WO2024256490A1 - Module d'affichage et son procédé de production - Google Patents

Module d'affichage et son procédé de production Download PDF

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Publication number
WO2024256490A1
WO2024256490A1 PCT/EP2024/066276 EP2024066276W WO2024256490A1 WO 2024256490 A1 WO2024256490 A1 WO 2024256490A1 EP 2024066276 W EP2024066276 W EP 2024066276W WO 2024256490 A1 WO2024256490 A1 WO 2024256490A1
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WO
WIPO (PCT)
Prior art keywords
contact
layer
dielectric
optoelectronic components
material layer
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PCT/EP2024/066276
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German (de)
English (en)
Inventor
Siegfried Herrmann
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Ams Osram International GmbH
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Ams Osram International GmbH
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Publication of WO2024256490A1 publication Critical patent/WO2024256490A1/fr
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/833—Transparent materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Definitions

  • the present invention relates to a display module with a plurality of optoelectronic components, in particular pLEDs, and to a method for producing a display module with a plurality of optoelectronic components, in particular pLEDs.
  • a common conductive plane or a common conductive element that contacts the plurality of optoelectronic components simultaneously.
  • a common conductive element can be formed, for example, by a conductive transparent contact layer that is arranged on the optoelectronic components and electrically contacts them.
  • a metallic contact In order to electrically contact the conductive transparent contact layer, a metallic contact is usually applied, which extends over the edge of the conductive transparent contact layer and along a side surface of the arrangement to a carrier on which the optoelectronic components are arranged.
  • the metallic contact is accordingly designed as a metallic contact ramp and must bridge a height difference that is essentially of the same order of magnitude as the height of the optoelectronic components.
  • the inventor proposes to provide individual display modules for a display arrangement, which can be combined together to form a display arrangement.
  • the display modules are designed in such a way that they have a common conductive element and a contact structure designed in such a way that no metallic contact ramps are required to supply the optoelectronic components with electricity, in particular pLEDs.
  • contacting of the top side of the optoelectronic components takes place via non-metallic transparent contacts or by means of the common conductive element, and contact ramps to a base plane of the modules are formed by the material of the non-metallic transparent contacts or by the material of the common conductive element.
  • Such a module can be designed to be essentially completely transparent, or have reflective layers that prefer to guide light in a desired direction.
  • such a module can have contact tabs by means of which several modules can be connected to one another in rows and columns, for example to enable a matrix connection of a resulting display arrangement.
  • the display module comprises a first contact element arranged in a first plane and which comprises a metal layer and a conductive transparent layer, as well as a plurality of second contact elements which are arranged at a distance from one another and at a distance from the first contact element in the first plane.
  • the plurality of second contact elements can each also comprise a metal layer and a conductive transparent layer, but can also be formed solely by a conductive transparent layer.
  • both the first contact element and optionally the second contact elements comprise a metal layer arranged directly on the first level and a conductive transparent layer covering the metal layer, which encapsulates the metal layers together with the first level.
  • the conductive transparent layer which is in particular not a metal layer but, for example, a transparent conductive oxide layer (TCO), "protects" the metal layers on the first level by encapsulating them.
  • TCO transparent conductive oxide layer
  • the combination of a TCO and a metal layer ensures, on the one hand, good conductivity in order to supply the pLEDs arranged later with power homogeneously, and on the other hand, the metal layers ensure good reflectivity since they act as mirrors under the pLEDs.
  • a plurality of vertical optoelectronic components are arranged in such a way that a first contact surface of the vertical optoelectronic components is electrically connected to the first contact element, and a second contact surface of the vertical optoelectronic components opposite the first contact surface is electrically connected to one of the plurality of second contact elements.
  • a common potential can be provided for the vertical optoelectronic components by means of the first contact element, whereas a different potential can be provided for the vertical optoelectronic components via the second contact elements, so that the vertical optoelectronic components can be controlled individually.
  • a pLED is an optoelectronic device that has a very small size, i.e.
  • the display module may also comprise optoelectronic devices with larger dimensions.
  • vertical refers to an optoelectronic device that has its respective contact surfaces on two opposite sides.
  • the vertical optoelectronic components are embedded in a dielectric first material layer, in particular such that the dielectric first material layer surrounds the vertical optoelectronic components in the lateral direction and the first and second contact surfaces are exposed.
  • An electrically conductive, transparent contact layer adjoins the dielectric first material layer and covers an upper side of the dielectric first material layer and the first contact surfaces. The contact layer electrically connects the first contact element to the first contact surfaces of the vertical optoelectronic components.
  • the first contact element is loop-shaped and the second contact elements cross the loop-shaped first contact element, consisting of it and spaced from one another.
  • the second contact elements cross the loop-shaped first contact element, electrically insulated from the loop-shaped first contact element.
  • the first contact element is ring-shaped and the second contact elements are arranged in the center of the ring-shaped first contact element, electrically insulated from the ring-shaped first contact element (2a) and spaced from one another.
  • the first contact element at least partially surrounds the second contact elements in the first plane in a circumferential direction. In some aspects, the first contact element surrounds the second contact elements in the first plane in the circumferential direction with the exception of contact lugs that extend from the second contact elements in the direction of side surfaces of the display module.
  • the first contact element can be a loop-shaped or ring-shaped element that is interrupted by the second contact elements in the form of, for example, conductor tracks, wherein, for example, contact lugs of the second contact elements cross the loop-shaped or ring-shaped first contact element at a distance from the first contact element.
  • the second contact elements are formed.
  • the strip-shaped contact elements can be arranged substantially parallel to one another and spaced apart from one another in the first plane.
  • the first contact element can also be formed in a strip shape or in the form of a plurality of strips which are spaced apart from the second contact elements and in particular substantially parallel to them in the first plane.
  • the second contact elements and optionally the first contact element comprise contact tabs which extend in particular parallel to the first plane and in particular extend from the respective contact element in the direction of a side surface of the display module.
  • contact lug can be understood in particular to mean that the first and/or second common contact element has a section that protrudes laterally from a main body of the first and/or second common contact element, wherein the protruding section is in particular small in comparison to the main body.
  • a supply current can in particular be applied to the respective common contact element.
  • the vertical optoelectronic components are each arranged on one of the second contact elements and contact- electrically contact the respective second contact element with their second contact surface.
  • the vertical optoelectronic components are arranged accordingly between the second contact elements and the transparent contact layer and contact a second contact element and the transparent contact layer with their opposite sides.
  • the dielectric first material layer is also arranged accordingly between the second contact elements and the transparent contact layer and embeds the vertical optoelectronic components in this area.
  • the dielectric first material layer fills gaps between the first contact element and the second contact elements and is substantially flush with the first plane.
  • the dielectric first material layer can, for example, contribute to mechanical stability of the display module and provide an electrical insulation layer between the first contact element and the second contact elements.
  • the dielectric first material layer can be reflective or have reflective particles or reflective regions in order to achieve emission of light in the direction of an upper side of the dielectric first material layer.
  • the transparent contact layer extends from the top of the dielectric first material layer along at least one side wall of the dielectric first material layer to the first contact element.
  • the contact layer encapsulates the dielectric first material layer with the exception of contact areas between the dielectric first material layer and the second contact elements on a side facing away from the first plane. As a result, almost the entire dielectric first material layer can be protected from external influences and possible damage or cracks between the dielectric material of the dielectric first material layer and the transparent contact layer can be largely prevented.
  • a short circuit between the second contact elements and the conductive transparent contact layer by leaving the contact area or areas of the second contact elements and the dielectric second material layer free from the conductive transparent contact layer.
  • the vertical optoelectronic components are arranged on the contact layer on a side opposite the first contact element.
  • the vertical optoelectronic components are correspondingly arranged on the transparent contact layer on a side opposite the first level.
  • the dielectric first material layer is also arranged on the transparent contact layer on a side opposite the first level and embeds the vertical optoelectronic components in this area.
  • the display module further comprises a dielectric second material layer that is formed between the transparent contact layer and the first plane, and fills the gaps between the first contact element and the second contact elements and is substantially flush with the first plane.
  • the dielectric first material layer can, for example, contribute to mechanical stability of the display module and provide an electrical insulation layer between the first contact element and the second contact elements.
  • the dielectric second material layer electrically insulates the second contact elements from the transparent contact layer.
  • the dielectric second material layer can be reflective, or have reflective particles or reflective regions in order to achieve emission of light in the direction of an upper side of the dielectric first material layer.
  • the transparent contact layer extends from a top side of the dielectric second material layer along at least one side wall of the dielectric second material layer to the first contact element.
  • the transparent contact layer encapsulates the dielectric second material layer with the exception of contact regions between the dielectric second material layer and the second contact elements on a side facing away from the first plane. As a result, almost the entire dielectric second material layer can be protected from external influences. and possible damage or cracks between the dielectric second material layer and the transparent contact layer can be prevented to the greatest possible extent.
  • a short circuit between the second contact elements and the conductive transparent contact layer can be prevented.
  • the display module further comprises a plurality of third contact elements, each of which electrically connects one of the second contact elements to a second contact surface of one of the vertical optoelectronic components.
  • the third contact elements are in particular transparent and extend in particular along a side wall of the first and second dielectric material layer.
  • the display module further comprises a carrier substrate, on the top side of which the first contact element and the plurality of second contact elements are arranged, wherein the carrier substrate in particular comprises a layer stack of at least one semiconductor layer and a dielectric layer, wherein the dielectric layer forms the top side of the carrier substrate.
  • the top side of the carrier substrate forms the first plane.
  • the carrier substrate comprises a supply circuit or an integrated circuit which is in electrical contact with the first and/or the second contact element(s).
  • a supply circuit or an integrated circuit which is in electrical contact with the first and/or the second contact element(s).
  • the conductive transparent contact layer can, for example, completely enclose the dielectric first or second material layer together with the carrier substrate and provide an electrical connection with the first and/or the second Contact element ( s ) results from the supply circuit ( s ) within the carrier substrate .
  • the carrier substrate comprises a reflective region that is arranged adjacent to the first contact element and extends from the top of the carrier substrate in the direction of a side of the carrier substrate opposite the top of the carrier substrate.
  • the reflective region extends below the entire first contact element from the top of the carrier substrate in the direction of a side of the carrier substrate opposite the top of the carrier substrate. This makes it possible to create a reflective border within the carrier substrate, by means of which an increase in the efficiency of the display module can be achieved.
  • the dielectric first and/or second material layer comprises an inactivated photoactive material or a spin-on-glass material.
  • various dielectric materials can be used for embedding the vertical optoelectronic components.
  • spin-on-glass material can be used, but also inactivated photoactive material.
  • the sidewall(s) of the first and/or second dielectric material layer have a contact angle to a plane parallel to the first plane of less than 60°, and in particular between 35° and 55°.
  • the small contact angle prevents cracking or breaking of the conductive transparent contact layer during its deposition process and allows the conductive transparent contact layer to be extended to the first contact element without the need for additional metallic contact.
  • a contact pad is arranged on each or at least one of the first and second contact elements and in particular on a contact tab of the respective contact element.
  • the contact pad(s) for example, several display modules can be electrically connected to one another.
  • the conductive transparent contact layer and/or the third contact elements comprise indium tin oxide (ITO) with an optional thickness that is less than the distance between the first or second contact element(s) and the top surface of the optoelectronic components. Therefore, the conductive transparent contact layer is thinner than the distance between the first or second contact element(s) and the top surface of the optoelectronic components.
  • Some aspects of the proposed principle relate to a method for manufacturing a display module with a plurality of optoelectronic components and in particular pLEDs.
  • the method leads to a less error-prone structure with higher reproducibility and reduced costs.
  • the method comprises a step of providing a carrier substrate with a first contact element arranged on the carrier, which comprises a metal layer and a conductive transparent layer, and with a plurality of second contact elements which are arranged on the carrier substrate at a distance from one another and at a distance from the first contact element.
  • the second contact elements can also each comprise a metal layer on the carrier substrate and a conductive transparent layer encapsulating the metal layer.
  • both the first and the second contact elements comprise a metal layer arranged directly on an upper side of the carrier substrate and a conductive transparent layer covering the metal layer, which encapsulates the metal layers together with the upper side of the carrier substrate.
  • the conductive transparent layer which is in particular not a metal layer but, for example, a transparent conductive oxide layer (TCO), "protects" the metal layers on the carrier substrate by encapsulating them.
  • TCO transparent conductive oxide layer
  • the combination of a TCO and a metal layer ensures, on the one hand, good conductivity in order to homogeneously supply the pLED(s) later arranged on the carrier substrate with power, and can also ensure good reflectivity.
  • a plurality of vertical optoelectronic components are provided in such a way that a first contact surface of the vertical optoelectronic components is electrically connected to the first contact element, and a second contact surface of the vertical optoelectronic components opposite the first contact surface is electrically connected to one of the plurality of second contact elements.
  • the vertical optoelectronic components can in particular be arranged in rows and/or columns.
  • the vertical optoelectronic components are then embedded in a dielectric first material layer, wherein the dielectric first material layer surrounds the vertical optoelectronic components in the lateral direction such that at least the first and second contact surfaces of the vertical optoelectronic components are exposed.
  • This can in particular also be carried out by an etching-back/cleaning step, by means of which all contact regions on the upper side of the vertical optoelectronic components are exposed, and thus any dielectric material of the dielectric first material layer that is arranged on the corresponding contact regions on the upper side of the vertical optoelectronic components is removed.
  • a conductive , transparent contact layer is also provided such that it adjoins the dielectric first material layer and covers a first upper side of the dielectric first material layer and the first contact surfaces , wherein the contact layer electrically connects the first contact element to the first contact surfaces .
  • the step of providing a plurality of vertical optoelectronic components comprises providing one of the plurality of vertical optoelectronic components on one of the plurality of second contact elements.
  • the provision is carried out in such a way that the second contact surface of the vertical optoelectronic components is in electrical contact with one of the plurality of second contact elements.
  • the step of embedding the plurality of vertical optoelectronic components can take place after the step of providing a plurality of vertical optoelectronic components and in particular can comprise filling gaps between the first contact element and the second contact elements.
  • the step of providing a conductive, transparent contact layer can take place after the step of embedding the plurality of vertical optoelectronic components and in particular can comprise providing the transparent contact layer such that the contact layer extends from the top side of the dielectric first material layer along at least one side wall of the dielectric first material layer to the first contact element.
  • the vertical optoelectronic components can be arranged accordingly between the second contact elements and the transparent contact layer and contact a second contact element and the transparent contact layer with their opposite sides.
  • the dielectric first material layer is also arranged accordingly between the second contact elements and the transparent contact layer and embeds the vertical optoelectronic components in this area.
  • the dielectric first material layer can fill gaps between the first contact element and the second contact elements and be essentially flush with the first plane.
  • the method comprises the step of filling gaps between the first contact element and the second contact elements with a dielectric second material layer and/or the step of providing a plurality of third contact elements, each of which electrically connects one of the second contact elements to a second contact surface of one of the vertical optoelectronic components.
  • the third contact elements are in particular transparent and extend in particular along a side wall of the first and in particular second dielectric material layer.
  • the step of providing a conductive, transparent contact layer can take place after the step of filling gaps, and in particular a parts of the contact layer such that the contact layer extends from a top side of the dielectric second material layer along at least one side wall of the dielectric second material layer to the first contact element.
  • the step of providing a plurality of vertical optoelectronic components can take place after the step of providing a conductive, transparent contact layer and comprises providing the vertical optoelectronic components on the contact layer.
  • the step of embedding the plurality of vertical optoelectronic components can take place after the step of providing a plurality of vertical optoelectronic components and the step of providing a plurality of third contact elements can take place after the step of embedding the plurality of vertical optoelectronic components.
  • the vertical optoelectronic components can accordingly be arranged on the transparent contact layer on a side opposite the first contact element and embedded by the dielectric first material layer on the transparent contact layer on a side opposite the first plane.
  • the display module comprises a dielectric second material layer which is formed between the transparent contact layer and the carrier substrate and fills the gaps between the first contact element and the second contact elements and is essentially flush with the first plane. Electrical contact between the vertical optoelectronic components and the second contact elements is then made via third contact elements which are formed on the dielectric first material layer and each electrically connect one of the second contact elements to a second contact surface of one of the vertical optoelectronic components.
  • the method further comprises a step of applying a photomask layer to the dielectric first or second material layer before the conductive transparent contact layer or the third contact elements are applied to the corresponding dielectric material layer.
  • the photomask layer is then mask layer is structured in such a way that the part of the dielectric material of the corresponding dielectric material layer which borders on or lies above the first or second contact element ( s ) is exposed. As a result, the region ( s ) bordering on or lying above the first or second contact element ( s ) becomes accessible for a subsequent etching step.
  • the contact angle between the photomask layer and a portion of the dielectric material is less than 90°, and in particular less than 60°. In some cases, it is between 35° and 55°. In other words, the sidewalls of the photomask layer disposed adjacent to or above the first or second contact element(s) are inclined, but not perpendicular, with respect to a plane parallel to the top surface of the carrier.
  • the subsequent etching step transfers the inclination of the side wall of the photomask layer to the dielectric material next to or above the first or second contact element(s) at least partially to the etched side walls of the dielectric material.
  • the dielectric material is not etched perpendicular to its upper side, but at an angle, so that an inclination is created along the edges of the dielectric material adjacent to or above the first or second contact element(s).
  • This inclination can be adjusted, for example, but not only, by changing etching parameters, but also by the selectivity of the photomask layer to the etching process, so that the shape of the structured mask layer is transferred to the dielectric material at the edges by the etching process.
  • the etching is performed by a plasma etching process, a chemical etching, or a combination thereof. Due to the inclined sidewalls of the photomask layer, the inclination is converted during the etching process, so that a sidewall of the dielectric first or second material layer is formed next to or above the first or second contact element(s), which at least partially has the same angle as the contact angle between the photomask layer and the dielectric first or second material layer. ken material and the dielectric first and second material layers, respectively. Therefore, in some aspects, the etching of the sidewalls of the dielectric first and second material layers, respectively, may follow the inclination of the sidewalls of the photomask layer during the etching step.
  • the conductive transparent contact layer or the third contact elements are applied after the removal of the photomask layer and the optional opening of the contact regions on the top side of the vertical optoelectronic components.
  • This last step is necessary if the dielectric first or second material layer has not been previously processed in order to open the corresponding contact regions on the top side of the vertical optoelectronic components.
  • parts of the photoactive material on the top side of the vertical optoelectronic components can be illuminated and then removed in a simple process for removing the photoresist.
  • the step of embedding a plurality of vertical optoelectronic components already comprises removing parts of the dielectric material of the dielectric first material layer in order to expose at least the first or second contact regions.
  • the step of embedding the vertical optoelectronic components and/or the step of filling gaps between the first and second contact elements comprises spinning the dielectric material of the dielectric first and/or second material layer.
  • the dielectric material may be sputtered, dispensed or sprayed.
  • the material may contain a solvent during deposition, which is subsequently evaporated to form a planar dielectric material layer.
  • the dielectric material can be a photoactive material, particularly an inactivated photoactive material. This can facilitate the subsequent etching process. driving.
  • the dielectric material may consist of a resin, a siloxane or a glass material. The latter may be applied using spin-on-glass techniques.
  • the step of providing a carrier substrate comprises at least one of the following steps:
  • Providing a layer stack comprising at least one semiconductor layer and a dielectric layer or release layer, wherein the dielectric layer or release layer forms the upper side of the carrier substrate;
  • first metal layer on top of the carrier substrate and optionally a plurality of second metal layers on top of the carrier substrate, wherein the first metal layer and the optional plurality of second metal layers are spaced apart from each other;
  • first metal layer and optionally the plurality of second metal layers each with a conductive transparent layer such that in particular the conductive transparent layer encloses the first and the optional plurality of second metal layers together with the carrier substrate.
  • the method further comprises detaching the carrier substrate, in particular by dissolving, evaporating or removing the release layer.
  • the resulting display module can accordingly be substrate-free.
  • a further aspect relates to a display arrangement comprising a plurality of display modules according to at least some of the above-mentioned aspects.
  • the display modules are arranged next to one another in particular in rows and columns and are electrically coupled to one another.
  • the vertical optoelectronic components of the display modules can be coupled in such a way that they can be controlled or operated according to a matrix circuit.
  • the individual second contact elements can be arranged along a column of display modules may be coupled in series with each other and the first contact elements may be coupled in series with each other along a row of display modules.
  • Figure 1 shows a display arrangement with a plurality of optoelectronic components
  • Figures 2A and 2B show a top view and a perspective view of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle
  • Figures 3A to 3C show a side view and cross sections of the
  • Figures 4A and 4B show a top view and a perspective
  • Figure 5 shows a plan view of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle
  • Figures 6A to 6C show a side view and cross sections of the display module of Figure 5;
  • Figure 7 shows a plan view of another embodiment of a display module with a plurality of of optoelectronic devices according to some aspects of the proposed principle
  • Figure 8 shows a display arrangement according to some aspects of the proposed principle
  • Figure 9 shows a plan view of another embodiment of a display module with a plurality of optoelectronic components according to some aspects of the proposed principle
  • FIGS 10A and 10B show possible cross sections of the display module of Figure 9.
  • Figures 11A to 11C show further cross sections of a display module.
  • FIG. 1 shows such a display arrangement in a side view.
  • the display arrangement comprises a carrier structure 10 with a carrier substrate 10a and a dielectric layer 11 arranged on the carrier substrate 10a.
  • a metallic contact layer 13 is arranged on the carrier structure 10.
  • a plurality of optoelectronic components 20 with corresponding contacts are arranged on the metallic contact layer 13.
  • the optoelectronic components are designed as vertical optoelectronic components 20 which have a bottom side and a top side opposite the bottom side. Each of these top and bottom sides has a corresponding contact surface. In particular, the contact surfaces of the bottom sides 22 of the plurality of vertical optoelectronic components 20 are connected to the metallic contact layer 13. The top sides 21 of the optoelectronic components also each have a contact surface.
  • the optoelectronic components 20 are designed as pLEDs with a diameter or edge length of less than 50 pm to, for example, approximately 2 pm. Typical dimensions and sizes for pLEDs are between 30 pm and 10 pm, but can also be somewhat smaller, for example 5 pm.
  • the optoelectronic components 20 are arranged above the metallic contact layer 13 and secured thereto.
  • a thin dielectric material layer 14, e.g. SiO2 is deposited on the surface of the carrier structure 10 and on the side walls of the several vertical optoelectronic components.
  • the remaining space between the optoelectronic components is filled with a further dielectric material 40, whereby the optoelectronic tronic components 20 are completely embedded.
  • the top sides of the optoelectronic components and the dielectric material 40 are now covered with a conductive, transparent upper contact layer 30, e.g. ITO.
  • the conductive transparent upper contact layer 30 contacts the respective contact area on the top sides of the optoelectronic components and extends over the dielectric material 40 and the optoelectronic components to form a structure shown on the right.
  • a contact 15 made of gold or a similar metal is applied to the conductive transparent upper contact layer 30, which makes electrical contact to a common contact element 12 arranged on the dielectric layer 11 of the carrier structure 10.
  • This element circled in Figure 1, provides a so-called contact ramp for the common contacting of pLEDs and optoelectronic components, which are used e.g. for display applications. Consequently, the metal structure must be deposited over the edge created by the height difference between the top side of the conductive, transparent upper contact layer 30 and the application of the plurality of optoelectronic components on the carrier structure. As shown in Figure 1, the step is very steep and amounts to approximately 90°. In particular, the metal contact 15 requires a height that is in the same order of magnitude as the height of the respective optoelectronic components.
  • the inventor proposes an alternative solution for forming a display arrangement.
  • the inventor proposes to provide individual display modules for a display arrangement, which can be combined together to form a display arrangement.
  • the display modules are designed in such a way that they have a common conductive element and a contact structure designed in such a way that no metallic contact ramps are required to supply the optoelectronic components with electricity, in particular pLEDs.
  • Figures 2A, 2B, 3A, 3B and 3C each show an embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs.
  • Figure 2A shows a top view of the display module 1
  • Figure 2B shows a perspective view of the display module 1
  • Figures 3A to 3C show cross-sectional and side views of the display module 1 at a location indicated in Figure 2A by the section lines A-A, B-B and C-C.
  • the display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a.
  • the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3.
  • the plurality of second contact elements 2b also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, but the second contact elements 2b can also be formed solely by a conductive transparent layer 5b or a metal layer 4b.
  • the display module must be substantially completely transparent, at least in the emission region of the display module.
  • the first contact element 2a is loop-shaped and the second contact elements 2b cross the loop-shaped first contact element 2a in the form of elongated conductors, electrically insulated from the loop-shaped first contact element 2a. tracks. Accordingly, the loop-shaped first contact element 2a surrounds the second contact elements 2b.
  • the first and the second contact elements can be designed differently, for example in the form of essentially parallel elongated conductor tracks that are arranged next to one another.
  • the first contact element can comprise two elongated conductor tracks between which the second contact elements are arranged at a distance, but the first and the second contact elements can also be designed by flat contacts and not elongated conductor tracks that are arranged differently from one another.
  • the display module 1 also comprises a plurality of vertical optoelectronic components 20, in particular pLEDs, one of which is arranged on each of the second contact elements 2b and electrically contacts the second contact element 2b with a second contact surface 6b of the vertical optoelectronic component 20, which is opposite a first contact surface 6a.
  • the display module 1 comprises three vertical optoelectronic components 20 and correspondingly three second contact elements 2b, on which the optoelectronic components 20 are arranged.
  • the number of three optoelectronic components 20 or second contact elements is, however, to be understood as an example and the display module 1 can also comprise more than three or, for example, only two optoelectronic components 20 or second contact elements.
  • the display module can, for example, form an RGB module and accordingly comprise an optoelectronic component for emitting red light, an optoelectronic component for emitting green light and an optoelectronic component for emitting blue light.
  • the display module can, for example, form an RGB module and accordingly comprise an optoelectronic component for emitting red light, an optoelectronic component for emitting green light and an optoelectronic component for emitting blue light.
  • the vertical optoelectronic components 20 are embedded in a dielectric first material layer 40, so that the first and second contact regions 6a, 6b are exposed and the vertical optoelectronic components 20 are laterally separated from the dielectric first material layer 40. material layer 40.
  • the dielectric first material layer 40 extends adjacent to and partially onto the first and second contact elements 2a, 2b, fills spaces between the first and second contact elements 2a, 2b, terminates substantially flush with the first plane 3, and covers the first and second contact elements 2a, 2b adjacent to the vertical optoelectronic components 20.
  • a conductive transparent contact layer 30 is arranged on the top side 7 of the dielectric first material layer 40 and on the top side of the vertical optoelectronic components 20, which electrically contacts the first contact areas 6a.
  • the transparent contact layer 30 covers the vertical optoelectronic components 20 and the dielectric first material layer and extends along the side walls 16 of the dielectric first material layer 40, thereby contacting the first contact element 2a.
  • the first contact element 2a is electrically coupled to the first contact areas 6a by means of the conductive transparent contact layer 30, so that a supply current can be applied to the vertical optoelectronic components 20 via the first and second contact elements 2a, 2b.
  • the conductive transparent contact layer 30 covers/encapsulates in particular the dielectric first material layer 40 completely except for the contact region of the second contact elements 2b and the dielectric first material layer 40, wherein the conductive transparent contact layer 30 is only arranged on the dielectric first material layer 40, but does not extend to the second contact elements 2b.
  • the dielectric first material layer 40 is almost completely covered by the conductive transparent contact layer 30, so that the dielectric first material layer 40 is protected from external influences by means of the conductive transparent contact layer 30.
  • the dielectric first material layer 40 can, as shown, be single-layered, but can also, as shown in Figure 1, consist of more than one layer in which the optoelectronic components are embedded.
  • the conductive transparent contact layer 30 can in particular consist of a conductive transparent oxide such as ITO, which together with the conductive transparent layer 5a of the first contact element 2a has a better adhesive strength than a non-metal with a metal, as would be the case if the first contact element 2a were not covered with the conductive transparent layer 5a.
  • This can be advantageous in particular in the transition region of the conductive transparent contact layer 30 from the top of the dielectric first material layer 40 along the side walls 16 to the first contact element 2a, where the greatest stresses and strains prevail.
  • the display module 1 shown is substrate-free, i.e. it does not comprise a carrier substrate, which may be required in particular for producing the display module 1.
  • Mechanical stability of the display module 1 can be provided by the dielectric first material layer 40 and by the transparent contact layer 30.
  • the display module 1 can form an essentially completely transparent module at least in its central light emission region.
  • Figures 4A and 4B show a further embodiment of a display module 1 with a plurality of optoelectronic components 20, in particular pLEDs.
  • Figure 4A shows a plan view of the display module 1
  • Figure 4B shows a perspective view of the display module 1.
  • the first contact element 2a has contact lugs 17 which extend laterally outwards from the first contact element 2a in the direction of the side surfaces of the display module 1.
  • the first contact element 2a has two contact lugs 17 which extend in opposite directions from the first contact element.
  • Figures 5, 6A, 6B and 6C each show a further embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs.
  • Figure 5 shows a plan view of the display module 1
  • Figures 6A to 6C show cross-sectional and side views of the display module 1 at a location indicated in Figure 5 by the section lines A-A, B-B and C-C.
  • the display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a.
  • the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3.
  • the plurality of second contact elements 2b also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, but the second contact elements 2b can also be formed merely by a conductive transparent layer 5b or a metal layer 4b.
  • the first contact element 2a is loop-shaped and the second contact elements 2b cross the loop-shaped first contact element 2a in the form of elongated conductor tracks, electrically insulated from the loop-shaped first contact element 2a. Accordingly, the loop-shaped first contact element 2a surrounds the second contact elements 2b.
  • the first and second contact elements can be designed differently, for example in the form of essentially parallel elongated conductor tracks that are arranged next to one another.
  • the first contact element can comprise two elongated conductor tracks between which the second contact elements are arranged at a distance from one another, but the first and second contact elements can also be designed by flat contacts and not elongated conductor tracks that are arranged differently to one another.
  • the optoelectronic components 20 are not arranged on the second contact elements 2b, but rather a dielectric second material layer 50 is arranged between the transparent contact layer 30 and the first or second contact elements 2a, 2b, which fills spaces between the first and second contact elements 2a, 2b and is essentially flush with the first plane 3.
  • This dielectric second material layer 50 is covered with the transparent contact layer 30, on which in turn the optoelectronic components 20 are arranged and encapsulated by means of the dielectric first material layer 40.
  • the conductive transparent contact layer 30 is arranged on the top side 7 of the dielectric second material layer 40 and contacts the first contact element 2a as well as the optoelectronic components 20 arranged on the transparent contact layer 30 or their first contact regions 6a.
  • the transparent contact layer 30 covers the dielectric second material layer 50 and extends along the side walls 16 of the dielectric second material layer 40 and in doing so contacts the first contact element 2a.
  • the first contact element 2a is electrically coupled to the first contact surfaces 6a by means of the conductive transparent contact layer 30.
  • the conductive transparent contact layer 30 covers/encapsulates in particular the dielectric second material layer 50 completely except for the contact area of the second contact elements 2b and the dielectric second material layer 40, wherein the conductive transparent contact layer 30 is only arranged on the dielectric second material layer 50, but does not extend to the second contact elements 2b.
  • the dielectric second material layer 50 is almost completely covered by the conductive transparent contact layer 30, so that the dielectric second material layer 50 is protected from external influences by means of the conductive transparent contact layer 30.
  • the vertical optoelectronic components 20 are embedded in the dielectric first material layer 40 so that the first and second contact regions 6a, 6b are exposed and the vertical optoelectronic components 20 are laterally surrounded by the dielectric first material layer 40.
  • the dielectric first material layer 40 extends adjacent to the transparent contact layer 30.
  • Third contact elements 2c are arranged on the dielectric first material layer or on the second contact regions 6b of the optoelectronic components 20, which in each case electrically connect one of the second contact elements 2b to a second contact surface 6b of one of the vertical optoelectronic components 20.
  • the third contact elements 2c are in particular transparent and extend along a side wall 16 of the first and second dielectric material layers 40, 50.
  • the third contact elements 2c are, as shown, designed as elongated conductor tracks that extend once across the entire display module 1 and extend in particular along two opposite side walls 16 of the first and second dielectric material layers 40, 50. However, it is also possible that the third contact elements extend only along one of the side walls 16 of the first and second dielectric material layers 40, 50.
  • Figure 7 shows a further embodiment of a display module 1 with a plurality of optoelectronic components 20, in particular pLEDs, in particular a plan view of the display module 1.
  • the first contact element 2a has contact lugs 17 that extend laterally outward from the first contact element 2a in the direction of the side surfaces of the display module 1.
  • the first contact element 2a has two contact lugs 17 that extend in opposite directions from the first contact element.
  • the first contact elements of a series of several display modules arranged in rows and columns can be electrically connected to one another, for example.
  • Figure 8 shows an embodiment of a display arrangement 100 with a plurality of display modules 1. The display modules are arranged next to one another in rows and columns and are electrically coupled to one another.
  • the vertical optoelectronic components of the display modules 1 are coupled in such a way that they can be controlled or operated according to a matrix circuit.
  • the individual second contact elements are coupled to one another in series along a column of display modules 1 and the first contact elements are coupled to one another in series along a row of display modules 1.
  • Figure 9 shows a further embodiment of a display module with a plurality of optoelectronic components 20, in particular pLEDs.
  • Figure 9 shows a plan view of the display module 1
  • Figures 10A and 10B show possible cross-sectional views of the display module 1 at a location indicated in Figure 9 by the section lines A-A.
  • the display module 1 comprises a first contact element 2a, which is arranged in a first plane 3 and which comprises a metal layer 4a and a conductive transparent layer 5a covering the metal layer 4a.
  • the display module 1 comprises a plurality of second contact elements 2b, which are arranged at a distance from one another and at a distance from the first contact element 2a in the first plane 3.
  • the plurality of second contact elements 2b in one case also each comprises a metal layer 4b and a conductive transparent layer 5b covering the metal layer, but the second contact elements 2b can be formed only by a conductive transparent or metallic layer, as shown in Figure 10B.
  • the first contact element 2a is ring-shaped and the second contact elements 2b are arranged in the center of the ring-shaped first contact element 2a, electrically insulated from it.
  • the second contact elements 2b are in the form of flat contact elements. Accordingly, the ring-shaped first contact element 2a surrounds the second contact elements 2b.
  • FIG. 10A The cross-sectional views of Figures 10A and 10B differ in that the display module 1 of Figure 10B has a carrier substrate on which the first and second contact elements 2a, 2b are arranged and whose upper side forms the first plane 3.
  • the carrier substrate 10 also has an integrated circuit 8 or supply circuit, which is in electrical contact with the first and second contact elements 2a, 2b and is designed to supply electricity to the optoelectronic components 20.
  • an integrated circuit 8 or supply circuit which is in electrical contact with the first and second contact elements 2a, 2b and is designed to supply electricity to the optoelectronic components 20.
  • a different type of electrical supply to the optoelectronic components 20 can also be adjacent to the first and in electrical contact with the first and second contact elements 2a, 2b.
  • the carrier substrate 10 has a reflective region 9, which is arranged adjacent to the first contact element 2a and extends from the top of the carrier substrate 10 in the direction of a side of the carrier substrate 10 opposite the top of the carrier substrate.
  • the reflective region is also ring-shaped and extends below the entire first contact element 2a from the top of the carrier substrate 10 in the direction of a side of the carrier substrate 10 opposite the top of the carrier substrate. The efficiency of the display module can be increased even further by this ring-shaped reflective region, since light emitted into the carrier substrate is reflected at the reflective region, so that it cannot spread further in the carrier substrate.
  • Figures 11A to 11C show further possible cross-sectional views of a display module 1 and in particular of the display module 1 of Figure 9 at a location indicated in Figure 9 by the section lines A-A.
  • the carrier substrate has recesses in which the second contact elements 2b are arranged and on which the optoelectronic components 20 are arranged.
  • the optoelectronic components 20 can be controlled either, as shown in Figure 11A, via an integrated circuit 8 or a supply circuit which is in electrical contact with the first and the second contact elements 2a, 2b and which is designed to electrically supply the optoelectronic components 20.
  • a contact structure can be provided in the carrier substrate 10 at different levels, which is in electrical contact with the first and the second contact elements 2a, 2b and which is designed to supply electrical power to the optoelectronic components 20. This is shown as an example in Figure 11B.
  • the display module shown can also comprise a further optoelectronic component 20 adjacent to the first and second contact elements 2a, 2b, which is integrated into the carrier substrate 10 or is arranged on it.
  • this can be a sensor component.
  • the optoelectronic components 20 embedded in the dielectric first material layer 40 are formed by light-emitting and/or light-detecting components.

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  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un module d'affichage comprenant un premier élément de contact, qui est agencé dans un premier plan et qui comporte une couche métallique et une couche transparente conductrice ; une pluralité de seconds éléments de contact qui sont agencés à une certaine distance les uns des autres et à une certaine distance du premier élément de contact dans le premier plan ; une pluralité de composants optoélectroniques verticaux, en particulier des µDEL, qui sont agencés de sorte qu'une première surface de contact des composants optoélectroniques verticaux est connectée électriquement au premier élément de contact, et qu'une seconde surface de contact, opposée à la première surface de contact, des composants optoélectroniques verticaux est connectée électriquement à l'un des seconds éléments de contact de la pluralité de seconds éléments de contact ; une première couche de matériau diélectrique dans laquelle les composants optoélectroniques verticaux sont incorporés et qui entoure les composants optoélectroniques verticaux dans un sens latéral, de sorte qu'au moins les première et seconde surfaces de contact sont exposées ; et une couche de contact transparente électroconductrice qui est adjacente à la première couche de matériau diélectrique et qui recouvre une surface supérieure de la première couche de matériau diélectrique et les premières surfaces de contact, la couche de contact connectant électriquement le premier élément de contact aux premières surfaces de contact.
PCT/EP2024/066276 2023-06-14 2024-06-12 Module d'affichage et son procédé de production Pending WO2024256490A1 (fr)

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DE102023115548.2 2023-06-14

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WO2014093063A1 (fr) * 2012-12-10 2014-06-19 LuxVue Technology Corporation Structure de banc réfléchissant de dispositif électroluminescent
DE102020124258A1 (de) * 2020-09-17 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung zumindest eines optoelektronischen halbleiterbauelements
US20220384397A1 (en) * 2019-12-19 2022-12-01 Sl Vionics Co., Ltd. Semiconductor light emitting device and method for manufacturing the same
US20230032729A1 (en) * 2021-08-02 2023-02-02 Hon Hai Precision Industry Co., Ltd. Display panel and method for making the same
DE102023115548A1 (de) 2023-06-14 2024-12-19 Ams-Osram International Gmbh DISPLAY-MODUL UND VERFAHREN ZUR HERSTELLUNG EINES DISPLAY-MODULS MIT µLEDS

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CN117242900A (zh) * 2021-04-23 2023-12-15 株式会社半导体能源研究所 显示装置、显示模块、电子设备及显示装置的制造方法

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Publication number Priority date Publication date Assignee Title
WO2014093063A1 (fr) * 2012-12-10 2014-06-19 LuxVue Technology Corporation Structure de banc réfléchissant de dispositif électroluminescent
US20220384397A1 (en) * 2019-12-19 2022-12-01 Sl Vionics Co., Ltd. Semiconductor light emitting device and method for manufacturing the same
DE102020124258A1 (de) * 2020-09-17 2022-03-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung zumindest eines optoelektronischen halbleiterbauelements
US20230032729A1 (en) * 2021-08-02 2023-02-02 Hon Hai Precision Industry Co., Ltd. Display panel and method for making the same
DE102023115548A1 (de) 2023-06-14 2024-12-19 Ams-Osram International Gmbh DISPLAY-MODUL UND VERFAHREN ZUR HERSTELLUNG EINES DISPLAY-MODULS MIT µLEDS

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