CA947458A - Electroless deposition of ductile copper - Google Patents

Electroless deposition of ductile copper

Info

Publication number: CA947458A
Authority: CA; Canada
Prior art keywords: electroless deposition; ductile copper; ductile; copper; electroless
Prior art date: 1969-10-16
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA095,339A

Other languages

English (en)

Other versions

CA95339S (en

Inventor

Hendrik Jonker

Eise B. Geertsema

Arian Molenaar

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Koninklijke Philips NV

Original Assignee

Philips Gloeilampenfabrieken NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-10-16

Filing date

1970-10-13

Publication date

1974-05-21

1970-10-13 Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV

1974-05-21 Application granted granted Critical

1974-05-21 Publication of CA947458A publication Critical patent/CA947458A/en

Status Expired legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
229910052802 copper Inorganic materials 0.000 title 1
239000010949 copper Substances 0.000 title 1
230000008021 deposition Effects 0.000 title 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

CA095,339A 1969-10-16 1970-10-13 Electroless deposition of ductile copper Expired CA947458A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL6915718A NL6915718A (fr)	1969-10-16	1969-10-16

Publications (1)

Publication Number	Publication Date
CA947458A true CA947458A (en)	1974-05-21

Family

ID=19808149

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA095,339A Expired CA947458A (en)	1969-10-16	1970-10-13	Electroless deposition of ductile copper

Country Status (11)

Country	Link
US (1)	US3804638A (fr)
AT (1)	AT311145B (fr)
AU (1)	AU2101370A (fr)
BE (1)	BE757573A (fr)
CA (1)	CA947458A (fr)
CH (1)	CH550255A (fr)
DE (1)	DE2049061C3 (fr)
FR (1)	FR2065996A5 (fr)
GB (1)	GB1330332A (fr)
HK (1)	HK49576A (fr)
NL (1)	NL6915718A (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5627594B2 (fr) *	1975-03-14	1981-06-25
US4171225A (en)	1976-01-23	1979-10-16	U.S. Philips Corporation	Electroless copper plating solutions
US4211564A (en) *	1978-05-09	1980-07-08	Hitachi, Ltd.	Chemical copper plating solution
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
US4303443A (en) *	1979-06-15	1981-12-01	Hitachi, Ltd.	Electroless copper plating solution
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution
CA1184359A (fr) *	1981-10-23	1985-03-26	Donald A. Arcilesi	Repression des impuretes metalliques en cuivrage non electrolytique
IT1157006B (it) *	1982-03-09	1987-02-11	Alfachimici Spa	Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) *	1982-09-28	1985-10-22	Hitachi Chemical Company, Ltd.	Electroless copper deposition solution
US4563217A (en) *	1983-07-25	1986-01-07	Hitachi, Ltd.	Electroless copper plating solution
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) *	1994-01-31	1999-07-20	Matsushita Electric Works, Ltd.	Method of coating a copper film on a ceramic substrate
US6852152B2 (en) *	2002-09-24	2005-02-08	International Business Machines Corporation	Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) *	2003-07-23	2005-01-27	Jon Bengston	Stabilizer for electroless copper plating solution
US7534298B2 (en) *	2003-09-19	2009-05-19	Applied Materials, Inc.	Apparatus and method of detecting the electroless deposition endpoint
US20050067297A1 (en) *	2003-09-26	2005-03-31	Innovative Technology Licensing, Llc	Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) *	2004-09-17	2006-03-23	Applied Materials, Inc	Patterned wafer thickness detection system
CN1876891B (zh) *	2005-06-10	2013-07-03	恩通公司	使不导电基底直接金属化的方法
US20160273112A1 (en) *	2013-03-27	2016-09-22	Atotech Deutschland Gmbh	Electroless copper plating solution
US10060034B2 (en)	2017-01-23	2018-08-28	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions
US10294569B2 (en)	2017-10-06	2019-05-21	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en)	2017-10-06	2020-05-19	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) *	2019-08-15	2019-11-26	深南电路股份有限公司	印制线路板废水的处理方法及处理装置
CN113388829A (zh) *	2021-06-11	2021-09-14	惠州金晟新电子科技有限公司	化学镀铜液以及利用化学镀铜液镀铜基板的方法
EP4545680B1 (fr) *	2023-10-26	2026-03-04	Atotech Deutschland GmbH & Co. KG	Solution de cuivrage sans courant et sans nickel et procede d'utilisation de cette solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3075856A (en) *	1958-03-31	1963-01-29	Gen Electric	Copper plating process and solution
US3300335A (en) *	1963-11-20	1967-01-24	Dow Chemical Co	Electroless metal plating with foam
US3485643A (en) *	1966-05-06	1969-12-23	Photocircuits Corp	Electroless copper plating
US3472664A (en) *	1966-09-15	1969-10-14	Enthone	Inhibiting stardusting in electroless copper plating
US3515563A (en) *	1967-12-28	1970-06-02	Photocircuits Corp	Autocatalytic metal plating solutions

0
- BE BE757573D patent/BE757573A/fr not_active IP Right Cessation
1969
- 1969-10-16 NL NL6915718A patent/NL6915718A/xx unknown
1970
- 1970-10-06 DE DE2049061A patent/DE2049061C3/de not_active Expired
- 1970-10-13 GB GB4859070A patent/GB1330332A/en not_active Expired
- 1970-10-13 AT AT922170A patent/AT311145B/de not_active IP Right Cessation
- 1970-10-13 CA CA095,339A patent/CA947458A/en not_active Expired
- 1970-10-13 AU AU21013/70A patent/AU2101370A/en not_active Expired
- 1970-10-13 CH CH1511570A patent/CH550255A/xx not_active IP Right Cessation
- 1970-10-15 FR FR7037240A patent/FR2065996A5/fr not_active Expired
1972
- 1972-04-06 US US00241806A patent/US3804638A/en not_active Expired - Lifetime
1976
- 1976-07-29 HK HK495/76*UA patent/HK49576A/xx unknown

Also Published As

Publication number	Publication date
DE2049061B2 (de)	1980-07-24
NL6915718A (fr)	1971-04-20
AU2101370A (en)	1972-04-20
CH550255A (de)	1974-06-14
DE2049061A1 (de)	1971-04-29
US3804638A (en)	1974-04-16
FR2065996A5 (fr)	1971-08-06
DE2049061C3 (de)	1981-04-30
BE757573A (fr)	1971-04-15
AT311145B (de)	1973-10-25
GB1330332A (en)	1973-09-19
HK49576A (en)	1976-08-06

Publication	Publication Date	Title
CA947458A (en)	1974-05-21	Electroless deposition of ductile copper
CA927220A (en)	1973-05-29	Electroless metal deposition
CA923252A (en)	1973-03-27	Electroless metal deposition
CA949332A (en)	1974-06-18	Deposition of copper values
CA990006A (en)	1976-06-01	Bath for the electroless deposition of ductile copper
CA922056A (en)	1973-03-06	Electroless copper plating solution and process
AU2328870A (en)	1972-06-15	Process of a1 plating
IL34975A0 (en)	1970-09-17	Metal plating of substrates
CA807061A (en)	1969-02-25	Electroless metal deposition
CA807059A (en)	1969-02-25	Electroless metal deposition
CA807060A (en)	1969-02-25	Electroless metal plating
YU34223B (en)	1979-02-28	Process for the electroless deposition of metal
AU429168B2 (en)	1971-02-04	Electroless; copper plating
CA829773A (en)	1969-12-16	Method of electroless plating
AU432661B2 (en)	1971-01-21	Metal plating of substrates
AU451823B2 (en)	1972-01-27	Metal plating of substrates
CA927219A (en)	1973-05-29	Metal plating of substrates
CA828697A (en)	1969-12-02	Electroless metal coating
AU424078B2 (en)	1971-07-01	Electroless copper plating
AU2328567A (en)	1969-01-09	Electroless metal plating of polymeric substrates
AU5865769A (en)	1971-02-04	Electroless; copper plating
AU1799570A (en)	1972-01-27	Metal plating of substrates
AU5812869A (en)	1971-01-21	Metal plating of substrates
AU6561969A (en)	1971-07-15	Metal plating of thermplastics
AU6536869A (en)	1971-07-01	Electroless copper plating