WO2025249965A1 - Dispositif électronique comprenant un ensemble haut-parleur et procédé de dissipation de chaleur associé - Google Patents

Dispositif électronique comprenant un ensemble haut-parleur et procédé de dissipation de chaleur associé

Info

Publication number
WO2025249965A1
WO2025249965A1 PCT/KR2025/007475 KR2025007475W WO2025249965A1 WO 2025249965 A1 WO2025249965 A1 WO 2025249965A1 KR 2025007475 W KR2025007475 W KR 2025007475W WO 2025249965 A1 WO2025249965 A1 WO 2025249965A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
speaker
various embodiments
metal plate
speaker assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2025/007475
Other languages
English (en)
Korean (ko)
Inventor
박성욱
안영준
김정섭
윤종근
한준희
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020240115274A external-priority patent/KR20250172276A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2025249965A1 publication Critical patent/WO2025249965A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to an electronic device including a speaker assembly and a heat dissipation method thereof.
  • Electronic devices contain multiple electronic components that generate heat when they consume current, such as processors, communication modules, or charging modules.
  • Heat generated by multiple electronic components in electronic devices can degrade their performance or even cause battery explosions. Design constraints or the slimming of electronic devices can make it difficult to incorporate active components, such as cooling fans.
  • Embodiments of the present disclosure provide an electronic device including a speaker assembly and a heat dissipation method thereof, wherein heat emitted from at least one electronic component is dispersed or discharged to the outside of the electronic device through the speaker assembly.
  • an electronic device comprising a housing, a first speaker assembly, a thermally conductive plate, at least one processor, and a memory.
  • the housing includes a first speaker hole.
  • the first speaker assembly is disposed within the housing corresponding to the first speaker hole.
  • the thermally conductive plate is configured to overlap the at least one processor and the first speaker assembly.
  • the memory stores instructions that, when executed by the processor, cause the electronic device to check a temperature for the electronic device while playing first audio data of a first frequency band through the first speaker assembly, and to play second audio data of a second frequency band through the first speaker assembly based on the temperature for the electronic device.
  • an electronic device comprising a housing, a speaker assembly, a printed circuit board, a thermally conductive plate, a processor, and a memory.
  • the housing forms at least a portion of a front surface of the electronic device, a rear surface of the electronic device, and a side surface of the electronic device, and includes a speaker hole.
  • the speaker assembly is disposed within the housing corresponding to the speaker hole.
  • the speaker assembly includes a speaker housing and a speaker positioned within the speaker housing.
  • the speaker housing includes a metal plate. The metal plate is positioned between the rear surface of the electronic device and the speaker, and forms a portion of a sound wave path of the speaker assembly.
  • a printed circuit board is disposed within the housing, and a plurality of electronic components are disposed on the printed circuit board.
  • the thermally conductive plate is configured to overlap the printed circuit board and the metal plate of the speaker assembly.
  • the memory stores instructions that, when executed by the processor, cause the electronic device to determine a temperature for an electronic device reproducing first audio data of a first frequency band through the speaker assembly, and to reproduce second audio data of a second frequency band through the speaker assembly based on the temperature of the electronic device.
  • a method of operating an electronic device including at least one electronic component disposed on a PCB, a speaker assembly electrically connected to the PCB, and a thermally conductive member connecting the at least one electronic component and the speaker assembly, the method including an operation of checking a temperature for the electronic device while playing back first audio data of a first frequency band through the speaker assembly.
  • the method includes an operation of playing back second audio data of a second frequency band through the speaker assembly based on the temperature for the electronic device.
  • an electronic device including a speaker assembly and a heat dissipation method thereof can reduce overheating of at least one electronic component through the speaker assembly.
  • FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.
  • FIG. 2 is a drawing showing various aspects of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3 is an exploded perspective view of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIGS. 4 and 5 are perspective views of a first speaker assembly according to various embodiments of the present disclosure.
  • FIG. 6 is an exploded perspective view of a first speaker assembly according to various embodiments of the present disclosure.
  • FIG. 7 is a diagram illustrating a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 8 is an exploded perspective view of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2, according to various embodiments of the present disclosure.
  • FIG. 10 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2, according to various embodiments of the present disclosure.
  • FIG. 11 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 12 is a perspective view of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 13 is a perspective view of a thermally conductive plate and drawings illustrating the thermally conductive plate according to various embodiments of the present disclosure.
  • FIG. 14 illustrates heat maps of electronic devices according to various embodiments of the present disclosure.
  • FIG. 15 is a graph showing the performance of a first speaker included in an electronic device according to the present disclosure, and the performance of a first speaker included in an electronic device of a comparative example in which the first thermally conductive layer is omitted.
  • FIG. 16 is a block diagram of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 17 is a block diagram of a generative AI system according to various embodiments of the present disclosure.
  • FIG. 18 is a graph showing frequency characteristics of audio data for heat dissipation according to various embodiments of the present disclosure.
  • FIG. 19 illustrates an operational flow for heat dissipation of an electronic device according to various embodiments of the present disclosure.
  • FIG. 20 illustrates an operational flow for heat dissipation of an electronic device according to various embodiments of the present disclosure.
  • FIG. 21 is a block diagram of a portion of an electronic device according to various embodiments of the present disclosure.
  • FIG. 22 illustrates an operational flow for heat dissipation of an electronic device according to various embodiments of the present disclosure.
  • FIG. 23 illustrates an operational flow for heat dissipation of an electronic device according to various embodiments of the present disclosure.
  • FIG. 24 is a graph showing performance when second audio data of a designated inaudible frequency band for heat dissipation is mixed and played back through a speaker module when first audio data including an audible frequency band is played back according to various embodiments of the present disclosure, and a graph showing performance when first audio data is played back through a speaker module without mixing of the second audio data of the designated inaudible frequency band.
  • FIG. 25 illustrates heat maps of an electronic device according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present disclosure.
  • an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network).
  • the electronic device (101) may communicate with the external electronic device (104) via the server (108).
  • the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and/or an antenna module (197).
  • at least one of these components e.g., the connection terminal (178)
  • some of these components may be implemented as a single integrated circuitry.
  • a sensor module (176), a camera module (180), or an antenna module (197) may be implemented embedded in one component (e.g., a display module (160)).
  • the processor (120) may include various processing circuits and/or multiple processors.
  • the term "processor” as used in this disclosure, including the claims, may include various processing circuits, including at least one processor, wherein one or more of the at least one processor may be individually and/or collectively configured to perform the various functions described in this disclosure in a distributed manner.
  • processor any processor capable of performing various functions described in this disclosure.
  • processors such as being configured to perform a number of functions
  • the at least one processor may include a combination of processors that perform the various recited/disclosed functions, for example, in a distributed manner.
  • the at least one processor may execute program instructions to achieve or perform the various functions.
  • the processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. As at least part of the data processing or operations, the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134).
  • software e.g., a program (140)
  • the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134).
  • the processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121).
  • a main processor (121) e.g., a central processing unit (CPU) or an application processor (AP)
  • auxiliary processor (123) e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)
  • the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function.
  • the auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
  • the auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.
  • the auxiliary processor (123) e.g., an image signal processor (ISP) or a communication processor (CP)
  • the auxiliary processor (123) may include a hardware structure specialized for processing an artificial intelligence model.
  • the artificial intelligence model may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)).
  • the learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model can include a plurality of artificial neural network layers.
  • the artificial neural network can be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model can additionally or alternatively include a software structure.
  • the memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101).
  • the various data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto.
  • the memory (130) can include a volatile memory (132) and/or a non-volatile memory (134).
  • the program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), and/or an application (146).
  • the input module (150) can receive commands or data to be used in other components of the electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the electronic device (101).
  • the input module (150) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).
  • the audio output module (155) can output audio signals to the outside of the electronic device (101).
  • the audio output module (155) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls.
  • the receiver can be implemented separately from the speaker or as part of the speaker.
  • the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101).
  • the display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (160) may include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).
  • the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound.
  • the audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (101).
  • an external electronic device e.g., an external electronic device (102)
  • a speaker or headphones directly or wirelessly connected to the electronic device (101).
  • the sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status.
  • the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the external electronic device (102)).
  • the interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high-definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital
  • the connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)).
  • the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (e.g., a headphone connector).
  • a haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations.
  • the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (180) can capture still images and videos.
  • the camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.
  • ISPs image signal processors
  • the power management module (188) can manage power supplied to or consumed by the electronic device (101).
  • the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • a battery (189) may power at least one component of the electronic device (101).
  • the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and/or a fuel cell.
  • the communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel.
  • the communication module (190) may operate independently from the processor (120) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication.
  • AP application processor
  • CPs communication processors
  • the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module (192) e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module (194) e.g., a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as BLUETOOTH, wireless fidelity (WiFi) direct, or IR data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G ( 5th generation) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)).
  • a first network (198) e.g., a short-range communication network such as BLUETOOTH, wireless fidelity (WiFi) direct, or IR data association (IrDA)
  • a second network (199) e.g., a long-range communication network such as a legacy cellular network, a 5G ( 5th generation) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)
  • the wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196).
  • subscriber information e.g., an international mobile subscriber identity (IMSI)
  • SIM subscriber identity module
  • the wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G ( 4th generation) network, for example, NR access technology (new radio access technology).
  • the NR access technology can support high-speed transmission of high-capacity data (i.e., enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module (192) can support, for example, a high-frequency band (e.g., millimeter wave band) to achieve a high data transmission rate.
  • a high-frequency band e.g., millimeter wave band
  • the wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna.
  • the wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)).
  • the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip
  • the antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device).
  • the antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)).
  • the antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna.
  • other components e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (197) may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the PCB and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the PCB and capable of transmitting or receiving signals of the designated high-frequency band.
  • PCB printed circuit board
  • an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the PCB and capable of supporting a designated high-frequency band (e.g., a mmWave band)
  • a plurality of antennas e.g., an array antenna
  • At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • peripheral devices e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199).
  • Each of the external electronic devices (102 or 104) may be of the same or a different type of device as the electronic device (101). All or part of the operations executed by the electronic device (101) may be executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute the function or at least a part of the service.
  • the one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101).
  • the electronic device (101) may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device (101) may provide an ultra-low delay service, for example, by using distributed computing or mobile edge computing (MEC).
  • the external electronic device (104) may include an Internet of Things (IoT) device.
  • the server (108) may be an intelligent server utilizing machine learning and/or a neural network.
  • the external electronic device (104) or the server (108) may be included in the second network (199).
  • the electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may take various forms. Electronic devices may include portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, electronic devices are not limited to the aforementioned devices.
  • first,” “second,” or “first” or “second” may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order).
  • a first component e.g., a first component
  • another element e.g., a second component
  • the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions.
  • a module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)).
  • a processor e.g., a processor (120)
  • the machine e.g., an electronic device (101)
  • the one or more commands may include code generated by a compiler or code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • a 'non-transitory' storage medium is a tangible device, may not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
  • the methods according to various embodiments of the present disclosure may be provided as included in a computer program product.
  • the computer program product may be traded as a commodity between a seller and a buyer.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., by download or upload) through an application store (e.g., PLAYSTORE TM ) or directly between two user devices (e.g., smart phones).
  • an application store e.g., PLAYSTORE TM
  • at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • Each component (e.g., a module or a program) of the above-described components may comprise one or more entities.
  • One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added.
  • multiple components e.g., modules or programs
  • the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration.
  • the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
  • disposed on XX can be understood as disposed adjacent to XX, disposed in substantial contact with XX, or coupled to XX.
  • located on XX may be understood as being located adjacent to XX, positioned in substantial contact with XX, or coupled to XX.
  • conductivity may be understood as “electrical conductivity,” and “non-conductivity” may be understood as “electrical insulation.” When referring to thermal properties, “conductivity” may be understood as “thermal conductivity.”
  • the expression “comprising” means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve the tolerance. It should be understood that terms such as “comprising” or “having” indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.
  • FIG. 2 is a drawing showing various aspects of an electronic device (2) according to various embodiments of the present disclosure.
  • the direction in which the front side (20A) of the electronic device (2) faces, or the direction in which the display area (or active area or screen area) of the electronic device (2) faces, is defined as the positive direction of the z-coordinate axis.
  • the direction in which the rear side (20B) of the electronic device (2) faces is defined as the negative direction of the z-coordinate axis.
  • the electronic device (2) may include a housing (20) and a display module (201).
  • the electronic device (2) may include the electronic device (101) of FIG. 1, or may include one or more of the components included in the electronic device (1) of FIG. 1.
  • the housing (20) may provide (or form) at least a portion of the exterior appearance of the electronic device (2).
  • the housing (20) may, for example, provide (or form) at least a portion of the front surface (20A) of the electronic device (2), the back surface (20B) of the electronic device (2), and/or the side surface (20C) of the electronic device (2).
  • the housing (20) may refer to a structure that provides at least a portion of the front surface (20A), the back surface (20B), and the side surface (20C).
  • the housing (20) may include a front plate (or front cover) (21) and a frame (or case) (22).
  • the front plate (21) may provide (or form) at least a portion of the front surface (20A) of the electronic device (2).
  • the front plate (21) may be substantially transparent at least in part.
  • the front plate (21) may include, for example, a glass plate or a polymer plate including various coating layers.
  • the frame (22) may provide (or form) at least a portion of the back surface (20B) and the side surface (20C) of the electronic device (2).
  • the frame (22) may be substantially opaque.
  • the frame (22) may include a metallic material and/or a non-metallic material (e.g., a polymer).
  • the frame (22) may include a back surface (23) and/or a side surface (24).
  • the back surface (23) may provide (or form) at least a portion of the back surface (20B) of the electronic device (2).
  • the side surface (24) may provide (or form) at least a portion of the side surface (20C) of the electronic device (2).
  • the frame (22) may be provided (or formed) as a combination of a metal part (or metal portion) (also referred to as a metal structure, a conductor, or a conductive structure) (not shown separately) and a non-metal part (or non-metal portion) (also referred to as a non-metal structure, a non-conductor, or a non-conductive structure) (not shown separately).
  • a part of the metal part may provide a part of the rear part (23), and another part of the metal part may provide (or form) a part of the side part (24).
  • the metal part may be provided (or formed) as, for example, an integrated or single structure (e.g., a single continuous structure or a complete structure).
  • a part of the non-metal part may provide a part of the rear part (23), and another part of the non-metal part may provide (or form) a part of the side part (24).
  • the non-metallic portion may be provided (or formed) as, for example, an integral or single structure (e.g., a single continuous structure or a complete structure).
  • a rear plate (also referred to as a rear cover) corresponding to the rear portion (23) and a side member (also referred to as a side bezel, a side bezel structure, or a side) corresponding to the side portion (24) may be provided (or formed) in place of the frame (22).
  • the rear plate may be substantially opaque and may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.
  • At least some of the elements constituting the housing (20) of the present disclosure may mean each area of one integrally formed housing (20) or may mean each housing of a plurality of separately formed housings.
  • the side portion (24) may include a first side portion (also referred to as a first side, a first sidewall, or a first sidewall portion, a first bezel, or a first bezel portion) (241), a second side portion (also referred to as a second side, a second sidewall, or a second sidewall portion, a second bezel, or a second bezel portion) (242), a third side portion (also referred to as a third side, a third sidewall, or a third sidewall portion, a third bezel, or a third bezel portion) (243), and/or a fourth side portion (also referred to as a fourth side, a fourth sidewall, or a fourth sidewall portion, a fourth bezel, or a fourth bezel portion) (244).
  • a first side portion also referred to as a first side, a first sidewall, or a first sidewall portion, a first bezel, or a first bezel portion
  • a second side portion also referred to as
  • the first side surface (241) and the second side surface (242) may extend in a direction parallel to the y-coordinate axis and may be spaced apart from each other in a direction parallel to the x-coordinate axis.
  • the first side surface (241) may provide (or form) a first side surface corresponding to the negative direction of the x-coordinate axis among the side surfaces (20C) of the electronic device (2).
  • the second side surface (242) may provide (or form) a second side surface corresponding to the positive direction of the x-coordinate axis among the side surfaces (20C) of the electronic device (2).
  • the third side surface (243) and the fourth side surface (244) may extend in a direction parallel to the x-coordinate axis and may be spaced apart from each other in a direction parallel to the y-coordinate axis.
  • the third side portion (243) can provide (or form) a third side corresponding to the positive direction of the y-coordinate axis among the side portions (20C) of the electronic device (2).
  • the fourth side portion (244) can provide (or form) a fourth side corresponding to the negative direction of the y-coordinate axis among the side portions (20C) of the electronic device (2).
  • the side portion (24) may include a smooth curved first corner (C1) between the first side portion (241) and the third side portion (243), a smooth curved second corner (C2) between the first side portion (241) and the fourth side portion (244), a smooth curved third corner (C3) between the second side portion (242) and the third side portion (243), and/or a smooth curved fourth corner (C4) between the second side portion (242) and the fourth side portion (244).
  • a display module (referred to as a display) (201) (e.g., display module (160) of FIG. 1) is housed in a housing (20), and a display area (also referred to as an active area or screen area) of the display module (201) is visually visible (or, visually exposed) through a front plate (21).
  • the front plate (21) may include a bezel area (also referred to as a screen bezel area) (B).
  • the bezel area (B) may not overlap with the display area of the display module (201) when viewed from above the front surface (20A) of the electronic device (2).
  • the bezel area (B) may be provided (or formed) in a shape (e.g., a rectangular ring or loop shape) that surrounds the display area when viewed from above the front surface (20A).
  • the bezel area (B) may be substantially opaque.
  • the bezel area (B) may be provided (or formed) by, for example, an opaque material coated or colored on the front plate (21).
  • the bezel area (B) may include a first bezel area (B1), a second bezel area (B2), a third bezel area (B3), and/or a fourth bezel area (B4).
  • the first bezel area (B1) may be positioned adjacent to the first side portion (241) corresponding to the first side portion (241).
  • the second bezel area (B2) may be positioned adjacent to the second side portion (242) corresponding to the second side portion (242).
  • the third bezel area (B3) may be positioned adjacent to the third side portion (243) corresponding to the third side portion (243).
  • the fourth bezel area (B4) may be positioned adjacent to the fourth side portion (244) corresponding to the fourth side portion (244).
  • the electronic device (2) may include a first camera module (202), a second camera module (203), and/or a third camera module (204).
  • the first camera module (202), the second camera module (203), and/or the third camera module (204) may include one or more lenses, image sensor(s), and/or image signal processor (ISP).
  • the first camera module (202), the second camera module (203), or the third camera module (204) may be the camera module (180) of FIG. 1.
  • a first camera module (referred to as a front camera module) (202) may be accommodated in a housing (20) corresponding to the front side (20A) of the electronic device (2). External light may pass through the front plate (21) to reach the first camera module (202).
  • the first camera module (202) may be accommodated in the housing (20) corresponding to the third bezel area (B3) of the front plate (21).
  • the front plate (21) may include a first transparent area (also referred to as a first light-transmitting area) positioned in the third bezel area (B3). External light may pass through the first transparent area to reach the first camera module (202).
  • the display area of the display module (201) may be implemented as large as possible so that the bezel area (B) may be reduced or substantially omitted, unlike the illustrated example.
  • the first camera module (202) may overlap the display area of the display module (201) when viewed from above the front (20A) of the electronic device (2) (or in a direction perpendicular to the front (20A).
  • the first camera module (202) may be positioned on the back of the display area or below or beneath the display area. When viewed from the outside of the electronic device (2), the first camera module (202) or the position of the first camera module (202) may be substantially not visually distinguishable (or visible).
  • the first camera module (202) may include, for example, a hidden display rear camera (e.g., an under display camera (UDC)). External light can pass through the front plate (21) and the display area to reach the first camera module (202).
  • UDC under display camera
  • the first camera module (202) when the first camera module (202) is implemented as a hidden display rear camera, the first camera module (202) may be positioned in alignment with or at least partially inserted into an opening (not separately illustrated) provided in a display area of the display module (201). External light may pass through the opening of the front plate (21) and the display area to reach the first camera module (202).
  • the opening of the display area aligned with or overlapping the first camera module (202) may be provided in the form of a hole.
  • the opening of the display area aligned with or overlapping the first camera module (202) when viewed from above the front surface (20A) of the electronic device (2) (or in a direction orthogonal to the front surface (20A)), the opening of the display area aligned with or overlapping the first camera module (202) may be provided as a notch (not separately illustrated).
  • the first camera module (202) when the first camera module (202) is implemented as a hidden display rear camera, the first camera module (202) may be aligned and positioned in a recess (not shown separately) provided on the rear surface of the display area or may be at least partially inserted into the recess.
  • a portion of the display area of the display module (201) that at least partially overlaps with the first camera module (202) may include a different pixel structure and/or wiring structure than other portions.
  • the pixel structure and/or wiring structure provided in the portion of the display area that at least partially overlaps with the first camera module (202) may be implemented so as to reduce light loss between the outside of the electronic device (2) and the first camera module (202).
  • the portion of the display area that at least partially overlaps with the first camera module (202) may have, for example, a different pixel density (e.g., number of pixels per unit area) than other portions.
  • the portion of the display area that at least partially overlaps with the first camera module (202) may not substantially include a plurality of pixels.
  • a second camera module (also referred to as a first rear camera module) (203) and a third camera module (also referred to as a second rear camera module) (204) may be provided corresponding to the rear side (20B) of the electronic device (2).
  • the position or number of the rear camera modules is not limited to the illustrated example.
  • the second camera module (203) is positioned corresponding to a first camera hole provided (or formed) in the rear portion (23) of the frame (22) and is visually visible from the outside of the electronic device (2) through the first camera hole.
  • the third camera module (204) is positioned corresponding to a second camera hole provided (or formed) in the rear portion (23) of the frame (22) and is visually visible from the outside of the electronic device (2) through the second camera hole.
  • the rear portion (23) of the frame (22) may include a first light-transmitting area replacing the first camera hole and/or a second light-transmitting area replacing the second camera hole.
  • the second camera module (203) and/or the third camera module (204) may include a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera) module.
  • a wide-angle camera module e.g., a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera) module.
  • TOF time of flight
  • the second camera module (203) and/or the third camera module (204) may have different properties (e.g., field of view) or functions.
  • the second camera module (203) and/or the third camera module (204) may provide different angles of view (or lenses with different angles of view).
  • the electronic device (2) may selectively use the angles of view of the second camera module (203) and/or the third camera module (204) based on a user's selection regarding the angles of view.
  • the electronic device (2) may include a first light-emitting module (205) positioned corresponding to the rear surface (20B) of the electronic device (2).
  • the first light-emitting module (205) may be positioned corresponding to a flash hole or a light-transmitting area provided (or formed) in the rear surface (23) of the frame (22).
  • the first light-emitting module (205) may include a light source for the second camera module (203) and/or the third camera module (204).
  • the first light-emitting module (205) may include, but is not limited to, a light emitting diode (LED), an IR LED, or a xenon lamp.
  • the electronic device (2) may include a second light-emitting module (e.g., an LED, an IR LED, or a xenon lamp) accommodated in a housing (20) corresponding to the front surface (20A) of the electronic device (2).
  • the second light-emitting module may provide status information of the electronic device (2) in the form of light and/or provide a light source that is linked to the operation of the first camera module (202).
  • the electronic device (2) may include a sensor module (206) (e.g., the sensor module (176) of FIG. 1) positioned corresponding to the front surface (20A) of the electronic device (2).
  • the sensor module (206) may include an optical sensor (e.g., a proximity sensor or an illuminance sensor).
  • the sensor module (206) may be accommodated in the housing (20), for example, corresponding to the third bezel area (B3) of the front plate (21).
  • the front plate (21) may include a second transparent area (or a second light-transmitting area) positioned in the third bezel area (B3). External light may pass through the second transparent area to reach the sensor module (206).
  • the sensor module (206) may overlap the display area when viewed from above (or in a direction perpendicular to the front surface (20A) of the electronic device (2) in a manner at least partially identical or similar to the example in which the first camera module (202) overlaps the display area of the display module (201).
  • the sensor module (206) may be positioned on the back surface of the display area or below or beneath the display area.
  • the sensor module (206), or the location of the sensor module (206) may be substantially invisible or indistinguishable.
  • the electronic device (2) may include at least one other sensor module provided in various other locations.
  • the electronic device (2) may include, for example, an optical, electrostatic, or ultrasonic biometric sensor module (e.g., a fingerprint recognition sensor module).
  • the biometric sensor module may overlap the display area of the display module (201) when viewed from above the front surface (20A) of the electronic device (2) in a manner at least partially identical or similar to the example in which the first camera module (202) overlaps the display area of the display module (201).
  • the electronic device (2) may include one or more audio input modules (e.g., a microphone of the input module (150) of FIG. 1).
  • the electronic device (2) may include, for example, a first audio input module, a second audio input module, and a third audio input module.
  • the first audio input module includes a first microphone (also referred to as a first microphone), and the first microphone may be accommodated in the housing (20) corresponding to a first microphone hole (MH1) provided (or formed) in, for example, a first side portion (241).
  • the second audio input module includes a second microphone (also referred to as a second microphone), and the second microphone may be accommodated in the housing (20) corresponding to a second microphone hole (MH2) provided (or formed) in, for example, a third side portion (243).
  • the third sound input module includes a third microphone (also referred to as a third microphone), and the third microphone can be accommodated in the housing (20) corresponding to a third microphone hole (MH3) provided (or formed) in, for example, the third side portion (243).
  • the position or number of the microphone and the microphone holes corresponding to the microphone are not limited to the illustrated example.
  • the electronic device (2) can perform noise-cancelling through one or more microphones.
  • the electronic device (2) can be configured to detect the direction of a sound outside the electronic device (2) through a plurality of microphones.
  • the electronic device (2) may include one or more audio output modules (e.g., the audio output module (155) of FIG. 1).
  • the electronic device (2) may include, for example, a first audio output module, a second audio output module, a third audio output module, and a fourth audio output module.
  • the first audio output module includes a first speaker module (e.g., the first speaker module (41) of FIG. 8), and the first speaker module may be accommodated in the housing (20), for example, corresponding to a first speaker hole (SH1) provided (or formed) in the first side portion (241).
  • the second audio output module includes a second speaker module, and the second speaker module may be accommodated in the housing (20), for example, corresponding to a second speaker hole (SH2) provided (or formed) in the first side portion (241).
  • the third sound output module includes a third speaker module, and the third speaker module can be accommodated in the housing (20) corresponding to, for example, a third speaker hole (SH3) provided (or formed) in the second side portion (242).
  • the fourth sound output module includes a fourth speaker module, and the fourth speaker module can be accommodated in the housing (20) corresponding to, for example, a fourth speaker hole (SH4) provided (or formed) in the second side portion (242).
  • the first speaker hole (SH1), the second speaker hole (SH2), the third speaker hole (SH3), and/or the fourth speaker hole (SH4) may include a plurality of holes arranged along the y-coordinate axis.
  • the positions or numbers of the speaker modules and the speaker holes corresponding to the speaker modules are not limited to the illustrated examples.
  • the electronic device (2) may include a key input module (e.g., a key of the input module (150) of FIG. 1).
  • the key input module may include, for example, a first key (also referred to as a first side key) (K1), a second key (also referred to as a second side key) (K2), and/or a key signal generation unit (also referred to as a key signal generation circuit) (not shown separately).
  • the first key (K1) may be positioned in a first key hole (e.g., the first key hole (KH1) of FIG.
  • the key signal generation unit may be accommodated in the housing (20).
  • the key signal generation unit can generate a first key signal corresponding to a press or touch of a first key (K1) and a second key signal corresponding to a press or touch of a second key (K2).
  • the location or number of the key input module or keys is not limited to the illustrated example.
  • the electronic device (2) may include one or more connection terminals (e.g., the connection terminal (178) of FIG. 1).
  • the electronic device (2) may include, for example, a first connection terminal and a second connection terminal.
  • the first connection terminal may include a first connector (208), and the first connector (208) may be accommodated in the housing (20) corresponding to a first connector hole (245) provided (or formed) in, for example, the second side portion (242).
  • the electronic device (2) may transmit and/or receive power and/or data to and from an external electronic device (e.g., the external electronic device (102 or 104) of FIG. 1) electrically connected to the connector (208).
  • the first connector (208) may include a USB connector or an HDMI connector.
  • the position or number of the first connector hole (245) and the corresponding first connector (208) is not limited to the illustrated example.
  • the second connection terminal includes a second connector (not illustrated separately), and the second connector can be accommodated in the housing (20) corresponding to a second connector hole (246) provided (or formed) in, for example, the third side portion (243).
  • a tray in which an external storage medium e.g., a SIM card, a USIM (universal SIM) card, a CF (compact flash), a MMC (multi-media card), an SMC (smart media card), an SD (secure disk), or an MS (memory stick)
  • an external storage medium e.g., a SIM card, a USIM (universal SIM) card, a CF (compact flash), a MMC (multi-media card), an SMC (smart media card), an SD (secure disk), or an MS (memory stick)
  • the second connector e.g., a socket
  • the position or number of the second connector hole (246) and the corresponding second connector is not limited to the illustrated example.
  • a pen input device (207) may be attached to and detached from the housing (20).
  • the pen input device (207) may be attached to, for example, the rear surface (20B) of the electronic device (2).
  • the pen input device (207) may be attached to and detached from the side surface (20C) or the front surface (20A) of the electronic device (2).
  • the pen input device (207) may be attached to the housing (20) through an attractive force between magnetic materials, but is not limited thereto, and may be disposed in the housing (20) through various other methods, such as being inserted into the interior of the housing (20).
  • the pen input device (207) may be implemented by an electromagnetic induction method (e.g., an electro-magnetic resonance (EMR) method).
  • EMR electro-magnetic resonance
  • the pen input device (207) may include a resonant circuit and may be implemented to interact with an electromagnetic induction panel (not shown separately) included in the electronic device (2).
  • FIG. 3 is an exploded perspective view of a portion of an electronic device (2) according to various embodiments of the present disclosure.
  • FIGS. 4 and 5 are perspective views of a first speaker assembly (4A) according to various embodiments of the present disclosure.
  • FIG. 6 is an exploded perspective view of a first speaker assembly (4A) according to various embodiments of the present disclosure.
  • the electronic device (2) may include a frame (22), a display module (201), and a first speaker assembly (4A).
  • the frame (22) may include a rear portion (23) and a side portion (24).
  • the frame (22) may have recesses in the rear portion (23) and the side portion (24) in which electrical elements, such as a display module (201) and a first speaker assembly (4A), or other structural elements, may be positioned.
  • the display module (201) may be positioned between the front plate (21) (see FIG. 2) and the rear portion (23) of the frame (22).
  • the display module (201) may be coupled to the front plate (21) (see FIG. 2) via an optically clear adhesive layer (or optically clear adhesive layer) (not shown separately).
  • the optically clear adhesive layer may include an optically clear adhesive material such as, for example, an optically clear adhesive (OCA), an optically clear resin (OCR), or a super view resin (SVR).
  • the display module (201) may include a display panel (not shown separately).
  • the display panel may include a plurality of pixels implemented with light-emitting elements such as organic light emitting diodes (OLEDs) or micro LEDs.
  • the display panel may include at least one thin film transistor (TFT) configured to control current to the plurality of pixels to turn the plurality of pixels on or off, or adjust the brightness of the plurality of pixels.
  • TFT thin film transistor
  • the display module (201) may include a touch sensing circuit (e.g., a touch sensor or a touch panel) (not shown separately).
  • the touch sensing circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO).
  • the display module (201) may include an electromagnetic induction panel (not shown separately).
  • the electromagnetic induction panel may include, for example, a digitizer that detects a magnetic field-type pen input device (207) (see FIG. 2).
  • the electromagnetic induction panel may include a plurality of electrode patterns. When an alternating current is supplied to the electromagnetic induction panel, an electromagnetic field may be formed by the plurality of electrode patterns.
  • the pen tip of the pen input device (207) see FIG. 2 is brought close to the front surface (20A) (see FIG. 2) of the electronic device (2), a current may flow through a coil included in the pen input device (207) due to electromagnetic induction.
  • the pen input device (207) may generate a signal (e.g., a radio frequency signal) (e.g., a position signal, a pressure signal, and/or an angle signal) related to a user input using energy supplied from the electromagnetic induction panel and transmit the signal to the electromagnetic induction panel.
  • a signal e.g., a radio frequency signal
  • the electromagnetic induction panel may be defined as a separate element disposed in the display module (201).
  • the first speaker assembly (4A) may be positioned in the space between the front plate (21) (see FIG. 2) and the frame (22).
  • the first speaker assembly (4A) may be positioned or coupled to the frame (22).
  • the electronic device (2) may include an internal support (also called an internal support member, an internal support, or a bracket) (not shown) positioned at least partially between the rear portion (23) of the frame (22) and the display module (201).
  • the internal support may be connected to the rear portion (23) and/or the side portion (24) of the frame (22), or may extend from the rear portion (23) and/or the side portion (24) of the frame (22).
  • the internal support may include, for example, at least one conductive portion and/or at least one non-conductive portion. In various embodiments, the internal support may be defined as a portion of the frame (22).
  • At least one electrical element such as the display module (201), may be positioned or coupled to the internal support between the front plate (21) and the internal support, or may be supported by the internal support.
  • at least one electrical element such as a PCB (e.g., PCB (80) of FIG. 7) having a processor (e.g., processor (120) of FIG. 1), a communication module (e.g., communication module (190) of FIG. 1), and a power management module (e.g., power management module (188) of FIG. 1) disposed thereon, may be disposed or coupled to the internal support between the rear portion (23) of the frame (22) and the internal support or supported by the internal support.
  • the first speaker assembly (4A) may be disposed or coupled to the internal support between the display module (201) and the internal support.
  • At least a portion of the first speaker assembly (4A) may be positioned between the display module (201) and the rear portion (23) of the frame (22).
  • the first speaker assembly (4A) may include a first speaker module (41), a first speaker housing (42), a first metal plate (51), a second metal plate (52), a third metal plate (53), a fourth metal plate (54), a fifth metal plate (55), and/or an air permeable member (6).
  • the first speaker module (41) may include a first speaker (411) configured to convert an audio signal into a sound wave.
  • the first speaker (411) may be disposed or coupled to a first speaker housing (42).
  • the first speaker (411) may include, for example, a magnetic circuit, a coil structure, and a diaphragm, although not separately illustrated.
  • the magnetic circuit may form a fixed magnetic field (also referred to as a permanent magnetic field).
  • the magnetic circuit may include, for example, an inner magnet, an outer magnet, and a magnetic conductor (e.g., a yoke).
  • the inner magnet and the outer magnet may include permanent magnets (e.g., neodymium magnets, alnico magnets, or ferrite magnets) that participate in the magnetic field strength of the first speaker (411).
  • the magnetic conductor may include, for example, a plate including a magnetic material.
  • the magnetic conductor can form a magnetic circuit or magnetic path that controls the flow of the magnetic field formed from the inner and outer magnets and enhances the strength of the magnetic field.
  • the magnetic conductor can control the flow of the magnetic field formed from the inner and outer magnets to concentrate the magnetic force on the coil structure.
  • the magnetic conductor can at least play a role in controlling the flow of the magnetic field formed from the magnets to enhance the strength of the magnetic field and/or to concentrate the magnetic force on the coil structure.
  • the coil structure can include a coil support member (e.g., a coil former) and a coil wound on the coil support member.
  • a coil support member e.g., a coil former
  • a magnetic force can be generated that is induced toward the central axis around which the coil is wound. Due to the interaction between the induced magnetic force and the fixed magnetic field (e.g., Fleming's left-hand rule), the coil structure can move in the direction of the central axis, and a diaphragm connected to the coil structure can vibrate air due to the movement of the coil structure.
  • the diaphragm (not shown separately) of the first speaker (411) may face the rear portion (23) of the frame (22).
  • the first speaker (411) may generate sound waves toward the rear portion (23) of the frame (22).
  • the first speaker module (41) may include an electrical connection member (412) electrically connected to the first speaker (411).
  • the electrical connection member (412) may extend from a first end (4121) to a second end (4122).
  • the first end (4121) of the electrical connection member (412) may be connected to the first speaker (411).
  • the first end (4121) of the electrical connection member (412) may be electrically connected to a coil (not shown separately) of the first speaker (411).
  • a connector (not shown separately) may be disposed at the second end (4122) of the electrical connection member (412).
  • the connector may be electrically connected to a PCB (e.g., PCB (80) of FIG. 7) located at least partially between the display module (201) and the rear portion (23) of the frame (22).
  • An audio signal may be provided to the first speaker (411) via an electrical connection member (412).
  • the electrical connection member (412) may include, for example, an FPCB (e.g., a speaker FPCB).
  • the first speaker housing (42) may provide (or form) at least a portion of the appearance of the first speaker assembly (4A).
  • the first speaker housing (42) may be disposed or coupled to the frame (22).
  • the first speaker housing (42) may be coupled to the frame (22) by a mechanical fastening, such as, for example, a screw fastening (not shown separately).
  • the first speaker housing (42) may be coupled to the frame (22) by, for example, an adhesive material (or an adhesive material) (e.g., double-sided tape).
  • the first speaker housing (42) may include a non-metallic frame (also referred to as a non-metallic support member).
  • the non-metallic frame may be a basic structure designed to withstand a load.
  • the first metal plate (51), the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and the fifth metal plate (55) may be disposed or coupled to the non-metallic frame.
  • the exterior of the first speaker assembly (4A) may be provided (or formed) by a combination of a non-metal frame, a first metal plate (1021), a second metal plate (1022), and a third metal plate (1023).
  • the positions or numbers of the metal plates arranged on the non-metal frame are not limited to the illustrated examples.
  • the first speaker housing (42) may include a combination of a non-metal frame and one or more metal plates (e.g., the first metal plate (1021), the second metal plate (1022), and the third metal plate (1023)).
  • the first speaker (411) of the first speaker module (41) may be accommodated in the first speaker housing (42).
  • the electrical connection member (412) of the first speaker module (41) may pass through a hole (not shown separately) formed in the first speaker housing (42), and some of the electrical connection members (412) including a connector may be positioned outside the first speaker housing (42) for electrical connection with a PCB (e.g., PCB (80) of FIG. 7).
  • a PCB e.g., PCB (80) of FIG. 7
  • the first speaker housing (42) may include a first partial housing (421) (e.g., a first non-metallic frame) and a second partial housing (422) (e.g., a second non-metallic frame).
  • the first partial housing (421) and the second partial housing (422) may be coupled to each other through mechanical fastening, such as, for example, a screw fastening.
  • the first partial housing (421) and the second partial housing (422) may be coupled to each other through, for example, an adhesive material (or bonding material).
  • the first speaker housing (42) may include a front surface (423) and a rear surface (424).
  • the front surface (423) and/or the rear surface (424) of the first speaker housing (42) may be provided (or formed) by a combination of the first partial housing (421) and the second partial housing (422).
  • the front surface (423) and/or the rear surface (424) of the first speaker housing (42) may include, for example, a combination of surface areas of different heights.
  • the front surface (423) of the first speaker housing (42) may be substantially oriented toward the front plate (21).
  • the rear surface (424) of the first speaker housing (42) may be substantially oriented toward the rear portion (23) of the frame (22).
  • the first partial housing (421) and/or the second partial housing (422) of the first speaker housing (42) may comprise a non-metallic material (e.g., a polymer).
  • the first partial housing (421) and/or the second partial housing (422) may be provided (or formed) by a combination of at least one non-conductive portion (not shown separately) of a non-metallic material and at least one conductive portion (not shown separately) of a metallic material.
  • the first speaker housing (42) may include a sound wave output port (e.g., a sound wave output port (401) of FIGS. 8 and 9).
  • a sound wave output port e.g., a sound wave output port (401) of FIGS. 8 and 9.
  • sound waves generated by vibration of a diaphragm (not shown separately) of the first speaker (411) may be propagated in the air within an internal space of the first speaker assembly (4A) (e.g., a sound wave passage (901) of FIG. 9) and output to the outside of the first speaker housing (42) through the sound wave output port of the first speaker housing (42).
  • the sound wave output port of the first speaker housing (42) is arranged to correspond to the first speaker hole (SH1) of the frame (22), and the sound waves generated by the first speaker (411) can be output to the outside of the electronic device (2) through the sound wave output port of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22).
  • the first metal plate (51) may be disposed or coupled to the front surface (423) of the first speaker housing (42).
  • the first metal plate (51) may be coupled to the first speaker housing (42) via, for example, an adhesive material (or adhesive material) (e.g., double-sided tape) (not shown separately) disposed between the first metal plate (51) and the first speaker housing (42).
  • the first metal plate (51) may be disposed or coupled to the first speaker housing (42) via, for example, a mechanical fastening such as a screw fastening.
  • the first metal plate (51) may be at least partially disposed between the display module (201) and the first speaker (411) of the first speaker module (41). When viewed from above the front surface (20A) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the front surface (20A)), the first metal plate (51) can overlap the first speaker (411).
  • the first speaker housing (42) (e.g., the first partial housing (421)) may include a first opening (4201) between the first metal plate (51) and the first speaker (411).
  • the first metal plate (51) may be positioned or coupled to the first partial housing (421) to block the first opening (4201).
  • the first metal plate (51) may reduce or prevent sound waves generated by the first speaker (411) from leaking out of the first speaker housing (42) through the first opening (4201).
  • the first opening (4201) may allow the combination of the first partial housing (421) and the first metal plate (51) to have a slim structure.
  • the first metal plate (51) can provide (or form) an inner surface that defines the internal space (e.g., resonance space) of the first speaker assembly (4A).
  • the first metal plate (51) is a thin plate for slimming the first speaker assembly (4A), and can have strength that can reduce vibrations from sound waves generated from the first speaker (411) and ensure durability.
  • the first opening (4201) of the first speaker housing (42) corresponding to the first metal plate (51) may be omitted.
  • the first speaker housing (42) may be expanded to further include a portion supporting the first metal plate (51) or attached to the first metal plate (51) corresponding to the omission of the first opening (4201), and the first metal plate (51) may be provided (or formed) thinner than the example including the first opening (4201).
  • the first metal plate (51) can reduce or prevent electromagnetic interference (EMI) to the first speaker (411).
  • the first metal plate (51) can reduce or prevent magnetic force from the first speaker (411) from being transmitted or moved to the outside of the first speaker assembly (4A).
  • the first metal plate (51) can include an electromagnetic shielding material or an electromagnetic absorbing material.
  • the first metal plate (51) can reduce or prevent an electromagnetic influence (e.g., electromagnetic interference (EMI)) of the first speaker (411) on the display module (201).
  • the first metal plate (51) can reduce or prevent a degradation of the performance of the display module (201) caused by the first speaker (411).
  • the first metal plate (51) can reduce or prevent a magnetic force of the first speaker (411) from being transmitted or moved to the display module (201).
  • EMI electromagnetic interference
  • the first metal plate (51) may be disposed at least partially between an electromagnetic induction panel (not shown separately) included or disposed in the display module (201) and the first speaker (411).
  • the first metal plate (51) may overlap the electromagnetic induction panel and the first speaker (411).
  • the first metal plate (51) may reduce or prevent electromagnetic influence (e.g., EMI) that the first speaker (411) exerts on the electromagnetic induction panel.
  • the first metal plate (51) may reduce or prevent a magnetic force from the first speaker (411) from being transmitted or moved to the electromagnetic induction panel, thereby reducing or preventing degradation of the performance of the electromagnetic induction panel.
  • the first metal plate (51) may include various metal materials capable of shielding magnetic forces.
  • the first metal plate (51) may include, for example, SPCC (steel plate cold commercial), but is not limited thereto.
  • the first metal plate (51) may be electrically connected to a ground area (not shown separately) of a PCB (e.g., PCB (80) of FIG. 7) included in the electronic device (2), and may be defined or interpreted as part of the ground structure of the electronic device (2).
  • a PCB e.g., PCB (80) of FIG. 7
  • the first metal plate (51) may include a metal material having better magnetic shielding properties than the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55).
  • the first metal plate (51) may be in an electrically floating state.
  • the first metal plate (51) may be electrically and physically isolated from a surrounding conductor, such as, for example, a second metal plate (52), a third metal plate (53), a fourth metal plate (54), or a fifth metal plate (55).
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be disposed or coupled to the first speaker housing (42).
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be coupled to the first speaker housing (42) via, for example, an adhesive material (or bonding material).
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be coupled to the first speaker housing (42) via, for example, a mechanical fastening such as a screw fastening (not shown separately).
  • the second metal plate (52) may be positioned or coupled to the rear surface (424) of the first speaker housing (42).
  • the second metal plate (52) may be positioned or coupled to, for example, the second partial housing (422).
  • the second metal plate (52) may overlap the first metal plate (51) when viewed from above the rear surface (20B) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the rear surface (20B)). When viewed from above the rear surface (20B) of the electronic device (2) (see FIG. 2), the second metal plate (52) may overlap the first speaker (411).
  • the first speaker (411) may be positioned between the first metal plate (51) and the second metal plate (52).
  • the first speaker housing (42) (e.g., the second partial housing (422)) may include a second opening (4202).
  • a second metal plate (52) may be positioned or coupled to the second partial housing (422) to block the second opening (4202).
  • the second metal plate (52) may reduce or prevent sound waves generated by the first speaker (411) from leaking out of the first speaker housing (42) through the second opening (4202).
  • the second opening (4202) may allow the combination of the second partial housing (422) and the second metal plate (52) to have a slim structure.
  • the second metal plate (52) may provide (or form) an inner surface that defines an internal space (e.g., a sound wave passage (901) of FIG. 9) of the first speaker assembly (4A).
  • the second metal plate (52) is a thin plate for slimming the first speaker assembly (4A), and can have strength that can reduce vibrations from sound waves generated from the first speaker (411) and ensure durability.
  • the second metal plate (52) can reduce or prevent electromagnetic interference (EMI) to the first speaker (411).
  • the second metal plate (52) can reduce or prevent magnetic force from the first speaker (411) from being transmitted or moved outside the first speaker assembly (4A).
  • the second metal plate (52) can include an electromagnetic shielding material or an electromagnetic absorbing material.
  • the second metal plate (52) may include various metal materials capable of shielding magnetic forces.
  • the second metal plate (52) may include, for example, SPCC, but is not limited thereto.
  • the third metal plate (53) may be placed or coupled to the front surface (423) of the first speaker housing (42).
  • the third metal plate (53) may be placed or coupled to, for example, the first partial housing (421).
  • the third metal plate (53) may not overlap the first metal plate (51) and/or the second metal plate (52) when viewed from above the front surface (20A) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the front surface (20A)).
  • the first speaker housing (42) (e.g., the first partial housing (421)) may include a third opening (4203).
  • a third metal plate (53) may be positioned or coupled to the first partial housing (421) to block the third opening (4203).
  • the third opening (4203) may allow the combination of the first partial housing (421) and the third metal plate (53) to have a slim structure.
  • the third metal plate (53) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker assembly (4A).
  • the third metal plate (53) may be a thin plate for slimming the first speaker assembly (4A), and may have a strength that can reduce vibrations against sound waves generated from the first speaker (411) and ensure durability.
  • the third opening (4203) of the first speaker housing (42) corresponding to the third metal plate (53) may be omitted.
  • the first speaker housing (42) may be expanded to further include a portion supporting the third metal plate (53) or attached to the third metal plate (53) corresponding to the omission of the third opening (4203), and the third metal plate (53) may be provided (or formed) thinner than the example including the third opening (4203).
  • the fourth metal plate (54) may be positioned or coupled to the rear surface (424) of the first speaker housing (42).
  • the fourth metal plate (54) may be positioned or coupled to, for example, the second partial housing (422).
  • the fourth metal plate (54) may not overlap the first metal plate (51), the second metal plate (52), the third metal plate (53), and/or the fifth metal plate (55) when viewed from above the rear surface (20B) of the electronic device (2) (or in a direction perpendicular to the rear surface (20B)) (see FIG. 2).
  • the first speaker housing (42) (e.g., the second partial housing (422)) may include a fourth opening (4204).
  • a fourth metal plate (54) may be positioned or coupled to the second partial housing (422) to block the fourth opening (4204).
  • the fourth opening (4204) may allow the combination of the second partial housing (422) and the fourth metal plate (54) to have a slim structure.
  • the fourth metal plate (54) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker assembly (4A).
  • the fourth metal plate (54) may be a thin plate for slimming the first speaker assembly (4A), and may have a strength that can reduce vibrations against sound waves generated from the first speaker (411) and ensure durability.
  • the fourth opening (4204) of the first speaker housing (42) corresponding to the fourth metal plate (54) may be omitted.
  • the first speaker housing (42) may be expanded to further include a portion supporting the fourth metal plate (54) or attached to the fourth metal plate (54) corresponding to the omission of the fourth opening (4204), and the fourth metal plate (54) may be provided (or formed) thinner than the example including the fourth opening (4204).
  • the fifth metal plate (55) may be placed or coupled to the rear surface (424) of the first speaker housing (42).
  • the fifth metal plate (55) may be placed or coupled to, for example, the second partial housing (422).
  • the fifth metal plate (55) may not overlap the first metal plate (51), the second metal plate (52), the third metal plate (53), and/or the fourth metal plate (54) when viewed from above the rear surface (20B) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the rear surface (20B)).
  • the first speaker housing (42) (e.g., the second partial housing (422)) may include a fifth opening (4205).
  • a fifth metal plate (55) may be positioned or coupled to the second partial housing (422) to block the fifth opening (4205).
  • the fifth opening (4205) may allow the combination of the second partial housing (422) and the fifth metal plate (55) to have a slim structure.
  • the fifth metal plate (55) may provide (or form) an inner surface that defines an internal space (e.g., a resonance space) of the first speaker assembly (4A).
  • the fifth metal plate (55) may be a thin plate for slimming the first speaker assembly (4A), and may have a strength that can reduce vibrations against sound waves generated from the first speaker (411) and ensure durability.
  • the fifth opening (4205) of the first speaker housing (42) corresponding to the fifth metal plate (55) may be omitted.
  • the first speaker housing (42) may be expanded to further include a portion supporting the fifth metal plate (55) or attached to the fifth metal plate (55) corresponding to the omission of the fifth opening (4205), and the fifth metal plate (55) may be provided (or formed) thinner than the example including the fifth opening (4205).
  • the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) can reduce or prevent electromagnetic interference (EMI) to the first speaker module (41).
  • the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) can include various electromagnetic shielding materials or electromagnetic absorbing materials.
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be defined as a part of a ground structure (not separately illustrated) included in the electronic device (2).
  • the ground structure of the electronic device (2) may include, for example, a ground region (not separately illustrated) of a PCB (e.g., a PCB (80) of FIG. 7) included in the electronic device (2), and at least one conductor electrically connected to the ground region (e.g., the second metal plate (52), the third metal plate (53), the fourth metal plate (54), the fifth metal plate (55), an electromagnetic shielding layer (e.g., a copper sheet) of the display module (201), and/or various other metal bodies).
  • a PCB e.g., a PCB (80) of FIG.
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be electrically connected to a ground area of a PCB (e.g., a PCB (80) of FIG. 7) as part of a ground structure.
  • a metal portion (not separately illustrated) included in the frame (22) may be electrically connected to a ground area of a PCB (e.g., a PCB (80) of FIG. 7) as part of a ground structure.
  • an electromagnetic shielding layer (e.g., a copper sheet) of the display module (201) may be electrically connected to a ground area of a PCB (e.g., a PCB (80) of FIG.
  • the ground structure of the electronic device (2) may reduce or prevent electromagnetic interference (EMI) to electrical elements included in the electronic device (2).
  • EMI electromagnetic interference
  • the ground structure of the electronic device (2) can reduce or prevent electromagnetic influence of noise from outside the electronic device (2) on electrical elements included in the electronic device (2).
  • the ground structure of the electronic device (2) can reduce or prevent electromagnetic interference between electrical elements included in the electronic device (2).
  • a portion of the first electrical connection member (412) may be positioned between a combination of the fourth metal plate (54) and the fifth metal plate (55) and the third metal plate (53).
  • the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may reduce or prevent electromagnetic interference (EMI) to the first electrical connection member (412).
  • EMI electromagnetic interference
  • the second metal plate (52), the third metal plate (53), the fourth metal plate (54), and/or the fifth metal plate (55) may be formed of stainless steel, but are not limited thereto.
  • the first speaker assembly (4A) may include an integrated or single metal plate (not shown) in place of the fourth metal plate (54) and the fifth metal plate (55).
  • the first speaker assembly (4A) may include an integrated or single metal plate (not shown) replacing at least two of the second metal plate (52), the fourth metal plate (54), and the fifth metal plate (55).
  • the first speaker assembly (4A) may include a resonance space (or an enclosure providing a resonance space) for the first speaker (411).
  • the resonance space is configured to improve the quality of sound waves output through the first speaker (411).
  • the resonance space may, for example, enrich mid-low frequency sounds.
  • the resonance space may be separated from a sound wave passage (e.g., a sound wave passage (901) of FIG. 9).
  • the resonance space may be provided (or formed) by a combination of the first speaker housing (42) and at least one metal plate (e.g., the first metal plate (51), the third metal plate (53), the fourth metal plate (54), and the fifth metal plate (55)) disposed in the first speaker housing (42).
  • the air permeable member (6) may be disposed in a sixth opening (4206) formed in the first speaker housing (42) (e.g., the first partial housing (421)).
  • the sixth opening (4206) may be an air vent that allows air to flow between the interior of the first speaker assembly (4A) and the exterior of the first speaker assembly (4A). Air may flow through the air permeable member (6) disposed in the sixth opening (4206).
  • the air permeable member (6) may reduce or prevent external foreign substances, such as dust or moisture, from entering the interior space of the first speaker housing (42) through the sixth opening (4206).
  • the air permeable member (6) may include, but is not limited to, a porous member or a mesh member, for example.
  • the sixth opening (4206) can improve the quality of sound output through the first speaker (411).
  • the sixth opening (4206) can improve the quality of sound output through the first speaker (411).
  • the sixth opening (4206) can enable rich sound transmission through the first speaker (411).
  • the sixth opening (4206) can enable rich sound transmission through the first speaker (411).
  • the sixth opening (4206) can, for example, enrich low-mid range sounds.
  • the sixth opening (4206) can, for example, enrich low-mid range sounds.
  • the position or number of the sixth openings (4206) is not limited to the illustrated example and may vary.
  • the electronic device (2) may include a first thermally conductive layer (57) disposed on a second metal plate (52).
  • the first thermally conductive layer (57) may include a thermally conductive material, such as a thermal interface material (TIM).
  • the electronic device (2) may include a first thermally conductive plate (71) (see FIGS. 7 and 8) disposed on a rear surface (23) of the frame (22).
  • the first thermally conductive layer (57) may be disposed between the second metal plate (52) and the first thermally conductive plate (71) (see FIGS. 7 and 8).
  • the first thermally conductive plate (71) may be replaced with a TIM.
  • the first thermally conductive layer (57) may be omitted. Heat emitted from at least one electronic component included in the electronic device (2) can be transferred to the second metal plate (52) through the first thermally conductive plate (71) (see FIGS. 7 and 8) and the first thermally conductive layer (57). Sound waves generated by the first speaker (411) can be propagated in the air within the internal space of the first speaker assembly (4A) (e.g., the sound wave passage (901) of FIG. 9) and output to the outside of the electronic device (2) through the sound wave output port of the first speaker housing (42) (e.g., the sound wave output port (401) of FIGS. 8 and 9) and the first speaker hole (SH1) of the frame (22).
  • the first speaker assembly (4A) e.g., the sound wave passage (901) of FIG. 9
  • Sound waves generated by the first speaker (411) can be propagated in the air within the internal space of the first speaker assembly (4A) (e.g., the sound wave passage (901) of FIG. 9) and output
  • Heat transferred from the first thermally conductive plate (71) (see FIGS. 7 and 8) to the second metal plate (52) can be discharged to the outside of the electronic device (2) through the sound wave output port of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22) through the air flow caused by the sound waves generated by the first speaker (411) being propagated in the air, thereby reducing or preventing overheating of at least one electronic component.
  • the first speaker assembly (4A) may include a sound wave passage (e.g., a sound wave passage (901) of FIG. 9).
  • the sound wave passage may guide sound waves generated by the first speaker (411) to proceed to a sound wave output port (e.g., a sound wave output port (401) of FIGS. 8 and 9).
  • the first speaker assembly (4A) may include an inner wall of the passage (also referred to as an inner side of the passage) forming the sound wave passage.
  • the inner wall of the passage may be formed by, for example, the first speaker housing (42), the first metal plate (51), and the second metal plate (52), but is not limited thereto.
  • the second metal plate (52) may provide (or form) a portion of the inner wall of the passage of the first speaker assembly (4A).
  • a portion of the second metal plate (52) corresponding to the second opening (4202) of the second partial housing (422) may form a portion of the inner wall of the passage.
  • the second metal plate (52) forming a portion of the inner wall of the passage may improve the performance (e.g., convective heat transfer performance) of heat transferred from the first thermally conductive plate (71) (see FIGS. 7 and 8) to the second metal plate (52) to be transferred to the air within the sound wave passage.
  • FIG. 7 is a drawing showing a part of an electronic device (2) according to various embodiments of the present disclosure.
  • FIG. 8 is an exploded perspective view of a portion of an electronic device (2) according to various embodiments of the present disclosure.
  • the electronic device (2) may include a frame (22), a display module (201), a first speaker assembly (4A), a second speaker assembly (4B), a third speaker assembly (4C), a fourth speaker assembly (4D), a first thermally conductive plate (71), a second thermally conductive plate (72), and/or a PCB (80).
  • the first speaker assembly (4A) may be positioned or coupled to the rear portion (23) of the frame (22) corresponding to the first speaker hole (SH1) of the frame (22).
  • the first speaker assembly (4A) may be positioned corresponding to the first corner (C1) of the frame (22).
  • the first speaker assembly (4A) may overlap the display module (201) and the first thermally conductive plate (71).
  • a first speaker assembly (4A) may include a first speaker module (41) including a first speaker (411), a first speaker housing (42), a first metal plate (51) disposed in a first partial housing (421), and a second metal plate (52) disposed in a second partial housing (422).
  • the first metal plate (51) may face the display module (201), and the second metal plate (52) may face the rear portion (23) of the frame (22).
  • the first metal plate (51) may reduce or prevent an electromagnetic influence (e.g., EMI) of the first speaker (411) on the display module (201).
  • the second metal plate (52) may be configured to receive heat from a first thermally conductive plate (71) disposed in the rear portion (23) of the frame (22).
  • the second speaker assembly (4B) may be positioned or coupled to the rear portion (23) of the frame (22) corresponding to the second speaker hole (SH2) (see FIG. 2) of the frame (22).
  • the second speaker assembly (4B) may be positioned corresponding to the second corner (C2) of the frame (22).
  • the second speaker assembly (4B) may overlap the display module (201) and the first thermally conductive plate (71).
  • the second speaker assembly (4B) may be implemented to be at least partially identical or similar to the first speaker assembly (4A).
  • the second speaker assembly (4B) may include, for example, a second speaker module including a second speaker (e.g., a first speaker module (41) including a first speaker (411) of FIG. 8), a second speaker housing (42B) (e.g., the first speaker housing (42) of FIG. 8), and a sixth metal plate (e.g., the first metal plate (51) of FIG. 8) disposed in the second speaker housing (42B), and a seventh metal plate (52B) (e.g., the second metal plate (52) of FIG. 8) disposed in the second speaker housing (42B).
  • the sixth metal plate may face the display module (201), and the seventh metal plate (52B) may face the rear portion (23) of the frame (22).
  • the sixth metal plate may reduce or prevent electromagnetic influence (e.g., EMI) of the second speaker on the display module (201).
  • the seventh metal plate (52B) can receive heat from the first thermally conductive plate (71) placed on the rear side (23) of the frame (22).
  • the third speaker assembly (4C) may be positioned or coupled to the rear portion (23) of the frame (22) corresponding to the third speaker hole (SH3) of the frame (22) (e.g., see FIG. 2).
  • the third speaker assembly (4C) may be positioned corresponding to the third corner (C3) of the frame (22).
  • the third speaker assembly (4C) may overlap the display module (201) and the second thermally conductive plate (72).
  • the third speaker assembly (4C) may be implemented to be at least partially identical or similar to the first speaker assembly (4A).
  • the third speaker assembly (4C) may include, for example, a third speaker module including a third speaker (e.g., a first speaker module (41) including a first speaker (411) of FIG. 8), a third speaker housing (42C) (e.g., the first speaker housing (42) of FIG. 8), and an eighth metal plate (e.g., the first metal plate (51) of FIG. 8) disposed in the third speaker housing (42C), and a ninth metal plate (52C) (e.g., the second metal plate (52) of FIG. 8) disposed in the third speaker housing (42C).
  • the eighth metal plate may face the display module (201), and the ninth metal plate (52C) may face the rear portion (23) of the frame (22).
  • the eighth metal plate may reduce or prevent electromagnetic influence (e.g., EMI) of the third speaker on the display module (201).
  • the ninth metal plate (52C) can receive heat from the second thermally conductive plate (72) placed on the rear side (23) of the frame (22).
  • the fourth speaker assembly (4D) may be positioned or coupled to the rear portion (23) of the frame (22) corresponding to the fourth speaker hole (SH4) (see FIG. 2) of the frame (22).
  • the fourth speaker assembly (4D) may be positioned corresponding to the fourth corner (C4) of the frame (22).
  • the fourth speaker assembly (4D) may overlap the display module (201) and the second thermally conductive plate (72).
  • the fourth speaker assembly (4D) may be implemented at least partially identical to or similar to the first speaker assembly (4A).
  • the fourth speaker assembly (4D) may include, for example, a fourth speaker module including a fourth speaker (e.g., a first speaker module (41) including a first speaker (411) of FIG. 8), a fourth speaker housing (42D) (e.g., the first speaker housing (42) of FIG. 8), and a tenth metal plate (e.g., the first metal plate (51) of FIG. 8) disposed in the fourth speaker housing (42D), and an eleventh metal plate (52D) (e.g., the second metal plate (52) of FIG. 8) disposed in the fourth speaker housing (42D).
  • the tenth metal plate may face the display module (201), and the eleventh metal plate (52D) may face the rear portion (23) of the frame (22).
  • the tenth metal plate can reduce or prevent electromagnetic influence (e.g., EMI) from the fourth speaker on the display module (201).
  • the eleventh metal plate (52D) can receive heat from the second thermally conductive plate (72) disposed on the rear surface (23) of the frame (22).
  • the first thermally conductive plate (71) may be disposed or coupled to the rear portion (23) of the frame (22).
  • the first thermally conductive plate (71) may be coupled to the rear portion (23) of the frame (22), for example, via an adhesive material (or bonding material) disposed between the first thermally conductive plate (71) and the rear portion (23) of the frame (22).
  • the first thermally conductive plate (71) may include a heat dissipation layer, a heat dissipation plate, or a heat dissipation sheet.
  • the first thermally conductive plate (71) may extend from a first region overlapping the second metal plate (52) of the first speaker assembly (4A) to a second region overlapping the seventh metal plate (52B) of the second speaker assembly (4B) when viewed from above the rear surface (20B) of the electronic device (2) (or in a direction perpendicular to the rear surface (20B)) (see FIG. 2).
  • Heat emitted from at least one first electronic component (81) included in the electronic device (2) may be transferred to the second metal plate (52) of the first speaker assembly (4A) and/or the seventh metal plate (52B) of the second speaker assembly (4B) through the first thermally conductive plate (71).
  • the first thermally conductive plate (71), the second metal plate (52) of the first speaker assembly (4A), and the seventh metal plate (52B) of the second speaker assembly (4B) can be a first heat spreader that reduces or prevents overheating of at least one first electronic component (81).
  • the first thermally conductive plate (71) may be a thin plate for slimming while having strength that can ensure durability.
  • the first thermally conductive plate (71) may be formed of a flexible material having a thickness of less than a certain thickness.
  • the first thermally conductive plate (71) may be formed in the form of a film or thin plate to have flexibility, for example.
  • the first thermally conductive plate (71) may be implemented to have partially different thicknesses. In various embodiments, although not separately illustrated, the first thermally conductive plate (71) may be formed in a partially curved shape. In various embodiments, although not separately illustrated, the first thermally conductive plate (71) may be provided (or formed) in a shape in which a plurality of heat transfer members are connected, or in a shape in which a plurality of heat transfer layers are laminated. The first thermally conductive plate (71) may be provided (or formed) in various other shapes that can be arranged while reducing interference between components within the electronic device (2).
  • the first thermally conductive plate (71) may include at least one of a conductive material and a non-conductive material.
  • the electronic device (2) may include a first thermally conductive layer (57) having a thermally conductive material (e.g., a thermally conductive material), such as a TIM, disposed between the first thermally conductive plate (71) and the second metal plate (52) of the first speaker assembly (4A).
  • a thermally conductive material e.g., a thermally conductive material
  • the first thermally conductive layer (57) may improve the performance of heat transfer from the first thermally conductive plate (71) to the second metal plate (52) of the first speaker assembly (4A).
  • the electronic device (2) may include a second thermally conductive layer (57B) having a thermally conductive material (e.g., a thermally conductive material), such as a TIM, disposed between the first thermally conductive plate (71) and the seventh metal plate (52B) of the second speaker assembly (4B).
  • a thermally conductive material e.g., a thermally conductive material
  • the second thermally conductive layer (57B) may improve the performance of heat transfer from the first thermally conductive plate (71) to the seventh metal plate (52B) of the second speaker assembly (4B).
  • sound waves generated by the first speaker (411) may be propagated in the air within a sound wave passage (e.g., a sound wave passage (901) of FIG. 9) of the first speaker assembly (4A) and output to the outside of the electronic device (2) through a sound wave output port (e.g., a sound wave output port (401) of FIGS. 8 and 9) of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22).
  • a sound wave passage e.g., a sound wave passage (901) of FIG. 9) of the first speaker assembly (4A)
  • a sound wave output port e.g., a sound wave output port (401) of FIGS. 8 and 9
  • Heat transferred from the first thermally conductive plate (71) to the second metal plate (52) of the first speaker assembly (4A) can be discharged to the outside of the electronic device (2) through the sound wave output port of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22) by the air flow caused by the sound waves generated by the first speaker (411) being propagated in the air, thereby reducing or preventing overheating of at least one first electronic component (81).
  • Sound waves generated by the second speaker can be propagated in the air within the sound wave passage of the second speaker assembly (4B) and be output to the outside of the electronic device (2) through the sound wave output port of the second speaker housing (42B) and the second speaker hole (SH2) of the frame (22) (see FIG. 2).
  • Heat transferred from the first thermally conductive plate (71) to the seventh metal plate (52B) of the second speaker assembly (4B) can be discharged to the outside of the electronic device (2) through the sound wave output port of the second speaker housing (42B) and the second speaker hole (SH2) of the frame (22) (see FIG. 2) through the air flow caused by the sound waves generated by the second speaker being propagated in the air, thereby reducing or preventing overheating of at least one first electronic component (81).
  • the second thermally conductive plate (72) may be disposed or coupled to the rear portion (23) of the frame (22).
  • the second thermally conductive plate (72) may be coupled to the rear portion (23) of the frame (22), for example, via an adhesive material (or bonding material) disposed between the second thermally conductive plate (72) and the rear portion (22) of the frame (22).
  • the second thermally conductive plate (72) may include a heat dissipation layer, a heat dissipation plate, or a heat dissipation sheet.
  • the second thermally conductive plate (72) may extend from a third region overlapping the ninth metal plate (52C) of the third speaker assembly (4C) to a fourth region overlapping the eleventh metal plate (52D) of the fourth speaker assembly (4D) when viewed from above the rear surface (20B) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the rear surface (20B). Heat emitted from at least one second electronic component (82) included in the electronic device (2) may be transferred to the ninth metal plate (52C) of the third speaker assembly (4C) and/or the eleventh metal plate (52D) of the fourth speaker assembly (4D) through the second thermally conductive plate (72).
  • the second thermally conductive plate (72), the ninth metal plate (52C) of the third speaker assembly (4C), and the eleventh metal plate (52D) of the fourth speaker assembly (4D) may be a second heat spreader that reduces or prevents overheating of at least one second electronic component (82).
  • the second thermally conductive plate (72) may be a thin plate for slimming while having strength that can ensure durability.
  • the second thermally conductive plate (72) may be formed of a flexible material having a thickness of less than a certain thickness.
  • the second thermally conductive plate (72) may be formed in the form of a film or thin plate to have flexibility, for example.
  • the second thermally conductive plate (72) may be implemented to have partially different thicknesses.
  • the second thermally conductive plate (72) may be formed in a partially curved shape.
  • the second thermally conductive plate (72) may be provided (or formed) in a shape in which a plurality of thermally conductive members are connected, or in a shape in which a plurality of thermally conductive layers are laminated.
  • the second thermally conductive plate (72) may be provided (or formed) in various other shapes that can be arranged while reducing interference between components within the electronic device (2).
  • the electronic device (2) may include a third thermally conductive layer (57C) having a thermally conductive material (e.g., a thermally conductive material), such as a TIM, disposed between the second thermally conductive plate (72) and the ninth metal plate (52C) of the third speaker assembly (4C).
  • a thermally conductive material e.g., a thermally conductive material
  • the third thermally conductive layer (57C) may improve the performance of heat transfer from the second thermally conductive plate (72) to the ninth metal plate (52C) of the third speaker assembly (4C).
  • the electronic device (2) may include a fourth thermally conductive layer (57D) having a thermally conductive material (e.g., a thermally conductive material), such as a TIM, disposed between the second thermally conductive plate (72) and the eleventh metal plate (52D) of the fourth speaker assembly (4D).
  • a thermally conductive material e.g., a thermally conductive material
  • the fourth thermally conductive layer (57D) may improve the performance of heat transfer from the second thermally conductive plate (72) to the eleventh metal plate (52D) of the fourth speaker assembly (4D).
  • the sound wave generated by the third speaker may be propagated in the air within the sound wave passage of the third speaker assembly (4C) and output to the outside of the electronic device (2) through the sound wave output port of the third speaker housing (42C) and the third speaker hole (SH3) of the frame (22) (see FIG. 2).
  • the heat transferred from the second thermally conductive plate (72) to the ninth metal plate (52C) of the third speaker assembly (4C) may be discharged to the outside of the electronic device (2) through the sound wave output port of the third speaker housing (42C) and the third speaker hole (SH3) of the frame (22) (see FIG.
  • the sound wave generated by the fourth speaker can be propagated in the air within the sound wave passage of the fourth speaker assembly (4D) and output to the outside of the electronic device (2) through the sound wave output port of the fourth speaker housing (42D) and the fourth speaker hole (SH4) of the frame (22) (see FIG. 2).
  • the heat transferred from the second thermally conductive plate (72) to the eleventh metal plate (52D) of the fourth speaker assembly (4D) can be discharged to the outside of the electronic device (2) through the sound wave output port of the fourth speaker housing (42D) and the fourth speaker hole (SH4) of the frame (22) (see FIG. 2) through the air flow caused by the sound wave generated by the fourth speaker being propagated in the air, thereby reducing or preventing overheating of at least one second electronic component (82).
  • the PCB (80) may be positioned or coupled to the rear portion (23) of the frame (22).
  • the PCB (80) may partially overlap or not overlap the first speaker assembly (4A) (or the first speaker housing (42)).
  • the PCB (80) may not overlap the second metal plate (52) of the first speaker assembly (4A).
  • the PCB (80) may partially overlap or not overlap the second speaker assembly (4B) (or the second speaker housing (42B)).
  • the PCB (80) When viewed from above on the rear surface (20B) of the electronic device (2), the PCB (80) may not overlap with the seventh metal plate (52B) of the second speaker assembly (4B). When viewed from above on the rear surface (20B) of the electronic device (2), the PCB (80) may partially overlap with, or may not overlap with, the third speaker assembly (4C) (or, the third speaker housing (42C)). When viewed from above on the rear surface (20B) of the electronic device (2), the PCB (80) may partially overlap with, or may not overlap with, the ninth metal plate (52C) of the third speaker assembly (4C).
  • the PCB (80) When viewed from above on the rear surface (20B) of the electronic device (2), the PCB (80) may partially overlap with, or may not overlap with, the fourth speaker assembly (4D) (or, the fourth speaker housing (42D)). When viewed from above on the rear (20B) of the electronic device (2), the PCB (80) may not overlap with the eleventh metal plate (52D) of the fourth speaker assembly (4D).
  • the first thermally conductive plate (71) may overlap the PCB (80) when viewed from above the rear surface (20B) of the electronic device (2) (see FIG. 2) (or in a direction perpendicular to the rear surface (20B)). At least one first electronic component (81) may be disposed on the PCB (80) between the PCB (80) and the first thermally conductive plate (71). Heat emitted from the at least one first electronic component (81) may be transferred to the first thermally conductive plate (71).
  • the electronic device (2) may include a thermally conductive material (not shown separately) such as TIM disposed between at least one first electronic component (81) and the first thermally conductive plate (71) to improve heat transfer performance.
  • a thermally conductive material such as TIM disposed between at least one first electronic component (81) and the first thermally conductive plate (71) to improve heat transfer performance.
  • At least one first electronic component (81) may include, but is not limited to, a processor (e.g., processor (120) of FIG. 1) or a communication module (e.g., communication module (190) of FIG. 1).
  • a processor e.g., processor (120) of FIG. 1
  • a communication module e.g., communication module (190) of FIG. 1.
  • the size of the first thermally conductive plate (71) when viewed from above on the rear surface (20B) of the electronic device (2) (see FIG. 2), the size of the first thermally conductive plate (71) may be smaller than the size of the PCB (80).
  • an additional conductive/thermally conductive plate (e.g., a first shield can) (not shown separately) may be included between the first thermally conductive plate (71) and the at least one first electronic component (81).
  • the electronic device (2) may include a first shield can disposed (e.g., mounted) on the PCB (80) to cover the at least one first electronic component (81).
  • the first shield can may be electrically connected to a ground region (not shown separately) of the PCB (80) and may be defined or interpreted as part of the ground structure of the electronic device (2).
  • the first shield can may be configured to reduce or prevent electromagnetic interference (EMI) to the at least one first electronic component (81).
  • EMI electromagnetic interference
  • Heat emitted from at least one first electronic component (81) may be transferred to the first thermally conductive plate (71) through the first shield can.
  • a thermally conductive material such as a TIM may be disposed between the first shield can and the first thermally conductive plate (71) to improve heat transfer performance.
  • a thermally conductive material such as a TIM may be disposed between the at least one first electronic component (81) and the first shield can to improve heat transfer performance.
  • the second thermally conductive plate (72) may overlap the PCB (80) when viewed from above (or in a direction perpendicular to the rear surface (20B)) of the electronic device (2) (see FIG. 2).
  • the second thermally conductive plate (72) when viewed from above on the rear surface (20B) of the electronic device (2) (see FIG. 2), the second thermally conductive plate (72) may have a different shape and/or size from the first thermally conductive plate (71). At least one second electronic component (82) may be disposed on the PCB (80) between the PCB (80) and the second thermally conductive plate (72). Heat emitted from the at least one second electronic component (82) may be transferred to the second thermally conductive plate (72).
  • the electronic device (2) may include a thermally conductive material (e.g., a thermally conductive material) (not shown) such as a TIM disposed between the at least one second electronic component (82) and the second thermally conductive plate (72).
  • At least one second electronic component (82) may include, but is not limited to, a charging module or a charging integrated circuit (IC).
  • the size of the second thermally conductive plate (72) when viewed from above on the rear surface (20B) of the electronic device (2) (see FIG. 2), the size of the second thermally conductive plate (72) may be smaller than the size of the PCB (80).
  • an additional conductive/thermally conductive plate (e.g., a second shield can) (not shown separately) may be included between the second thermally conductive plate (72) and the at least one second electronic component (82).
  • the electronic device (2) may include a second shield can disposed (e.g., mounted) on the PCB (80) to cover the at least one second electronic component (82).
  • the second shield can may be electrically connected to a ground region (not shown separately) of the PCB (80) and may be defined or interpreted as part of the ground structure of the electronic device (2).
  • the second shield can be configured to reduce or prevent electromagnetic interference (EMI) to the at least one second electronic component (82).
  • EMI electromagnetic interference
  • Heat radiating from the at least one second electronic component (82) may be transferred to the second thermally conductive plate (72) through the second shield can.
  • a thermally conductive material such as a TIM may be placed between the second shield can and the second thermally conductive plate (72) to improve heat transfer performance.
  • a thermally conductive material such as a TIM may be placed between at least one second electronic component (82) and the second shield can to improve heat transfer performance.
  • FIG. 9 is a cross-sectional view of an electronic device (2) taken along line A-A' of FIG. 2 according to various embodiments of the present disclosure.
  • the electronic device (2) may include a front plate (21), a frame (22), a display module (201), a first speaker assembly (4A), a first thermally conductive layer (57), and/or a first thermally conductive plate (71).
  • the first speaker assembly (4A) may include a first partial housing (421), a second partial housing (422), a first speaker (411), a first metal plate (51), a second metal plate (52), a sound-transmitting member (91), and/or an elastic member (92).
  • the first speaker (411) may be positioned between the first metal plate (51) and the second metal plate (52).
  • the first speaker (411) may overlap the first metal plate (51) and the second metal plate (52) in a direction orthogonal to the front plate (21) (e.g., a direction parallel to the z-coordinate axis).
  • the first metal plate (51) may face the display module (201), and the second metal plate (52) may face the rear surface (23) of the frame (22).
  • the first metal plate (51) may reduce or prevent an electromagnetic influence (e.g., EMI) of the first speaker (411) on the display module (201).
  • the second metal plate (52) may receive heat from the first thermally conductive plate (71) disposed on the rear surface (23) of the frame (22).
  • the diaphragm (not shown separately) of the first speaker (411) may face the rear portion (23) of the frame (22).
  • the diaphragm of the first speaker (411) may face the second metal plate (52).
  • the first speaker (411) may generate sound waves toward the second metal plate (52).
  • the first speaker (411) and the second metal plate (52) may be spaced apart from each other for propagation of the sound waves generated by the first speaker (411).
  • the first speaker (411) and the second metal plate (52) may be spaced apart from each other by a distance of about 0.5 mm (millimeter) to about 1.0 mm (e.g., about 0.7 mm) in a direction orthogonal to the front plate (21) (e.g., a direction parallel to the z-coordinate axis), but is not limited thereto.
  • the space between the first speaker (411) and the second metal plate (52) may be part of the sound wave passage (901) of the first speaker assembly (4A).
  • a portion of the first thermally conductive plate (71) may be positioned between the second metal plate (52) of the first speaker assembly (4A) and the rear portion (23) of the frame (22).
  • the first thermally conductive layer (57) may be positioned between the first thermally conductive plate (71) and the second metal plate (52). Heat emitted from at least one electronic component included in the electronic device (2) (e.g., at least one first electronic component (81) of FIG. 7) may be transferred to the second metal plate (52) through the first thermally conductive plate (71) and the first thermally conductive layer (57).
  • the first thermally conductive layer (57) can reduce or prevent vibration of the second metal plate (52) when sound waves are generated by the first speaker (411).
  • the first thermally conductive layer (57) can reduce or prevent resonance by the second metal plate (52) when sound waves are generated by the first speaker (411).
  • the first thermally conductive layer (57) can include a thermally conductive material having a buffering function.
  • the electronic device (2) or the first speaker assembly (4A) may include an integral or unitary structure (e.g., a single continuous structure or a complete structure) by replacing the first thermally conductive plate (71) and the second metal plate (52) of the first speaker assembly (4A).
  • an integral or unitary structure e.g., a single continuous structure or a complete structure
  • the first speaker assembly (4A) may include a sound wave passage (901).
  • the sound wave passage (901) may guide sound waves generated by the first speaker (411) to propagate to the sound wave output port (401).
  • the first speaker assembly (4A) may include an inner wall of the passage (also referred to as an inner side surface of the passage) forming the sound wave passage (901).
  • the second metal plate (52) may provide (or form) a portion of the inner wall of the passage of the first speaker assembly (4A).
  • a portion of the second metal plate (52) corresponding to the second opening (4202) of the second partial housing (422) may form a portion of the inner wall of the passage.
  • the second metal plate (52) forming a part of the inner wall of the passage can improve the performance (e.g., convective heat transfer performance) of heat transferred from the first thermally conductive plate (71) to the second metal plate (52) to the air within the sound wave passage (901).
  • the sound wave generated by the first speaker (411) may be propagated in the air within the sound wave passage (901) of the first speaker assembly (4A) and output to the outside of the electronic device (2) through the sound wave output port (401) of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22) (see 902).
  • the heat transferred from the first thermally conductive plate (71) to the second metal plate (52) may be discharged to the outside of the electronic device (2) through the sound wave output port (401) of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22) through the air flow caused by the sound wave generated by the first speaker (411) being propagated in the air, thereby reducing or preventing overheating of at least one electronic component (e.g., at least one first electronic component (81) of FIG. 7).
  • at least one electronic component e.g., at least one first electronic component (81) of FIG. 7
  • the sound wave permeable member (91) may be disposed or coupled to the first speaker housing (42) so as to be disposed at the sound wave output port (401). Sound waves generated by the first speaker (411) may be output to the outside of the electronic device (2) through the sound wave permeable member (91).
  • the sound wave permeable member (91) may include, for example, a porous member or a mesh member, but is not limited thereto.
  • the sound wave permeable member (91) may reduce or prevent external foreign substances, such as dust or moisture, from entering the interior of the first speaker assembly (4A) through the sound wave output port (401).
  • an elastic member (92) may be disposed or coupled to the first speaker housing (42).
  • the elastic member (92) may be coupled to the sound-transmitting member (91) and may support the sound-transmitting member (91).
  • the elastic member (92) may be provided (or formed) in an annular (or loop-shaped) shape, for example, including an opening corresponding to the sound-wave output port (401) of the first speaker housing (42).
  • the elastic member (92) may be resiliently disposed between the first speaker housing (42) and the frame (22).
  • the elastic member (92) may reduce or prevent sound waves generated by the first speaker (411) from leaking between the first speaker housing (42) and the frame (22).
  • the elastic member (92) can reduce or prevent external foreign substances such as dust or moisture from entering the interior of the first speaker assembly (4A) through the space between the first speaker housing (42) and the frame (22) (see FIG. 3).
  • the elastic member (92) may include, but is not limited to, sponge or rubber, for example.
  • the structure in which the second speaker assembly (4B) (see FIG. 7) and the second thermally conductive layer (57B) are arranged relative to the front plate (210), the frame (22), the display module (201), and the first thermally conductive plate (71) may be provided (or formed) at least partially identical to or similar to the structure in which the first speaker assembly (4A) and the first thermally conductive layer (57) are arranged relative to the front plate (21), the frame (22), the display module (201), and the first thermally conductive plate (71), although not illustrated separately.
  • the structure in which the third speaker assembly (4C) (see FIG. 7) and the third thermally conductive layer (57C) are arranged relative to the front plate (210), the frame (22), the display module (201), and the second thermally conductive plate (72) may be provided (or formed) at least partially identical to or similar to the structure in which the first speaker assembly (4A) and the first thermally conductive layer (57) are arranged relative to the front plate (21), the frame (22), the display module (201), and the first thermally conductive plate (71), although not illustrated separately.
  • the structure in which the fourth speaker assembly (4D) (see FIG. 7) and the fourth thermally conductive layer (57D) are arranged relative to the front plate (210), the frame (22), the display module (201), and the second thermally conductive plate (72) may be provided (or formed) at least partially identical to or similar to the structure in which the first speaker assembly (4A) and the first thermally conductive layer (57) are arranged relative to the front plate (21), the frame (22), the display module (201), and the first thermally conductive plate (71), although not illustrated separately.
  • FIG. 10 is a cross-sectional view of an electronic device (2) taken along line A-A' of FIG. 2 according to various embodiments of the present disclosure.
  • FIG. 11 is a perspective view of a portion of an electronic device (2) according to various embodiments of the present disclosure.
  • FIG. 12 is a perspective view of a portion of an electronic device (2) according to various embodiments of the present disclosure.
  • FIG. 13 is a perspective view of a thermally conductive plate (1000) and drawings showing the thermally conductive plate (1000) according to various embodiments of the present disclosure.
  • the electronic device (2) may include a front plate (21), a frame (22), a display module (201), a first speaker assembly (4A), a first thermally conductive layer (57), and/or a thermally conductive plate (e.g., a thermally conductive sheet) (1000).
  • the first speaker assembly (4A) may include a first partial housing (421), a second partial housing (422), a first speaker (411), a first metal plate (51), a second metal plate (52), a sound-transmitting member (91), and/or an elastic member (92). Descriptions of some components that are the same as those in the preceding embodiments will not be repeated.
  • the thermally conductive plate (1000) may include a first portion (1010) positioned at least partially between the second metal plate (52) of the first speaker assembly (4A) and the rear portion (23) of the frame (22).
  • the first portion (1010) may overlap the second metal plate (52) of the first speaker assembly (4A) when viewed from above (or in a direction perpendicular to the rear portion (20B)) of the electronic device (2) (see FIG. 2).
  • the first portion (1010) may overlap at least one first electronic component (81) (e.g., the processor (120) of FIG. 1). Heat emitted from at least one first electronic component (81) can be transferred to the first portion (1010).
  • Heat emitted from at least one first electronic component (81) can be transferred to the second metal plate (52) of the first speaker assembly (4A) through the thermally conductive plate (1000), thereby reducing or preventing overheating of the at least one first electronic component (81).
  • Heat transferred from the thermally conductive plate (1000) to the second metal plate (52) of the first speaker assembly (4A) can be discharged to the outside of the electronic device (2) through the sound wave output port (401) (see FIG. 9) and the first speaker hole (SH1) of the frame (22) through the air flow caused by the sound wave generated by the first speaker (411) (see FIG. 9) being propagated in the air within the sound wave passage (901) (see FIG. 9) of the first speaker assembly (4A), thereby reducing or preventing overheating of at least one first electronic component (81).
  • the thermally conductive plate (1000) may include a second portion (1020) extending from the first portion (1010).
  • the second portion (1020) may be disposed at least partially in the first speaker hole (SH1) of the frame (22) and may include a plurality of holes to reduce interference with the propagation of sound waves (or the flow of air) through the first speaker hole (SH1).
  • the thermally conductive plate (1000) including the first portion (1010) and the second portion (1020) may improve heat dissipation performance by expanding the heat dissipation area compared to the thermally conductive plate of the comparative example including only the first portion (1010).
  • the first portion (1010) of the thermally conductive plate (1000) may extend between the seventh metal plate (52B) (see FIG. 7) of the second speaker assembly (4B) and the rear portion (23) of the frame (22).
  • the first portion (1010) may overlap the seventh metal plate (52B) of the second speaker assembly (4B) when viewed from above (or in a direction perpendicular to the rear portion (20B)) of the rear portion (20B) of the electronic device (2).
  • the first portion (1010) may overlap at least one first electronic component (81) (see FIG. 7) (e.g., a charging module or a charging IC).
  • Heat emitted from at least one first electronic component (81) can be transferred to the first portion (1010). Heat emitted from at least one first electronic component (81) can be transferred to the seventh metal plate (52B) (see FIG. 7) of the second speaker assembly (4B) through the thermally conductive plate (1000), thereby reducing or preventing overheating of the at least one first electronic component (81).
  • the heat transferred from the thermally conductive plate (1000) to the seventh metal plate (52B) of the second speaker assembly (4B) can be discharged to the outside of the electronic device (2) through the sound wave output port (401) and the second speaker hole (SH2) of the frame (22) (see FIG.
  • the thermally conductive plate (1000) may include a third portion (not separately illustrated) extending from the first portion (1010).
  • the third part may be arranged at least partially in the second speaker hole (SH2) of the frame (22) and may include a plurality of holes to reduce interference with the propagation of sound waves (or the flow of air) through the second speaker hole (SH2).
  • the third part may expand the heat dissipation area to improve heat dissipation performance.
  • the thermally conductive plate (1000) may replace the first thermally conductive plate (71) of FIG. 9.
  • the thermally conductive plate (1000) may be connected to the first thermally conductive plate (71) of FIG. 9 to enable heat transfer.
  • FIG. 14 illustrates heat maps of electronic devices according to various embodiments of the present disclosure.
  • 1410 is a heat map for an electronic device (2) of the present disclosure.
  • 1420 is a heat map for an electronic device (1421) of a comparative example in which a thermally conductive plate (e.g., the first thermally conductive plate (71) of FIG. 7) is omitted.
  • 1430 indicates a heat-generating region corresponding to at least one electronic component (e.g., at least one first electronic component (81) of FIG. 7).
  • the electronic device (2) of the present disclosure may have relatively, for example, improved heat dissipation performance compared to the electronic device (1421) of the comparative example due to the thermally conductive plate (e.g., the first thermally conductive plate (71) of FIG. 7).
  • the electronic device (2) of the present disclosure may, for example, dissipate heat of about 49.2° C. in a heat-generating region (1430) corresponding to at least one electronic component.
  • the electronic device (1421) of the comparative example may, for example, dissipate heat of about 50.2° C. in a heat-generating region (1430) corresponding to at least one electronic component.
  • the thermally conductive plate e.g., the first thermally conductive plate (71) of FIG. 7 may diffuse or disperse the heat dissipated from the at least one electronic component.
  • FIG. 15 is a graph showing the performance of a first speaker (411) included in an electronic device (2) according to the present disclosure (see FIGS. 9 and 10), and the performance of a first speaker included in a comparative example electronic device in which the first thermally conductive layer (57) (see FIGS. 9 and 10) is omitted.
  • 1501 is a graph showing the performance of a first speaker (411) included in an electronic device (2) according to the present disclosure.
  • 1502 is a graph showing the performance of a first speaker included in an electronic device of a comparative example in which the first thermally conductive layer (57) is omitted.
  • the first thermally conductive layer (57) e.g., a TIM layer
  • the first thermally conductive layer (57) can reduce or prevent vibration of the second metal plate (52) when sound waves are generated by the first speaker (411).
  • the first thermally conductive layer (57) can reduce or prevent resonance by the second metal plate (52) when sound waves are generated by the first speaker (411).
  • the electronic device (2) according to the present disclosure can have improved speaker performance (e.g., RMS level output performance) compared to the electronic device of the comparative example in the corresponding frequency band (see 1500).
  • the first thermally conductive layer (57) can include a thermally conductive material having a buffering function.
  • FIG. 16 is a block diagram of a portion of an electronic device (1600) according to various embodiments of the present disclosure.
  • an electronic device (1600) may include a processor (or at least one processor) (1610) (e.g., processor (120) of FIG. 1), a memory (1620) (e.g., memory (130) of FIG. 1), an audio processing circuit (1630) (e.g., audio module (170) of FIG. 1), a speaker module (1640), and/or a communication circuit (1650) (e.g., communication module (190) of FIG. 1).
  • the electronic device (1600) may be, for example, the electronic device (101) of FIG. 1 or the electronic device (2) of FIG. 2.
  • a processor may control hardware components or software components connected to the processor (1610) by running an operating system (OS) or an embedded software program.
  • the processor (1610) may, for example, execute instructions (e.g., a program (140) of FIG. 1) stored in a memory (1620) to control a plurality of hardware components or software components.
  • the processor (1610) may control audio data (1621) stored in a memory (e.g., a non-volatile memory, a volatile memory) (1620) to be output through a speaker module (1640).
  • the processor (1610) may correspond to a plurality of processors that collectively perform a plurality of operations by dividing the operations among the processors.
  • the processor (1610) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing.
  • the processor (1610) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (1620).
  • the processor (1610) may include a processor cluster including one or more processing circuits.
  • the processor (1610) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (1600).
  • the processor (1610) e.g., an application processor (AP)
  • SoC system on chip
  • the processor (1610) may be implemented as multiple cores (or at least one core circuit), multiple chips, or multiple chipsets.
  • the processor (1610) may include one or more processing circuits.
  • the processor (1610) may include one or more processing circuits configured to individually and/or collectively perform various functions of the present disclosure.
  • at least a portion of the processor (1610) may be included in a first chip of the electronic device (1600), and at least another portion of the processor (1610) may be included in a second chip of an electronic device (not shown) that is different from the first chip of the electronic device (1600).
  • the processor (1610) may include a CPU, a GPU, an NPU, an ISP, a display controller, a memory controller, a storage controller, a CP, and/or a sensor interface. These components of the processor (1610) are merely exemplary.
  • the processor (1610) may further include other components.
  • some components of the processor (1610) may be omitted from the processor (1610).
  • some components of the processor (1610) may be included as separate components of the electronic device (1600) outside of the processor (1610).
  • some components of the processor (1610) such as a memory controller, may be included within other components, such as at least a portion of the memory (1620), an interface (e.g., available for connection to at least one component of the electronic device (1600), a display, an image sensor, audio processing circuitry (1630), and/or a speaker module (1640)).
  • the processor (1610) may cause other components of the electronic device (1600) to perform various operations by executing instructions stored in the memory (1620).
  • the memory (1620) may include one or more storage media (or one or more storage devices).
  • the memory (1620) may include a memory assembly including one or more storage media.
  • the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof.
  • the memory (1620) may include a cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (1600).
  • the cache memory may be included within the processor (1610).
  • the memory (1620) may be fixedly embedded within the electronic device (1600) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and/or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (1600).
  • SIM subscriber identity module
  • SD secure digital
  • the memory (1620) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and/or applet) software application, and/or any other suitable software applications.
  • the one or more software applications may include instructions executable by the processor (1610).
  • the memory (1620) may store instructions callable by an application programming interface (API).
  • API application programming interface
  • the memory (1620) may store instructions within a library.
  • the memory (1620) may store various data used by at least one component of the electronic device (1600) (e.g., the processor (1610), the audio processing circuit (1630), or the communication circuit (1650)).
  • the various data may include, for example, software (e.g., the program (140) of FIG. 1) and input data or output data for commands related thereto.
  • the memory (1620) can store audio data (1621).
  • the memory (1620) can include non-volatile memory that stores non-volatile audio data.
  • the memory (1620) can include volatile memory that stores volatile audio data.
  • the memory (1620) can store audio data (e.g., non-volatile memory and/or volatile audio data) (1621) received from an external electronic device (e.g., the external electronic device (102 or 104) of FIG. 1, the server (108), or the access point) via, for example, a communication circuit (1650).
  • an external electronic device e.g., the external electronic device (102 or 104) of FIG. 1, the server (108), or the access point
  • the memory (1620) may store sound wave reproduction instructions (1622) for heat dissipation.
  • the sound wave reproduction instructions (1622) for heat dissipation may be configured to cause the processor (1610) to control the audio processing circuit (1630) to output (or reproduce) sound waves of a specified inaudible frequency band through the speaker module (1640).
  • Heat emitted from at least one electronic component may be transferred to the speaker module (1640) and may be discharged to the outside of the electronic device (1600) through the air flow caused by sound waves of a specified inaudible frequency band generated by the speaker module (1640) being propagated through the air, thereby reducing or preventing overheating of the at least one electronic component.
  • the user may not perceive sound waves of a specified inaudible frequency band.
  • the audible frequency band that a person can perceive with their hearing can be defined as about 20 Hz (hertz) to about 20,000 Hz. Since the scope of certification for the performance (referred to as output performance) of the speaker module (1640) can be determined to not include frequencies lower than about 20 Hz, the sound waves that the speaker module (1640) intends to generate for heat dissipation may not be implemented with frequencies lower than about 20 Hz.
  • the 'designated inaudible frequency band' of the sound waves that the speaker module (1640) intends to generate for heat dissipation may be defined as a frequency band that is substantially imperceptible or difficult to perceive with hearing among about 20 Hz to about 20,000 Hz, which is typically defined as the audible frequency band, except for some special people with hearing that is much better than that of ordinary people.
  • the 'designated inaudible frequency band' of the present disclosure may be about 100 Hz or less, but is not limited thereto.
  • the 'designated inaudible frequency band' of the present disclosure may be about 20 Hz to about 70 Hz.
  • the 'audible frequency band' may be defined as a frequency band greater than the 'designated inaudible frequency band'. Since the inaudible frequency band may vary depending on age group or individual hearing ability, the electronic device (1600) according to the present disclosure may be configured to set the inaudible frequency band differently for each individual based on personal data. Since the audible frequency band may vary depending on age group or individual hearing ability, the electronic device (1600) according to the present disclosure may be configured to set the audible frequency band differently for each individual based on personal data.
  • the electronic device (1600) may provide a test sound source for at least one frequency band so as to be able to set an audible and/or inaudible frequency band for each user, and may output a speaker based on the user's response to the test sound source.
  • the audible and/or inaudible frequency bands associated with the module (1640) can be determined.
  • the audio processing circuit (1630) may be configured to reproduce audio data through the speaker module (1640).
  • the audio processing circuit (1630) may convert the audio data into an audio signal in the form of a current (e.g., an alternating current) and provide the audio signal to the speaker module (1640).
  • the audio processing circuit (1630) may be configured to reproduce the audio data through an external electronic device (e.g., an external electronic device (102) of FIG. 1) (e.g., earphones or headphones) directly or wirelessly connected to the electronic device (1600).
  • an external electronic device e.g., an external electronic device (102) of FIG. 1
  • an external electronic device (102) of FIG. 1 e.g., earphones or headphones
  • playing audio data through an output device may be defined as converting the audio data into an input (e.g., an audio signal) for the output device.
  • the audio processing circuit (1630) may be configured to provide an input of a designated inaudible frequency band to the speaker module (1640) such that sound waves of a designated inaudible frequency band are generated by the speaker module (1640) under the control of the processor (1610) according to the sound wave reproduction induction for heat dissipation (1622).
  • the audio processing circuit (1630) may provide an input of a designated inaudible frequency band to the speaker module (1640) under the control of the processor (1610) according to the sound wave reproduction induction for heat dissipation (1622).
  • the 'input of a designated inaudible frequency band' may be an audio signal in the form of a current (e.g., an alternating current) that the speaker module (1640) can output.
  • the 'input of the specified inaudible frequency band' may be audio data of the specified inaudible frequency band converted into an audio signal in the form of a current (e.g., alternating current) that the speaker module (1640) can output.
  • the audio processing circuit (1630) may be configured to reproduce first audio data including an audible frequency band through a speaker module (1640) and second audio data of a designated inaudible frequency band through the speaker module (1640) under the control of the processor (1610) according to the sound wave reproduction insertion (1622) for heat dissipation.
  • Reproducing the first audio data including an audible frequency band and the second audio data of the designated inaudible frequency band through the speaker module (1640) may be defined as mixing of the second audio data with the first audio data.
  • second audio data for heat dissipation may be mixed with first audio data (e.g., audio data including an audible frequency band) and played back (or output), or the first audio data and the second audio data may each be played back (or output) simultaneously.
  • second audio data for heat dissipation (e.g., audio data in an inaudible frequency band) may be stored in the memory (1620).
  • the second audio data for heat dissipation may be configured to be generated through a generator module included in the electronic device (1600).
  • the generator module may be configured to generate the second audio data by adjusting the form and level of the second audio data in consideration of, for example, the first audio data (e.g., audio data including an audible frequency band) and the state of the electronic device (1600).
  • the state of the electronic device (1600) may include, but is not limited to, for example, the internal temperature of the electronic device (1600), the location where the internal temperature of the electronic device (1600) is measured, the magnitude of the internal temperature of the electronic device (1600), or the audio output path.
  • the second audio data may be configured to be generated by a generative artificial intelligence (AI) system (see FIG. 17) via a server (e.g., server 108 of FIG. 1).
  • AI artificial intelligence
  • an input level value or an output level value of the second audio data in an inaudible frequency band which is set based on an internal temperature of the electronic device (1600), a playback volume of the first audio data (e.g., audio data including an audible frequency band), and/or a frequency component of the first audio data, may be set by the AI model.
  • the AI model may include a machine learning model trained to determine an input level value, an output level value, and/or a frequency band of the second audio data based on audio data including the first audio data and/or the second audio data and a temperature threshold value allowed by the electronic device (1600).
  • a machine learning model, deep learning, or artificial intelligence neural network may be used to determine the frequency range, weight, volume, etc. of a sound source in an inaudible band.
  • the machine learning model may be provided by the electronic device (1600) or an external device (e.g., the server (108) of FIG. 1) connected to the electronic device (1600). Some of the necessary operations may be performed by the machine learning model of the electronic device (1600), and other parts may be performed by the machine learning model of the external device.
  • the machine learning model of the present disclosure may be a model trained to identify a sound source or an auxiliary sound source in an inaudible band that can lower the temperature to a certain level or more based on the temperature of the electronic device (1600), the type and usage time of the application being used, the remaining battery level, the type and location of the speaker, the location of the main heat source, the distance between the main heat source and the speaker, whether it is charging, the location of the electronic device (1600), audio in an audible band, and/or sound sources in an inaudible band.
  • the machine learning model of the present disclosure can identify frequency bands, weights, volumes, speakers to be used, etc. for sound sources in the inaudible band based on the aforementioned contextual information.
  • the machine learning model can be trained or learned through sufficient training data to associate a specific context with a specific temperature and a specific sound source.
  • the machine learning model of the present disclosure can include various transformer models.
  • the operation of the machine learning model of the present disclosure can include a learning and inference process that finds patterns in data, stores them as models that are generalized rules, and inputs new data into the trained model to obtain results.
  • a user's operations and the resulting temperature in a mobile device can be monitored to train a machine learning model.
  • the functions, temperatures, and sound sources used can serve as input values for learning, and the subsequent temperature change (decrease) can correspond to a target output value.
  • the machine learning model can learn the user's usage patterns. Learning in a mobile device can correspond to initial learning or relearning.
  • the learning process of the machine learning model can include forward propagation and backward propagation. Algorithms such as regression, decision trees, neural networks, and k-nearest neighbors can be used for learning. Different machine learning models can be used depending on the target task or input context.
  • the audio processing circuit (1630) may be configured to reproduce audio data in an inaudible frequency band designated for heat dissipation through the speaker module (1640) while the speaker module (1640) is in a silent state (also referred to as a silent mode) under the control of the processor (1610) according to the sound wave reproduction instruction (1622) for heat dissipation.
  • the electronic device (1600) may be implemented such that heat emitted from at least one electronic component is transferred to the speaker module (1640).
  • the speaker module (1640) may include a first speaker module (41) included in a first speaker assembly (4A) (see FIG. 6), a second speaker module included in a second speaker assembly (4B), a third speaker module included in a third speaker assembly (4C), and/or a fourth speaker module included in a fourth speaker assembly (4D).
  • sound waves of a designated inaudible frequency band generated by the first speaker module (41) can be propagated in the air within the sound wave passage (901) of the first speaker assembly (4A) and output to the outside of the electronic device (2) through the sound wave output port (401) of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22).
  • the heat transferred from the first thermally conductive plate (71) to the second metal plate (52) of the first speaker assembly (4A) can be discharged to the outside of the electronic device (2) through the sound wave output port (401) of the first speaker housing (42) and the first speaker hole (SH1) of the frame (22) by the air flow caused by the sound wave of the specified inaudible frequency band generated by the first speaker (411) being propagated in the air, thereby reducing or preventing overheating of at least one first electronic component (81).
  • the sound wave of the specified inaudible frequency band generated by the second speaker module can be propagated in the air within the sound wave passage of the second speaker assembly (4B) and be output to the outside of the electronic device (2) through the sound wave output port of the second speaker housing (42B) and the second speaker hole (SH2) of the frame (22).
  • Heat transferred from the first thermally conductive plate (71) to the seventh metal plate (52B) of the second speaker assembly (4B) can be discharged to the outside of the electronic device (2) through the sound wave output port of the second speaker housing (42B) and the second speaker hole (SH2) of the frame (22) through the air flow caused by sound waves of a designated inaudible frequency band generated by the second speaker module being propagated in the air, thereby reducing or preventing overheating of at least one first electronic component (81).
  • sound waves of a designated inaudible frequency band generated by the third speaker module may be propagated in the air within a sound wave passage of the third speaker assembly (4C) and output to the outside of the electronic device (2) through a sound wave output port of the third speaker housing (42C) and a third speaker hole (SH3) of the frame (22).
  • the heat transferred from the second thermally conductive plate (72) to the ninth metal plate (52C) of the third speaker assembly (4C) can be discharged to the outside of the electronic device (2) through the sound wave output port of the third speaker housing (42C) and the third speaker hole (SH3) of the frame (22) by the air flow caused by the sound wave of the designated inaudible frequency band generated by the third speaker module being propagated in the air, thereby reducing or preventing overheating of at least one second electronic component (82).
  • the sound wave of the designated inaudible frequency band generated by the fourth speaker module can be propagated in the air within the sound wave passage of the fourth speaker assembly (4D) and be output to the outside of the electronic device (2) through the sound wave output port of the fourth speaker housing (42D) and the fourth speaker hole (SH4) of the frame (22).
  • Heat transferred from the second thermally conductive plate (72) to the eleventh metal plate (52D) of the fourth speaker assembly (4D) can be discharged to the outside of the electronic device (2) through the sound wave output port of the fourth speaker housing (42D) and the fourth speaker hole (SH4) of the frame (22) through the air flow caused by sound waves of a designated inaudible frequency band generated by the fourth speaker module being propagated in the air, thereby reducing or preventing overheating of at least one second electronic component (82).
  • the communication circuit (1650) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1600) and an external electronic device (e.g., the external electronic device (102), the external electronic device (104), or the server (108) of FIG. 1), and performing communication through the established communication channel.
  • a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1600) and an external electronic device (e.g., the external electronic device (102), the external electronic device (104), or the server (108) of FIG. 1), and performing communication through the established communication channel.
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured, when executed by the processor (1610), to determine a temperature for the electronic device (1600) (e.g., an internal temperature of the electronic device (1600) or a temperature measured inside the electronic device (1600)) and determine (or adjust) an input level (also referred to as a gain) for an input of a designated inaudible frequency band provided to the speaker module (1640) based at least on the determined temperature.
  • the internal temperature of the electronic device (1600) may be, but is not limited to, the temperature of heat emitted from at least one electronic component (or the temperature of at least one electronic component).
  • the input level for the sound wave for heat dissipation based on the temperature may vary depending on the temperature or a temperature range.
  • the input level for the input of the designated inaudible frequency band provided to the speaker module (1640) may be determined as a first value.
  • the input level for the input of the designated inaudible frequency band provided to the speaker module (1640) may be determined as a second value greater than the first value.
  • the input level for the sound wave for heat dissipation based on temperature may improve heat dissipation efficiency as active heat dissipation depending on the situation.
  • the input level for the input of the designated inaudible frequency band in the present disclosure may be proportional to the output size of the sound wave for heat dissipation.
  • the heat-dissipating sound wave may provide (or form) a faster vibration-like movement to the second metal plate (52) (see FIG. 9) so that heat can be better discharged to the sound wave output port (901) (see FIG. 9).
  • heat emitted from at least one first electronic component (81) is transferred to a first speaker module (41) (see FIG. 8) of a first speaker assembly (4A) through a first thermally conductive plate (71), and a temperature of the heat emitted from the at least one first electronic component (81) can be determined through an internal resistance value (e.g., RDC (direct current) resistance) included in the first speaker module (41).
  • the internal resistance value (e.g., RDC resistance) of the first speaker module (41) can indicate a direct current resistance of the first speaker module (41) at a given temperature.
  • the temperature of the electronic device (2) (e.g., the internal temperature of the electronic device (2) or the temperature measured inside the electronic device (2)) can be estimated through the internal resistance value of the first speaker module (41) in a situation where an audio function is performed, and the temperature of the electronic device (2) can be influenced by a specific heat source (e.g., at least one first electronic component (81)).
  • a specific heat source e.g., at least one first electronic component (81)
  • heat emitted from at least one first electronic component (81) is transferred to the second speaker module of the second speaker assembly (4B) through the first thermally conductive plate (71), and the temperature of the heat emitted from at least one first electronic component (81) can be confirmed through the internal resistance value (e.g., RDC resistance value) included in the second speaker module.
  • heat emitted from at least one second electronic component (82) is transferred to a third speaker module of a third speaker assembly (4C) through a second thermally conductive plate (72), and a temperature of the heat emitted from at least one second electronic component (82) can be determined through an internal resistance value (e.g., RDC resistance value) included in the third speaker module.
  • an internal resistance value e.g., RDC resistance value
  • heat emitted from at least one second electronic component (82) is transferred to a fourth speaker module of a fourth speaker assembly (4D) through a second thermally conductive plate (72), and a temperature of the heat emitted from at least one second electronic component (82) can be determined through an internal resistance value (e.g., RDC resistance value) included in the fourth speaker module.
  • an internal resistance value e.g., RDC resistance value
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620), when executed by the processor (1610), may be configured such that the internal temperature of the electronic device (2) may additionally or alternatively be measured at a location other than the speaker module (e.g., an audio amplifier, a processor, components around the processor, a communication circuit, or components around the communication circuit).
  • the speaker module e.g., an audio amplifier, a processor, components around the processor, a communication circuit, or components around the communication circuit.
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured to, when executed by the processor (1610), cause the electronic device (2) to determine which speaker module among a plurality of speaker modules (e.g., the first speaker module (41) (see FIG. 8), the second speaker module, the third speaker module, and the fourth speaker module) to output (or reproduce) sound waves in an inaudible frequency band based on the internal temperature of the electronic device (2), the location where the internal temperature of the electronic device (2) is measured, and/or the magnitude of the internal temperature of the electronic device (2).
  • a plurality of speaker modules e.g., the first speaker module (41) (see FIG. 8), the second speaker module, the third speaker module, and the fourth speaker module
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured to, when executed by the processor (1610), determine how many speaker modules among a plurality of speaker modules (e.g., the first speaker module (41) (see FIG. 8), the second speaker module, the third speaker module, and the fourth speaker module) the electronic device (2) will reproduce (or output) sound waves in the inaudible frequency band based on the internal temperature of the electronic device (2), the location where the internal temperature of the electronic device (2) is measured, and/or the magnitude of the internal temperature of the electronic device (2).
  • a plurality of speaker modules e.g., the first speaker module (41) (see FIG. 8), the second speaker module, the third speaker module, and the fourth speaker module
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured, when executed by the processor (1610), to analyze frequency components of first audio data when first audio data including an audible frequency band is reproduced through the speaker module (1640), and to determine an input level for an input of a designated inaudible frequency band provided to the speaker module (1640) based at least on the analysis result.
  • the sound wave reproduction instructions (1622) for heat dissipation may be configured, when executed by the processor (1610), to determine a ratio (or distribution) of low-band components, mid-band components, and high-band components for the first audio data when the first audio data including an audible frequency band is reproduced through the speaker module (1640).
  • the first vibration of the speaker module (1640) according to the low-band component of the first audio data may have greater heat dissipation performance than the second vibration of the speaker module (1640) according to the mid-band component of the first audio data, and the third vibration of the speaker module (1640) according to the high-band component of the first audio data.
  • the second vibration of the speaker module (1640) according to the mid-band component of the first audio data may have greater heat dissipation performance than the third vibration of the speaker module (1640) according to the high-band component of the first audio data.
  • the input level for the input of a specified inaudible frequency band may be determined according to the ratio of components of different frequency bands (e.g., low-band components, mid-band components, and high-band components) included in the first audio data including the audible frequency band.
  • different frequency bands e.g., low-band components, mid-band components, and high-band components
  • a first weight (e.g., '1') may be applied to a low-band component of the first audio data
  • a second weight (e.g., '0.8') smaller than the first weight may be applied to a mid-band component of the first audio data
  • a third weight (e.g., '0.4') smaller than the second weight may be applied to a high-band component of the first audio data, thereby determining a heat dissipation performance value of the first audio data.
  • an input level for an input of a designated inaudible frequency band provided to the speaker module (1640) may be lowered.
  • an input level for an input of a designated inaudible frequency band provided to the speaker module (1640) may be increased.
  • the input level for a sound wave for heat dissipation based on a frequency component may improve heat dissipation efficiency as active heat dissipation depending on the situation.
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured, when executed by the processor (1610), to determine (or adjust) an input level for an input of a designated inaudible frequency band provided to the speaker module (1640) based at least on a reproduction volume (also referred to as an output volume) when first audio data including an audible frequency band is reproduced through the speaker module (1640). As the reproduction volume for the first audio data including an audible frequency band increases, frequency interference may be reduced when mixing the first audio data including an audible frequency band and second audio data of the designated inaudible frequency band.
  • the input level for an input of the designated inaudible frequency band provided to the speaker module (1640) may be increased.
  • the lower the playback volume of the first audio data including the audible frequency band the lower the input level for the input of the designated inaudible frequency band provided to the speaker module (1640).
  • the input level for the sound wave for heat dissipation based on the playback volume can improve heat dissipation efficiency as active heat dissipation depending on the situation.
  • the sound wave reproduction instruction (1622) for heat dissipation stored in the memory (1620) may be configured to use at least two or more of an input level for a sound wave for heat dissipation based on temperature, an input level for a sound wave for heat dissipation based on frequency components, and an input level for a sound wave for heat dissipation based on reproduction volume when executed by the processor (1610), and different weights may be applied to the at least two or more input levels.
  • a first weight may be applied to the input level for a sound wave for heat dissipation based on temperature
  • a second weight less than the first weight may be applied to the input level for a sound wave for heat dissipation based on frequency components.
  • a first weight may be applied to the input level for the sound wave for heat dissipation based on temperature
  • a third weight may be applied that is smaller than the first weight to the input level for the sound wave for heat dissipation based on playback volume
  • a first weight may be applied to the input level for the sound wave for heat dissipation based on temperature
  • a second weight may be applied that is smaller than the first weight to the input level for the sound wave for heat dissipation based on frequency components
  • a third weight may be applied that is smaller than the second weight to the input level for the sound wave for heat dissipation based on playback volume.
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured, when executed by the processor (1610), to use an input level for sound waves for heat dissipation based on temperature, and additionally use at least one of an input level for sound waves for heat dissipation based on frequency components and an input level for sound waves for heat dissipation based on reproduction volume. For example, when an input level for sound waves for heat dissipation based on temperature and an input level for sound waves for heat dissipation based on frequency components are used, a sum of the two input levels may be applied to heat dissipation without applying weights.
  • a sum of the two input levels may be applied to heat dissipation without applying weights. For example, if an input level for sound waves for heat dissipation based on temperature, an input level for sound waves for heat dissipation based on frequency components, and an input level for sound waves for heat dissipation based on playback volume are used, the sum of the three input levels can be applied to heat dissipation without applying weights.
  • the sound wave reproduction instruction (1622) for heat dissipation stored in the memory (1620) may be configured to, when executed by the processor (1610), check an audio output path and determine an input level for an input of a designated inaudible frequency band provided to the speaker module (1640) at least based on the audio output path.
  • the processor (1610) may check an audio output path through which audio data is output, for example, through a digital signal processor (DSP) (also referred to as an audio DSP) of an audio processing circuit (1630).
  • DSP digital signal processor
  • the audio output path may include, but is not limited to, a state in which audio output is set to an external electronic device (e.g., another electronic device (102), earphones, or headphones) connected to the electronic device (2) by wire or wirelessly, a state in which audio output is set to the speaker module (1640), or a state in which audio output is set to the speaker module (1640) when a designated application is executed.
  • an external electronic device e.g., another electronic device (102), earphones, or headphones
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured such that, when executed by the processor (1610), at least two or more of an input level for a sound wave for heat dissipation based on temperature, an input level for a sound wave for heat dissipation based on frequency components, and an input level for a sound wave for heat dissipation based on playback volume may be used depending on the audio output path, and different weights may be applied to the at least two or more input levels.
  • the sound wave reproduction instructions (1622) for heat dissipation stored in the memory (1620) may be configured such that, when executed by the processor (1610), at least two or more of an input level for a sound wave for heat dissipation based on temperature, an input level for a sound wave for heat dissipation based on frequency components, and an input level for a sound wave for heat dissipation based on playback volume may be used depending on the audio output path, and a sum of the at least two or more input levels may be applied without applying weights.
  • an audio output path is identified in which audio output is set to an external electronic device (e.g., earphones or headphones) connected wired or wirelessly to the electronic device (2)
  • an input level for sound waves for heat dissipation based on temperature can be applied to heat dissipation.
  • an input level for sound waves for heat dissipation based on temperature is used, and at least one of an input level for sound waves for heat dissipation based on a frequency component and an input level for sound waves for heat dissipation based on a playback volume may be additionally used.
  • an input level for a sound wave for heat dissipation based on temperature and an input level for a sound wave for heat dissipation based on playback volume may be used.
  • a first weight may be applied to the input level for the sound wave for heat dissipation based on temperature
  • a third weight may be applied to the input level for the sound wave for heat dissipation based on playback volume, which is smaller than the first weight.
  • a sum of the input level for the sound wave for heat dissipation based on temperature and the input level for the sound wave for heat dissipation based on playback volume may be applied to heat dissipation.
  • an input level for sound waves for heat dissipation based on temperature is used for heat dissipation, and a designated input level of a designated inaudible frequency band may be additionally configured to be used.
  • the designated input level may have, for example, an input level of about +3 dB (decibel).
  • a designated input level of a designated inaudible frequency band may be additionally used to secure heat dissipation performance that may be insufficient with only an input level for sound waves for heat dissipation based on temperature for heat dissipation.
  • FIG. 17 is a block diagram of a generative AI system according to various embodiments of the present disclosure.
  • the User Query/Response Interface (1710) can receive user input.
  • the user input may be in the form of natural language, images, and/or videos. Additionally, context information may also be transmitted when the user input is transmitted. Context information may include various additional information at the time of user input. For example, information on the application currently being used by the user or the user's location information.
  • the user input may be in a mixed form of the aforementioned natural language, images, sounds, and context information.
  • the user input may also be in a non-natural language form, such as selecting a menu.
  • the User Query/Response Interface (1710) can output the results of a generative AI system to the user.
  • the output may be in the form of natural language or specific content, and may also be provided in the form of an action requested by the user.
  • the User Query Interface (1710) can output the results of a generative AI system to the user.
  • the output may be in the form of natural language or specific content, and may also be provided in the form of an action requested by the user.
  • the AI framework (1720) can receive user input and coordinate and control each component necessary to perform the user's intention based on the user's query.
  • user input received at the User Query/Response Interface (1710) can be transmitted to a prompt design component (1730).
  • the prompt design component (1730) can be used to generate prompts suitable for inputting the user input into a large language model (LLM) or large multimodal models (LMM).
  • the prompt design component (1730) can be an AI component that uses a machine learning algorithm or a neural network to develop better prompts over time.
  • the prompt design component (1730) can access a knowledge component that includes user preference data, a prompt library, and prompt examples based on the user input to generate a prompt, and can pass the generated prompt to the LLM or LMM.
  • the API (application programming interface)/Plug-in management component (1740) may communicate with external information when there is a request for additional information when passing user input as input to a generative model.
  • the API/Plug-in management component (1740) may establish a channel for communicating with the outside of the AI Interface through the API, and may enable access to various data sources through the established channel.
  • the API/Plug-in management component (1740) may request an action through the API that ultimately performs the user input, rather than an intermediate result, when the action needs to be performed in the application or service. Information obtained from the outside may be used to generate a prompt in the Prompt design component (1730) together with the user input, or may be passed as an input to the generative model.
  • the Refiner component (not shown separately) can fine-tune the output from the generative model. For example, the Refiner component can verify that the content generated through the LLM and/or LMM is not irrelevant, does not contain biased content, or does not contain harmful content. Furthermore, the Refiner component can determine the degree to which the content matches the user's desired result and, if necessary, perform additional processing. The Refiner component can additionally configure and provide the user with hints to avoid undesired output.
  • the Generative AI Model (1750) may generally refer to an artificial intelligence neural network that generates new types of data based on user input information.
  • the Generative AI Model (1750) may include an image generating model and/or a language generating model.
  • Representative models for generating images include a generative adversarial network (GAN) and a variational autoencoder (VAE), and examples include a VAE and a Diffusion-based generative model using a Transformer structure.
  • GAN generative adversarial network
  • VAE variational autoencoder
  • a language generating model is a model trained to statistically output the most appropriate output based on input values, and representative examples include models such as CHAT-GPT 3 and CHAT-GPT 4.
  • FIG. 18 is a graph showing frequency characteristics of audio data for heat dissipation according to various embodiments of the present disclosure.
  • audio data in a designated frequency band for heat dissipation can be configured to have a first output level (1801) (e.g., about 10 dB), a second output level (1802) (e.g., about 5 dB), or a third output level (1803) (e.g., about 2 dB), as illustrated.
  • the frequency characteristics (e.g., output levels) of the audio data in the designated frequency band for heat dissipation are not limited to the illustrated examples. In addition to the three output levels, various other output levels may also exist.
  • audio data of a designated frequency band for heat dissipation may be stored in memory (1620) (see FIG. 16).
  • audio data of a designated frequency band for heat dissipation can be controlled and/or generated using a generator module included in the electronic device (2) or a generation type AI system (see FIG. 17) via a server (e.g., server (108) of FIG. 1).
  • a server e.g., server (108) of FIG. 1.
  • FIG. 19 illustrates an operation flow (1900) for heat dissipation of an electronic device (1600) according to various embodiments of the present disclosure.
  • the processor (1610) may check the temperature for the electronic device (1600) while playing the first audio data of the first frequency band through the speaker assembly (e.g., the first speaker assembly (4A) of FIG. 8) (or the speaker module (1640) of FIG. 16).
  • the speaker assembly e.g., the first speaker assembly (4A) of FIG. 8
  • the speaker module (1640) of FIG. 16 may check the temperature for the electronic device (1600) while playing the first audio data of the first frequency band through the speaker assembly (e.g., the first speaker assembly (4A) of FIG. 8) (or the speaker module (1640) of FIG. 16).
  • the temperature for the electronic device (1600) may include the internal temperature of the electronic device (1600), or a temperature measured inside the electronic device (1600). In various embodiments, the temperature for the electronic device (1600) may be a temperature due to heat emitted from at least one electronic component (e.g., the processor (1610)). In various embodiments, the temperature for the electronic device (1600) may be understood as a temperature measured directly from the heat emitted from the at least one electronic component, or an indirect measurement through at least one member through which the heat emitted from the at least one electronic component is transferred. In various embodiments, the temperature for the electronic device (1600) may be understood as a temperature for at least one heat-generating region (e.g., a hot spot or a hot spot region) of the electronic device (1600) that requires heat dissipation management.
  • a heat-generating region e.g., a hot spot or a hot spot region
  • the first frequency band may include, but is not limited to, an audible frequency band.
  • the processor (1610) may be configured to reproduce second audio data of a second frequency band through a speaker assembly (e.g., the first speaker assembly (4A) of FIG. 8) (or the speaker module (1640) of FIG. 16) based on a temperature of the electronic device (1600).
  • the second frequency band may be included in an inaudible frequency band.
  • the electronic device (1600) may be configured to measure a temperature inside the electronic device (2) during at least a portion of the time during which the electronic device (1600) executes an audio application and plays back first audio data through at least one first speaker assembly, and if the measured temperature corresponds to a specified condition (e.g., exceeds a temperature threshold value), play back second audio data in a frequency band of about 100 Hz or less by overlapping the first audio data through at least one first speaker assembly, or play back the second audio data through at least one other second speaker assembly.
  • a specified condition e.g., exceeds a temperature threshold value
  • FIG. 20 illustrates an operation flow (2000) for heat dissipation of an electronic device (1600) according to various embodiments of the present disclosure.
  • the operation flow (2000) for heat dissipation of Fig. 20 relates to the input level of sound waves for heat dissipation based on temperature.
  • the processor (1610) may check the temperature of the electronic device (1600).
  • the temperature of the electronic device (1600) may include the internal temperature of the electronic device (1600) or the temperature measured inside the electronic device (1600).
  • the temperature of the electronic device (1600) may be, for example, a temperature due to heat emitted from at least one electronic component (or a temperature of at least one electronic component).
  • the processor (1610) may check the temperature of heat emitted from the processor (1610) (i.e., the temperature of the processor (1610).
  • At least a portion of the heat emitted from the processor (1610) may be transferred to a speaker assembly (e.g., a first speaker assembly (4A) of FIG. 8) through a thermally conductive plate (e.g., a first thermally conductive plate (71) of FIG. 7), and the temperature of the processor (1610) may be determined based on an internal resistance value (e.g., an RDC resistance value) related to the temperature detected through an audio processing circuit (1630) electrically connected to the speaker module (1640).
  • the processor (1610) may be implemented to have a function of determining the temperature of the processor (1610).
  • the processor (1610) may determine an input level for a designated frequency band (e.g., an inaudible frequency band) for heat dissipation based on a temperature for the electronic device (1600).
  • the designated frequency band may be an inaudible frequency band. Table 1 shows, for example, values of input levels according to temperature, but is not limited thereto.
  • the processor (1610) may provide an input of a designated frequency band (e.g., an inaudible frequency band) to the speaker module (1640) (or speaker assembly) according to an input level. Sound waves of the designated frequency band for heat dissipation may be reproduced (or output) at an output level according to the input level.
  • a case where a large value of the input level is applied may increase the ratio (or distribution) of sound waves of the designated frequency band to more quickly dissipate heat emitted from at least one electronic component, compared to a case where a small value of the input level is applied.
  • At least one first electronic component (81) may be thermally connected to the first speaker assembly (4A) and/or the second speaker assembly (4B) via the first thermally conductive plate (71).
  • At least one second electronic component (82) e.g., charging module or charging IC
  • a first input level of an input of a designated frequency band (e.g., an inaudible frequency band) provided to the first speaker assembly (4A) and the second speaker assembly (4B) for heat dissipation may be set to be relatively greater than a second input level of an input of a designated frequency band (e.g., an inaudible frequency band) provided to the third speaker assembly (4C) and the fourth speaker assembly (4D) for heat dissipation.
  • the second input level of the input of the designated frequency band e.g., inaudible frequency band
  • the first input level of the input of the designated frequency band e.g., inaudible frequency band
  • FIG. 21 is a block diagram of a portion of an electronic device (1600) according to various embodiments of the present disclosure.
  • an electronic device (1600) may include an audio processing circuit (1630) and a speaker module (1640).
  • the audio processing circuit (1630) may include a DSP (2101) and an AMP (amplifier) (2102) electrically connected to the DSP (2101).
  • the AMP (2102) may be electrically connected to the speaker module (1640) via a first electrical path (2110).
  • the first electrical path (2110) may be an output line through which audio signals are transmitted from the DSP (2101) and the AMP (2102) to the speaker module (1640).
  • the AMP (2102) may be electrically connected to the first electrical path (2110) via a second electrical path (2120).
  • the second electrical path (2120) may be a feedback line.
  • heat emitted from at least one electronic component may be transferred to a speaker module (1640) (e.g., the first speaker module (41) of FIG. 8), and the DSP (2101) may detect an internal resistance value (e.g., an RDC resistance value) related to the temperature of the heat through the first electrical path (2110) and the second electrical path (2120).
  • the AMP (2102) may include a V/I sensing circuit configured to measure the internal resistance value (e.g., an RDC resistance value) related to the temperature. The internal resistance value may increase as the temperature of the heat emitted from the at least one electronic component increases.
  • the internal resistance value may decrease as the temperature of the heat emitted from the at least one electronic component decreases.
  • the temperature of heat emitted from at least one electronic component can be recognized by detecting the internal resistance value through the first electrical path (2110) and the second electrical path (2120).
  • FIG. 22 illustrates an operation flow (2200) for heat dissipation of an electronic device (1600) according to various embodiments of the present disclosure.
  • the operation flow (2200) of Fig. 22 relates to the input level of sound waves for heat dissipation based on frequency components.
  • the processor (1610) may analyze frequency components of audio data including a first frequency band reproduced through the speaker module (1640).
  • the first frequency band may be an audible frequency band.
  • the frequency components of the audio data including the first frequency band may be analyzed by applying at least one filter (referred to as a filter component).
  • the frequency components of the audio data including the first frequency band may be analyzed before reproduction.
  • the frequency components of the audio data including the first frequency band may be analyzed substantially in real time during reproduction.
  • Table 2 shows, for example, values of low-band reproduction volume corresponding to low-band components, values of mid-band reproduction volume corresponding to mid-band components, and values of high-band reproduction volume corresponding to high-band components, which are present in first audio data including a first frequency band (e.g., an audible frequency band).
  • Table 3 shows, for example, values of low-band reproduction volume corresponding to low-band components, values of mid-band reproduction volume corresponding to mid-band components, and values of high-band reproduction volume corresponding to high-band components, which are present in second audio data including a first frequency band (e.g., an audible frequency band).
  • the value of the low-band reproduction volume can be measured at, for example, about 800 Hz.
  • the value of the mid-band reproduction volume can be measured at, for example, about 3 kHz (kilohertz).
  • the value of the high-band reproduction volume can be measured at, for example, about 20 kHz.
  • the processor (1610) may determine an input level for a second frequency band for heat dissipation based on a frequency component.
  • the second frequency band may be an inaudible frequency band.
  • the processor (1610) may determine an input level for an input of the second frequency band (e.g., an inaudible frequency band) for heat dissipation provided to the speaker module (1640) based on a ratio of a low-band component, a mid-band component, and a high-band component from an analysis result of frequency components for audio data including a first frequency band (e.g., an audible frequency band).
  • a first frequency band e.g., an audible frequency band
  • the first vibration of the speaker module (1640) according to the low-band component of audio data including the first frequency band may have greater heat dissipation performance than the second vibration of the speaker module (1640) according to the mid-band component of audio data including the first frequency band, and the third vibration of the speaker module (1640) according to the high-band component of audio data including the first frequency band.
  • the second vibration of the speaker module (1640) according to the mid-band component of audio data including the first frequency band may have greater heat dissipation performance than the third vibration of the speaker module (1640) according to the high-band component of audio data including the first frequency band.
  • the input level for the input of the second frequency band may be determined according to the ratio of the low-band component, the mid-band component, and the high-band component included in the audio data including the first frequency band.
  • the value of the input level for the input of the second frequency band for heat dissipation provided to the speaker module (1640) may be determined based on a loudness score according to the following mathematical expression 1.
  • a first weight (e.g., '1') may be applied to a value of a low-band reproduction volume of audio data including a first frequency band (e.g., an audible frequency band).
  • a second weight (e.g., '0.8') smaller than the first weight may be applied to a value of a mid-band reproduction volume of audio data including the first frequency band.
  • a third weight (e.g., '0.4') smaller than the second weight may be applied to a value of a high-band reproduction volume of audio data including the first frequency band.
  • a loudness score calculated according to Equation 1 may represent a heat dissipation performance value for audio data including the first frequency band.
  • Audio data including a first frequency band having a high loudness score may have a larger heat dissipation performance value than audio data including a first frequency band having a low loudness score.
  • the first audio data including the first frequency band of Table 2 may have a loudness score of about 4947.4, and the second audio data including the first frequency band of Table 3 may have a loudness score of about 5151.5.
  • the audio data including the first frequency band may be determined to have a predominant low-band component.
  • the audio data including the first frequency band when the loudness score of the audio data including the first frequency band is 5000 or greater, the audio data including the first frequency band may be determined to have a predominant mid-band characteristic and/or a predominant high-band characteristic. In various embodiments, based on the loudness score, the first audio data including the first frequency band may have a lower heat dissipation performance value than the second audio data including the first frequency band.
  • an input level value of an input of a second frequency band e.g., an inaudible frequency band for heat dissipation may be applied to be greater than when reproducing second audio data including the first frequency band.
  • an input level value of an input of a second frequency band for heat dissipation may be applied to be greater than when reproducing second audio data including the first frequency band. This may be because the ratio (or distribution) of sound waves of the second frequency band is increased to compensate for the reduced heat dissipation performance compared to when reproducing second audio data including the first frequency band.
  • a frequency band when a sound source (e.g., audio data or an audio file) is played, a frequency band may be output differently for each section.
  • the sound wave playback instruction (1622) for heat dissipation (see FIG. 16) stored in the memory (1620) may be configured, when executed by the processor (1610), to cause the electronic device (1600) to analyze the frequency components for each section and, in a section where the output of the low-band component is lowered below a threshold value, to supplement the low-band component so that the loudness score can be maintained above a certain value.
  • the processor (1610) may provide an input of a second frequency band (e.g., an inaudible frequency band) to the speaker module (1640) according to an input level. Sound waves of a designated frequency band for heat dissipation may be reproduced (or output) at an output level according to the input level.
  • a second frequency band e.g., an inaudible frequency band
  • FIG. 23 illustrates an operation flow (2300) for heat dissipation of an electronic device (1600) according to various embodiments of the present disclosure.
  • the operation flow (2300) for heat dissipation of Fig. 23 relates to the input level of sound waves for heat dissipation based on the playback volume.
  • the processor (1610) may determine a playback volume (also referred to as output volume) for audio data including a first frequency band played through the speaker module (1640).
  • the first frequency band may be an audible frequency band.
  • the processor (1610) may determine an input level for a second frequency band for heat dissipation based on a playback volume.
  • the second frequency band may be an inaudible frequency band.
  • frequency interference for mixing may be reduced when the first audio data including the first frequency band and the second audio data of the second frequency band are played back through the speaker module (1640).
  • the input level for the input of the second frequency band provided to the speaker module (1640) may be set relatively higher.
  • the input level for the input of the second frequency band provided to the speaker module (1640) may be set relatively lower.
  • the processor (1610) may provide an input of a second frequency band (e.g., an inaudible frequency band) to the speaker module (1640) according to an input level. Sound waves of a designated frequency band for heat dissipation may be reproduced (or output) at an output level according to the input level.
  • a second frequency band e.g., an inaudible frequency band
  • an input level for sound waves for heat dissipation based on temperature may be used, and at least one of an input level for sound waves for heat dissipation based on frequency components and an input level for sound waves for heat dissipation based on playback volume may additionally be used.
  • Different weights may be applied to at least two or more input levels.
  • a first weight may be applied to the input level for sound waves for heat dissipation based on temperature
  • a second weight less than the first weight may be applied to the input level for sound waves for heat dissipation based on frequency components.
  • a first weight may be applied to the input level for the sound wave for heat dissipation based on temperature
  • a third weight may be applied that is smaller than the first weight to the input level for the sound wave for heat dissipation based on playback volume
  • a first weight may be applied to the input level for the sound wave for heat dissipation based on temperature
  • a second weight may be applied that is smaller than the first weight to the input level for the sound wave for heat dissipation based on frequency components
  • a third weight may be applied that is smaller than the second weight to the input level for the sound wave for heat dissipation based on playback volume.
  • an input level for a sound wave for heat dissipation based on temperature may be used, and at least one of an input level for a sound wave for heat dissipation based on frequency components and an input level for a sound wave for heat dissipation based on playback volume may additionally be used.
  • a sum of at least two input levels may be applied to heat dissipation without weighting.
  • a sum of the two input levels may be applied to heat dissipation without weighting.
  • a sum of the two input levels may be applied to heat dissipation without weighting.
  • an input level for sound waves for heat dissipation based on temperature an input level for sound waves for heat dissipation based on frequency components, and an input level for sound waves for heat dissipation based on playback volume are used, the sum of the three input levels can be applied to heat dissipation without applying weights.
  • Table 4 shows, but is not limited to, values of input levels when input levels for sound waves for heat dissipation based on temperature and input levels for sound waves for heat dissipation based on playback volume are used.
  • Playback volume level W1 The value of the input level for the sound wave for heat dissipation based on temperature.
  • the temperature of the electronic device (1600) e.g., the internal temperature of the electronic device (1600) or the temperature measured inside the electronic device (1600
  • the playback volume of the first audio data e.g., audio data including an audible frequency band
  • the AI model may include a machine learning model trained to determine the input level value, the output level value and/or the frequency band of the second audio data based on the audio data including the first audio data and/or the second audio data and a temperature threshold value allowed in the electronic device.
  • FIG. 24 is a graph (2401) showing performance when first audio data including an audible frequency band is played back through a speaker module (1640) (see FIG. 16) mixed with second audio data of a designated inaudible frequency band for heat dissipation, according to various embodiments of the present disclosure, and a graph (2402) showing performance when first audio data is played back through the speaker module (1640) without mixing of the second audio data of the designated inaudible frequency band.
  • the output of a designated inaudible frequency band that is difficult for a user to perceive with hearing may increase due to mixing of second audio data of a designated inaudible frequency band for heat dissipation.
  • FIG. 25 illustrates heat maps of an electronic device (2500) according to various embodiments of the present disclosure.
  • a first example illustrates a heat map of an electronic device (2500) while generating heat from at least one electronic component and reproducing audio data including an audible frequency band.
  • a second example (2520) illustrates a heat map of an electronic device (2500) while mixing low-band audio data for heat dissipation while generating heat from at least one electronic component and reproducing audio data including an audible frequency band.
  • a third example (2530) illustrates a heat map of an electronic device (2500) while mixing mid-band audio data for heat dissipation while generating heat from at least one electronic component and reproducing audio data including an audible frequency band.
  • a fourth example (2540) illustrates a heat map of an electronic device (2500) when mixing high-band audio data for heat dissipation while playing audio data including an audible frequency band and emitting heat from at least one electronic component.
  • 2550 indicates a heat generating area corresponding to at least one electronic component.
  • the heat generating area (2550) may have a temperature of about 49.7°C.
  • the heat generating area (2550) may have a temperature of about 49.2°C.
  • the heat generating area (2550) may have a temperature of about 49.4°C.
  • the heat generating area (2550) may have a temperature of about 49.5°C.
  • the second example (2520), the third example (2530), and the fourth example (2540) configured to mix additional audio data for heat dissipation may have relatively improved heat dissipation performance compared to the first example (2510).
  • the second example (2520) configured to mix low-band audio data for heat dissipation may have relatively improved heat dissipation performance compared to the third example (2530) configured to mix mid-band audio data for heat dissipation and the fourth example (2540) configured to mix high-band audio data for heat dissipation.
  • the third example (2530) configured to mix mid-band audio data for heat dissipation may have relatively improved heat dissipation performance compared to the fourth example (2540) configured to mix high-band audio data for heat dissipation.
  • Mixing low-band audio data for heat dissipation may cause vibration of the speaker module (1640), which may have relatively higher heat dissipation performance compared to mixing mid-band audio data for heat dissipation and mixing high-band audio data for heat dissipation.
  • audio data of a designated inaudible frequency band reproduced through a speaker module (1640) for heat dissipation may be included in the low band.
  • the sound source e.g., first audio data
  • the sound source may be played through another speaker assembly that is separate from the electronic component instead of the speaker assembly that is thermally connected to the electronic component
  • second audio data for heat dissipation e.g., audio data in an inaudible frequency band
  • the technical features of the present disclosure may be applied to electronic devices of other external shapes (e.g., a bar type electronic device, a foldable electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device) that are not limited to a plate type electronic device (2).
  • the technical features of the present disclosure may be applied to a laptop (also referred to as a laptop computer) (e.g., a laptop-type foldable electronic device).
  • the technical features of the present disclosure may be applied to an electronic device including a flexible display.
  • a foldable electronic device, a slidable electronic device, a stretchable electronic device, or a rollable electronic device may include a flexible display configured to be bent and arranged according to a deformation state of the electronic device.
  • the technical features of the present disclosure may be applied to wearable electronic devices.
  • the types of electronic devices that incorporate the technical features of the present disclosure may also vary.
  • an electronic device including the technical features of the present disclosure may include a first housing and a second housing.
  • the first housing and the second housing may be rotatably connected via a hinge portion (also referred to as a hinge assembly) including at least one hinge.
  • a hinge portion also referred to as a hinge assembly
  • the first housing and the second housing may be arranged to be slidable relative to each other.
  • One of a plurality of speaker assemblies e.g., the first speaker assembly (4A), the second speaker assembly (4B), the third speaker assembly (4C), and the fourth speaker assembly (4D) of FIG. 7 may be positioned in the first housing, and another of the plurality of speaker assemblies may be positioned in the second housing.
  • an electronic device may include a housing (e.g., housing (20)), a first speaker assembly (e.g., first speaker module (4A)), a thermally conductive plate (e.g., first thermally conductive plate (71)), at least one processor (e.g., processor (1610)), and a memory (e.g., memory (1620)).
  • the housing e.g., housing (20)
  • the first speaker assembly (e.g., first speaker assembly (4A)) may be disposed within the housing (e.g., housing (20)) corresponding to the first speaker hole (e.g., first speaker hole (SH1)).
  • the thermally conductive plate may be configured to overlap with at least one processor and the first speaker assembly (e.g., first speaker assembly (4A)).
  • a memory may store instructions that, when executed by at least one processor, cause the electronic device (e.g., electronic device (2)) to check a temperature for the electronic device (e.g., electronic device (2)) while the electronic device plays first audio data of a first frequency band through a first speaker assembly (e.g., first speaker assembly (4A)), and to play second audio data of a second frequency band through the first speaker assembly (e.g., first speaker assembly (4A)) based on the temperature for the electronic device (e.g., electronic device (2)).
  • a first speaker assembly e.g., first speaker assembly (4A)
  • second audio data of a second frequency band e.g., first speaker assembly (4A)
  • an electronic device e.g., electronic device (2)
  • an output level of second audio data is determined based on a temperature of the electronic device (e.g., electronic device (2)).
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to reproduce second audio data through a first speaker assembly (e.g., first speaker assembly (4A)) further based on a frequency component of the first audio data.
  • processor e.g., processor (1610)
  • the second audio data may not include the first frequency band.
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to reproduce second audio data through a first speaker assembly (e.g., first speaker assembly (4A)) further based on a reproduction volume of first audio data.
  • processor e.g., processor (1610)
  • the second frequency band may be set to lower the temperature of the electronic device (2) when played back through the first speaker assembly (4A).
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to play second audio data through a first speaker assembly (e.g., first speaker assembly (4A)) based on a state in which audio output is set to an external electronic device (e.g., earphones or headphones) connected to the electronic device (e.g., electronic device (2)) by wire or wirelessly.
  • processor e.g., processor (1610)
  • an electronic device e.g., electronic device (2)
  • a first speaker assembly e.g., first speaker assembly (4A)
  • an electronic device e.g., electronic device (2)
  • an internal resistance value e.g., RDC resistance value
  • a housing may form at least a portion of a front side (e.g., front side (20A)) of an electronic device (e.g., electronic device (2)), a rear side (e.g., rear side (20B)) of an electronic device (e.g., electronic device (2)), and a side side (e.g., side side (20C)) of an electronic device (e.g., electronic device (2)).
  • a first speaker assembly e.g., first speaker assembly (4A)
  • a speaker housing may include a metal plate (e.g., a second metal plate (52).
  • the metal plate e.g., the second metal plate (52)
  • the metal plate may be positioned between a rear surface (e.g., the rear surface (20B)) of an electronic device (e.g., an electronic device (2)) and a speaker (e.g., a first speaker (411)).
  • a thermally conductive plate (e.g., a first thermally conductive plate (71)) may overlap a metal plate (e.g., a second metal plate (52)) of a first speaker assembly (e.g., a first speaker assembly (4A)) in a direction perpendicular to the rear surface (e.g., the rear surface (20B)) of the electronic device (e.g., an electronic device (2)).
  • the metal plate (e.g., the second metal plate (52)) may form a part of a sound wave passage (e.g., a sound wave passage (901)) of the first speaker assembly (e.g., the first speaker assembly (4A)).
  • the electronic device may further include a thermally conductive material (e.g., a first thermally conductive layer (57)) disposed between a thermally conductive plate (e.g., a first thermally conductive plate (71)) and a metal plate (e.g., a second metal plate (52)).
  • a thermally conductive material e.g., a first thermally conductive layer (57)
  • a thermally conductive plate e.g., a first thermally conductive plate (71)
  • a metal plate e.g., a second metal plate (52)
  • a thermally conductive plate (e.g., a first thermally conductive plate (71)) may be connected to another thermally conductive plate (e.g., a thermally conductive plate (1000)) to enable heat transfer.
  • the other thermally conductive plate (e.g., the thermally conductive plate (1000)) may include a first portion (e.g., a first portion (1010)) positioned at least partially between a rear surface (e.g., a rear surface (20B)) of an electronic device (e.g., an electronic device (2)) and a metal plate (e.g., a second metal plate (52)).
  • thermally conductive plate may extend into the first portion (e.g., first portion (1010)) and be positioned in the first speaker hole (e.g., first speaker hole (SH1)), and may include a second portion (e.g., second portion (1020)) including a plurality of holes.
  • an electronic device may further include a second speaker assembly (e.g., second speaker assembly (4B)) disposed within a housing (e.g., housing (20)) corresponding to a second speaker hole (e.g., second speaker hole (SH2)) of the housing (e.g., housing (20)).
  • a thermally conductive plate e.g., first thermally conductive plate (71)
  • a memory may store instructions that, when executed by a processor (e.g., processor (1610)), cause the electronic device (e.g., electronic device (2)) to reproduce second audio data through the second speaker assembly (e.g., second speaker assembly (4B)).
  • a processor e.g., processor (1610)
  • the electronic device e.g., electronic device (2)
  • the second speaker assembly e.g., second speaker assembly (4B)
  • the second audio data may have a frequency of 70 Hz (hertz), or a frequency less than 70 Hz.
  • an electronic device may include a housing (e.g., housing (20)), a speaker assembly (e.g., first speaker assembly (4A)), a printed circuit board (e.g., printed circuit board (80)), a thermally conductive plate (e.g., first thermally conductive plate (71)), a processor (e.g., processor (1610)), and a memory (e.g., memory (1620)).
  • a housing e.g., housing (20)
  • a speaker assembly e.g., first speaker assembly (4A)
  • a printed circuit board e.g., printed circuit board (80)
  • a thermally conductive plate e.g., first thermally conductive plate (71)
  • a processor e.g., processor (1610)
  • a memory e.g., memory (1620
  • the housing may form at least a portion of a front side (e.g., front side (20A)) of the electronic device (e.g., electronic device (2)), a rear side (e.g., rear side (20B)) of the electronic device (e.g., electronic device (2)), and a side side (e.g., side side (20C)) of the electronic device (e.g., electronic device (2)), and may include a speaker hole (e.g., first speaker hole (SH1)).
  • a speaker assembly e.g., a first speaker assembly (4A)
  • a housing e.g., a housing (20)
  • a speaker hole e.g., a first speaker hole (SH1)
  • the speaker assembly may include a speaker housing (e.g., a first speaker housing (42)) and a speaker (e.g., a first speaker (411)) positioned within the speaker housing (e.g., the first speaker housing (42)).
  • the speaker housing e.g., the first speaker housing (42)
  • the speaker housing may include a metal plate (e.g., a second metal plate (52)).
  • the metal plate e.g., the second metal plate (52)
  • the metal plate may be positioned between a rear surface (e.g., the rear surface (20B)) of an electronic device (e.g., the electronic device (2)) and a speaker (e.g., the first speaker (411)).
  • a metal plate (e.g., a second metal plate (52)) may form a part of a sound wave passage (e.g., a sound wave passage (901)) of a speaker assembly (e.g., a first speaker assembly (4A)).
  • a printed circuit board (e.g., a printed circuit board (80)) may be disposed within a housing (e.g., a housing (20)), and a plurality of electronic components may be disposed on the printed circuit board (e.g., a printed circuit board (80)).
  • the thermally conductive plate may be configured to overlap the printed circuit board (e.g., a printed circuit board (80)) and the metal plate (e.g., a second metal plate (52)) of the speaker assembly (e.g., the first speaker assembly (4A)).
  • the printed circuit board e.g., a printed circuit board (80)
  • the metal plate e.g., a second metal plate (52)
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to determine a temperature for an electronic device (e.g., electronic device (2)) that reproduces first audio data of a first frequency band through a speaker assembly (e.g., first speaker assembly (4A)), and reproduce second audio data of a second frequency band through the speaker assembly based on the temperature for the electronic device (e.g., electronic device (2)).
  • processor e.g., processor (1610)
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to reproduce second audio data through a speaker assembly (e.g., first speaker assembly (4A)) further based on a frequency component of the first audio data.
  • processor e.g., processor (1610)
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to reproduce second audio data through a speaker assembly (e.g., first speaker assembly (4A)) further based on a reproduction volume of first audio data.
  • processor e.g., processor (1610)
  • a memory may store instructions that, when executed by at least one processor (e.g., processor (1610)), cause an electronic device (e.g., electronic device (2)) to play second audio data through a speaker assembly (e.g., first speaker assembly (4A)) based on a state in which audio output is set to an external electronic device (e.g., earphones or headphones) connected to the electronic device (e.g., electronic device (2)) by wire or wirelessly.
  • processor e.g., processor (1610)
  • an electronic device e.g., electronic device (2)
  • a speaker assembly e.g., first speaker assembly (4A)
  • a method of operating an electronic device may be provided.
  • the electronic device e.g., an electronic device (2)
  • the electronic device includes at least one electronic component (e.g., at least one first electronic component (81)) arranged on a PCB, a speaker assembly (e.g., a first speaker assembly (4A)) electrically connected to the PCB, and a thermally conductive member (e.g., a thermally conductive plate (71)) connecting the at least one electronic component and the speaker assembly.
  • at least one electronic component e.g., at least one first electronic component (81)
  • a speaker assembly e.g., a first speaker assembly (4A)
  • a thermally conductive member e.g., a thermally conductive plate (71)
  • the method of operating the electronic device may include an operation of checking an internal temperature of the electronic device (e.g., an electronic device (2)) while playing back first audio data of a first frequency band through the speaker assembly (e.g., the first speaker assembly (4A)).
  • the method of operating the electronic device may include an operation of playing back second audio data of a second frequency band through the speaker assembly based on the internal temperature of the electronic device (e.g., an electronic device (2)).
  • the second audio data may not include a first frequency band.
  • a method of operating an electronic device may further include an operation of playing back second audio data through a speaker assembly (e.g., first speaker assembly (4A)) based on a frequency component of the first audio data.
  • a speaker assembly e.g., first speaker assembly (4A)
  • a method of operating an electronic device may further include an operation of playing back second audio data through a speaker assembly (e.g., first speaker assembly (4A)) based on a playback volume of first audio data.
  • a speaker assembly e.g., first speaker assembly (4A)
  • a second frequency band may be set such that the temperature of the electronic device (e.g., electronic device (2)) is lowered when played back through a speaker assembly (e.g., first speaker assembly (4A)).
  • a speaker assembly e.g., first speaker assembly (4A)
  • the first frequency band may be an audible frequency band
  • the second frequency band may be an inaudible frequency band

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Function (AREA)

Abstract

Selon divers modes de réalisation, la présente divulgation concerne un dispositif électronique. Le dispositif électronique comprend : un boîtier comprenant un premier trou pour haut-parleur ; un premier ensemble haut-parleur disposé dans le boîtier pour correspondre au premier trou pour haut-parleur ; une plaque thermoconductrice configurée pour recouvrir en partie au moins un processeur et le premier ensemble haut-parleur ; et une mémoire, la mémoire stockant des instructions qui, lorsqu'elles sont exécutées par le ou les processeurs, amènent le dispositif électronique à : identifier la température du dispositif électronique lorsque le premier ensemble haut-parleur reproduit les premières données audio dans une première bande de fréquences ; et reproduire des secondes données audio dans une seconde bande de fréquences par le premier ensemble haut-parleur sur la base de la température du dispositif électronique.
PCT/KR2025/007475 2024-05-30 2025-05-30 Dispositif électronique comprenant un ensemble haut-parleur et procédé de dissipation de chaleur associé Pending WO2025249965A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20240070915 2024-05-30
KR10-2024-0070915 2024-05-30
KR1020240115274A KR20250172276A (ko) 2024-05-30 2024-08-27 스피커 어셈블리를 포함하는 전자 장치 및 그 방열 방법
KR10-2024-0115274 2024-08-27

Publications (1)

Publication Number Publication Date
WO2025249965A1 true WO2025249965A1 (fr) 2025-12-04

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Application Number Title Priority Date Filing Date
PCT/KR2025/007475 Pending WO2025249965A1 (fr) 2024-05-30 2025-05-30 Dispositif électronique comprenant un ensemble haut-parleur et procédé de dissipation de chaleur associé

Country Status (1)

Country Link
WO (1) WO2025249965A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100656660B1 (ko) * 2005-12-20 2006-12-11 주식회사 팬택 듀얼 스피커 모듈의 구조
KR100881341B1 (ko) * 2006-12-20 2009-02-02 삼성테크윈 주식회사 전자기기의 방열구조
JP2009239518A (ja) * 2008-03-26 2009-10-15 Quantum 14:Kk デジタル・スピーカー
US9014384B2 (en) * 2010-02-10 2015-04-21 Nxp B.V. System and method for adapting a loudspeaker signal
KR20190096593A (ko) * 2018-02-09 2019-08-20 삼성전자주식회사 방열 구조 및 이를 포함하는 전자 장치
KR102435292B1 (ko) * 2015-02-27 2022-08-23 삼성전자주식회사 오디오를 출력하는 방법 및 이를 위한 전자 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100656660B1 (ko) * 2005-12-20 2006-12-11 주식회사 팬택 듀얼 스피커 모듈의 구조
KR100881341B1 (ko) * 2006-12-20 2009-02-02 삼성테크윈 주식회사 전자기기의 방열구조
JP2009239518A (ja) * 2008-03-26 2009-10-15 Quantum 14:Kk デジタル・スピーカー
US9014384B2 (en) * 2010-02-10 2015-04-21 Nxp B.V. System and method for adapting a loudspeaker signal
KR102435292B1 (ko) * 2015-02-27 2022-08-23 삼성전자주식회사 오디오를 출력하는 방법 및 이를 위한 전자 장치
KR20190096593A (ko) * 2018-02-09 2019-08-20 삼성전자주식회사 방열 구조 및 이를 포함하는 전자 장치

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