AR110444A1 - Adhesivos sensibles a la presión convertibles que comprenden oligómeros (met)acrilato de uretano - Google Patents

Adhesivos sensibles a la presión convertibles que comprenden oligómeros (met)acrilato de uretano

Info

Publication number
AR110444A1
AR110444A1 ARP170103664A ARP170103664A AR110444A1 AR 110444 A1 AR110444 A1 AR 110444A1 AR P170103664 A ARP170103664 A AR P170103664A AR P170103664 A ARP170103664 A AR P170103664A AR 110444 A1 AR110444 A1 AR 110444A1
Authority
AR
Argentina
Prior art keywords
pressure sensitive
sensitive adhesives
oligomers
met
understanding
Prior art date
Application number
ARP170103664A
Other languages
English (en)
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Publication of AR110444A1 publication Critical patent/AR110444A1/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387Block-copolymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/246Intercrosslinking of at least two polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10Homopolymers or copolymers of methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2500/00Characteristics or properties of obtained polyolefins; Use thereof
    • C08F2500/01High molecular weight, e.g. >800,000 Da.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

Se describen adhesivos sensibles a la presión que pueden convertirse para formar adhesivos estructurales. Los adhesivos sensibles a la presión incluyen una mezcla de resinas de PSA acrílicas en combinación con uno o mas oligómeros de (met)acrilato de uretano particulares.
ARP170103664A 2016-12-22 2017-12-22 Adhesivos sensibles a la presión convertibles que comprenden oligómeros (met)acrilato de uretano AR110444A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201662437775P 2016-12-22 2016-12-22

Publications (1)

Publication Number Publication Date
AR110444A1 true AR110444A1 (es) 2019-03-27

Family

ID=60953973

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP170103664A AR110444A1 (es) 2016-12-22 2017-12-22 Adhesivos sensibles a la presión convertibles que comprenden oligómeros (met)acrilato de uretano

Country Status (3)

Country Link
US (1) US10526511B2 (es)
AR (1) AR110444A1 (es)
WO (1) WO2018118767A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2015004606A (es) 2012-10-09 2017-04-04 Avery Dennison Corp Adhesivos y metodos relacionados.
ES2992760T3 (en) 2015-02-05 2024-12-17 Avery Dennison Corp Label assemblies for adverse environments
BR112018016868B1 (pt) 2016-02-19 2022-09-13 Avery Dennison Corporation Composições de adesivos e artigo compreendendo as mesmas
JP6806488B2 (ja) * 2016-07-29 2021-01-06 株式会社Adeka 硬化性樹脂組成物、及び該組成物を用いた構造材料接合用接着剤
US12163069B2 (en) * 2017-12-19 2024-12-10 Avery Dennison Corporation Post-polymerization functionalization of pendant functional groups
CN109438654A (zh) * 2018-11-06 2019-03-08 天津科技大学 一种新型聚氨酯薄膜的制备
JP2023504902A (ja) * 2019-12-09 2023-02-07 スリーエム イノベイティブ プロパティズ カンパニー 難燃性感圧接着剤
CN111087526B (zh) * 2020-01-17 2021-02-09 苏州世华新材料科技股份有限公司 一种可耐受溶剂型丙烯酸酯组合物及其应用
WO2021162939A1 (en) * 2020-02-11 2021-08-19 Henkel IP & Holding GmbH Debondable pressure sensitive adhesives and uses thereof
CN111748313B (zh) * 2020-07-29 2022-04-01 上海仁速新材料有限公司 一种紫外光固化胶黏剂及其制备方法和应用
CN111909360B (zh) * 2020-08-11 2023-08-01 深圳市宝安区新材料研究院 一种高弹性环氧固化剂、制备方法以及环氧树脂
CN112280482B (zh) * 2020-10-28 2022-08-09 南京博新新材料有限公司 一种双组分高导热电绝缘丙烯酸酯结构胶及其制备方法
WO2023003714A1 (en) * 2021-07-22 2023-01-26 Corning Incorporated Films, laminates, and methods of making compositions
JPWO2023022185A1 (es) * 2021-08-20 2023-02-23
CN116410670B (zh) * 2021-12-31 2025-02-07 安徽飞谚新材料科技有限公司 Uv粘胶组合物、uv减粘胶及uv减粘膜
CN119731221A (zh) 2022-03-17 2025-03-28 科学把手粘合剂公司 可自主固化且可发泡的双组分丙烯酸类胶粘剂
CN117050691B (zh) * 2023-08-31 2025-09-26 江苏斯迪克新材料科技股份有限公司 用于电芯保护的耐高温高剪切uv蓝膜胶黏剂及蓝膜
CN120173358B (zh) * 2025-05-19 2025-08-29 上海品诚晶曜光伏科技有限公司 一种耐热阻水阻燃背板复合材料及其制备方法和应用

Family Cites Families (250)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408008A (en) 1966-12-02 1968-10-29 Eric H. Cocks Apparatus for applying hot melt adhesives
CH481197A (de) 1967-02-22 1969-11-15 Breveteam Sa Kleber zur unterseitigen Beschichtung von Bodenbelägen
US3639500A (en) 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
DE2446438C2 (de) 1974-09-28 1985-04-11 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung
US4049483A (en) 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
US4135033A (en) 1977-02-16 1979-01-16 Lawton William R Heat-activated adhesive coating
US4143858A (en) 1977-08-29 1979-03-13 Eastman Kodak Company Substantially amorphous polyolefins useful as pressure-sensitive adhesives
US4145511A (en) 1977-09-01 1979-03-20 The B. F. Goodrich Company Hydroxyl-containing liquid polymers and pressure-sensitive adhesives and laminates prepared therefrom
US4145514A (en) 1977-09-01 1979-03-20 The B. F. Goodrich Company Polyurethane pressure-sensitive adhesive and laminates therefrom
US4217434A (en) 1978-10-02 1980-08-12 Stauffer Chemical Company Pressure sensitive adhesive formulation
CA1154287A (en) 1979-02-26 1983-09-27 Joseph E. Gervay Dry-developing photosensitive dry film resist
JPS58152074A (ja) 1982-03-05 1983-09-09 Mitsui Toatsu Chem Inc 陶磁器質タイル用接着剤組成物
DE3650593T2 (de) 1985-02-05 1997-09-11 Avery International Corp Verbundfutter
DE3639266A1 (de) 1985-12-27 1987-07-02 Fsk K K Haftfolie
US5001173A (en) 1987-05-11 1991-03-19 Morton Coatings, Inc. Aqueous epoxy resin compositions and metal substrates coated therewith
US4914253A (en) 1988-11-04 1990-04-03 Exxon Chemical Patents Inc. Method for preparing polyethylene wax by gas phase polymerization
WO1990013420A1 (en) 1989-05-11 1990-11-15 Landec Labs, Inc. Temperature-activated adhesive assemblies
EP0400703A1 (en) 1989-05-24 1990-12-05 Akzo Nobel N.V. Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein
US5194486A (en) 1989-06-09 1993-03-16 H & N Chemical Company Adhesive
US5264532A (en) 1989-08-14 1993-11-23 Avery Dennison Corporation Emulsion pressure-sensitive adhesives
US5024880A (en) 1990-01-03 1991-06-18 Minnesota Mining And Manufacturing Company Cellular pressure-sensitive adhesive membrane
DE4021659A1 (de) 1990-07-07 1992-01-09 Bayer Ag Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer
CA2048232A1 (en) 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
US5264278A (en) 1991-03-20 1993-11-23 Minnesota Mining And Manufacturing Company Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates
CA2076278A1 (en) 1991-08-22 1993-02-23 Joseph T. Braun Curable silicone pressure sensitive adhesive tape
US5389704A (en) 1991-12-16 1995-02-14 The Dow Chemical Company Epoxy phosphate ester resin, its production and coating composition containing the resin
JP3035565B2 (ja) 1991-12-27 2000-04-24 株式会社半導体エネルギー研究所 薄膜太陽電池の作製方法
US5252694A (en) 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
CA2077103C (en) 1992-08-28 2003-06-10 Moore U.S.A. Inc. Multipurpose label construction
AU5407794A (en) 1992-10-20 1994-05-09 Avery Dennison Corporation Pressure-sensitive structural adhesive
US5322731A (en) 1993-03-09 1994-06-21 Minnesota Mining And Manufacturing Company Adhesive beads
US7575653B2 (en) 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5468652A (en) 1993-07-14 1995-11-21 Sandia Corporation Method of making a back contacted solar cell
US5721289A (en) 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5645764A (en) 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5695837A (en) 1995-04-20 1997-12-09 Minnesota Mining And Manufacturing Company Tackified acrylic adhesives
US5905099A (en) 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5800724A (en) 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
ID17196A (id) 1996-03-14 1997-12-11 Dow Chemical Co Bahan-bahan perekat yang mengandung polimer-polimer olefin
JPH09291258A (ja) 1996-04-26 1997-11-11 Lintec Corp 粘着剤組成物およびこれを用いた粘着シート
ES2187797T3 (es) 1996-07-22 2003-06-16 Dow Chemical Co Adhesivos de fusion en caliente.
ZA977909B (en) 1996-09-04 1999-03-03 Dow Chemical Co Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer
AU6461998A (en) 1997-03-14 1998-09-29 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
US6011307A (en) 1997-08-12 2000-01-04 Micron Technology, Inc. Anisotropic conductive interconnect material for electronic devices, method of use and resulting product
JP4072927B2 (ja) 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
US6077527A (en) 1997-10-28 2000-06-20 National Starch And Chemical Investment Holding Corporation Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery
US5951786A (en) 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
DE19800676A1 (de) 1998-01-10 1999-07-15 Henkel Kgaa Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen
FI106470B (fi) 1998-03-09 2001-02-15 Neste Chemicals Oy Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen
US6106982A (en) 1998-05-11 2000-08-22 Avery Dennison Corporation Imaged receptor laminate and process for making same
US6391415B1 (en) 1998-08-31 2002-05-21 Environmental Inks And Coatings Corporation Label system
US6362249B2 (en) 1998-09-04 2002-03-26 Dsm Desotech Inc. Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly
US6844391B1 (en) 1998-09-23 2005-01-18 Avery Dennison Corporation Adhesives with improved rivet properties and laminates using the same
US6228486B1 (en) 1998-10-06 2001-05-08 Avery Dennison Corporation Thermal transfer laminate
US6235850B1 (en) 1998-12-11 2001-05-22 3M Immovative Properties Company Epoxy/acrylic terpolymer self-fixturing adhesive
ATE394437T1 (de) 1998-12-11 2008-05-15 Henkel Kgaa Verwendung von dispersionen silylterminierter polymerer als dichtmassen
US6541872B1 (en) 1999-01-11 2003-04-01 Micron Technology, Inc. Multi-layered adhesive for attaching a semiconductor die to a substrate
US7641966B2 (en) 1999-06-14 2010-01-05 Nitto Denko Corporation Re-release adhesive and re-release adhesive sheet
US6429235B1 (en) 1999-08-27 2002-08-06 Cognis Corporation Energy-curable composition for making a pressure sensitive adhesive
US6664318B1 (en) 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP2001288438A (ja) 2000-04-06 2001-10-16 Sekisui Chem Co Ltd 粘着剤組成物
DE60121965T2 (de) 2000-06-01 2006-11-30 Kraton Polymers Research B.V. Funktionalisierte blockcopolymere enthaltende zusammensetzungen, die mit aluminiumacetylacetonaten vernetzt sind
US6353037B1 (en) 2000-07-12 2002-03-05 3M Innovative Properties Company Foams containing functionalized metal oxide nanoparticles and methods of making same
US6472065B1 (en) 2000-07-13 2002-10-29 3M Innovative Properties Company Clear adhesive sheet
US6841234B2 (en) 2000-08-04 2005-01-11 Scapa Tapes North America Inc. Heat-activated adhesive tape having an acrylic foam-like backing
US6497949B1 (en) 2000-08-11 2002-12-24 3M Innovative Properties Company Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives
US6756095B2 (en) 2001-01-10 2004-06-29 Avery Dennison Corporation Heat-sealable laminate
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
JP2002285106A (ja) 2001-03-27 2002-10-03 The Inctec Inc 活性エネルギー線硬化型感圧接着剤
US6686425B2 (en) 2001-06-08 2004-02-03 Adhesives Research, Inc. High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive
US6602958B2 (en) 2001-07-10 2003-08-05 Ips Corporation Adhesives for bonding composites
CA2453237A1 (en) 2001-07-26 2003-02-06 Ciba Specialty Chemicals Holding Inc. Photosensitive resin composition
JP2003138234A (ja) * 2001-11-02 2003-05-14 Nippon Synthetic Chem Ind Co Ltd:The 活性エネルギー線硬化型樹脂組成物
US20030095388A1 (en) 2001-11-16 2003-05-22 Jinbao Jiao Method and apparatus for securing a circuit board to a rigid surface
US6866919B2 (en) 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
EP1375617A1 (en) 2002-06-19 2004-01-02 3M Innovative Properties Company Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive
EP1375618A1 (en) 2002-06-19 2004-01-02 3M Innovative Properties Company Radiation-curable, solvent-free and printable precursor of an adhesive
MXPA05000686A (es) 2002-07-19 2005-04-08 Avery Dennison Corp Metodo de etiquetado que emplea adhesivos curables de dos partes.
US6613857B1 (en) 2002-07-26 2003-09-02 Avery Dennison Corporation UV-crosslinked, pressure-sensitive adhesives
AU2003265322A1 (en) 2002-07-31 2004-02-25 Nexicor Llc Induction bondable high-pressure laminate
KR20050026087A (ko) 2002-07-31 2005-03-14 유씨비 소시에떼아노님 아크릴계 감압 접착제
US6653408B1 (en) 2002-11-21 2003-11-25 Kraton Polymers U.S. Llc Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate
US7225992B2 (en) 2003-02-13 2007-06-05 Avery Dennison Corporation RFID device tester and method
DE10322898A1 (de) 2003-05-21 2004-12-16 Tesa Ag Flammfeste und Hitze-aktivierbare Haftklebemassen
KR101177251B1 (ko) 2003-06-06 2012-08-24 히다치 가세고교 가부시끼가이샤 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체 장치의 제조방법
TWI305542B (en) * 2003-06-09 2009-01-21 Mitsui Chemicals Inc Crosslinkable methacrylic resin composition
JP3907611B2 (ja) 2003-06-23 2007-04-18 日東電工株式会社 粘着剤組成物及び粘着製品
US7170001B2 (en) 2003-06-26 2007-01-30 Advent Solar, Inc. Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias
US7691437B2 (en) 2003-10-31 2010-04-06 3M Innovative Properties Company Method for preparing a pressure-sensitive adhesive
US7270889B2 (en) 2003-11-04 2007-09-18 Kimberly-Clark Worldwide, Inc. Tackified amorphous-poly-alpha-olefin-bonded structures
WO2005042612A1 (ja) 2003-11-04 2005-05-12 Soken Chemical & Engineering Co., Ltd. 重合性組成物及び(メタ)アクリル系熱伝導性シート
US7144751B2 (en) 2004-02-05 2006-12-05 Advent Solar, Inc. Back-contact solar cells and methods for fabrication
EA011898B1 (ru) 2004-03-09 2009-06-30 Спир Груп Холдингз Лимитед Этикетка для стеклянной бутылки и способ ее удаления
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
US7088248B2 (en) 2004-03-24 2006-08-08 Avery Dennison Corporation System and method for selectively reading RFID devices
US20050215655A1 (en) 2004-03-29 2005-09-29 Bilodeau Wayne L Anaerobic pressure sensitive adhesive
US7645829B2 (en) 2004-04-15 2010-01-12 Exxonmobil Chemical Patents Inc. Plasticized functionalized propylene copolymer adhesive composition
WO2005105857A1 (en) 2004-04-27 2005-11-10 Ashland Inc. Polyester-polyether hybrid urethane acrylate oligomer for uv curing pressure sensitive adhesives
US7166649B2 (en) 2004-04-27 2007-01-23 Ashland Chemical, Inc. Polyester-polyether hybrid urethane acrylate oligomer for UV curing pressure sensitive adhesives
US20050266237A1 (en) 2004-05-28 2005-12-01 Siddhartha Asthana Heat-activated sound and vibration damping sealant composition
EP1640388B1 (en) 2004-09-24 2015-02-25 Rohm and Haas Company Biomass based Michael addition composition
JP4829242B2 (ja) 2004-10-22 2011-12-07 株式会社サトー ラベルおよびラベルを物体に貼付するための方法
US20080280111A1 (en) 2004-11-10 2008-11-13 Avery Dennison Corporation In-Mold Labels and Uses Thereof
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
BRPI0609841B1 (pt) 2005-03-17 2022-09-27 Dow Global Technologies Inc Composição de interpolímero de etileno/a-olefina e artigo
KR101399699B1 (ko) 2005-03-17 2014-05-27 다우 글로벌 테크놀로지스 엘엘씨 관능화된 에틸렌/α-올레핀 혼성중합체 조성물
US7786216B2 (en) 2005-03-17 2010-08-31 Dow Global Technologies Inc. Oil based blends of interpolymers of ethylene/α-olefins
US7756154B2 (en) 2005-03-22 2010-07-13 Netapp, Inc. Shared implementation for multiple system interfaces
TWI353360B (en) 2005-04-07 2011-12-01 Nippon Catalytic Chem Ind Production process of polyacrylic acid (salt) wate
US7298266B2 (en) 2005-05-09 2007-11-20 Avery Dennison RFID communication systems and methods
JP4634856B2 (ja) 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US8287949B2 (en) 2005-07-07 2012-10-16 Dow Global Technologies Inc. Aqueous dispersions
US7521015B2 (en) 2005-07-22 2009-04-21 3M Innovative Properties Company Curable thiol-ene compositions for optical articles
EP1749869A1 (en) 2005-08-02 2007-02-07 Henkel Corporation Dual cure adhesives
JP4711777B2 (ja) 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
US20100311920A1 (en) 2005-08-26 2010-12-09 Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers
JP4869015B2 (ja) 2005-10-18 2012-02-01 日東電工株式会社 粘着剤組成物、粘着剤層およびその製造方法、ならびに粘着剤付光学部材
US20070088145A1 (en) 2005-10-19 2007-04-19 Mgaya Alexander P Adhesive useful for film laminating applications
JP5085028B2 (ja) 2005-10-20 2012-11-28 日東電工株式会社 粘着型光学フィルムおよびその製造方法
US20070092733A1 (en) 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
EP1792925B1 (en) 2005-12-01 2015-10-07 Henkel AG & Co. KGaA Novel material forming supramolecular structures, process and uses
CN101000899A (zh) 2006-01-11 2007-07-18 南茂科技股份有限公司 晶片封装结构
JP4780766B2 (ja) 2006-03-27 2011-09-28 日東電工株式会社 光学用粘着剤、粘着剤付き光学フィルムおよび画像表示装置
US20070231571A1 (en) 2006-04-04 2007-10-04 Richard Lane Pressure sensitive adhesive (PSA) laminates
US7935424B2 (en) 2006-04-06 2011-05-03 Lintec Corporation Adhesive sheet
US8785531B2 (en) 2006-07-06 2014-07-22 Dow Global Technologies Llc Dispersions of olefin block copolymers
JP2008060151A (ja) 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP4620028B2 (ja) 2006-10-19 2011-01-26 日東電工株式会社 基板加工用粘着シート
ATE539094T1 (de) 2006-10-27 2012-01-15 Basf Se Strahlungshärtbare mischung, enthaltend niedermolekulare, ethylenisch ungesättigte verbindungen mit nicht-aromatischen ringsystemen
EP2094801B2 (en) 2006-12-07 2017-02-22 3M Innovative Properties Company Block copolymer blend adhesives with multiple tackifiers
TW200842174A (en) 2006-12-27 2008-11-01 Cheil Ind Inc Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
KR100907982B1 (ko) 2006-12-27 2009-07-16 제일모직주식회사 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름
JP2008163276A (ja) 2007-01-05 2008-07-17 Nitto Denko Corp 半導体基板加工用粘着シート
KR100948778B1 (ko) 2007-01-23 2010-03-24 주식회사 엘지화학 광학 보상된 아크릴계 점착제 조성물, 이를 포함하는편광판 및 액정표시소자
WO2008093398A1 (ja) 2007-01-30 2008-08-07 Asics Corporation シューズの製造方法、及びシューズ
CA2621791A1 (en) 2007-02-20 2008-08-20 Polymerica Corporation Production of stable water dispersion epoxy phosphate ester resins and their aqueous coating compositions
JP5089201B2 (ja) 2007-03-12 2012-12-05 日東電工株式会社 アクリル系粘着テープ又はシート、およびその製造方法
PL2139967T3 (pl) 2007-03-21 2015-05-29 Avery Dennison Corp Klej samoprzylepny
JP5419376B2 (ja) 2007-04-20 2014-02-19 日東電工株式会社 粘着シートの自動車塗膜面への接着方法
JP5038770B2 (ja) 2007-05-01 2012-10-03 日東電工株式会社 車両用塗膜面に対する粘着シートの接着方法
JP5118880B2 (ja) 2007-05-08 2013-01-16 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
EP2185601B1 (en) 2007-08-24 2019-02-27 Dow Global Technologies LLC Adhesives made from interpolymers of ethylene/alpha-olefins
KR100922684B1 (ko) 2007-08-31 2009-10-19 제일모직주식회사 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프
CN101802062B (zh) 2007-09-19 2012-07-04 汉高两合股份公司 高度衰减的可膨胀的材料和装置
EP2053109A1 (en) 2007-10-22 2009-04-29 Nitto Denko Corporation Pressure-sensitive adhesive composition for optical film, pressure-sensitive adhesive layer for optical film, production method thereof, pressure-sensitive adhesive optical film and image display
US7786868B2 (en) 2007-12-11 2010-08-31 Avery Dennison Corporation RFID device with multiple passive operation modes
KR100945638B1 (ko) * 2007-12-17 2010-03-04 제일모직주식회사 광경화성 점착 조성물 및 이를 포함하는 다이싱 다이본딩필름
EP2072552A3 (en) 2007-12-20 2009-07-29 Nitto Denko Corporation Pressure-sensitive adhesive composition for optical films, pressure-sensitive adhesive optical film and image display
CN101925664B (zh) 2007-12-27 2013-05-29 3M创新有限公司 脲基压敏粘合剂
KR101023842B1 (ko) 2008-01-11 2011-03-22 주식회사 엘지화학 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치
JP5379409B2 (ja) 2008-02-15 2013-12-25 日東電工株式会社 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置
NZ605100A (en) 2008-03-14 2014-12-24 3M Innovative Properties Co Assembly comprising a stretch releasable adhesive article
JP5379410B2 (ja) 2008-03-14 2013-12-25 日東電工株式会社 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
BRPI0908995B1 (pt) 2008-03-20 2019-04-24 Avery Dennison Corporation Composição reticulável, adesivo sensível à pressão, espuma,elastômero, e processo de preparação de adesivo sensível à pressão
WO2009133175A1 (de) 2008-04-30 2009-11-05 Tesa Se Klebeband
US8289165B2 (en) 2008-06-11 2012-10-16 Avery Dennison Corporation RFID device with conductive loop shield
JP5696994B2 (ja) * 2008-07-16 2015-04-08 エルジー・ケム・リミテッド 粘着剤組成物、偏光板及び液晶表示装置
US8080177B2 (en) 2008-08-19 2011-12-20 The Boeing Company Low RF loss static dissipative adhesive
US20110159238A1 (en) 2008-08-27 2011-06-30 Takashi Kawamori Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
DE102008045802A1 (de) 2008-09-05 2010-03-11 Henkel Ag & Co. Kgaa Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren
US8068028B2 (en) 2008-09-26 2011-11-29 Avery Dennison Corporation Encapsulated RFID device for flexible, non-planar or curvilinear surfaces
EP2334721A4 (en) 2008-09-30 2013-09-25 Henkel Corp SHEAR AND / OR PRESSURE-RELATED MICROBALLS
CN102264855B (zh) 2008-12-26 2014-03-12 东洋纺织株式会社 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板
AT12321U1 (de) 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100200063A1 (en) 2009-02-12 2010-08-12 Derek Djeu Thin film solar cell
JP5294931B2 (ja) 2009-03-11 2013-09-18 日東電工株式会社 アクリル系粘着シート
EP2236534A1 (de) 2009-03-31 2010-10-06 Sika Technology AG Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat
JP5187973B2 (ja) 2009-04-30 2013-04-24 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルムおよび画像表示装置
JP5404174B2 (ja) 2009-05-14 2014-01-29 日東電工株式会社 熱剥離性感圧接着テープ又はシート
US9296933B2 (en) 2009-05-15 2016-03-29 3M Innovative Properties Company Urethane-based pressure sensitive adhesives
KR20120029421A (ko) 2009-06-11 2012-03-26 헨켈 코포레이션 다관능성 디엔 및 친디엔체 화합물을 함유하는 열 가역성 핫 멜트 접착제 조성물
US8593256B2 (en) 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
AU2010275394B2 (en) 2009-07-24 2015-06-18 Bostik, Inc. Hot melt adhesive based on olefin block copolymers
US8179198B2 (en) 2009-07-31 2012-05-15 Texas Instruments Incorporated Variable gain amplifier having automatic power consumption optimization
US8242185B2 (en) 2009-08-03 2012-08-14 Morgan Adhesives Company Adhesive compositions for easy application and improved durability
CN102498183A (zh) 2009-09-16 2012-06-13 日东电工株式会社 丙烯酸类粘合带
CN102510887B (zh) 2009-09-24 2015-10-14 艾利丹尼森公司 用于粘附于低表面能基底的丙烯酸组合物
JP2011096988A (ja) 2009-11-02 2011-05-12 Keiwa Inc 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール
US20120240973A1 (en) 2009-12-16 2012-09-27 Avery Dennison Corporation Photovoltaic Backsheet
RU2557614C2 (ru) 2010-02-26 2015-07-27 Интерконтинентал Грейт Брэндс ЛЛС Уф-отверждаемый самоклеющийся материал с низкой липкостью для повторно укупориваемых упаковок
WO2011105878A2 (ko) 2010-02-26 2011-09-01 (주)Lg화학 점착제 조성물
WO2011112447A2 (en) 2010-03-09 2011-09-15 3M Innovative Properties Company Heat activated optically clear adhesive for bonding display panels
CN102834121A (zh) 2010-03-26 2012-12-19 3M创新有限公司 消毒伤口敷料的方法
JP2011231319A (ja) 2010-04-09 2011-11-17 Nitto Denko Corp 粘着性組成物およびアクリル系粘着テープ
JP5749052B2 (ja) 2010-04-12 2015-07-15 日東電工株式会社 硬化多層シートの製造方法及び硬化多層シート
JP5621039B2 (ja) 2010-05-11 2014-11-05 スリーエム イノベイティブプロパティズカンパニー 硬化性組成物、感圧性接着剤、その製造方法、及び接着物品
AU2011256318B2 (en) 2010-05-19 2015-11-19 Avery Dennison Corporation Ordered architectures in acrylic polymers
EP2580715B1 (en) 2010-06-14 2019-05-22 Avery Dennison Corporation Method, system and apparatus for making short run radio frequency identification tags and labels
JP5432853B2 (ja) 2010-07-30 2014-03-05 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法
WO2012024217A1 (en) 2010-08-18 2012-02-23 3M Innovative Properties Company Optical assemblies including stress-relieving optical adhesives and methods of making same
MX2013002214A (es) 2010-08-26 2013-05-09 Henkel Corp Adhesivo de poli-alfa-olefina amorfa de temperatura de aplicacion baja.
KR101705936B1 (ko) 2010-08-27 2017-02-10 닛토덴코 가부시키가이샤 아크릴계 점착제 조성물, 아크릴계 점착제층 및 아크릴계 점착 테이프
DE102010035889B4 (de) 2010-08-30 2021-11-11 Bundesdruckerei Gmbh Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung
JP5854404B2 (ja) 2010-09-17 2016-02-09 昭和電工株式会社 光硬化性透明粘着シート用組成物
JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
CN103314066A (zh) 2010-11-23 2013-09-18 粘合剂研究股份有限公司 反应性导电压敏胶带
CA2818881C (en) 2010-11-23 2019-06-11 Westinghouse Electric Company Llc Full spectrum loca evaluation model and analysis methodology
KR20140031849A (ko) 2010-12-13 2014-03-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 저 표면 에너지 기재용 감압 접착제
WO2012088384A1 (en) 2010-12-22 2012-06-28 Bostik Inc. Olefin block copolymer based packaging adhesive
WO2012100024A2 (en) 2011-01-20 2012-07-26 Bayer Materialscience Llc Non-aqueous polyurethane coating compositions
JP5689336B2 (ja) 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
JP2012193317A (ja) 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
JP5282113B2 (ja) 2011-03-22 2013-09-04 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
JP5762781B2 (ja) 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
BR112013024365A8 (pt) 2011-03-24 2018-02-06 Henkel US IP LLC Adesivo para laminação de filme extensível
WO2012139120A1 (en) 2011-04-08 2012-10-11 Bostik, Inc. Polyolefin based hot melt adhesive containing a solid plasticizer
KR20120119442A (ko) 2011-04-21 2012-10-31 동우 화인켐 주식회사 광학용 감압 점착제 조성물
JP2012229375A (ja) 2011-04-27 2012-11-22 Nitto Denko Corp 粘着シート
US9000659B2 (en) 2011-05-09 2015-04-07 Kenneth S. Chin Lamp socket
JP5966581B2 (ja) 2011-05-10 2016-08-10 デクセリアルズ株式会社 両面粘着テープ及びその製造方法
EP2545798B1 (en) 2011-07-13 2018-02-21 3M Innovative Properties Company Sanitary product system
EP2546053B1 (en) 2011-07-15 2013-12-11 Nitto Denko Corporation Double-sided pressure-sensitive adhesive sheet
EP2551102B1 (en) 2011-07-29 2014-12-03 3M Innovative Properties Company Self-stick foam adhesive
CN103748488B (zh) 2011-08-19 2016-04-06 Lg化学株式会社 偏光板
CN103998481B (zh) 2011-10-14 2018-02-06 艾利丹尼森公司 可控构造聚合物
EP2581423A1 (en) 2011-10-14 2013-04-17 3M Innovative Properties Company Primerless multilayer adhesive film for bonding glass substrates
CN103814095B (zh) 2011-11-08 2016-08-17 Lg化学株式会社 用于具有抗静电性的保护膜的压敏粘合剂组合物及其制备方法
DE102011088170A1 (de) 2011-12-09 2013-06-13 Bayer Materialscience Aktiengesellschaft Reaktive Haftklebstoffe
CN104144997A (zh) 2011-12-22 2014-11-12 3M创新有限公司 基于烯烃嵌段共聚物的压敏粘合剂
DE102012200854A1 (de) 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
WO2013115851A1 (en) 2012-02-03 2013-08-08 Avery Dennison Corporation Laser patterning of photovoltaic backsheet
TWI488930B (zh) 2012-03-12 2015-06-21 Lg化學股份有限公司 壓感性黏著組成物
EP2831190B1 (en) 2012-03-30 2016-12-14 Dow Global Technologies LLC Polyolefin adhesive composition
JP6188252B2 (ja) 2012-03-30 2017-08-30 シラス・インコーポレイテッド 重合性組成物の活性化方法、重合系およびこれにより形成される製品
KR102086441B1 (ko) 2012-03-30 2020-03-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 우레아계 및 우레탄계 감압 접착제 블렌드
CN102634286B (zh) 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
KR20150027067A (ko) 2012-05-29 2015-03-11 닛토덴코 가부시키가이샤 접착제 및 그것을 사용한 투명 기판
DE102012209116A1 (de) 2012-05-30 2013-12-05 Tesa Se Heißsiegelbares Klebeband
DE102013209827A1 (de) 2012-06-21 2013-12-24 Tesa Se Hitzebeständiges Klebeband
JP5961055B2 (ja) 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
WO2014007219A1 (ja) 2012-07-05 2014-01-09 株式会社スリーボンド シート状接着剤およびこれを用いた有機elパネル
WO2014018231A1 (en) 2012-07-26 2014-01-30 3M Innovative Properties Company Heat de-bondable optical articles
KR20150038203A (ko) 2012-07-26 2015-04-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열 접합해제성 접착제 물품
MX2015004606A (es) 2012-10-09 2017-04-04 Avery Dennison Corp Adhesivos y metodos relacionados.
US20140162082A1 (en) 2012-12-07 2014-06-12 H.B. Fuller Company Composition, an article and a method for the bonding of non-woven substrates
US9023954B1 (en) 2012-12-26 2015-05-05 The United States Of America As Represented By The Secretary Of The Navy Side-chain and end-group modified poly-p-phenylene oligomers
JP6443634B2 (ja) 2013-01-24 2018-12-26 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 発泡性ホットメルト接着剤組成物およびその使用
ES2676694T3 (es) 2013-01-24 2018-07-24 Basf Se Productos adhesivos reactivos sensibles a la presión
US20140255681A1 (en) 2013-03-05 2014-09-11 Avery Dennison Corporation Differential dual functional foam tapes
US9926410B2 (en) * 2013-03-28 2018-03-27 Dow Corning Corporation Organosiloxane compositions and coatings, manufactured articles, methods and uses
JP6472172B2 (ja) 2013-06-28 2019-02-20 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着剤層付き光学フィルム、液晶表示装置、及び、積層体
US20160230047A1 (en) 2013-09-23 2016-08-11 Lubrizol Advanced Materials, Inc. A combined hot-melt adhesive and pressure sensitive adhesive system and composite materials made from the same
BR112016006114A2 (pt) 2013-09-25 2020-05-19 Bostik, Inc. composição adesiva termofundida
CN104870590A (zh) 2013-10-10 2015-08-26 艾利丹尼森公司 胶黏剂和相关方法
CN106164121B (zh) 2014-03-31 2019-12-20 三菱化学株式会社 氨基甲酸酯(甲基)丙烯酸酯系化合物、活性能量射线固化性树脂组合物及涂布剂
CA2952825A1 (en) 2014-06-18 2015-12-23 Avery Dennison Corporation Transposable pressure sensitive adhesives, articles, and related methods
MX2017004059A (es) 2014-09-29 2017-08-28 Avery Dennison Corp Etiqueta rfid de seguimiento de neumáticos.
ES2992760T3 (en) 2015-02-05 2024-12-17 Avery Dennison Corp Label assemblies for adverse environments
TWI586780B (zh) 2015-03-23 2017-06-11 阿科瑪法國公司 壓敏性黏合劑

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