WO2025242510A1 - Procédé pour faire fonctionner un actionneur à corps solide dans un système de microlithographie par projection, élément optique adaptatif et installation de lithographie par projection - Google Patents

Procédé pour faire fonctionner un actionneur à corps solide dans un système de microlithographie par projection, élément optique adaptatif et installation de lithographie par projection

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Publication number
WO2025242510A1
WO2025242510A1 PCT/EP2025/063253 EP2025063253W WO2025242510A1 WO 2025242510 A1 WO2025242510 A1 WO 2025242510A1 EP 2025063253 W EP2025063253 W EP 2025063253W WO 2025242510 A1 WO2025242510 A1 WO 2025242510A1
Authority
WO
WIPO (PCT)
Prior art keywords
solid
charge
voltage
weighting
state actuator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/063253
Other languages
German (de)
English (en)
Inventor
Markus Raab
Eike Oliver Schaefer-Nolte
Cornelius RICHT
Stefan BAUEREGGER
Maximilian LODERER
Elena ROMMEL
Tien Luc LE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of WO2025242510A1 publication Critical patent/WO2025242510A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/06—Drive circuits; Control arrangements or methods
    • H02N2/062—Small signal circuits; Means for controlling position or derived quantities, e.g. for removing hysteresis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure

Definitions

  • the invention relates to a method for operating at least one solid-state actuator of an optical element or an adaptive optical element, in particular for adjusting and/or deforming an optical element and/or its surface.
  • the invention further relates to an adaptive optical element for a lithography system, in particular for a microlithographic projection exposure system, comprising at least one solid-state actuator for adjusting or changing an optical surface of the optical element, wherein the solid-state actuator comprises a dielectric medium that is deformable by means of an electric field, and electrodes for generating the electric field in the dielectric medium by applying an electrical operating voltage, comprising at least one measuring device configured to measure an electric charge and a voltage present on the electrodes when the operating voltage is applied, and a control unit.
  • the invention further relates to a projection exposure system.
  • Projection exposure systems are used to create extremely fine structures, particularly on semiconductor devices or other microstructured components.
  • the operating principle of these systems is based on the creation of ultra-fine structures down to the nanometer range by means of a generally reduced-size projection of structures onto a mask, a so-called reticle, onto a wafer, which is coated with photosensitive material.
  • the minimum dimensions of the generated structures depend directly on the wavelength of the light used. This light is shaped in an illumination optic to optimally illuminate the reticle.
  • light sources with emission wavelengths in the nanometer range for example between 1 nm and 120 nm, have been increasingly used, particularly in...
  • the wavelength range of 13.5 nm is used.
  • the described wavelength range is also referred to as the EUV range.
  • the microstructured components are manufactured not only using EUV systems but also with established DUV systems with wavelengths between 100 nm and 400 nm, particularly 193 nm. With the increasing demand for ever smaller structures, the requirements for optical correction in these systems have also risen.
  • the optical elements of the microlithographic projection exposure system such as lenses or mirrors, are adjusted, positioned, or their active surface is deformed by means of actuators.
  • These actuators are preferably solid-state actuators, which, according to the present invention, are electrostrictive or piezoelectric actuators.
  • the solid-state actuators are attached to the optical element, particularly to its back surface, and can actuate either perpendicular to or parallel to the surface. By controlling each individual actuator, the position or profile of the mirror can be precisely adjusted.
  • actuation behavior which can generally be categorized as aging effects, can lead to large and increasing actuation errors over the service life of the solid-state actuator.
  • the actuation behavior of the solid-state actuator changes over time when it is operated at a setpoint voltage for an extended period (burn-in).
  • the resulting change in the slope of the stress-strain curve is called the gain-dip effect. Since these changes can occur very locally, they can be particularly well observed in the The first derivative of the strain of the solid actuator can be identified via the stress.
  • the problem relating to the method is solved by a method having the features of claim 1.
  • the problem relating to the adaptive optical element is solved by an adaptive optical element having the features of claim 16, and the problem relating to the projection exposure system is solved by a projection exposure system having the features of claim 19.
  • Advantageous embodiments with expedient further developments are specified in the dependent claims.
  • the inventive method for operating an adaptive optical element with at least one solid-state actuator comprises at least the following steps:
  • the actual strain of the solid-state actuator can be detected and controlled by means of a feedback control system, whereby the control system, i.e., the determination of the controlled variable, takes into account both the detected charge and the detected voltage.
  • the control system i.e., the determination of the controlled variable
  • the displacement i.e., strain of the solid-state actuator
  • a calibration curve exhibiting a charge-strain correlation can be generated, particularly before carrying out the method.
  • a stress-strain correlation can also be created as an additional correlation curve.
  • the strain of the solid-state actuator can be determined by measuring the stress and charge.
  • a control unit can be set up to maintain the determined strain at the setpoint using the controlled variable and, if the measured strain deviates from the setpoint, to take appropriate measures to bring the setpoint strain into line with the actual strain, for example, by adjusting the operating voltage of a voltage generator using a control signal based on the controlled variable.
  • the measuring device includes at least one measuring capacitor and is configured to determine the electrical charge on the electrodes by measuring the voltage.
  • the measuring device includes a voltage measuring unit, which is configured to perform the voltage measurement at the measuring capacitor.
  • the measuring device is specifically designed as a Sawyer tower circuit.
  • the measuring device is specifically configured to repeatedly, and in particular continuously, measure the charge and/or voltage.
  • the procedure can include steps whereby an optical surface of the adaptive optical element is adjusted or locally deformed by means of the stretching of the solid actuator.
  • the weighting value is adjusted to the operating time of the solid-state actuator or the occurrence of an event.
  • the two weightings can be temporarily equal.
  • the values of the two weightings differ.
  • the values of the two weightings can change over the operating time of the solid-state actuator, or the weighting values can change only intermittently, i.e., temporarily at a predetermined or predeterminable time and/or period.
  • the weighting values can behave periodically or repeatedly; that is, in a first period, the weighting values are initial values, and in at least a second period, the weighting values are second values that differ from the initial values, with the first and second periods alternating.
  • one weighting is at least temporarily less than 10%, preferably less than 5%, and most preferably less than 2%.
  • the weightings can also be temporarily 0%.
  • the value of the first weighting is greater than the value of the second weighting until a predetermined or predetermined time or the occurrence of an event, and that the value of the second weighting is at least temporarily greater than the value of the first weighting from the predetermined or predetermined time or the occurrence of the event.
  • the value of one weighting is at least 60%, preferably at least 70%, and most preferably at least 80%.
  • the values of the first and second weightings can exhibit a sudden, step-like progression, or a continuous progression. Furthermore, the value of the first weighting can temporarily decrease, only to then increase again at at least one predetermined or predictable time, or after the occurrence of a specific event. to increase with each event or to rise abruptly to a value of over 50%, preferably over 70%, and most preferably over 80%. The value of the first weighting can then decrease again – preferably continuously. In particular, it is advantageous if the value of the first weighting decreases at least temporarily by the amount by which the value of the second weighting increases. This takes into account the surprising finding that control via charge exhibits lower control errors than control via a detected voltage over short operating times/durations, while control via charge can exhibit a larger control error than control via a detected voltage over longer operating durations.
  • a new reference point for the control system at a predetermined or predefinable time or upon the occurrence of an event.
  • This new reference point is based predominantly or exclusively on the measured voltage, and the control system is then referenced to this new reference point using the measured charge.
  • the system references the voltage measured at that time. This means that the measured voltage signal is considered error-free, and the determination of the controlled variable is temporarily or at a predetermined time based solely on the measured voltage.
  • the charge is measured again and defined as the new charge reference point. This means that the control error is set to zero at this charge level.
  • the first weighting is greater than the second weighting when determining the controlled variable, or if the controlled variable is determined exclusively by means of the recorded charge.
  • the procedure preferably includes the following steps:
  • the reference operating point can be higher or lower than the operating point. These process steps shift the operating point such that hysteresis, gain dip, and creep effects are at least reduced.
  • the solid-state actuator method ensures that the charge-strain correlation of the new operating point corresponds to that of the old operating point.
  • aging effects include effects such as hysteresis, creep, and gain dip.
  • the procedure includes the following steps:
  • a recalibration is performed by moving the solid-state actuator according to a predetermined or specifiable calibration signal, during which the charge and voltage are determined using the measuring device.
  • the calibration signal is particularly preferably an oscillating signal, especially a trigonometric signal.
  • the charge and voltage are determined by the measuring device and compared with stored or storeable target values as a disturbance observer.
  • the event is a wafer exchange or the end of an exposure time.
  • the method according to the invention can be used in particular for controlling a solid-state actuator configured to adjust a mirror.
  • the adaptive optical element is characterized in particular by the fact that the control unit is configured to control the at least one solid-state actuator by means of a control variable that takes into account the detected charge with at least a first weighting and the detected voltage with a second weighting.
  • the adaptive optical element is specifically configured to carry out the method for operating a solid-state actuator.
  • the adaptive optical element can also be designed as an optical element, the at least one of which has a solid-state actuator configured to adjust the optical element.
  • the control unit is configured to determine the displacement, i.e., strain, of the solid-state actuator and compare it to the setpoint as the controlled variable, maintaining it at the setpoint. If necessary, if the measured strain deviates from the setpoint, a manipulated variable or correction variable based on the controlled variable can, for example, regulate a voltage generator that sets an operating voltage.
  • the measuring device includes at least one measuring capacitor and is configured to determine the electrical charge on the electrodes by measuring the voltage.
  • the measuring device includes a voltage measuring unit configured to perform the voltage measurement across the measuring capacitor.
  • the measuring device is specifically designed as a Sawyer tower switching device. A circle is formed.
  • a measuring device suitable for the method and the adaptive element is described in German patent application DE 10 2023 202 040.8, which is hereby fully incorporated into the present disclosure.
  • the value of the weights is adjusted to the operating time of the solid-state actuator and/or the occurrence of an event, such as a wafer exchange or the end of an exposure time.
  • control unit includes a crossover network configured to reduce the value of the first weight by the increase in the value of the second weight.
  • the crossover network can be configured as a high-pass and a low-pass filter.
  • the low-pass filter is configured to reduce or suppress the weight value at times earlier than a predetermined or predefined time, while the high-pass filter is configured to reduce or suppress the weight value from the predetermined or predefined time onward, or upon the occurrence of an event.
  • the invention further relates to a projection exposure system with at least one adaptive element according to the invention.
  • the invention that is, the method according to the invention and the adaptive optical element, can also be used in a lithography system, in a lighting system for a lithography system, in particular a microlithography system, or in a projection lens for a lithography system, in particular a microlithography system.
  • Figure 1a shows a schematic representation of a microlithographic projection exposure system designed for operation in the EUV
  • Figure 1b shows a schematic representation of a microlithographic projection exposure system designed for operation in DUV
  • Figure 2 shows a first schematic representation of the process
  • FIG. 3 shows a second schematic representation of the process
  • Figure 4 shows a third schematic representation of the process.
  • Figure 5 shows a fourth schematic representation of the process
  • Figure 6 shows a fifth schematic representation of the process.
  • Figure 1a shows a schematic representation of an exemplary projection exposure system 600 designed for operation in the EUV, in which the present invention can be implemented.
  • a lighting device in a projection exposure system 600 designed for EUV has a field facet mirror 603 and a pupil facet mirror 604.
  • the light from a light source unit which comprises a plasma light source 601 and a collector mirror 602, is directed onto the field facet mirror 603.
  • a first telescope mirror 605 and a second telescope mirror 606 are arranged.
  • a deflecting mirror 607 which directs the incident radiation onto an object field in the object plane of a projection lens comprising six mirrors 651-656.
  • a reflective A structure-bearing mask 621 is arranged on a mask table 620, which is imaged into an image plane by means of the projection lens.
  • a substrate 661 coated with a photosensitive layer (photoresist) is located on a wafer table 660.
  • One or more of the mirrors of the EUV-designed projection exposure system 600 can be formed as the (adaptive) optical element 100 according to the invention.
  • the invention can also be used in a DUV system, as shown in Figure 1b.
  • a DUV system is fundamentally constructed like the EUV system described above in Figure 1a, except that mirrors and lenses can be used as optical elements in a DUV system, and the light source of a DUV system emits useful radiation in a wavelength range of 100 nm to 400 nm.
  • the DUV lithography system 700 shown in Figure 1b has a DUV light source 701.
  • a DUV light source 701 for example, an ArF excimer laser can be used as the DUV light source 701, which emits radiation 702 in the DUV range at, for example, 193 nm.
  • a beam shaping and illumination system 703 directs the DUV radiation 702 onto a photomask 704.
  • the photomask 704 is designed as a transmissive optical element and can be arranged outside the systems 703.
  • the photomask 704 has a structure which is reduced in size and projected onto a wafer 706 or the like by means of the projection system 705.
  • the projection system 705 has several lenses 707 and/or mirrors 708 for imaging the photomask 704 onto the wafer 706.
  • Individual lenses 707 and/or mirrors 708 of the projection system 705 can be arranged symmetrically to the optical axis 709 of the projection system 705. It should be noted that the number of lenses 707 and mirrors 708 of the DUV lithography system 700 is not limited to the number shown. More or fewer lenses 707 and/or mirrors 708 may be provided.
  • the beam shaping and illumination system 703 of the DUV lithography system 700 has several lenses 707 and/or mirrors 708.
  • the mirrors are typically curved on their front surface for beam shaping.
  • An air gap 710 between the last lens 707 and the wafer 706 can be replaced by a liquid medium having a refractive index > 1.
  • the liquid medium can, for example, be... It must be highly purified water.
  • Such a setup is also known as immersion lithography and exhibits increased photolithographic resolution.
  • Figure 2 shows a schematic representation of a control loop 103 for operating at least one solid-state actuator 100 of an (adaptive) optical element.
  • the solid-state actuator 100 is moved to an operating voltage 101.
  • a setpoint 102 for a strain of the solid-state actuator 100 is requested, and the solid-state actuator 100 is moved within the control loop 103 according to the setpoint 102.
  • a charge and a voltage measurement applied to the electrodes of the solid-state actuator are performed using a measuring device 108.
  • the charge C and the voltage U are measured repeatedly, and in particular continuously.
  • the strain of the solid-state actuator 100 is controlled by a control unit 104, whereby a controlled variable Stot is determined, which in this case is a strain.
  • the measured charge is weighted Gi in the first control variable Gi, and the measured voltage is weighted G2 in the second control variable G2.
  • the measured voltage and charge are each converted into a charge-based polarization Pc and a voltage-based polarization Pu, respectively, which, with weights G1 and G2, contribute to a total polarization Ptot.
  • the resulting total polarization is, in turn, proportional to the controlled variable Stot, i.e., the strain of the solid actuator 100.
  • a calibration curve can preferably be created that exhibits a charge-strain correlation.
  • a stress-strain correlation is created as an additional correlation curve.
  • the strain of the solid-state actuator 100 can be determined by measuring the stress and charge.
  • the control unit 104 is configured to maintain the determined strain at the setpoint using the control variable Stot.
  • the control unit 104 is prompted to take action if the detected strain deviates from the setpoint 102 by a predetermined or predefinable value, in order to bring the setpoint strain into conformity with the actual strain.
  • a voltage generator 109 can be prompted to generate a control signal based on the control variable Stot.
  • the control unit 104 includes a conversion specification for determining a target operating voltage Uo from the specified target strain 101.
  • the at least one solid-state actuator 100 has a dielectric medium which can be deformed by means of an electric field, as well as electrodes for generating the electric field in the dielectric medium by applying an electrical operating voltage.
  • FIG. 2 also shows an embodiment of a measuring device 108 that may be used to carry out the method.
  • the measuring device 108 is configured as a Sawyer tower circuit.
  • the electrodes of the at least one solid-state actuator are connected to the voltage generator 109.
  • the measuring device 108 is preferably connected between the solid-state actuator 100 and the voltage generator 109.
  • the measuring device 108 includes at least one measuring capacitor CM and is configured to determine the electrical charge on the electrodes by measuring the voltage.
  • the measuring device 108 includes a voltage measuring unit 110, which is configured to perform the voltage measurement at the measuring capacitor CM, i.e., to detect the voltage drop UM ZU across the measuring capacitor CM.
  • An ohmic resistor RM can be connected in parallel with the measuring capacitor CM.
  • another ohmic resistor RA also referred to as a shunt resistor, can be connected in parallel with the electrode arrangement of the solid-state actuator 100.
  • the measuring voltage UM corresponds to the difference between the operating voltage Uo and an actuator voltage UA.
  • the measuring device is also configured to use the voltage drop UM across the measuring capacitor CM to determine the electric charge Q. This charge corresponds to the charge present on the electrodes of the solid-state actuator when the actuator voltage UA is applied.
  • the measuring device 108 can also be connected downstream of the solid-state actuator 100, i.e., between ground and one of the electrodes.
  • the measuring device 108 is specifically designed to repeatedly, and in particular continuously, detect the charge and/or voltage.
  • the charge QM determined by measuring device 108 is converted into a strain S of the solid-state actuator.
  • the charge QM is converted into the polarization Pc on the electrodes.
  • Pc is proportional to QM.
  • the proportionality constant can be determined by suitable calibration or by model-based calculation.
  • the strain is then calculated from the determined polarization P, where the strain S is proportional to the square of the polarization (S ⁇ P2 ).
  • the determined voltage UM is also converted into a polarization Pu on the electrodes.
  • the polarization Pc contributes to the total polarization Ptot with the first weighting Gi, and the polarization Pu contributes to the second weighting G2.
  • the strain is then calculated from the polarization Ptot thus determined, where the strain S is proportional to the square of the polarization (S ⁇ P2 ).
  • the proportionality constant can be determined by suitable calibration
  • the values of the weights GI, G2 are preferably adapted to the operating time of the solid-state actuator 100 or to the occurrence of an event (for example, a wafer change).
  • the two weights GI, G2 can be temporarily equal.
  • the values of the two weights GI, G2 differ.
  • the values of the two weights GI, G2 can change over the operating time of the solid-state actuator 100, or the values of the weights GI, G2 can change only intermittently, i.e., temporarily, especially at a predetermined or predeterminable time and/or period.
  • the values of the weights GI, G2 can behave periodically or repeatedly, that is, in a first period, the values of the weights GI, G2 are initial values, and in at least a second period, the values of the weights GI, G2 are second values that differ from the initial values, with the first and second periods alternating.
  • the value of one weighting GI,G2 is at least temporarily less than 10%, preferably less than 5%, and most preferably less than 2%.
  • the weightings GI,G2 can also temporarily be 0%.
  • the value of the first weighting G1 is greater than the value of the second weighting G2 until a predetermined or predeterminable time or the occurrence of an event.
  • the value of the second weighting G2 is, at least temporarily, greater than the value of the first weighting Gi from the specified or specifiable time or the occurrence of the event.
  • the value of the first weighting GI ,G2 is at least 60%, preferably at least 70%, and most preferably at least 80%.
  • the values of the first and second weights GI,G2 can exhibit a discontinuous, step-like, or continuous profile. Furthermore, the value of the first weight GI can temporarily decrease, then increase at at least one predetermined or predeterminable time or after the occurrence of an event, or increase abruptly to a value exceeding 50%, preferably exceeding 70%, and most preferably exceeding 80%. The value of the first weight GI can subsequently decrease again—preferably continuously. In particular, the value of the first weight GI,G2 can decrease at least temporarily by the same amount by which the value of the second weight GI increases.
  • the controlled variable Stot is initially determined exclusively by charge measurement (i.e., by means of Pc) until a predetermined or predeterminable time or the occurrence of an event. Upon the occurrence of the time or event, the controlled variable Stot is determined exclusively by voltage measurement (i.e., Pu).
  • control via charging has lower control errors than control via a detected voltage for short operating times/durations, while control via charging can have a larger control error than control via the detected voltage for longer operating times.
  • control unit 104 can also include a crossover network configured to reduce the value of the first weighting Gi by the increase in the value of the second weighting G2ZU.
  • the crossover network can be configured as a high-pass filter 111 and a low-pass filter 112.
  • the method according to Figure 4 differs in that, in addition to at least one predetermined or predefinable time or the occurrence of an event, a new reference point 105 is defined for the control, which is based predominantly or exclusively on the determined voltage, and that the control is referenced to the new reference point 105 using the detected charge.
  • a predetermined or predefinable time or the occurrence of an event for example, a wafer exchange
  • the reference is therefore made to the voltage detected at that time.
  • the detected voltage signal is considered error-free and the determination of the controlled variable is temporarily or at a predetermined time based exclusively on the detected voltage.
  • the charge is again detected and defined as the new charge reference point. That is, the control error is set to zero at this charge.
  • the first weighting G1 is greater than the second weighting G2.
  • the controlled variable is determined exclusively using the detected charge Pc.
  • a new voltage-based reference point 105 is regularly referenced over the operating lifetime of the solid-state actuator 100. This reduces the control error for the charge-based control even for longer operating lifetimes.
  • the method according to Figure 5 differs by the following additional process steps, whereby at least one predetermined or predeterminable event or time, the solid-state actuator is moved by means of a calibration signal 106, preferably by means of an oscillating, in particular trigonometric, calibration signal 106, and the charge and voltage are thereby recorded by means of the measuring device 108.
  • the charges and voltages thus recorded are used as an additional quantity 107 in the determination of the controlled variable Stot. This is taken into account.
  • a recalibration is performed by moving the solid-state actuator 100 according to a predetermined or specifiable calibration signal, during which the charge and voltage are determined using the measuring device.
  • Figure 6 shows a further embodiment of the method.
  • the method preferably comprises the following steps:
  • the reference operating point 101b can be larger or smaller than the operating point 101a. Using these process steps, the operating point 101 is shifted such that hysteresis, gain dip, and creep effects are at least reduced compared to the first operating point.
  • the solid-state actuator 100 process ensures that the charge-strain correlation of the new operating point 101c corresponds to that of the old operating point 101a, i.e., it is free of aging effects.
  • the reference operating point 101b is selected within a voltage range that is free of aging and/or drift effects.
  • the effects of aging include, in this case, effects such as hysteresis, creep, or gain dip.
  • the charge and voltage can be determined using the measuring device and compared with stored or storeable target values as a disturbance observer.
  • the method is preferably used to control a solid-state actuator 100 of an optical element in a lithography system, preferably an adaptive optical element.
  • the event is a wafer exchange or the end of the exposure time.
  • the solid-state actuator 100 can adjust an optical element and/or deform its surface, at least locally.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un procédé pour faire fonctionner au moins un actionneur à corps solide (100) d'un élément optique, comprenant les étapes consistant à : commander l'actionneur à corps solide (100) avec une tension de service (101) ; demander une grandeur théorique (102) pour un allongement de l'actionneur à corps solide (100) ; commander l'actionneur à corps solide (100) selon la grandeur théorique (102) dans une boucle de régulation (103) ; effectuer une mesure de charge et une mesure de tension appliquées aux électrodes de l'actionner à corps solide (100) au moyen d'un dispositif de mesure (108) et ; réguler l'allongement (s) de l'actionneur à corps solide (100) par détermination d'une grandeur de régulation Stot de l'allongement sur la base de la charge mesurée et de la tension mesurée, la charge mesurée entrant dans le calcul de la grandeur de régulation (Stot avec un premier coefficient de pondération G1 et la tension mesurée avec un deuxième coefficient de pondération (G2. Cette invention concerne en outre un élément optique adaptatif et une installation de lithographie par projection.
PCT/EP2025/063253 2024-05-22 2025-05-14 Procédé pour faire fonctionner un actionneur à corps solide dans un système de microlithographie par projection, élément optique adaptatif et installation de lithographie par projection Pending WO2025242510A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102024204700.7A DE102024204700A1 (de) 2024-05-22 2024-05-22 Verfahren zum Betreiben eines Festkörperaktuators in einer mikrolithographischen Projektionsbelichtungsanlage, adaptives optisches Element und Projektionsbelichtungsanlage
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DE102007023546A1 (de) * 2007-05-21 2008-11-27 Siemens Ag Schaltung zum Regeln zumindest eines Festkörperaktors einer Festkörperaktor-Antriebsvorrichtung
US20180183357A1 (en) * 2015-06-12 2018-06-28 Universite D'aix-Marseille Device for controlling a piezoelectric actuator
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