ZA96543B - A method for mounting an electronic module in a card body - Google Patents

A method for mounting an electronic module in a card body

Info

Publication number
ZA96543B
ZA96543B ZA96543A ZA96543A ZA96543B ZA 96543 B ZA96543 B ZA 96543B ZA 96543 A ZA96543 A ZA 96543A ZA 96543 A ZA96543 A ZA 96543A ZA 96543 B ZA96543 B ZA 96543B
Authority
ZA
South Africa
Prior art keywords
module
mounting
electronic module
card body
recess
Prior art date
Application number
ZA96543A
Other languages
English (en)
Inventor
Thomas Tarantino
Original Assignee
Giesecke & Devrient Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7752376&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ZA96543(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Giesecke & Devrient Gmbh filed Critical Giesecke & Devrient Gmbh
Publication of ZA96543B publication Critical patent/ZA96543B/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
ZA96543A 1995-01-26 1996-01-26 A method for mounting an electronic module in a card body ZA96543B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19502398A DE19502398A1 (de) 1995-01-26 1995-01-26 Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper

Publications (1)

Publication Number Publication Date
ZA96543B true ZA96543B (en) 1996-08-15

Family

ID=7752376

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA96543A ZA96543B (en) 1995-01-26 1996-01-26 A method for mounting an electronic module in a card body

Country Status (9)

Country Link
US (1) US5951810A (fr)
EP (1) EP0724228B2 (fr)
JP (1) JPH08258471A (fr)
AT (1) ATE237168T1 (fr)
DE (2) DE19502398A1 (fr)
DK (1) DK0724228T3 (fr)
ES (1) ES2192210T5 (fr)
PT (1) PT724228E (fr)
ZA (1) ZA96543B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19637213C1 (de) * 1996-08-22 1998-02-19 Pav Card Gmbh Verfahren und Fügewerkzeug zum Herstellen einer Chipkarte
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
FR2794552B1 (fr) * 1999-06-03 2001-08-31 Gemplus Card Int Procede de collage a chaud d'un module electronique dans une carte a puce
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
US20040144472A1 (en) * 2003-01-24 2004-07-29 G & D Cardtech, Inc. Process for manufacturing laminated plastic products
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
DE102004041035B4 (de) * 2004-04-14 2010-04-29 Steinhauser, Jürgen Verfahren zum Befestigen von Bauteilen auf einem Substrat
US20060146271A1 (en) * 2005-01-04 2006-07-06 Pennaz Thomas J Universal display module
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
US7821794B2 (en) * 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
DE102018112476B4 (de) 2017-06-02 2022-01-27 Ulrich Lang Verfahren und Fertigungsanlage zum Herstellen eines Foliensubstrats
WO2019224364A1 (fr) 2018-05-24 2019-11-28 Ulrich Lang Procédé et système de production pour produire un substrat de film

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3166462A (en) * 1961-11-01 1965-01-19 Fr Hesser Maschinenfabrik Ag F Method and apparatus for heat sealing packages
US3600248A (en) * 1966-07-13 1971-08-17 Mojonnier Inc Albert Method for heat sealing thermoplastic bodies
US3692608A (en) * 1971-01-20 1972-09-19 Nasco Ind Inc Sealing means and method
US3951713A (en) * 1973-12-19 1976-04-20 Fortin Laminating Corporation Method and apparatus for insulating electrically conductive elements
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
US4543147A (en) * 1984-08-20 1985-09-24 Tetrahedron Associates, Inc. Laminating process and apparatus
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6433749A (en) * 1987-07-30 1989-02-03 Toshiba Corp Manufacture for tracking channel of optical recording card
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5145548A (en) * 1989-09-16 1992-09-08 Natec Incorporated Laminating device for use in laminating a continuous id card material
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.

Also Published As

Publication number Publication date
JPH08258471A (ja) 1996-10-08
ES2192210T3 (es) 2003-10-01
ATE237168T1 (de) 2003-04-15
EP0724228B1 (fr) 2003-04-09
EP0724228A3 (fr) 1998-01-07
PT724228E (pt) 2003-08-29
ES2192210T5 (es) 2006-07-16
EP0724228A2 (fr) 1996-07-31
DK0724228T3 (da) 2003-09-01
DE59610318D1 (de) 2003-05-15
DE19502398A1 (de) 1996-08-01
EP0724228B2 (fr) 2006-04-05
US5951810A (en) 1999-09-14

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