WO2025002557A1 - Procédé d'utilisation d'un tampon dur pour produire un tampon souple - Google Patents

Procédé d'utilisation d'un tampon dur pour produire un tampon souple Download PDF

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Publication number
WO2025002557A1
WO2025002557A1 PCT/EP2023/067845 EP2023067845W WO2025002557A1 WO 2025002557 A1 WO2025002557 A1 WO 2025002557A1 EP 2023067845 W EP2023067845 W EP 2023067845W WO 2025002557 A1 WO2025002557 A1 WO 2025002557A1
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WO
WIPO (PCT)
Prior art keywords
stamp
layer
soft
embossing
soft stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2023/067845
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German (de)
English (en)
Inventor
Walter ZORBACH
Jonas KHAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EV Group E Thallner GmbH
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EV Group E Thallner GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EV Group E Thallner GmbH filed Critical EV Group E Thallner GmbH
Priority to PCT/EP2023/067845 priority Critical patent/WO2025002557A1/fr
Priority to TW113117256A priority patent/TW202501149A/zh
Publication of WO2025002557A1 publication Critical patent/WO2025002557A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Definitions

  • the present invention relates to a method for producing, in particular for embossing, a soft stamp or a soft stamp embossing compound with a master stamp.
  • master stamps or hard stamps have structures to be molded, which are transferred to the soft stamp during embossing.
  • Imprint lithography is a process in which micro and/or nanometer sized structures are embossed into a material using a stamp.
  • the material is in particular an embossing material applied to a substrate.
  • Imprint processes of this type have become increasingly important in recent years because they can be carried out more quickly, more effectively and more cost-effectively than many photolithographic processes.
  • the resolution achievable using imprint lithography processes is in no way inferior to the resolution that can be achieved with photolithography. In some cases, such as in the so-called “first print”, better resolution can be achieved with imprint lithography than with conventional lithography.
  • mask aligners are particularly suitable for special imprint systems, as they have already been widely used in the semiconductor industry for photolithography. This made it useful for suppliers to offer extensions and attachments that were based on or could extend the already known mask aligner technology.
  • the main advantage of mask aligners is that in most cases they already have optical systems, in particular lamp housings, for illuminating the substrates, and thus the embossed materials, in particular over the entire surface.
  • MIMIC Microforming in capillaries
  • imprint stamps can be divided into two large families: hard stamps (made of metal, ceramic materials or voluminous glass or plastic) and so-called soft stamps (made of polymers, silicones, etc.) can be used. All imprint stamps have a structured stamp surface, which usually shows the negative of the structure to be created and is molded into the embossing compound.
  • Soft stamps are produced as a negative of a master stamp.
  • Master stamps are stamps that are used to form the original soft stamp.
  • master stamps are templates for replication.
  • the master stamp is either a hard stamp made of metal, glass, especially quartz glass, plastic or ceramic, which is produced once through correspondingly complex processing, or a soft stamp that is to be molded, especially a soft stamp with an elastic, stiffened carrier.
  • any number of soft stamps can then be produced from the master stamp.
  • the soft stamps are known to enable conformal, uniform contact over large surfaces.
  • Both the master stamp from the soft stamp and the soft stamp from the embossed surface of the substrate can be separated from each other without damage. Error-free separation of the soft stamp from the master stamp is essential for the production of functioning products.
  • the separability can be the result of a low surface energy of a soft stamp, which is achieved by functionalization, in particular coating. Therefore, after embossing with the master stamp and hardening of the soft stamp embossing compound, soft stamps are coated with a non-stick layer (so-called anti-sticking layer, non-adhesive layer, ASL layer).
  • the soft stamps are easier to separate from the substrate than hard stamps.
  • glass carrier substrates of various thicknesses are widely used.
  • the glass supports are sufficiently thin glass supports that provide the necessary stability for the soft stamp, but are flexible enough to achieve the necessary flexibility.
  • a soft stamp reinforced with a support has increased strength and rigidity that can be adjusted by design, as well as increased dimensional stability compared to non-reinforced soft stamps.
  • soft stamps are manufactured as layer systems made of elastomer or polymer.
  • the mechanical properties such as stability, elasticity, flatness, roughness can be significantly determined by the carrier.
  • the structures of the soft stamp are created from the soft stamp material, in particular by molding the master stamp.
  • a master stamp or a hard stamp can be produced in particular in a step-and-repeat process (S&R process). This is particularly advantageous when very large master stamps have to be produced.
  • the master stamp is produced using another, master-master stamp.
  • the master stamp from which the soft stamps are molded is usually called a sub-master stamp and the master stamp for producing the sub-master stamp is called a master stamp.
  • the definitions can therefore vary.
  • a master stamp in particular a large-area one, which is used to mold soft stamps
  • a repeated embossing process step-and-repeat process
  • embossing at a first location
  • the master stamp-master stamp or master stamp
  • embossing is carried out at least once more.
  • the soft stamp material has as high an adhesion to the master stamp as possible in order to obtain a flawless embossing of the embossing material to the master stamp and thus to obtain a precise molding of the master stamp.
  • the soft stamp material has low adhesion to the master stamp so that the master stamp can be separated from the originally formed soft stamp.
  • master stamps that have been molded once, master stamp-master stamps, as well as step-and-repeat master stamps or the stamp itself.
  • a master stamp is used in a step-and-repeat process to directly emboss the soft stamp. This is particularly advantageous if the soft stamp is very large.
  • the master stamp is moved to a first position, embosses the soft stamp there, then moves to a second position that is different from the first position and embosses again. This process can be continued as often as necessary until a soft stamp of any size has been produced.
  • the individually embossed areas of the soft stamp can be embossed seamlessly.
  • the soft stamp detachment must be precisely controlled so that the embossed soft stamp structure and the soft stamp are not damaged when they are removed from the master stamp.
  • the state of the art for the micro- and/or nanostructuring of surfaces mainly includes photolithography and the various embossing techniques.
  • the embossing techniques work with either hard or soft stamps.
  • embossing lithography techniques in particular have become established and are displacing the classic photolithography techniques.
  • the use of so-called soft stamps is becoming increasingly popular.
  • a stamp made of an elastomer with a micro- or nanostructured surface is used to produce structures in the range of less than 1 ⁇ m to more than 1000 ⁇ m in terms of structure height. It is possible to produce structure widths of several centimeters, especially for Fresnel lenses.
  • An important feature for characterizing the finished soft stamp is the roughness, which can reach values (Ra or Rz values) of less than 10 nm, preferably less than 5 nm. Independently of this, the structure sizes can preferably be produced from 10 nm.
  • the object of the invention to provide an improved method for producing, in particular for embossing, a soft stamp, which at least partially eliminates, in particular completely eliminates, the disadvantages mentioned in the prior art. Furthermore, it is an object of the present invention to show a method which allows an efficient and rapid production of suitable soft stamps. In addition, it is an object of the present invention to show a device for carrying out the embossing method, as well as a soft stamp which can be easily separated from a substrate during later use of the embossed soft stamp.
  • the invention relates to a method for producing, in particular for embossing, a soft stamp with the following steps: i) providing a hard stamp with a first layer, ii) applying a second layer directly on the first layer, iii) embossing the soft stamp with the hard stamp, wherein the second layer is fixed to the soft stamp, iv) separating the soft stamp from the hard stamp so that the second layer is transferred to the soft stamp.
  • a further layer in particular a functional layer, preferably an ASL layer, is provided on the first layer.
  • the soft stamp to be embossed can also be formed only from a soft stamp embossing compound, which is preferably applied directly to the second layer. It has surprisingly been found that, particularly with a suitable combination of materials, a non-stick effect can be created directly on the soft stamp or the surface to be embossed.
  • the functionalization or adhesion reduction of the surface of the soft stamp can advantageously take place during the embossing process.
  • the steps are preferably carried out in the order described above.
  • the structures of the hard stamp are transferred to the soft stamp or molded onto it.
  • the second layer can already have been applied, so that a hard stamp with the two layers arranged directly on top of each other is provided.
  • the soft stamp contacts the second layer.
  • the structures of the hard stamp are molded onto the soft stamp through the layers, since these are very thin layers.
  • the first layer preferably covers the surface of the structures of the hard stamp completely or over the entire surface.
  • the second layer adheres to the now structured surface of the soft stamp. In other words, the second layer is fixed to the soft stamp.
  • the materials are preferably selected so that the adhesion forces between the two layers are at least lower than the adhesion force between the second layer and the soft stamp. In this way, when the hard stamp and the soft stamp move apart or separate, the second layer can advantageously be transferred to the soft stamp.
  • a soft stamp embossing compound of the soft stamp is applied directly to the second layer. In other words, for embossing, the soft stamp embossing compound is applied directly to the second layer, in particular before the transfer of the structures by the start of the effect of embossing forces.
  • the soft stamp embossing compound is thus preferably provided directly to the second layer before the embossing step by contacting the soft stamp with the hard stamp. In this way, it is ensured that the second layer can advantageously be provided directly and without contamination on the embossed and thus functionalized soft stamp.
  • the embossing in step iii) further comprises hardening of the soft stamp.
  • the soft stamp can be held, for example, by a carrier, frame or film that is transmissive for certain wavelengths and can be hardened through this by means of radiation.
  • the hardening can also be carried out by other known measures. It is particularly advantageous for the adhesive forces between the soft stamp and the second layer to be increased during the hardening, so that a strong connection is created. In this way, separation can be carried out particularly easily and without errors.
  • the material of the second layer and the material of the soft stamp are compatible during hardening, so that the second layer is further fixed to the soft stamp.
  • the first layer is completely wetted by the second layer during application in step ii).
  • the entire surface of the soft stamp to be structured can advantageously be functionalized or coated during embossing.
  • the first layer and the second layer are non-stick layers for reducing adhesive forces between interfaces. Both layers are therefore known non-stick layers which functionalize the adhesive properties of the soft stamp in such a way that it can be easily and efficiently separated or removed from a product or substrate when the structures of the soft stamp are later transferred to the product or substrate. In this way, a non-stick coating can advantageously be applied directly during the embossing of the soft stamp.
  • the interfaces between the two layers and between the layers and the hard stamp or the soft stamp can thus be advantageously adjusted in terms of their adhesive properties.
  • the adhesion between the layers is preferably low so that the second layer can be easily separated from the first layer, which preferably remains on the hard stamp after separation, and the stamps can be easily separated.
  • the first layer is applied to the hard stamp
  • ii) the second layer is applied to the hard stamp
  • iii) the soft stamp embossing compound is applied to a carrier, so that to produce a soft stamp iv) the soft stamp embossing compound is contacted with the second layer, in particular over the entire surface, and v) the soft stamp is then cured.
  • the soft stamp is separated from the hard stamp, with the separation taking place between the first layer and the second layer.
  • the anti-adhesive layers are at least partially tridecafluoro-
  • the layers can also consist of these materials. These materials have proven to be particularly suitable for use as non-stick layers for soft stamp functionalization or soft stamp embossing.
  • the respective materials of the first layer and the second layer are different. It has also proven advantageous that the materials are at least not identical. In this way, the adhesive properties required for transfer or suitable adhesion forces can be provided at the corresponding interfaces.
  • the additional second layer to be transferred preferably an ASL layer, can advantageously be applied to the first layer and fixed directly to the soft stamp during embossing. The soft stamp is thus coated at the same time during embossing.
  • the properties of the soft stamping compound can be optimized using the first layer and the second layer.
  • the filling behavior of the soft stamping compound can be advantageously influenced by adjusting the hydrophilic and/or hydrophobic properties.
  • the electrostatic behavior of the finished, hardened soft stamp can be influenced by selecting the second layer in particular.
  • the conductivity of the soft stamp can be influenced and adjusted using the electrical conductivities of the first layer and the second layer.
  • at least one further layer can be used in addition to the first layer and the second layer, in particular for adjusting the surface properties of the hard stamp and the soft stamp.
  • the surface properties can be adjusted more easily with several thin layers than with two layers.
  • the first layer and the second layer, in particular along a structured surface of the hard stamp each have a uniform thickness of less than 5 nm, preferably less than 3 nm, particularly preferably less than 1 nm, most preferably less than 0.3 nm.
  • the height of the layer along the stamp surface or structured surface is constant.
  • the low thickness or height also ensures that the fine structures can also be reproduced on the soft stamp.
  • a particularly thin layer is surprisingly sufficient to functionalize the soft stamp with regard to the adhesive properties if a second non-stick layer is provided on the first.
  • the first layer and the second layer, in particular along a structured surface of the hard stamp each have a uniform thickness of less than 30 micrometers, particularly preferably less than 15 micrometers, most preferably less than 10 micrometers.
  • These layer thicknesses are particularly necessary for large structures when the structure size in a z-direction to the layer thickness can be up to 1000:5 (preferably both values in nm).
  • the first layer and/or the second layer are applied by spin coating, spray coating, chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), dip coating, doctor blade coating or molecular beam epitaxy (MBE).
  • CVD chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PVD physical vapor deposition
  • MBE molecular beam epitaxy
  • the soft stamp at least partially comprises polydimethylsiloxane (PDMS), and/or perfluoropolyether (PFPE), polyhedral oligomeric silsesquioxane (POS S) and/or polydimethylsiloxane (PDMS) and/or tetraethylorthosilicate (TEOS) and/or poly(organo)siloxanes (silicone) and/or thermoplastics and/or thermosets.
  • PDMS polydimethylsiloxane
  • PFPE perfluoropolyether
  • POS S polyhedral oligomeric silsesquioxane
  • PDMS polydimethylsiloxane
  • TEOS tetraethylorthosilicate
  • silicone poly(organo)siloxanes
  • thermoplastics and/or thermosets thermoplastics and/or thermosets.
  • a first adhesion force between the second layer and the first layer is lower than a second adhesion force between the second layer and the soft stamp.
  • the materials are selected accordingly.
  • the force required for separation can also be advantageously adjusted.
  • the adhesion of the hard stamp and the first layer can be selected so that it remains on the hard stamp during separation. In other words, only the second layer can advantageously be transferred to the soft stamp.
  • the hard stamp is made of at least one of the following materials: glass, metal, metal alloy, ceramic or semiconductor material, preferably silicon, hardened polymer. These materials are predestined for use in the advantageous embossing method as hard stamps or master stamps.
  • the hard stamp has hardened polymer as the stamping surface.
  • the hard stamp is preferably stiffened with a rigid carrier.
  • the assembled hard stamp consists of a rigid carrier and the hardened impression surface made of polymer. It has been found that this embodiment is particularly advantageous for the embossing quality.
  • the invention relates to a device for embossing a soft stamp with a hard stamp according to the method according to at least one of the preceding claims, at least comprising a hard stamp with a first layer, coating means for applying a second layer to the first layer, embossing means for embossing the soft stamp with the hard stamp, wherein the second layer can be fixed to the soft stamp, separating means for separating the soft stamp from the hard stamp, wherein the second layer can be transferred to the soft stamp.
  • a layer preferably a non-stick layer, can be transferred directly to the soft stamp, since two layers arranged directly above one another are provided on the master stamp or hard stamp.
  • the device is designed to enable the embossing of the soft stamp and at the same time to carry out a functionalization with regard to the adhesive properties of the structured soft stamp surface.
  • the device preferably comprises means for applying a soft stamp embossing compound directly to the second layer, in particular before the embossing means begin to work.
  • the means are designed in particular to provide the soft stamp embossing compound on the second layer before embossing. In this way, embossing can advantageously be carried out precisely. In addition, contamination between the second layer and the soft stamp embossing compound and thus between the embossed soft stamp and the second layer fixed to it after embossing is avoided.
  • the device further comprises hardening means for solidifying the soft stamp, wherein the hardening means are designed to harden the soft stamp during embossing before the release means take effect.
  • the hardening means can be, for example, heat, electromagnetic radiation, in particular UV radiation, etc.
  • the use of radiation, in particular through a carrier/frame of the soft stamp, is preferred for hardening.
  • the second layer can advantageously be hardened and fixed to the soft stamp at the same time. In this way, a simple and error-free separation along the interface can be carried out even more easily.
  • a master stamp can be coated with a layer for functionalization, in particular with low adhesion (so-called anti-sticking layer, non-adhesive layer, ASL layer, non-stick layer) and a further second functional layer that is different from the first layer, in particular with an ASL layer, which is applied to the first layer in order to then mold a soft stamp from the master stamp.
  • a layer for functionalization in particular with low adhesion (so-called anti-sticking layer, non-adhesive layer, ASL layer, non-stick layer)
  • a further second functional layer that is different from the first layer, in particular with an ASL layer, which is applied to the first layer in order to then mold a soft stamp from the master stamp.
  • the interface between the first ASL layer and the second ASL layer serves as the separating surface.
  • the soft stamp is molded, the first ASL layer remains on the master stamp.
  • the soft stamp embossing compound hardens, the second ASL layer becomes part of the molded soft
  • ASL layers are intended as molecular layers with at least one molecular layer, preferably a molecular layer with a particularly coherent molecular layer, which functionalizes the soft stamp and/or the master stamp.
  • the soft stamp adheres to the master stamp for a combination of mechanical and/or physical and/or chemical reasons: mechanical reasons are the enlargement of the surface of the soft stamp due to the structuring, the friction between the master stamp and the soft stamp and a positive connection between the soft stamp embossing compound and the master stamp.
  • the physical basis of the adhesive property results primarily from van der Waals forces and/or hydrogen bonds.
  • the chemical basis of the adhesive property results from the chemical bonds: ionic and/or covalent, atomic and/or metallic bonds.
  • the actual adhesion between the master stamp and the soft stamp is in particular a resulting effect from a combination of the three principles mentioned. If the resulting adhesion is large, there is a risk of inaccurate molding and/or tearing off of the soft stamp.
  • At least one additional functional layer in particular another ASL layer, is applied.
  • This additional functional layer remains directly on the molded soft stamp and does not have to be applied in a further process step.
  • the aim is to attach a functional layer to the soft stamp during production of the soft stamp, so that a functional layer remains on the soft stamp when the soft stamp is demolded from the master stamp. From a design point of view, it is advantageous to generally avoid undercuts in the structure.
  • the adhesion properties of the individual soft stamp materials can be coordinated in such a way that the dimensional stability and embossing accuracy are increased and at the same time the necessary separation force of the soft stamp from the master stamp is reduced.
  • the adhesion properties should generally be reduced.
  • the ASL layers reduce friction by chemically and/or physically smoothing the surfaces, which can be equated with lubrication, even though no classic wetting lubricants are used.
  • the conditions for a dimensionally accurate stamp include the following features and/or properties:
  • Dimensional accuracy means that the surface with the 3D surface profile of the master stamp is reproduced error-free in the soft stamp and that this shape is retained after demolding.
  • the stamps have the following spatial sequence during embossing in a preferred embodiment:
  • Second interface First ASL surface to second ASL surface.
  • the master stamp is preferably made of glass, a metal, a metal alloy, a ceramic or a semiconductor material such as silicon.
  • the following properties are preferred for the master stamp material: high abrasion resistance, high rigidity, low thermal expansion, high thermal conductivity, low porosity, chemical inertness at operating temperature, and preferably anisotropy characterize the master stamp bulk material.
  • the bulk material is used well below the yield point in order to ensure the dimensional stability of the master stamp, so that the elasticity of the master stamp is in particular two orders of magnitude smaller than the elasticity of the hardened embossing compound.
  • the elasticity is characterized by the modulus of elasticity, which for the master stamp can preferably have at least two-digit values in gigapascals.
  • Master stamps can also be hardened soft stamps made of polymers, elastomers or silicone.
  • the hard master stamp is preferably produced using electron beam lithography.
  • Coating includes spin coating, spray coating, chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), dip coating, doctor blade coating and molecular beam epitaxy (MBE), in which the material is coated either by reaction of volatile starting materials or by condensation from the vapor phase on an existing layer or substrate surface, in particular on the master stamp surface.
  • CVD chemical vapor deposition
  • PECVD plasma-enhanced chemical vapor deposition
  • PVD physical vapor deposition
  • MBE molecular beam epitaxy
  • the structured master stamp surface to be molded is coated with a layer for functionalizing the master stamp surface, with the first ASL material.
  • the coating material is used to preferably produce a particularly coherent monoatomic and/or monomolecular layer on the master stamp surface.
  • the first ASL material should preferably create a physical and/or chemical bond to the master stamp material.
  • the first interface should preferably not change the geometry of the master stamp surface due to the monomolecular and/or monoatomic first ASL layer.
  • the layer thickness of the first ASL layer is taken into account when producing the master stamp structures, so that the correct impression dimensions of the master stamp with the coating of the first ASL layer result in the required structure sizes.
  • the first interface connects the first ASL material to the master stamp through a chemical and/or physical reaction, but the functionalizing surface property of the first ASL layer is retained.
  • the task of the first ASL layer on the master stamp is to absorb the second ASL layer, which remains on the soft stamp when the soft stamp is demolded from the master stamp.
  • the adhesive properties of a surface can be expressed using the energy density.
  • the energy density is derived from the force required to separate two surfaces.
  • the expert can estimate the surface energy at least approximately from the measured force required to separate a stamp from a master, knowing the size of the separated surface.
  • the energy density can be estimated from the surface energy.
  • the mechanical force can occur as a shear force or as a normal force.
  • the normal forces can be a point force, a line force or a surface force.
  • the energy density is less than 100 mJ/m2, preferably less than 30 mJ/m2, particularly preferably less than 15 mJ/m2, optimally less than 10 mJ/m2, between the first layer and the second layer, measured after curing at a given temperature (in particular above 70°C).
  • the first ASL layer consists of a single atomic and/or molecular layer which wets the master stamp surface.
  • a first ASL material is selected which has very good adhesion properties to the master stamp surface.
  • the first ASL material has very good abrasion properties, so that abrasive wear is largely prevented or at least minimized.
  • the first ASL material is preferably a solid substance with pronounced polar-anisotropic properties for adjusting the adhesive properties of the master stamp.
  • a contact angle measurement can be used to measure the adhesive properties.
  • the contact angle is a measure of the hydrophobicity or hydrophilicity that forms between a test liquid drop and the surface to be measured. Hydrophilic surfaces flatten the liquid drop because the adhesive forces between the liquid and the surface dominate over the cohesive forces of the liquid and therefore form low contact angles. Hydrophobic surfaces lead to a more spherical shape of the liquid drop because the cohesive forces of the liquid dominate over the adhesive forces between the liquid and the surface. Hydrophilic surfaces have a higher surface energy than hydrophobic surfaces.
  • water For a contact angle measurement of a solid surface such as the master stamp, the first ASL and the second ASL surfaces as well as the soft stamp surface, water can be used as the test liquid.
  • the separation between the master stamp and the soft stamp takes place along the second interface, which is formed by the first ASL and second ASL surfaces.
  • the second interface particularly preferably has the lowest surface energy of all interfaces in the process for embossing or coating the master stamp and separating the soft stamp from the master stamp.
  • the material pairing of the first ASL and second ASL material is selected so that the two materials have the lowest affinity for each other. It has proven surprisingly advantageous to deposit a further, different second ASL layer from the master stamp onto the first ASL layer when building up the layers for molding the soft stamp and then molding the master stamp.
  • At least the second ASL layer is a monoatomic or monomolecular layer.
  • the third interface is formed between the second ASL surface and the soft stamp surface.
  • the materials have a high affinity to each other, so that when the master stamp is separated from the soft stamp, the second ASL layer adheres to the soft stamp.
  • the third interface disappears at least partially, so that the non-stick property of the second ASL material is integrated into the soft stamp.
  • an at least partial material integration of the second ASL material into the soft stamp material takes place.
  • a transport of material from the soft stamp material into the second ASL material or vice versa is suboptimal.
  • the material pairing is carried out in such a way that diffusion is minimized as much as possible.
  • at least one permanent connection takes place between the second ASL material and the soft stamp material, especially during embossing.
  • the soft stamp material has at least the following properties: the soft stamp material can be applied to the second ASL material by a coating process. These can be the coating processes used in semiconductor technology or coating technology, in particular spray coating, spin coating with so-called puddle dispense or after application in a pattern, doctor blade coating, screen printing, inkjet printing.
  • the soft stamp material can be converted from a monomer state to a polymer in a thermochemical or photochemical reaction, thereby acquiring the necessary properties of strength and dimensional stability.
  • the soft stamp material is dimensionally stable and long-term stable, absorbent in the wavelength range of its own cross-linking radiation, but transparent for the cross-linking radiation of the embossing process with which a product is to be embossed by the soft stamp in later process steps.
  • the soft stamp material and the embossing material can be cross-linked with the same wavelength and/or with the same wavelength range.
  • the transparency, measured as transmittance can be over 70%, preferably over 80%, particularly preferably over 90%, in the optimal case over 95%, so that a high proportion of the cross-linking radiation penetrates and reacts in the embossing material.
  • the soft stamp material In order to maintain the dimensional stability of the soft stamp material, the soft stamp material must be sufficiently stiff. At the same time, the soft stamp material is elastic in order to return to the shape obtained during the original forming after demolding from the master stamp and/or a component to be stamped later. The soft stamp material also needs elasticity in order to absorb the forces of demolding and not tear. In particular, soft stamp materials are used whose elasticity, in particular their non-linear elastic material behavior and their stiffness, lead to optimal demolding behavior.
  • the fourth interface is formed between the soft stamp material and the carrier. In this interface, there is a high, preferably extremely high, affinity between the soft stamp material and the carrier material, so that the carrier adheres firmly to the soft stamp.
  • the carrier Preferably, there is an increased adhesion between the carrier and the soft stamp after plasma activation of at least the carrier surface compared to a non-surface-activated connection.
  • the carrier material preferably comprises at least one material from the following material classes:
  • -Materials that are referred to as glasses but are not, in particular sapphire glass or metal, in particular containing at least one element from the list Cu, Ag, Au, Al, Fe, Ni, Co, Pt, W, Cr, Pb, Ti, Ta, Zn, Sn,
  • Hypalon material
  • isoprene rubber material
  • nitrile rubber material
  • perfluoro rubber material
  • polyisobutene material
  • thermoplastic elastomers foams, in particular Arcel (material), Neopor (material), polyisocyanurates, polystyrenes, cellular rubber, acrylic ester-styrene-acrylonitrile, acrylonitrile/methyl methacrylate, acrylonitrile/butadiene/acrylate,
  • Urea resins isoprene rubber, lignin, melamine-formaldehyde resin, melamine resins, methyl acrylate/butadiene/styrene, natural rubber, perfluoroalkoxyalkane, phenol-formaldehyde resin, polyacetals, polyacrylonitrile, polyamide, polybutylene succinate,
  • the carrier can consist of several layers.
  • the carrier serves as a mechanical stabilizer for the soft stamp.
  • the carrier material is transparent to the crosslinking radiation of the soft stamp.
  • the transmittance is preferably greater than 80%, particularly preferably greater than 90%, very particularly preferably greater than 95%, in the optimal case greater than 98% for the given thickness of the carrier material.
  • ASL materials can in particular contain at least a portion of tridecafluoro-
  • Soft stamp materials can in particular contain at least a portion of polydimethylsiloxane (PDMS), and/or perfluoropolyether (PFPE), polyhedral oligomeric silsesquioxane (PO SS) and/or polydimethylsiloxane (PDMS) and/or tetraethylorthosilicate (TEOS) and/or poly(organo)siloxanes (silicone) and/or thermoplastics and/or thermosets.
  • PDMS polydimethylsiloxane
  • PFPE perfluoropolyether
  • PO SS polyhedral oligomeric silsesquioxane
  • PDMS polydimethylsiloxane
  • TEOS tetraethylorthosilicate
  • silicone poly(organo)siloxanes
  • a first embodiment of an exemplary method for embossing comprises the following steps, in particular at least carried out successively and/or simultaneously, in particular with the following sequence:
  • the master stamp is coated with a first ASL layer.
  • At least the first ASL layer has a self-assembly property.
  • At least the first ASL layer is deposited on the master stamp in a plasma deposition process.
  • the first ASL material is applied to the master stamp in such a way that the highly adhesive side of the first ASL layer adheres to the master stamp.
  • the low-adhesive side of the first ASL layer faces away from the master stamp.
  • the first ASL layer wets the master stamp structures as best as possible.
  • the master stamp can be subjected to an optional intermediate step for the modification and/or hardening and/or cross-linking of the first ASL layer.
  • the first ASL layer can form a chemical bond with the master stamp surface so that, from a macroscopic perspective, the adhesion of the first ASL layer is higher than the adhesion of a Langmuir-Blodgett film.
  • an adaptation of a surface can be understood as the production of a first layer.
  • nitriding, oxidation, coatings such as metallization (nickel plating, chrome plating), hardening of the surface or carbon enrichment can be understood in the broadest sense as the production of a first layer.
  • the resulting surface is the true impression surface of the master stamp.
  • the second ASL layer is applied to the first ASL layer. It is important that the first ASL layer has a low affinity to the second ASL layer, so that the molded soft stamp can be separated from the master stamp easily and with as little residue as possible in a further process step.
  • the second ASL layer differs at least in part from the first ASL layer.
  • the layer thicknesses of the first ASL layer and/or the second ASL layer are each less than 5 nm, preferably less than 3 nm, particularly preferably less than 1 nm, ideally less than 0.3 nm.
  • the soft stamp is molded onto the master stamp.
  • the second ASL layer remains on the soft stamp.
  • the carrier is attached to the back of the soft stamp.
  • the soft stamp and carrier are now referred to as the soft stamp.
  • the affinity of the second ASL material to the material of the soft stamp is greater than to the first ASL material, so that an easy separation of the fully processed soft stamp coated with a second ASL layer from the master stamp with the first ASL layer is possible.
  • the soft stamp is cross-linked, preferably through the carrier.
  • the soft stamp is given the necessary dimensional stability and strength.
  • the cross-linking reaction takes place as a photochemical and/or photo-thermochemical or a thermochemical or a delayed chemical reaction.
  • the second ASL layer bonds with the material of the soft stamp, preferably in an inseparable, in particular covalent, bond. This leads to the actual formation of the separation point between the first ASL layer, which forms an inseparable bond with the master stamp in particular, and the second ASL layer as a component of the soft stamp surface.
  • the cross-linking reaction forms a bond of high affinity between the soft stamp material and the carrier.
  • the hardened soft stamp is separated from the master stamp.
  • the soft stamp which has a second ASL layer, can be used to emboss structures.
  • the steps described above are part of the embossing process.
  • Figure la is a schematic representation of a first method step of a method for embossing a stamp according to the prior art
  • Figure 1b is a schematic representation of a second process step
  • Figure 1 c is a schematic representation of a third process step
  • Figure 2a is a schematic representation of a first process step of the embossing process according to the invention
  • Figure 2b is a schematic representation of a further process step of the embossing method according to the invention.
  • Figure 2c is a schematic representation of the stamps after separation.
  • Fig. la shows a coated master stamp 91.
  • the coated master stamp 91 consists of a master stamp 94 and an ASL layer 93.
  • the ASL layer 93 is applied to the master stamp surface.
  • Fig. 1b shows a master stamp 94 with an ASL layer 93 with an already hardened soft stamp 96, which is materially connected to a carrier 95.
  • the soft stamp 96 together with the carrier 95 is separated from the master stamp 91.
  • the ASL layer 93 remains on the master stamp 94.
  • the separation takes place between the soft stamp 96 and the ASL layer 93.
  • the soft stamp 96 is separated from the coated master stamp 91.
  • the separation itself is not shown.
  • Fig. 1 c shows the state of the process after the separation of the soft stamp 96 with the carrier 95 from the coated master stamp 91.
  • the soft stamp 96 is coated separately in a further process and can be used for embossing structures on a substrate not shown.
  • Fig. 2a shows a master stamp 4 which has been coated with a first ASL layer 3 and a second ASL layer 2.
  • the master stamp 4 with the two coatings of a first ASL layer 3 and a second ASL layer 2 is identified as a multi-coated master stamp 1.
  • the first ASL layer 3 has a high adhesive strength to the master stamp 4 and a low-adhesive surface to a second ASL layer 2.
  • the coating of the first ASL layer 3, which is already on the master stamp 4 is carried out at a different time than the second ASL layer, so that mixing of the first ASL layer 3 and the second ASL layer 2 can be avoided.
  • the second ASL layer 2 completely wets the first ASL layer 3 during processing, but enables a controlled and energetically favorable and dimensionally stable separation, i.e. a very low affinity between the first ASL layer 3 and the second ASL layer 2 is set as a material pairing.
  • Fig. 2b shows the result of a further process step for replicating and coating soft stamps.
  • the carrier 5 and the soft stamp 6 are connected to each other with a high affinity.
  • the soft stamp 6 also has a high affinity to the second ASL layer 2 in particular.
  • a multi-coated master stamp 1 was used for the primary formation of the soft stamp 6: The layer sequence of the first ASL layer 3, the second ASL layer 2 and the soft stamp 6 were applied to the master stamp 4 in primary formation.
  • the first ASL layer 3 has a high affinity to the master stamp 4 but a low affinity to the second ASL layer 2.
  • the second ASL layer 2 has a high affinity to the material of the soft stamp 6.
  • the soft stamp 6 also has a high affinity to the carrier 5.
  • the soft stamp 6 is stiffened with the carrier 5.
  • Fig. 2c shows the result of the process step for separating the soft stamp 6 from the master stamp 4.
  • the soft stamp 6 was lifted out of the master stamp 4 with the carrier 5.
  • the second ASL layer 2 remains connected to the soft stamp 6.
  • the second ASL layer 2 was separated from the first ASL layer 3 of the master stamp 4 without leaving any residue.
  • Soft stamp soft stamp embossing compound, embossing compound single coated master stamp

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un procédé et un dispositif de gaufrage d'un tampon souple ainsi qu'un dispositif de gaufrage et un tampon souple. Pendant le gaufrage avec le tampon dur, des structures sont produites sur le tampon souple, et un revêtement pour réduire les propriétés adhésives est disposé sur le tampon souple.
PCT/EP2023/067845 2023-06-29 2023-06-29 Procédé d'utilisation d'un tampon dur pour produire un tampon souple Ceased WO2025002557A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2023/067845 WO2025002557A1 (fr) 2023-06-29 2023-06-29 Procédé d'utilisation d'un tampon dur pour produire un tampon souple
TW113117256A TW202501149A (zh) 2023-06-29 2024-05-09 使用硬印模製作軟印模之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2023/067845 WO2025002557A1 (fr) 2023-06-29 2023-06-29 Procédé d'utilisation d'un tampon dur pour produire un tampon souple

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WO2025002557A1 true WO2025002557A1 (fr) 2025-01-02

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060258163A1 (en) * 2005-04-06 2006-11-16 Kenya Ohashi Methods of fabricating nano-scale and micro-scale mold for nano-imprint, and mold usage on nano-imprinting equipment
JP4496719B2 (ja) * 2003-06-17 2010-07-07 パナソニック株式会社 回路パターンの転写型およびその製造方法
US20160023400A1 (en) * 2014-07-25 2016-01-28 Samsung Electronics Co., Ltd. Method of transferring reverse pattern by using imprint process
WO2021098953A1 (fr) * 2019-11-19 2021-05-27 Ev Group E. Thallner Gmbh Appareil et procédé de formation de motifs de microstructures et/ou de nanostructures
WO2021195063A1 (fr) * 2020-03-27 2021-09-30 Illumina, Inc. Appareil d'impression

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4496719B2 (ja) * 2003-06-17 2010-07-07 パナソニック株式会社 回路パターンの転写型およびその製造方法
US20060258163A1 (en) * 2005-04-06 2006-11-16 Kenya Ohashi Methods of fabricating nano-scale and micro-scale mold for nano-imprint, and mold usage on nano-imprinting equipment
US20160023400A1 (en) * 2014-07-25 2016-01-28 Samsung Electronics Co., Ltd. Method of transferring reverse pattern by using imprint process
WO2021098953A1 (fr) * 2019-11-19 2021-05-27 Ev Group E. Thallner Gmbh Appareil et procédé de formation de motifs de microstructures et/ou de nanostructures
WO2021195063A1 (fr) * 2020-03-27 2021-09-30 Illumina, Inc. Appareil d'impression

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