BE757573A - Depot sans courant de cuivre flexible - Google Patents

Depot sans courant de cuivre flexible

Info

Publication number: BE757573A
Authority: BE; Belgium
Prior art keywords: flexible copper; copper current; current free; free deposit; deposit
Prior art date: 1969-10-16

Application number

Other languages

Original Assignee

Philips Nv

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-10-16

Publication date

1971-04-15

1971-04-15 Publication of BE757573A publication Critical patent/BE757573A/fr

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

BE757573D 1969-10-16 Depot sans courant de cuivre flexible BE757573A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL6915718A NL6915718A (fr)	1969-10-16	1969-10-16

Publications (1)

Publication Number	Publication Date
BE757573A true BE757573A (fr)	1971-04-15

Family

ID=19808149

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE757573D BE757573A (fr)	1969-10-16		Depot sans courant de cuivre flexible

Country Status (11)

Country	Link
US (1)	US3804638A (fr)
AT (1)	AT311145B (fr)
AU (1)	AU2101370A (fr)
BE (1)	BE757573A (fr)
CA (1)	CA947458A (fr)
CH (1)	CH550255A (fr)
DE (1)	DE2049061C3 (fr)
FR (1)	FR2065996A5 (fr)
GB (1)	GB1330332A (fr)
HK (1)	HK49576A (fr)
NL (1)	NL6915718A (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5627594B2 (fr) *	1975-03-14	1981-06-25
US4171225A (en)	1976-01-23	1979-10-16	U.S. Philips Corporation	Electroless copper plating solutions
US4211564A (en) *	1978-05-09	1980-07-08	Hitachi, Ltd.	Chemical copper plating solution
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
US4303443A (en) *	1979-06-15	1981-12-01	Hitachi, Ltd.	Electroless copper plating solution
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution
CA1184359A (fr) *	1981-10-23	1985-03-26	Donald A. Arcilesi	Repression des impuretes metalliques en cuivrage non electrolytique
IT1157006B (it) *	1982-03-09	1987-02-11	Alfachimici Spa	Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) *	1982-09-28	1985-10-22	Hitachi Chemical Company, Ltd.	Electroless copper deposition solution
EP0132594B1 (fr) *	1983-07-25	1988-09-07	Hitachi, Ltd.	Solution de cuivre pour le placage sans courant
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) *	1994-01-31	1999-07-20	Matsushita Electric Works, Ltd.	Method of coating a copper film on a ceramic substrate
US6852152B2 (en) *	2002-09-24	2005-02-08	International Business Machines Corporation	Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) *	2003-07-23	2005-01-27	Jon Bengston	Stabilizer for electroless copper plating solution
EP1664381A1 (fr) *	2003-09-19	2006-06-07	Applied Materials, Inc.	Appareil et procede de detection de point limite de depot autocatalytique
US20050067297A1 (en) *	2003-09-26	2005-03-31	Innovative Technology Licensing, Llc	Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) *	2004-09-17	2006-03-23	Applied Materials, Inc	Patterned wafer thickness detection system
CN1876891B (zh) *	2005-06-10	2013-07-03	恩通公司	使不导电基底直接金属化的方法
WO2014154702A1 (fr) *	2013-03-27	2014-10-02	Atotech Deutschland Gmbh	Solution de cuivrage autocatalytique
US10060034B2 (en)	2017-01-23	2018-08-28	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions
US10294569B2 (en)	2017-10-06	2019-05-21	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en)	2017-10-06	2020-05-19	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) *	2019-08-15	2019-11-26	深南电路股份有限公司	印制线路板废水的处理方法及处理装置
CN113388829A (zh) *	2021-06-11	2021-09-14	惠州金晟新电子科技有限公司	化学镀铜液以及利用化学镀铜液镀铜基板的方法
EP4545680B1 (fr) *	2023-10-26	2026-03-04	Atotech Deutschland GmbH & Co. KG	Solution de cuivrage sans courant et sans nickel et procede d'utilisation de cette solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3075856A (en) *	1958-03-31	1963-01-29	Gen Electric	Copper plating process and solution
US3300335A (en) *	1963-11-20	1967-01-24	Dow Chemical Co	Electroless metal plating with foam
US3485643A (en) *	1966-05-06	1969-12-23	Photocircuits Corp	Electroless copper plating
US3472664A (en) *	1966-09-15	1969-10-14	Enthone	Inhibiting stardusting in electroless copper plating
US3515563A (en) *	1967-12-28	1970-06-02	Photocircuits Corp	Autocatalytic metal plating solutions

0
- BE BE757573D patent/BE757573A/fr not_active IP Right Cessation
1969
- 1969-10-16 NL NL6915718A patent/NL6915718A/xx unknown
1970
- 1970-10-06 DE DE2049061A patent/DE2049061C3/de not_active Expired
- 1970-10-13 GB GB4859070A patent/GB1330332A/en not_active Expired
- 1970-10-13 CA CA095,339A patent/CA947458A/en not_active Expired
- 1970-10-13 AU AU21013/70A patent/AU2101370A/en not_active Expired
- 1970-10-13 CH CH1511570A patent/CH550255A/xx not_active IP Right Cessation
- 1970-10-13 AT AT922170A patent/AT311145B/de not_active IP Right Cessation
- 1970-10-15 FR FR7037240A patent/FR2065996A5/fr not_active Expired
1972
- 1972-04-06 US US00241806A patent/US3804638A/en not_active Expired - Lifetime
1976
- 1976-07-29 HK HK495/76*UA patent/HK49576A/xx unknown

Also Published As

Publication number	Publication date
DE2049061B2 (de)	1980-07-24
US3804638A (en)	1974-04-16
CA947458A (en)	1974-05-21
HK49576A (en)	1976-08-06
AU2101370A (en)	1972-04-20
DE2049061C3 (de)	1981-04-30
DE2049061A1 (de)	1971-04-29
AT311145B (de)	1973-10-25
FR2065996A5 (fr)	1971-08-06
CH550255A (de)	1974-06-14
GB1330332A (en)	1973-09-19
NL6915718A (fr)	1971-04-20

Publication	Publication Date	Title
BE757573A (fr)	1971-04-15	Depot sans courant de cuivre flexible
AT289952B (de)	1971-05-10	Elektrische Beleuchteinrichtung
AT301658B (de)	1972-09-11	Elektrische Verbindungsanordnung
BE755122A (fr)	1971-02-01	Procede de depot electrolytique de cuivre
CA924259A (en)	1973-04-10	Copper electroplating
BE756814A (fr)	1971-03-01	Interrupteur de courant de terre
BE760145A (fr)	1971-06-10	Trajet de commutation supraconducteur par courant
AT311451B (de)	1973-11-26	Elektrische Klemmengruppe
DK139590B (da)	1979-03-12	Strømløs kobberafsætningsopløsning.
CH513527A (de)	1971-09-30	Elektrische Verbindungsanordnung
CH527499A (de)	1972-08-31	Elektrische Verbindungsanordnung
BE777472A (fr)	1972-04-17	Circuit electronique
NL162798C (nl)	1980-06-16	Elektrische motor.
AT300943B (de)	1972-08-10	Elektrischer Schalter
CH494467A (de)	1970-07-31	Elektrischer Schalter
CH522274A (fr)	1972-06-15	Conducteur électrique
AT296417B (de)	1972-02-10	Elektrischer Schalter
CH498474A (de)	1970-10-31	Elektrisches Bauelement
ES161213Y (es)	1971-04-16	Terminal electrico.
BE778687A (fr)	1972-07-31	Circuit de limitation de courant
BR7017783D0 (pt)	1973-01-11	Gerador de corrente eletronica
NL164996C (nl)	1981-02-16	Op druk reagerende elektrische schakelinrichting.
DK134608B (da)	1976-12-06	Kobberlegering.
ES145477Y (es)	1970-02-16	Un material aislante electrico.
DK119903C (da)	1979-06-18	Kobber-zinklegering

Legal Events

Date	Code	Title	Description
1987-04-30	RE	Patent lapsed	Owner name: N.V. PHILIPS'GLOEILAMPENFABRIEKEN Effective date: 19861031

Date

Code

Title

Description

1987-04-30

Patent lapsed

Owner name: N.V. PHILIPS'GLOEILAMPENFABRIEKEN

Effective date: 19861031