WO2024259425A3 - Substrats électroniques thermoformables - Google Patents

Substrats électroniques thermoformables Download PDF

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Publication number
WO2024259425A3
WO2024259425A3 PCT/US2024/034359 US2024034359W WO2024259425A3 WO 2024259425 A3 WO2024259425 A3 WO 2024259425A3 US 2024034359 W US2024034359 W US 2024034359W WO 2024259425 A3 WO2024259425 A3 WO 2024259425A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate layer
thermoformable
sensors
electronic
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2024/034359
Other languages
English (en)
Other versions
WO2024259425A2 (fr
Inventor
Robert Swisher
Beth VASY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid X Printed Metals Inc
Original Assignee
Liquid X Printed Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid X Printed Metals Inc filed Critical Liquid X Printed Metals Inc
Publication of WO2024259425A2 publication Critical patent/WO2024259425A2/fr
Publication of WO2024259425A3 publication Critical patent/WO2024259425A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Substrat électronique thermoformable possédant une première couche de substrat de tissu extensible 4 sens qui comprend au moins une trace conductrice imprimée sur celui-ci et une seconde couche de substrat d'un polymère ou d'un textile thermoformable. La première couche de substrat peut être contrecollée sur une surface de la seconde couche de substrat par l'intermédiaire d'un adhésif extensible, de la chaleur, ou des deux. La trace conductrice est formée par impression d'une encre conductrice exempte de particules sur la première couche de substrat avant ou après le contrecollage sur la seconde couche de substrat. Les traces conductrices peuvent former des fils de connexion pour des éléments électroniques standard, ou des éléments électroniques tels que des éléments chauffants résistifs, des circuits, des capteurs tels que des capteurs thermiques, des capteurs d'humidité, des capteurs de proximité, des capteurs de pression et similaires. Les substrats électroniques thermoformables peuvent être thermoformés pour créer des parties tridimensionnelles utiles dans une large gamme de secteurs.
PCT/US2024/034359 2023-06-16 2024-06-17 Substrats électroniques thermoformables Ceased WO2024259425A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202363521455P 2023-06-16 2023-06-16
US63/521,455 2023-06-16
US202363605891P 2023-12-04 2023-12-04
US63/605,891 2023-12-04

Publications (2)

Publication Number Publication Date
WO2024259425A2 WO2024259425A2 (fr) 2024-12-19
WO2024259425A3 true WO2024259425A3 (fr) 2025-04-24

Family

ID=93852704

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2024/034359 Ceased WO2024259425A2 (fr) 2023-06-16 2024-06-17 Substrats électroniques thermoformables

Country Status (1)

Country Link
WO (1) WO2024259425A2 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121140A1 (en) * 2000-08-18 2003-07-03 Arx Theodore Von Formable thermoplastic laminate heated element assembly
US20190249026A1 (en) * 2018-02-13 2019-08-15 Liquid X Printed Metals, Inc. E-textiles fabricated using particle-free conductive inks
WO2022251742A1 (fr) * 2021-05-28 2022-12-01 Liquid X Printed Metals, Inc. Capteurs de force, électronique commandée par capteur de force et éléments chauffants conducteurs commandés par capteur de force

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030121140A1 (en) * 2000-08-18 2003-07-03 Arx Theodore Von Formable thermoplastic laminate heated element assembly
US20190249026A1 (en) * 2018-02-13 2019-08-15 Liquid X Printed Metals, Inc. E-textiles fabricated using particle-free conductive inks
WO2022251742A1 (fr) * 2021-05-28 2022-12-01 Liquid X Printed Metals, Inc. Capteurs de force, électronique commandée par capteur de force et éléments chauffants conducteurs commandés par capteur de force

Also Published As

Publication number Publication date
WO2024259425A2 (fr) 2024-12-19

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