiple detectors.
  • the optical shaping unit 31 and the light splitting unit 32 also have multiple, and a transceiver optical module 30 includes an optical shaping unit 31 and a light splitting unit 32, One transceiver optical module 30 corresponds to a group of laser arrays and a group of detector arrays. That is, in this embodiment, one optical shaping unit 31 and its corresponding light splitting unit 32, a group of laser arrays and a group of detector arrays form a detection channel.
  • each transceiver optical module includes an optical shaping unit 31 and a light splitting unit 32 ) are shown, and the two transceiver optical modules 30 are staggered.
  • the laser of the transmitting unit 11 and the detector of the receiving unit 12 and the corresponding optical shaping unit 100 and the spectroscopic unit 13 can be packaged together, and the packaged structure is set as a whole on the circuit board 15.
  • the laser of the transmitting unit 11 and the detector of the receiving unit 12 can also be set on the circuit board 15 respectively, and positioned and installed, and the optical shaping unit 100 and the spectroscopic unit 13 are set at a preset position, so that the transceiver optical module corresponds to the laser and the detector.
  • the laser of the transmitting unit 11 and the detector of the receiving unit 12 are first set at different positions of the circuit board 15, and then the optical shaping unit 100 and the spectroscopic unit 13 are installed at positions corresponding to the laser of the transmitting unit 11 and the detector of the receiving unit 13.
  • the present disclosure provides a laser radar chip, including: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form echo light; the spectroscopic unit is also configured to transmit the echo light to the array of light receiving devices; a package body, the package body is located on the substrate and encapsulates the array of light emitting devices, the array of light receiving devices and the spectroscopic unit.
  • the light emitting device array and the light receiving device array are sealed in the same chip.
  • the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the light splitting unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
  • the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.
  • FIG10 there is shown a schematic cross-sectional structure diagram of an embodiment of a laser radar chip disclosed herein.
  • the laser radar chip includes: a substrate 300; a light emitting device array 310 (the light emitting device may be, for example, the emitting unit 11 in the laser radar 10 in the aforementioned embodiment), the light emitting device array 310 being located on the substrate 300; a light receiving device array 320 (the light receiving device array 320 may be, for example, the receiving unit 12 in the laser radar 10 in the aforementioned embodiment), the light receiving device array 320 being located on one side of the substrate 300 of the light emitting device array 310 on; a spectroscopic unit 330, wherein the spectroscopic unit 330 is configured to transmit the detection light 301 generated by the light emitting device array 310 (the spectroscopic unit 330 in this embodiment may, for example, include the spectroscopic unit 13 in the laser radar 10 in the aforementioned embodiment, and in other embodiments of the present disclosure, the spectroscopic unit 330 may also include other optical elements, such as the optical shaping unit in the aforementioned embodiment, which will be specifically described in subsequent embodiments); the
  • optical paths of the detection light 301 and the echo light 302 shown in FIG10 are only an example, and the present disclosure does not limit this.
  • the light emitting device array 310 and the light receiving device array 320 are sealed in the same chip. Based on the chip packaging process, the mounting accuracy of the light emitting device array 310 and the light receiving device array 320 on the substrate can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of each channel laser and the receiving field of view of the detector; and the light emitting device array 310, the light receiving device array 320 and the spectrometer unit 330 are all located on the same substrate 300, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
  • the scheme disclosed in the present invention can effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is beneficial to reducing the cost of the laser radar, improving the reliability of the laser radar, and realizing high-line-count laser radar.
  • the substrate 300 is used to carry the devices disposed thereon, and is also used to realize electrical connection between the devices and external circuits and circuit boards.
  • the substrate 300 has a conductive structure, and the conductive structure is used to achieve electrical connection.
  • the light emitting device array 310 is located on one surface of the substrate 300 to generate detection light 301.
  • the light receiving device array 320 is located on the substrate 300 at one side of the light emitting device array 310 to receive echo light 302.
  • the light emitting device array 310 and the light receiving device array 320 are located between the light emitting device driving module 312 and the light receiving device driving module 322. As shown in FIG10 and FIG11 , the light emitting device array 310 and the light receiving device array 320 are arranged in parallel on the surface of the substrate 300; the light emitting device driving module 312 is located on the side of the light emitting device array 310 away from the light receiving device array 320; the light receiving device driving module 322 is located on the side of the light receiving device array 320 away from the light emitting device array 310, that is, the light emitting device driving module 312, the light emitting device array 310, the light receiving device array 320 and the light receiving device driving module 322 are arranged on the surface of the substrate 300 in sequence.
  • electrical connection between devices is achieved by means of bonding wires. Specifically, electrical connection is achieved between the light emitting device array 310 and the light emitting device driver module 312, between the light emitting device driver module 312 and the substrate 300, between the light receiving device array 320 and the light receiving device driver module 322, and between the light receiving device driver module 322 and the substrate 300 by means of bonding wires.
  • the multiple lasers 311 of the light emitting device array 310, the multiple detectors 321 of the light receiving device array 320, and the light emitting device driving module 312 and the light receiving device driving module 322 are respectively mounted on the surface of the substrate 300; then, the pads of the multiple lasers 311 and the light emitting device driving module 312 and the pads (bonding pads) of the multiple detectors 121 and the light receiving device driving module 322 are respectively connected through bonding wires; similarly, the light emitting device driving module 312 and the substrate 300, and the light receiving device driving module 322 and the substrate 300 are respectively connected through bonding wires.
  • the light emitting surface of the light emitting device array 310 is arranged to face away from the substrate 300, and the photosensitive surface of the light receiving device array 320 is also arranged to face away from the substrate 300; the detection light 301 generated by the light emitting device array 310 is emitted from the light emitting surface along a direction A facing away from the substrate 300, and the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the photosensitive surface along a direction toward the substrate 300; the spectroscopic unit 330 is located at a distance between the light emitting device array 310 and the light receiving device array 320, away from the substrate 300.
  • the laser radar chip further includes: a light-transmitting adhesive portion 350, wherein the light-transmitting adhesive portion 350 is located on the side of the spectroscopic unit 330 facing the substrate 300; the spectroscopic unit 330 is fixedly connected to the light receiving device array 320 and the light emitting device array 310 via the light-transmitting adhesive portion 350.
  • the light-transmitting adhesive portion 350 is located between the light receiving device array 320 and the light emitting device array 310 to achieve fixed connection between the light splitting unit 330, the light receiving device array 320 and the light emitting device array 310.
  • the material of the light-transmitting adhesive portion 350 can be a light-transmitting adhesive material.
  • the spectroscopic unit 330 includes: a spectroscopic element 331 (the spectroscopic element 331 can be, for example, the spectroscopic unit 13 in the laser radar 10 in the embodiment shown in the aforementioned FIG. 1 to FIG. 7D ), the spectroscopic element 331 is configured to separate the optical path of the detection light 301 (indicated by the white arrow in FIG. 12 ) from the optical path of the echo light 302 (indicated by the black arrow in FIG.
  • the optical path of the detection light 301 between the light emitting device array 310 and the spectroscopic element 331 is separated from the optical path of the echo light 302 between the light receiving device array 320 and the spectroscopic element 331, and the spectroscopic element 331 is a polarization spectrometer.
  • the spectroscopic element 331 can also be a polarization spectroscopic prism (FIG. 7A), polarizer spectroscopic (FIG. 7B), pinhole spectroscopic (FIG. 7C), local reflector spectroscopic (FIG. 7D), and other different methods.
  • the detection light 301 is emitted from the light emitting device array 310 along a direction perpendicular to the surface of the substrate 300; the echo light 302 is incident on the light receiving device array 320 along a direction perpendicular to the surface of the substrate 300;
  • the spectrometer unit 330 also includes: a light deflection element 332 (for example, it can be the reflection part 130 in the aforementioned embodiment), the light deflection element 332 is located in the optical path of the detection light 301, and the light deflection element 332 is configured to deflect the detection light 301 to the spectrometer element 331.
  • the light deflection element 332 is located on one side of the light splitting element 331, and the light deflection element 332 is used to deflect the detection light 301, so that the optical path of the detection light 301 and the optical path of the echo light 302 are partially parallel, specifically, the optical path of the detection light 301 between the light emitting device array 310 and the light deflection element 332 is parallel to the optical path of the echo light 302 between the light receiving device array 320 and the light splitting element 331, and the detection light 301 and the echo light 302 are both perpendicular to the surface of the substrate 300, so that the multiple lasers 311 in the light emitting device array 310 and the multiple detectors 321 in the light receiving device array 320 are arranged on the substrate 300 and are located on the same side of the light splitting element 330.
  • the light deflection element 332 is a prism.
  • the detection light 301 incident on the optical deflection element 332 is totally reflected on the surface 332a to be projected onto the spectroscopic element 331; the spectroscopic element 331 folds the detection light 301 again to achieve the emission of the detection light 301; the echo light 302 formed by the reflection of the detection light 301 by the target outside the laser radar is incident on the spectroscopic element 331 along an optical path coaxial with the emitted detection light 301, and the echo light 302 directly transmits the spectroscopic element 331 and is projected onto the optical receiving device array 320 to achieve detection.
  • the light deflection element 332 is located in the optical path of the detection light 301 to deflect the detection light 301, so the position of the light deflection element 332 corresponds to the position of the plurality of lasers 311 in the light emitting device array 310.
  • the light deflection element 332 is located in the The optical element 331 is located above the laser 311 in the optical emitting device array 310; the echo light 302 directly transmits the spectroscopic element 331, that is, the optical path direction of the echo light 302 does not change, so the position of the spectroscopic element 331 corresponds to the position of the detector 321 of the optical receiving device array 320.
  • the spectroscopic element 331 is located above the detector 321 of the optical receiving device array 320.
  • the spectroscopic element 331 deflects part of the detection light 301 to achieve the emission of the detection light 301; a light absorbing layer is provided on the surface of the spectroscopic element 331 facing away from the light deflection element 332 to absorb the detection light 301 transmitting the spectroscopic element 331.
  • the spectroscopic unit 330 further includes: a focusing element (the focusing element may be, for example, the first lens 110 and/or the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the focusing element being located in the optical path of the detection light 301 and suitable for adjusting the focal length, and the focusing element being configured so that the light emitting device array 310 and the light receiving device array 320 are both disposed on the substrate 300 .
  • a focusing element the focusing element may be, for example, the first lens 110 and/or the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment
  • the focusing element being located in the optical path of the detection light 301 and suitable for adjusting the focal length
  • the focusing element being configured so that the light emitting device array 310 and the light receiving device array 320 are both disposed on the substrate 300 .
  • the focal length of the optical system in the optical path of the detection light 301 is changed (specifically extended), so that the focal length of the optical system in the optical path of the detection light 301 (specifically the focal length of the optical system including a common lens group and a focusing element) is different from the focal length of the optical system in the optical path of the echo light 302, and then the focal length is reasonably adjusted through the focusing element, so that the light emitting device array 310 and the light receiving device array 320 are both arranged on the substrate 300.
  • the focusing element includes: a first lens 333a (the first lens 333a may be, for example, the first lens 110 in the optical shaping unit 100 in the aforementioned embodiment), the first lens 333a being located upstream of the light deflection element 332 in the optical path of the detection light 301 to transmit the detection light 301 to be incident on the light deflection element 332; a second lens 333b (the second lens 333b may be, for example, the second lens 120 in the optical shaping unit 100 in the aforementioned embodiment), the second lens 333b being located downstream of the light deflection element 332 in the optical path of the detection light 301, and the detection light 301 deflected by the light deflection element 332 is transmitted through the second lens 333b and then incident on the beam splitting element 331.
  • a first lens 333a may be, for example, the first lens 110 in the optical shaping unit 100 in the aforementioned embodiment
  • the first lens 333a being located upstream of the light deflection element 332 in the optical path of
  • the first lens 333a is a gradient refractive index lens
  • the second lens 333b is a gradient refractive index lens.
  • a gradient refractive index lens also known as a self-focusing lens, is a cylindrical optical lens whose internal material refractive index distribution gradually changes along the radial direction. Therefore, in some embodiments shown in FIG. 12, in a gradient refractive index lens, the surfaces on which the light beams are incident and emergent are both planes.
  • the spectroscopic element 330 is in a combined form, that is, the first lens 333a and the second lens 333b are both gradient refractive index lenses, and the first lens 333a, the light deflection element 332, the second lens 333b and the spectroscopic element 331 are integrally formed.
  • the package body 340 is suitable for packaging all components within the laser radar chip to achieve encapsulation, placement, fixation and protection of each component.
  • the material of the package body 340 may be a light-proof adhesive. Specifically, in some embodiments as shown in FIG. 10 , the material of the package body 340 may be a polymer.
  • the package body 340 may be formed by a T-Mo l d or C-Mo l d process to achieve overall packaging.
  • the package body 340 is located on the substrate 300 and covers all components on the substrate 300. As shown in FIG10 , the package body 340 is filled between the light emitting device array 310, the light receiving device array 320, the light splitting unit 330, the light emitting device driving module 312 and the light receiving device driving module 322, and covers their respective surfaces.
  • the packaging body 340 encapsulates the light emitting device array 310, the light receiving device array 320, the spectrometer unit 330, the light emitting device driving module 312 and the light receiving device driving module 322; in order to ensure the transmission of the detection light 301 and the echo light 302, the packaging body 340 does not cover the surface of the spectrometer unit 330 used to transmit the detection light 301 and the echo light 302.
  • the light emitting device array 310 and the light receiving device array 320 are set on the same substrate 300, and the patch accuracy of the light emitting device array 310 and the light receiving device array 320 is controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment of the emission field of view of the laser in each channel and the receiving field of view of the detector; the package body 340 fills the space between the components to fix the distance between the components, and the laser radar chip is used as a whole, which can effectively reduce the assembly accuracy and the influence of temperature changes, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
  • the light emitting device array 310 and the light receiving device array 320 are both arranged in a linear array.
  • the plurality of lasers (not shown in the figure) of the light emitting device array 410 are arranged in a single row on the surface of a substrate (not shown in the figure), and the light emitting device array 410 is arranged in a linear array; the light emitting device driving modules 412 are located on both sides of the light emitting device array 410, and the light emitting device driving modules 412 on both sides are electrically connected to the two sides of the light emitting device array 410, respectively.
  • the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers of the light emitting device array 410 shown in FIG13. Only the arrangement and gating method of the light receiving device driving module and the light emitting device driving module 412 are different.
  • the multiple lasers of the light emitting device array and the multiple detectors of the light receiving device array may also be arranged in a planar array.
  • the multiple lasers 511 of the light emitting device array 510 constitute a plurality of emitter groups arranged along a first direction X, and each emitter group includes a plurality of lasers 511 arranged along a second direction Y; in the second direction Y, each laser 511 of an emitter group is respectively located between two lasers 511 of adjacent emitter groups.
  • the arrangement of the two emitter groups in the array of light emitting devices arranged in a planar array in FIG14 along the first direction X is only an example.
  • a larger number of emitter groups may be arranged along the first direction X, and the lasers of adjacent emitter groups along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser of an emitter group is located between two lasers of adjacent emitter groups.
  • the two emitter groups in the light emitting device array shown in FIG. 14 and the arrangement of more emitter groups in other embodiments in an interlaced manner to form an irregular matrix are only examples.
  • multiple emitter groups in the light emitting device array arranged in a planar array may also be regularly arranged to form a regular matrix.
  • the arrangement of the multiple detectors of the light receiving device array can refer to the arrangement of the multiple lasers 511 of the light emitting device array 510 shown in FIG. 14. The only difference is the arrangement and gating of the light receiving device driving module and the light emitting device driving module 512.
  • the multiple detectors of the light receiving device array constitute multiple receiver groups arranged along the first direction X, and each receiver group includes multiple receivers arranged along the second direction X. Detectors arranged in direction Y; in the second direction Y, each detector of a receiver group is located between two detectors of adjacent receiver groups.
  • a light emitting device array 310, a light receiving device array 320, a light emitting device driving module 312, and a light receiving device driving module 322 are arranged in a flat structure on a substrate 300.
  • the light emitting device array and the light emitting device driving module and the light receiving device array and the light receiving device driving module may also be arranged in a stacked structure.
  • the light emitting device driving module 612 and the light emitting device array 610 are stacked sequentially on the surface of the substrate 600 ; the light receiving device driving module 622 and the light receiving device array 620 are stacked sequentially on the surface of the substrate 600 .
  • electrical connection between components is achieved through contacting bonding surfaces.
  • electrical connection can be achieved between the light emitting device driver module 612 and the light emitting device array 610, between the light emitting device driver module 612 and the substrate 600, between the light receiving device driver module 622 and the light receiving device array 620, and between the light receiving device driver module 622 and the substrate 600 by means of insulating bonding or metal bonding.
  • FIG16 there is shown a schematic cross-sectional structure diagram of another embodiment of the laser radar chip disclosed herein.
  • the light emitting device array and the light receiving device array are located on both sides of the light emitting device driving module and the light receiving device driving module to increase the distance between the laser of the light emitting device array and the detector of the light receiving device array, thereby reducing the difficulty of chip manufacturing process.
  • the light emitting device driving module 712 and the light receiving device driving module 722 are located between the light emitting device array 710 and the light receiving device array 720 .
  • the light emitting device array 710 and the light receiving device array 720 are arranged in parallel on the surface of the substrate 700; the light emitting device driving module 712 is located on the side of the light emitting device array 710 close to the light receiving device array 720; the light receiving device driving module 722 is located on the side of the light receiving device array 720 close to the light emitting device array 710, that is, the light emitting device array 710, the light emitting device driving module 712, the light receiving device driving module 722 and the light receiving device array 720 are arranged in sequence on the surface of the substrate 700.
  • electrical connection between devices is achieved by bonding wires.
  • the light emitting device array 710 and the light emitting device driving module 712 are both provided with bonding wires to achieve electrical connection with the substrate 700; the light receiving device array 720 and the light receiving device driving module 722 are both provided with bonding wires to achieve electrical connection with the substrate 700.
  • the light emitting device array 710, the light receiving device array 720, the light emitting device driving module 712, and the light receiving device driving module 722 are respectively mounted on the surface of the substrate 700; then, the bonding pads of the laser, the detector, the light emitting device driving module 712, and the light receiving device driving module 722 are connected to the substrate 700 using bonding wires formed by an ultra-low wire arc bonding (bonding wire low arc bonding) process.
  • the laser of the light emitting device array 310 is electrically connected to the light emitting device driving module 312, and then electrically connected to the substrate 300 through the light emitting device driving module 312.
  • the laser of the light emitting device array 710 is directly electrically connected to the substrate 700 through a bonding wire.
  • the light splitting unit is in a split form.
  • the first lens 733 a and the second lens 733 b are convex lenses; the first lens 733 a , the light deflection element 732 and the second lens 733 b are integrally formed and separated from the light splitting element 731 .
  • the present disclosure also provides a laser radar.
  • the laser radar includes: a laser radar chip 810, an optical component 820, and a scanning device 830, wherein the laser radar chip 810 includes: a substrate; an array of light emitting devices, the array of light emitting devices is located on the substrate; an array of light receiving devices, the array of light receiving devices is located on the substrate on one side of the array of light emitting devices; a spectroscopic unit, the spectroscopic unit is configured to transmit the detection light generated by the array of light emitting devices; the detection light is reflected by the target to form an echo light 302; the spectroscopic unit is also configured to transmit the echo light 302 to the array of light receiving devices; a package body, the package body is located on the substrate and packages the light
  • the optical component 820 transmits the detection light emitted by the laser radar chip 810, and the detection light transmitted by the optical component 820 is reflected by the scanning device 830 and then emitted from the laser radar (the
  • the laser radar chip includes: a substrate 300; a light emitting device array 310, the light emitting device array 310 is located on the substrate 300; a light receiving device array 320, the light receiving device array 320 is located on the substrate 300 on one side of the light emitting device array 310; a spectroscopic unit 330, the spectroscopic unit 330 is configured to transmit the detection light generated by the light emitting device array 310; the detection light is reflected by the target to form echo light 302; the spectroscopic unit 330 is also configured to transmit the echo light 302 to the light receiving device array 320; a package body 340, the package body 340 is located on the substrate 300 and encapsulates the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330.
  • the laser radar chip 810 is the laser radar chip disclosed in the present invention. Therefore, the specific technical solution of the laser radar chip 810 refers to the specific embodiment of the aforementioned laser radar chip, and the present invention will not repeat it here.
  • the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330 are all located on the same substrate 300 and are packaged in a package body 340 to form the laser radar chip 810.
  • the laser radar chip 810 is used as a whole, which can effectively reduce the impact of the assembly process on the optical path between the light emitting device array 310, the light receiving device array 320 and the spectroscopic unit 330, effectively improve the alignment accuracy of the laser radar's transmitting field of view and receiving field of view, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing a high-line-count laser radar.
  • the laser radar further includes: a circuit board 811, and the circuit board 811 is electrically connected to the laser radar chip 810.
  • the laser radar chip 810 is fixed to the surface of the circuit board 811 and electrically connected to the circuit board 811. Specifically, the laser radar chip 810 is electrically connected to the circuit board 811 through a solder ball 812 (as shown in FIG. 10 ).
  • the laser radar includes a plurality of the laser radar chips 810 ; the plurality of the laser radar chips 810 are fixed and electrically connected to the same circuit board 811 .
  • FIG20 a schematic diagram of the top view structure of multiple laser radar chips 810 on the circuit board 811 in the laser radar embodiment shown in FIG18 is shown.
  • the laser radar includes: a plurality of laser radar chipsets 813, the plurality of laser radar chipsets 813 are arranged along a first direction X, the laser radar chipset 813 includes a plurality of laser radar chips 810, and the plurality of laser radar chips 810 in the same laser radar chipset 813 are arranged along the second direction Y.
  • the plurality of laser radar chips 810 of a laser radar chipset and the plurality of laser radar chips 810 of an adjacent laser radar chipset are arranged alternately along the second direction Y. As shown in FIG.
  • the laser radar includes: a laser radar chipset 813a and a laser radar chipset 813b, the laser radar chipset 813a and the laser radar chipset 813b are arranged adjacent to each other along the first direction X, that is, no other laser radar chips are arranged between the laser radar chipset 813a and the laser radar chipset 813b.
  • the multiple laser radar chips of the laser radar chips group can also be arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction, that is, the multiple laser radar chips of one laser radar chips group are arranged flush with the multiple laser radar chips of the adjacent laser radar chips group along the second direction Y.
  • the multiple laser radar chips 810 of the laser radar chips group 813a and the multiple laser radar chips 810 of the laser radar chips group 813b are staggered along the second direction Y, that is, along the second direction Y, the laser radar chip 810 of the laser radar chips group 813a is located between two adjacent laser radar chips 810 of the laser radar chips group 813b, and each laser radar chip 810 of the laser radar chips group 813b is located between two adjacent laser radar chips 810 of the laser radar chips group 813a.
  • the arrangement of the two laser radar chipsets in FIG. 20 along the first direction X is only an example. In other embodiments of the present disclosure, a larger number of laser radar chipsets may be arranged along the first direction X. And the laser radar chips of adjacent laser radar chipsets along the first direction X are staggered along the second direction Y, that is, along the second direction Y, each laser radar chip of one laser radar chipset is located between two laser radar chips of adjacent laser radar chipsets.
  • each laser radar chip 810 has 32 lasers, and the light receiving device array has 32 detectors, that is, each laser radar chip 810 has 32 channels.
  • Eight laser radar chips 810 constitute 256 channels. Under the premise of ensuring that 256 channels are set on the circuit board, the arrangement shown in FIG. 20 can effectively reduce the size of the circuit board.
  • the laser radar is a vehicle-mounted laser radar.
  • the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, and the circuit board is arranged vertically to the horizontal plane; the arrangement shown in FIG20 can effectively reduce the height of the laser radar.
  • the laser radar further includes: an optical component 820 and a scanning device 830 for transmitting and receiving the detection light and the echo light.
  • the detection light emitted by the laser radar chip 810 is transmitted to the scanning device 830 by the optical component 820, and the scanning device 830 reflects the detection light to realize the emission of the detection light; the echo light formed by the reflection of the detection light by the target 840 is received by the scanning device 830, and the scanning device 830 reflects the echo light to the optical component 820, and the echo light is transmitted to the laser radar chip 810 via the optical component 820.
  • multiple laser radar chips 810 share an optical component 820 and a scanning device 830.
  • the light emitting device array 310 and the light receiving device array 320 share an optical component 820 and a scanning device 830, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the transmitting field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme of the present disclosure can effectively improve the alignment accuracy of the transmitting field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and help reduce the cost of the laser radar, improve the reliability of the laser radar, and realize the high-line-count laser radar.
  • a plurality of the laser radar chips 810 share one optical component 820 and one scanning device 830.
  • the present disclosure does not limit the number of optical components 820 and scanning devices 830 included in the laser radar.
  • the scanning device 830 causes the detection light to scan along the first direction X; the plurality of laser radar chips 810 are arranged in an array along the second direction Y, and the second direction Y is perpendicular to the first direction X.
  • the laser radar is a vehicle-mounted laser radar, and the detection range of the vehicle-mounted laser radar is mainly concentrated on the ground and its vicinity, the first direction X is parallel to the horizontal plane, and the second direction Y is perpendicular to the horizontal plane.
  • the first direction X is the scanning direction of the scanning device 830
  • the second direction is the arrangement direction of the plurality of laser radar chips 810.
  • the selection of the first direction X and the second direction Y is related to the field of view of the laser radar, that is, when the field of view of the laser radar changes, the scanning direction of the scanning device 830 and the arrangement direction of the plurality of laser radar chips 810 will also change accordingly.
  • the present disclosure does not limit the scanning direction of the scanning device and the arrangement direction of the plurality of laser radar chips.
  • the plurality of laser radar chips of a laser radar chips group and the plurality of laser radar chips of an adjacent laser radar chips group are staggered along the second direction Y.
  • the plurality of laser radar chips groups may also be arranged in other ways, such as arranging more laser radar chips groups along the first direction X, or arranging the plurality of laser radar chips 810 in a row along the second direction, or arranging the plurality of laser radar chips 810 in the same way as the arrangement of the plurality of lasers.
  • At least a portion of the lasers in the light emitting device array of the lidar chip of one lidar chips group are staggered along the second direction Y with at least a portion of the lasers in the light emitting device array of the lidar chip of an adjacent lidar chips group.
  • At least a portion of the detectors in the light receiving device array of the laser radar chip of one laser radar chips group are staggered along the second direction Y with at least a portion of the detectors in the light receiving device array of the laser radar chip of an adjacent laser radar chips group.
  • the laser radar includes: a first laser radar chipset and a second laser radar chipset, the first laser radar chipset and the second laser radar chipset are adjacently arranged along a first direction, that is, no other laser radar chip is arranged between the first laser radar chipset and the second laser radar chipset.
  • At least part of the lasers in the multiple laser radar chips 910a of the first laser radar chipset and at least part of the lasers in the multiple laser radar chips 910b of the second laser radar chipset are arranged along the first The two directions Y are staggered, that is, along the second direction Y, each laser of the laser radar chip 910a in the first laser radar chipset is located between two adjacent lasers of the adjacent laser radar chip 910b in the second laser radar chipset.
  • the center line 911b of the laser of the laser radar chip 910b in the second laser radar chipset along the second direction Y is located between the center line 911a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y and the center line 912a of the laser of the laser radar chip 910a in the first laser radar chipset along the second direction Y.
  • the arrangement of the multiple detectors in the light receiving device array of the laser radar can refer to the arrangement of the multiple lasers in the light emitting device array shown in Figure 21. It’s just that the arrangement and gating method of the light receiving device driver module are different from that of the light emitting device driver module. Specifically, at least part of the detectors in the multiple laser radar chips of the first laser radar chips group and at least part of the detectors in the multiple laser radar chips of the second laser radar chips group are staggered along the second direction Y, that is, along the second direction, the detector of the laser radar chip in the first laser radar chips group is located between two adjacent detectors of the laser radar chips in the second laser radar chips group.
  • the light emitting device array and the light receiving device array are sealed in the same chip.
  • the patch accuracy of the light emitting device array and the light receiving device array can be controlled to the micron ( ⁇ m) level, which can effectively ensure the high-precision alignment between the emission field of view of the laser in each channel and the receiving field of view of the detector; and the light emitting device array, the light receiving device array and the spectroscopic unit are all located on the same substrate, which can effectively reduce the assembly accuracy and the influence of temperature change, mechanical deformation and other processes on the emission field of view and the receiving field of view during the use of the laser radar.
  • the light emitting device array and the light receiving device array share optical components and scanning devices, which can effectively overcome the influence of the optical axis offset of the lens group in the optical component, the position offset of the scanning device, etc. on the alignment accuracy between the emission field of view of the laser in each channel and the receiving field of view of the detector. Therefore, the scheme disclosed in the present invention can effectively improve the alignment accuracy of the emission field of view and the receiving field of view of the laser radar, facilitate the assembly and production of the laser radar, and is conducive to reducing the cost of the laser radar, improving the reliability of the laser radar and realizing the high-line laser radar.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Optical Radar Systems And Details Thereof (AREA)

Abstract

La présente divulgation concerne une unité de mise en forme optique pour un lidar, une puce lidar, un lidar et un module émetteur-récepteur optique. L'unité de mise en forme optique comprend des première et seconde lentilles, la première lentille étant utilisée pour recevoir un faisceau lumineux de détection émis par une unité de transmission du lidar, l'unité de transmission étant pourvue d'une surface électroluminescente, et le faisceau lumineux de détection étant émis par la surface électroluminescente ; et la première lentille est située dans un chemin optique entre l'unité de transmission et la seconde lentille, et les première et seconde lentilles étant configurées de sorte que la surface électroluminescente de l'unité de transmission forme une surface électroluminescente réduite, les axes optiques des première et seconde lentilles n'étant pas parallèles. Selon la présente divulgation, les première et seconde lentilles interagissent pour réduire la taille de la surface électroluminescente, ce qui permet de régler avec souplesse la taille de la surface d'émission de lumière, d'augmenter ainsi la densité de puissance du faisceau lumineux de détection émis par le lidar et de réduire la nécessité pour le lidar d'avoir la densité de puissance d'un laser. De plus, le chemin optique tourne au moyen des première et seconde lentilles, de sorte que la position de la surface électroluminescente soit modifiée, ce qui permet d'optimiser l'agencement d'autres composants à l'intérieur du lidar, de réduire le nombre de composants et le volume du lidar, et les coûts sont par conséquent réduits, la structure est simple et la production par lots est facilitée.
PCT/CN2024/093620 2023-06-13 2024-05-16 Unité de mise en forme optique, lidar et module émetteur-récepteur optique Ceased WO2024255520A1 (fr)

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CN202310700387.0A CN119126059A (zh) 2023-06-13 2023-06-13 光学整形单元、激光雷达及收发光学模组
CN202310700387.0 2023-06-13
CN202310700711.9 2023-06-13
CN202310700711.9A CN119126129A (zh) 2023-06-13 2023-06-13 激光雷达芯片和激光雷达

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Citations (6)

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Publication number Priority date Publication date Assignee Title
US20190310368A1 (en) * 2018-04-06 2019-10-10 Luminar Technologies, Inc. Lidar System with AlInAsSb Avalanche Photodiode
CN210123470U (zh) * 2018-12-27 2020-03-03 北京经纬恒润科技有限公司 一种激光扫描雷达
CN210347921U (zh) * 2019-05-08 2020-04-17 深圳奥比中光科技有限公司 一种激光发射装置以及激光雷达系统
CN114265040A (zh) * 2021-12-14 2022-04-01 华天科技(南京)有限公司 一种高集成度的激光雷达芯片封装结构及方法
CN115267801A (zh) * 2021-04-30 2022-11-01 上海禾赛科技有限公司 光探测装置及探测方法
CN116165806A (zh) * 2022-11-10 2023-05-26 西安炬光科技股份有限公司 光学整形模组、装置及激光雷达系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190310368A1 (en) * 2018-04-06 2019-10-10 Luminar Technologies, Inc. Lidar System with AlInAsSb Avalanche Photodiode
CN210123470U (zh) * 2018-12-27 2020-03-03 北京经纬恒润科技有限公司 一种激光扫描雷达
CN210347921U (zh) * 2019-05-08 2020-04-17 深圳奥比中光科技有限公司 一种激光发射装置以及激光雷达系统
CN115267801A (zh) * 2021-04-30 2022-11-01 上海禾赛科技有限公司 光探测装置及探测方法
CN114265040A (zh) * 2021-12-14 2022-04-01 华天科技(南京)有限公司 一种高集成度的激光雷达芯片封装结构及方法
CN116165806A (zh) * 2022-11-10 2023-05-26 西安炬光科技股份有限公司 光学整形模组、装置及激光雷达系统

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