WO2024259425A3 - Thermoformable electronic substrates - Google Patents

Thermoformable electronic substrates Download PDF

Info

Publication number
WO2024259425A3
WO2024259425A3 PCT/US2024/034359 US2024034359W WO2024259425A3 WO 2024259425 A3 WO2024259425 A3 WO 2024259425A3 US 2024034359 W US2024034359 W US 2024034359W WO 2024259425 A3 WO2024259425 A3 WO 2024259425A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate layer
thermoformable
sensors
electronic
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2024/034359
Other languages
French (fr)
Other versions
WO2024259425A2 (en
Inventor
Robert Swisher
Beth VASY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid X Printed Metals Inc
Original Assignee
Liquid X Printed Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid X Printed Metals Inc filed Critical Liquid X Printed Metals Inc
Publication of WO2024259425A2 publication Critical patent/WO2024259425A2/en
Publication of WO2024259425A3 publication Critical patent/WO2024259425A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A thermoformable electronic substrate having a first substrate layer of 4-way stretch fabric that includes at least one conductive trace printed thereon and a second substrate layer of a thermoformable polymer or textile. The first substrate layer may be laminated to a surface of the second substrate layer via an extensible adhesive, heat, or both. The conductive trace is formed by printing a particle-free conductive ink on the first substrate layer either before or after lamination to the second substrate layer. The conductive traces may form connecting wires for standard electronic elements, or electronic elements such as resistive heaters, circuits, sensors such as thermal sensors, humidity sensors, proximity sensors, pressure sensors, and the like. The thermoformable electronic substrates may be thermoformed to create three dimensional parts useful in a wide range of industries.
PCT/US2024/034359 2023-06-16 2024-06-17 Thermoformable electronic substrates Ceased WO2024259425A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202363521455P 2023-06-16 2023-06-16
US63/521,455 2023-06-16
US202363605891P 2023-12-04 2023-12-04
US63/605,891 2023-12-04

Publications (2)

Publication Number Publication Date
WO2024259425A2 WO2024259425A2 (en) 2024-12-19
WO2024259425A3 true WO2024259425A3 (en) 2025-04-24

Family

ID=93852704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2024/034359 Ceased WO2024259425A2 (en) 2023-06-16 2024-06-17 Thermoformable electronic substrates

Country Status (1)

Country Link
WO (1) WO2024259425A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121140A1 (en) * 2000-08-18 2003-07-03 Arx Theodore Von Formable thermoplastic laminate heated element assembly
US20190249026A1 (en) * 2018-02-13 2019-08-15 Liquid X Printed Metals, Inc. E-textiles fabricated using particle-free conductive inks
WO2022251742A1 (en) * 2021-05-28 2022-12-01 Liquid X Printed Metals, Inc. Force sensors, force sensor controlled electronics, and force sensor controlled conductive heating elements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121140A1 (en) * 2000-08-18 2003-07-03 Arx Theodore Von Formable thermoplastic laminate heated element assembly
US20190249026A1 (en) * 2018-02-13 2019-08-15 Liquid X Printed Metals, Inc. E-textiles fabricated using particle-free conductive inks
WO2022251742A1 (en) * 2021-05-28 2022-12-01 Liquid X Printed Metals, Inc. Force sensors, force sensor controlled electronics, and force sensor controlled conductive heating elements

Also Published As

Publication number Publication date
WO2024259425A2 (en) 2024-12-19

Similar Documents

Publication Publication Date Title
TW200724583A (en) Method of manufacturing prepreg with carrier, prepreg with carrier, method of manufacturing thin double-faced board, thin double-faced board, and method of manufacturing multilayer printed wiring board
ATE172592T1 (en) MONOLITHIC MICROELECTRONIC CIRCUIT MODULES MADE OF LIQUID CRYSTAL POLYMER
US10165689B1 (en) Method for forming circuits for three-dimensional parts and devices formed thereby
US20030211246A1 (en) Additive electronic circuits on thermally unstable substrates
CN108242427A (en) The encapsulating structure and packaging technology of electronic products
MX2024011740A (en) Method for manufacturing electronics assembly and electronics assembly
CN201499374U (en) A double-sided copper foil substrate structure
WO2024259425A3 (en) Thermoformable electronic substrates
CN214004511U (en) Double-sided self-adhesive high-temperature bearing film
US20140110152A1 (en) Printed circuit board and method for manufacturing same
KR101175100B1 (en) Pvc static electricity prevent mat and manufacturing method
CN202353923U (en) Composite covering film
JP2008262981A (en) Flexible printed board and its production process
JPH0327982A (en) Laminate
CN110650597B (en) Circuit board, manufacturing method thereof and electronic equipment
JP2009172982A (en) Double-sided metal-clad laminate
CN205491428U (en) A kind of thermocompression bonding flexible circuit board
CN204859736U (en) Flexible circuit board
KR101491340B1 (en) Autoclave, a device manufacturing method using a flexible printed circuit board and manufacturing flexible printed circuit boards that are prepared by the method
CN200990719Y (en) Protective structures for flexible printed circuit boards and their components
CN210868316U (en) Circuit board and electronic device
Lall et al. Performance Stability and Reliability of Gravure Offset Printed Thermoformed IME Circuits Subjected to Sustained High Temperature Storage
JPH05327147A (en) Flexible printed-circuit board
JP2007103466A5 (en)
TH2501000710A (en) Methods for manufacturing laminates covered with metal foil, resin compositions, resin composite sheets, methods for manufacturing printed circuit boards, and methods for manufacturing semiconductor devices.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24824353

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE