AT506622A3 - Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger - Google Patents

Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger Download PDF

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Publication number
AT506622A3
AT506622A3 ATA357/2009A AT3572009A AT506622A3 AT 506622 A3 AT506622 A3 AT 506622A3 AT 3572009 A AT3572009 A AT 3572009A AT 506622 A3 AT506622 A3 AT 506622A3
Authority
AT
Austria
Prior art keywords
wafer
carrier
applying
disconnecting
membrane
Prior art date
Application number
ATA357/2009A
Other languages
English (en)
Other versions
AT506622B1 (de
AT506622A2 (de
Original Assignee
Thallner Erich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thallner Erich filed Critical Thallner Erich
Publication of AT506622A2 publication Critical patent/AT506622A2/de
Publication of AT506622A3 publication Critical patent/AT506622A3/de
Application granted granted Critical
Publication of AT506622B1 publication Critical patent/AT506622B1/de

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Die Erfindung betrifft eine Vorrichtung zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger mit- einer parallel zu einer Kontaktfläche des Wafers ausrichtbaren, verformbaren Membran mit einer Kontaktseite zur zumindest teilweisen Kontaktierung der Kontaktfläche,- rückwärtig zu der Kontaktseite angeordneten Verformungsmitteln zur definiert steuerbaren Verformung der Membran und- Haftmitteln zur Anhaftung des Wafers an die Membran sowie Verfahren zum Ablösen und/oder Aufbringen eines Wafers von einem/auf einen Träger mit einer entsprechenden Vorrichtung.
ATA357/2009A 2008-04-12 2009-03-05 Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger AT506622B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008018536.1A DE102008018536B4 (de) 2008-04-12 2008-04-12 Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger

Publications (3)

Publication Number Publication Date
AT506622A2 AT506622A2 (de) 2009-10-15
AT506622A3 true AT506622A3 (de) 2012-11-15
AT506622B1 AT506622B1 (de) 2016-01-15

Family

ID=41060606

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA357/2009A AT506622B1 (de) 2008-04-12 2009-03-05 Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger

Country Status (4)

Country Link
US (1) US8157615B2 (de)
JP (1) JP5421629B2 (de)
AT (1) AT506622B1 (de)
DE (1) DE102008018536B4 (de)

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DE102006026331B4 (de) * 2006-06-02 2019-09-26 Erich Thallner Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit
US8950459B2 (en) 2009-04-16 2015-02-10 Suss Microtec Lithography Gmbh Debonding temporarily bonded semiconductor wafers
US8764026B2 (en) * 2009-04-16 2014-07-01 Suss Microtec Lithography, Gmbh Device for centering wafers
US8366873B2 (en) * 2010-04-15 2013-02-05 Suss Microtec Lithography, Gmbh Debonding equipment and methods for debonding temporary bonded wafers
US9275029B2 (en) 2009-12-02 2016-03-01 International Business Machines Corporation Automated form layout based upon usage patterns
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9064686B2 (en) 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
KR101570917B1 (ko) 2011-04-11 2015-11-20 에베 그룹 에. 탈너 게엠베하 가요성의 캐리어 마운트 및 캐리어 기판을 분리하기 위한 장치 및 방법
EP2795669B1 (de) * 2011-12-22 2020-06-17 EV Group E. Thallner GmbH Biegsame substrathalterung, vorrichtung und verfahren zum lösen eines ersten substrats
US9233452B2 (en) * 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
KR102036907B1 (ko) * 2013-04-17 2019-10-28 삼성디스플레이 주식회사 패턴 마스크 제작을 위한 금속 시트의 고정 장치
CN105612598B (zh) * 2013-09-25 2019-09-24 芝浦机械电子株式会社 吸附台、贴合装置以及贴合基板的制造方法
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US20170140971A1 (en) * 2015-11-14 2017-05-18 Nachiket R. Raravikar Adhesive with tunable adhesion for handling ultra-thin wafer
DE102019135499B3 (de) * 2019-12-20 2021-04-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ablöseelement, Ablöseeinheit und Verfahren zum Ablösen einer Halbleiterschicht von einem Substrat
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
CN112053937B (zh) * 2020-08-05 2024-02-20 武汉新芯集成电路制造有限公司 一种降低破损率的晶圆解键合方法及装置

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WO2005005096A1 (en) * 2003-07-14 2005-01-20 Systems On Silicon Manufacturing Co. Pte. Ltd. Perforated plate for wafer chuck
WO2007143566A2 (en) * 2006-06-02 2007-12-13 Applied Materials, Inc. Fast substrate loading on polishing head without membrane inflation step

Also Published As

Publication number Publication date
JP2009260317A (ja) 2009-11-05
US8157615B2 (en) 2012-04-17
AT506622B1 (de) 2016-01-15
DE102008018536A1 (de) 2009-10-15
AT506622A2 (de) 2009-10-15
US20090258583A1 (en) 2009-10-15
JP5421629B2 (ja) 2014-02-19
DE102008018536B4 (de) 2020-08-13

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