AT517254A3 - Verfahren zur Handhabung aufeinander ausgerichteter Waferpaare - Google Patents

Verfahren zur Handhabung aufeinander ausgerichteter Waferpaare Download PDF

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Publication number
AT517254A3
AT517254A3 ATA50442/2016A AT504422016A AT517254A3 AT 517254 A3 AT517254 A3 AT 517254A3 AT 504422016 A AT504422016 A AT 504422016A AT 517254 A3 AT517254 A3 AT 517254A3
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Austria
Prior art keywords
publication
end effector
semiconductor wafer
wafer pairs
march
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ATA50442/2016A
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English (en)
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AT517254B1 (de
AT517254A2 (de
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Suss Microtec Lithography Gmbh
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Publication of AT517254A2 publication Critical patent/AT517254A2/de
Publication of AT517254A3 publication Critical patent/AT517254A3/de
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Publication of AT517254B1 publication Critical patent/AT517254B1/de

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/331—Bonding techniques, e.g. hybrid bonding characterised by the application of energy for connecting
    • H10W80/333—Compression bonding
    • H10W80/334—Thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • User Interface Of Digital Computer (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

Ein für den industriellen Einsatz geeignetes Verfahren zur Handhabung präzise aufeinander ausgerichteter und zentrierter Halbleiter-Waferpaare für Wafer-zu-Wafer- Ausrichtungs- und -Bondungsanwendungen weist einen Endeffektor mit einem Rahmenelement und einem schwimmenden Träger auf, der mit dem Rahmenelement, mit einem dazwischen ausgebildeten Spalt, verbunden ist, wobei der schwimmende Träger einen halbkreisförmigen Innenumfangsrand hat. Die zentrierten Halbleiter-Waferpaare sind unter Verwendung des Endeffektors unter robotischer Steuerung innerhalb eines Verarbeitungssystems positionierbar. Die zentrierten Halbleiter-Waferpaare werden ohne Gegenwart des Endeffektors in der Bondungsvorrichtung miteinander verbondet.

Description

(30) Priorität:
15.05.2015 US 62/161,988 beansprucht.
(56) Entgegenhaltungen:
WO 0218107 A1 US 2014023776 A1 US 2015086316 A1 US 2014295656 A1 US 2013204421 A1 JP 2001225292 A (71) Patentanmelder:
SUSS MICROTEC LITHOGRAPHY GMBH 85748 Garching (DE) (74) Vertreter:
SONN & PARTNER

Claims (1)

  1. PATENTANWÄLTE WIEN
    AT 517254 A3 2018-09-15 (54) Verfahren zur Handhabung aufeinander ausgerichteter Waferpaare (57) Ein für den industriellen Einsatz geeignetes Verfahren zur Handhabung präzise aufeinander ausgerichteter und zentrierter Halbleiter-Waferpaare für Wafer-zuWafer- Ausrichtungs- und -Bondungsanwendungen weist einen Endeffektor mit einem Rahmenelement und einem schwimmenden Träger auf, der mit dem Rahmenelement, mit einem dazwischen ausgebildeten Spalt, verbunden ist, wobei der schwimmende Träger einen halbkreisförmigen Innenumfangsrand hat. Die zentrierten HalbleiterWaferpaare sind unter Verwendung des Endeffektors unter robotischer Steuerung innerhalb eines Verarbeitungssystems positionierbar. Die zentrierten Halbleiter-Waferpaare werden ohne Gegenwart des Endeffektors in der Bondungsvorrichtung miteinander verbondet.
    HG. 4
    DVR 0078018
    Recherchenbericht zu A 50442/2016
    Klassifikation des Anmeldungsgegenstands gemäß IPC: H01L 21/677 (2006.01); H01L 21/67 (2006.01); HOIL 21/687 (2006.01); H01L 21/683 (2006.01) Klassifikation des Anmeldungsgegenstands gemäß CPC: H01L 21/67742 (2013.01); H01L 21/67766 (2013.01); H01L 21/67092 (2013.01); H01L 21/68721 (2013.01); H01L 21/687 (2013.01); H01L 21/6838 (2013.01); H01L 21/68728 (2013.01) Recherchierter Prüfstoff (Klassifikation): H01L Konsultierte Online-Datenbank: WPI, EPODOC, Volltext Dieser Recherchenbericht wurde zu den am 13.07.2016 eingereichten Ansprüchen 1-20 erstellt. Kategorie*· Bezeichnung der Veröffentlichung: Ländercode, Veröffentlichungsnummer, Dokumentart (Anmelder), Veröffentlichungsdatum, Textstelle oder Figur soweit erforderlich Betreffend Anspruch Y Y X X A A WO 0218107 Al (ASYST TECHNOLOGIES) 07. März 2002 (07.03.2002) Fig. 1 und dazugehöriger Text. US 2014023776 Al (KUWAHARA JOJI et al.) 23. Januar 2014 (23.01.2014) Fig. 7A, Merkmal sra. US 2015086316 Al (GREENBERG DANIEL) 26. März 2015 (26.03.2015) Fig. 6A - 6C und dazugehöriger Text. US 2014295656 Al (WATERWORTH BLAKE et al.) 02. Oktober 2014 (02.10.2014) Fig. 9. US 2013204421 Al (HAYASHI TOKUTAROU et al.) 08. August 2013 (08.08.2013) Fig. 2 & 3. JP 2001225292 A (SUMITOMO HEAVY INDUSTRIES) 21. August 2001 (21.08.2001) das ganze Dokument. 1-4, 6-8, 15, 20 1-4, 6-8, 15, 20 1, 2, 4, 15 1 1-20 1-20 Datum der Beendigung der Recherche: „ . , , Prüfer(in): 29.05.2018 beite 1 von 1 rOBISCH Nicolas > Kategorien der angeführten Dokumente: A Veröffentlichung, die den allgemeinen Stand der Technik definiert. X Veröffentlichung von besonderer Bedeutung: der Anmeldungs- P Dokument, das von Bedeutung ist (Kategorien X oder Y), jedoch nach gegenständ kann allein aufgrund dieser Druckschrift nicht als neu bzw. auf dem Prioritätstag der Anmeldung veröffentlicht wurde. erfinderischer Tätigkeit beruhend betrachtet werden. E Dokument, das von besonderer Bedeutung ist (Kategorie X), aus dem Y Veröffentlichung von Bedeutung: der Anmeldungsgegenstand kann nicht ein „älteres Recht“ hervorgehen könnte (früheres Anmeldedatum, jedoch als auf erfinderischer Tätigkeit beruhend betrachtet werden, wenn die nachveröffentlicht, Schutz ist in Österreich möglich, würde Neuheit in Frage Veröffentlichung mit einer oder mehreren weiteren Veröffentlichungen stellen). dieser Kategorie in Verbindung gebracht wird und diese Verbindung für & Veröffentlichung, die Mitglied der selben Patentfamilie ist. einen Fachmann naheliegend ist.
    1/1
    DVR 0078018
ATA50442/2016A 2015-05-15 2016-05-13 Verfahren zur Handhabung aufeinander ausgerichteter Waferpaare AT517254B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562161988P 2015-05-15 2015-05-15

Publications (3)

Publication Number Publication Date
AT517254A2 AT517254A2 (de) 2016-12-15
AT517254A3 true AT517254A3 (de) 2018-09-15
AT517254B1 AT517254B1 (de) 2020-01-15

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ID=57208539

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ATA50443/2016A AT517258B1 (de) 2015-05-15 2016-05-13 Vorrichtung zur Handhabung ausgerichteter Waferpaare
ATA50442/2016A AT517254B1 (de) 2015-05-15 2016-05-13 Verfahren zur Handhabung aufeinander ausgerichteter Waferpaare

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ATA50443/2016A AT517258B1 (de) 2015-05-15 2016-05-13 Vorrichtung zur Handhabung ausgerichteter Waferpaare

Country Status (7)

Country Link
US (3) US9640418B2 (de)
JP (2) JP6689668B2 (de)
KR (2) KR102173844B1 (de)
CN (2) CN106158714B (de)
AT (2) AT517258B1 (de)
DE (2) DE102016108787B4 (de)
TW (2) TWI706502B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11183401B2 (en) * 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
US9640418B2 (en) 2015-05-15 2017-05-02 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
JP6700130B2 (ja) * 2016-07-12 2020-05-27 東京エレクトロン株式会社 接合システム
US9975255B1 (en) * 2016-12-15 2018-05-22 Jabil Inc. Apparatus, system and method for providing a conformable vacuum cup for an end effector
CN109256353B (zh) * 2017-07-12 2021-10-22 家登精密工业股份有限公司 定位底座
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