DK0791446T3 - Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme - Google Patents

Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme

Info

Publication number
DK0791446T3
DK0791446T3 DK97102511T DK97102511T DK0791446T3 DK 0791446 T3 DK0791446 T3 DK 0791446T3 DK 97102511 T DK97102511 T DK 97102511T DK 97102511 T DK97102511 T DK 97102511T DK 0791446 T3 DK0791446 T3 DK 0791446T3
Authority
DK
Denmark
Prior art keywords
component
making
injection mold
plastic injection
composite body
Prior art date
Application number
DK97102511T
Other languages
English (en)
Inventor
Richard Herbst
Original Assignee
Richard Herbst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richard Herbst filed Critical Richard Herbst
Application granted granted Critical
Publication of DK0791446T3 publication Critical patent/DK0791446T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
DK97102511T 1996-02-26 1997-02-17 Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme DK0791446T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19607212A DE19607212C1 (de) 1996-02-26 1996-02-26 Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen

Publications (1)

Publication Number Publication Date
DK0791446T3 true DK0791446T3 (da) 2002-03-18

Family

ID=7786491

Family Applications (1)

Application Number Title Priority Date Filing Date
DK97102511T DK0791446T3 (da) 1996-02-26 1997-02-17 Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme

Country Status (6)

Country Link
US (1) US5913110A (da)
EP (1) EP0791446B1 (da)
JP (1) JP3058405B2 (da)
AT (1) ATE210543T1 (da)
DE (2) DE19607212C1 (da)
DK (1) DK0791446T3 (da)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07112349B2 (ja) * 1987-02-16 1995-11-29 株式会社電設 全波出力型ホワ−ドコンバ−タ
DE19615980C2 (de) * 1996-04-22 1999-02-04 Fraunhofer Ges Forschung Datenträgerkarte mit einem Kartenzwischenerzeugnis
DE29717395U1 (de) * 1997-09-29 1998-10-29 Siemens AG, 80333 München Chipkarte mit Sensor zur Erfassung physikalischer Meßgrößen
FR2786317B1 (fr) * 1998-11-24 2002-12-27 Gemplus Card Int Procede de fabrication de carte a puce a contact affleurant utilisant une etape de gravure au laser et carte a puce obtenue par le procede
US6194249B1 (en) * 1999-11-01 2001-02-27 Taiwan Semiconductor Manufacturing Company Method of assembly stress protection
FR2801709B1 (fr) 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
FR2809228B1 (fr) * 2000-05-22 2003-10-17 St Microelectronics Sa Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique
CN1498417A (zh) 2000-09-19 2004-05-19 ����ŵ����Ƥ 用于在无线频率识别装置中装配元件和天线的方法
AU3409702A (en) * 2000-10-24 2002-05-06 Nanopierce Technologies Inc Method and materials for printing particle-enhanced electrical contacts
AUPR245201A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus and method (WSM05)
US7142909B2 (en) * 2002-04-11 2006-11-28 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
DE20308813U1 (de) * 2003-06-05 2004-10-14 Harting Electro-Optics Gmbh & Co. Kg Schlüssel für ein Schließsystem
US20070040686A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
US20070040688A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
US8695207B2 (en) * 2008-06-02 2014-04-15 Nxp B.V. Method for manufacturing an electronic device
DE102015100208A1 (de) * 2015-01-09 2016-07-14 Leonhard Kurz Stiftung & Co. Kg Verfahren zur Herstellung eines Verbundartikels sowie ein Verbundartikel
DE102017106521A1 (de) 2017-03-27 2018-09-27 Schmidt & Heinzmann Gmbh & Co. Kg Formwerkzeug

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
IT1212711B (it) * 1983-03-09 1989-11-30 Ates Componenti Elettron Dispositivo a semiconduttore aforma di scheda piana con contatti elettrici su ambedue le facce eprocedimento per la sua fabbricazione.
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
GB2142478A (en) * 1983-07-01 1985-01-16 Welwyn Electronics Ltd Printed circuit boards
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
JPH01157541A (ja) * 1987-09-04 1989-06-20 Mitsubishi Electric Corp 半導体装置
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
JPH02102098A (ja) * 1988-10-11 1990-04-13 Matsushita Electric Ind Co Ltd 集積回路装置およびｉｃカード
JP2907914B2 (ja) * 1989-01-16 1999-06-21 シーメンス、アクチエンゲゼルシヤフト 電気又は電子デバイス又はモジユールの封止方法とパツケージ
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
US5417905A (en) * 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
JPH031992A (ja) * 1989-05-30 1991-01-08 Asahi Chem Ind Co Ltd Ｉｃカードおよびｉｃカード製造方法
DE3917707A1 (de) * 1989-05-31 1990-12-06 Siemens Ag Elektronisches modul und verfahren zu seiner herstellung
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
KR100199261B1 (ko) * 1990-04-27 1999-06-15 가나이 쓰도무 반도체장치 및 그 제조방법 그리고 그것에 사용되는 성형장치
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
DE9100665U1 (de) * 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
EP0649719B1 (de) * 1993-10-26 1997-10-01 Siemens Aktiengesellschaft Verfahren zur Herstellung von Chipkarten mittels Spritzgiessen
US5616958A (en) * 1995-01-25 1997-04-01 International Business Machines Corporation Electronic package

Also Published As

Publication number Publication date
DE19607212C1 (de) 1997-04-10
US5913110A (en) 1999-06-15
DE59705720D1 (de) 2002-01-24
JP3058405B2 (ja) 2000-07-04
EP0791446A2 (de) 1997-08-27
EP0791446A3 (de) 1998-12-16
ATE210543T1 (de) 2001-12-15
EP0791446B1 (de) 2001-12-12
JPH106362A (ja) 1998-01-13

Similar Documents

Publication Publication Date Title
DE59705720D1 (de) Verfahren und Kunststoff-Spritzgiesswerkzeug zur Herstellung eines Verbundkörpers
TWI340919B (en) Method of manufacturing a contactless or contact/contactless hybrid chip card with enhanced evenness
ATE210865T1 (de) Kontaktlose chipkarte mit transponderspule
DK16988A (da) Fremgangsmaade til fremstilling af lagerkort og kort fremstillet ved anvendelse af fremgangsmaaden
DE60102944D1 (de) Dekorfolie für das In-Mould Hinterspritzen, dekoriertes Formteil und In-Mould Hinterspritzverfahren
EP0377937A3 (en) Ic card
SG85653A1 (en) Method of manufacturing semiconductor devices and resin molding machine
KR890017060A (ko) 복합사출 성형방법, 장치 및 그 성형체
HUP0003638A3 (en) Method and apparatus for injection molded flip chip encapsulation
PL368383A1 (en) Method for making a plastic pane with electrical conductor structure and plastic pane with embedded wires
ATE184233T1 (de) Vorrichtung zum spritzgiessen im sandwich- verfahren
EP0789334A3 (en) Integrated circuit device having an opening exposing the integrated circuit die and related methods
SE9403573D0 (sv) Sprutning av kapsel på optokomponent
ATE154164T1 (de) Verfahren zur herstellung eines elektronischen moduls und elektronisches modul, hergestellt nach diesem verfahren
SE9402084L (sv) Sätt att formspruta plast för elektriska skärmningshöljen
BR9809395A (pt) Processo e dispositivo de fabricacão de um recipiente equipado com uma etiqueta
GB2236212B (en) Method of encapsulating a semiconductor element in resin or sealing it therewith,and a mould therefor
DK1064135T3 (da) Indretning og fremgangsmåde til kompressionsstøbning og/eller sprøjtestøbning til indfatning af et dekorativt materiale med et bæremateriale
ATE60276T1 (de) Verfahren zur herstellung von formteilen aus kunststoff zur durchfuehrung dessen.
EP0281637A4 (en) DIRECTLY ACTIVE MOLDING LOCKING DEVICE FOR AN INJECTION MOLDING MACHINE.
KR900700258A (ko) 사출 압축 성형기 및 그의 성형 방법
EP0807973A3 (en) Plastic molded type semiconductor device and method of manufacturing the same
IT8383353A0 (it) Dispositivo di iniezione in forma e procedimento per la formatura a iniezione di parti in materiale plastico.
DE50002342D1 (de) Spritzgiessvorrichtung zum hinterspritzen eines obermaterials mit kunststoff und verfahren
ATE217247T1 (de) Chipkarte