AT311145B - Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung - Google Patents

Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung

Info

Publication number
AT311145B
AT311145B AT922170A AT922170A AT311145B AT 311145 B AT311145 B AT 311145B AT 922170 A AT922170 A AT 922170A AT 922170 A AT922170 A AT 922170A AT 311145 B AT311145 B AT 311145B
Authority
AT
Austria
Prior art keywords
copper plating
electroless copper
alkaline aqueous
plating bath
bath
Prior art date
Application number
AT922170A
Other languages
German (de)
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of AT311145B publication Critical patent/AT311145B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT922170A 1969-10-16 1970-10-13 Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung AT311145B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6915718A NL6915718A (fr) 1969-10-16 1969-10-16

Publications (1)

Publication Number Publication Date
AT311145B true AT311145B (de) 1973-10-25

Family

ID=19808149

Family Applications (1)

Application Number Title Priority Date Filing Date
AT922170A AT311145B (de) 1969-10-16 1970-10-13 Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung

Country Status (11)

Country Link
US (1) US3804638A (fr)
AT (1) AT311145B (fr)
AU (1) AU2101370A (fr)
BE (1) BE757573A (fr)
CA (1) CA947458A (fr)
CH (1) CH550255A (fr)
DE (1) DE2049061C3 (fr)
FR (1) FR2065996A5 (fr)
GB (1) GB1330332A (fr)
HK (1) HK49576A (fr)
NL (1) NL6915718A (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (fr) * 1975-03-14 1981-06-25
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
CA1184359A (fr) * 1981-10-23 1985-03-26 Donald A. Arcilesi Repression des impuretes metalliques en cuivrage non electrolytique
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
EP0132594B1 (fr) * 1983-07-25 1988-09-07 Hitachi, Ltd. Solution de cuivre pour le placage sans courant
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
EP1664381A1 (fr) * 2003-09-19 2006-06-07 Applied Materials, Inc. Appareil et procede de detection de point limite de depot autocatalytique
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc Patterned wafer thickness detection system
CN1876891B (zh) * 2005-06-10 2013-07-03 恩通公司 使不导电基底直接金属化的方法
WO2014154702A1 (fr) * 2013-03-27 2014-10-02 Atotech Deutschland Gmbh Solution de cuivrage autocatalytique
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) * 2019-08-15 2019-11-26 深南电路股份有限公司 印制线路板废水的处理方法及处理装置
CN113388829A (zh) * 2021-06-11 2021-09-14 惠州金晟新电子科技有限公司 化学镀铜液以及利用化学镀铜液镀铜基板的方法
EP4545680B1 (fr) * 2023-10-26 2026-03-04 Atotech Deutschland GmbH & Co. KG Solution de cuivrage sans courant et sans nickel et procede d'utilisation de cette solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3300335A (en) * 1963-11-20 1967-01-24 Dow Chemical Co Electroless metal plating with foam
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3515563A (en) * 1967-12-28 1970-06-02 Photocircuits Corp Autocatalytic metal plating solutions

Also Published As

Publication number Publication date
DE2049061B2 (de) 1980-07-24
US3804638A (en) 1974-04-16
CA947458A (en) 1974-05-21
HK49576A (en) 1976-08-06
AU2101370A (en) 1972-04-20
DE2049061C3 (de) 1981-04-30
DE2049061A1 (de) 1971-04-29
FR2065996A5 (fr) 1971-08-06
CH550255A (de) 1974-06-14
BE757573A (fr) 1971-04-15
GB1330332A (en) 1973-09-19
NL6915718A (fr) 1971-04-20

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Legal Events

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ELJ Ceased due to non-payment of the annual fee