AT520028A3 - System und zugehörige Techniken zur Handhabung aufeinander ausgerichteter Substratpaare - Google Patents

System und zugehörige Techniken zur Handhabung aufeinander ausgerichteter Substratpaare Download PDF

Info

Publication number
AT520028A3
AT520028A3 ATA50452/2018A AT504522018A AT520028A3 AT 520028 A3 AT520028 A3 AT 520028A3 AT 504522018 A AT504522018 A AT 504522018A AT 520028 A3 AT520028 A3 AT 520028A3
Authority
AT
Austria
Prior art keywords
substrates
aligned
pairs
wafer
another
Prior art date
Application number
ATA50452/2018A
Other languages
English (en)
Other versions
AT520028A2 (de
AT520028B1 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT520028A2 publication Critical patent/AT520028A2/de
Publication of AT520028A3 publication Critical patent/AT520028A3/de
Application granted granted Critical
Publication of AT520028B1 publication Critical patent/AT520028B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
    • B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/301—Bonding techniques, e.g. hybrid bonding
    • H10W80/331—Bonding techniques, e.g. hybrid bonding characterised by the application of energy for connecting
    • H10W80/333—Compression bonding
    • H10W80/334—Thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)

Abstract

Es wird ein System im industriellen Maßstab zum Handhaben präzise aufeinander ausgerichteter und zentrierter Halbleitersubstrat (zum Beispiel Wafer)- Paare für Substrat-zu-Substrat (zum Beispiel Wafer-zu-Wafer)-Ausrichtungs- und Bondungsanwendungen bereitgestellt. Einige Ausführungsformen umfassen eine Vorrichtung (100) für den Transport aufeinander ausgerichteter Substrate (20, 30), die ein Rahmenelement (110) und eine Abstandshalteranordnung µ aufweist. Die zentrierten Halbleitersubstratpaare können innerhalb eines Verarbeitungssystems, das die Vorrichtung (100) für den Transport aufeinander ausgerichteter Substrate (20, 30) verwendet, optional unter Robotersteuerung, positioniert werden. Die zentrierten Halbleitersubstratpaare können ohne Gegenwart der Vorrichtung (100) für den Transport aufeinander ausgerichteter Substrate (20, 30) in der Bondungsvorrichtung miteinander verbondet werden. Die Bondungsvorrichtung kann eine zweite Abstandshalteranordnung umfassen, die in Abstimmung mit derjenigen für die Vorrichtung (100) für den Transport aufeinander ausgerichteter Substrate (20, 30) arbeitet, um eine Abstandshalterübergabe zwischen den Substraten (20, 30) auszuführen
ATA50452/2018A 2017-06-06 2018-06-06 System und zugehörige Techniken zur Handhabung aufeinander ausgerichteter Substratpaare AT520028B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762515883P 2017-06-06 2017-06-06
US15/680,706 US11183401B2 (en) 2015-05-15 2017-08-18 System and related techniques for handling aligned substrate pairs

Publications (3)

Publication Number Publication Date
AT520028A2 AT520028A2 (de) 2018-12-15
AT520028A3 true AT520028A3 (de) 2021-07-15
AT520028B1 AT520028B1 (de) 2023-07-15

Family

ID=64279116

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50452/2018A AT520028B1 (de) 2017-06-06 2018-06-06 System und zugehörige Techniken zur Handhabung aufeinander ausgerichteter Substratpaare

Country Status (9)

Country Link
US (1) US11183401B2 (de)
JP (1) JP7251926B2 (de)
KR (1) KR102514884B1 (de)
CN (1) CN109003932B (de)
AT (1) AT520028B1 (de)
DE (1) DE102018112915A1 (de)
NL (1) NL2021059B1 (de)
SG (1) SG10201804808TA (de)
TW (1) TWI765054B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
CN111696857B (zh) * 2019-03-11 2023-04-07 上海新微技术研发中心有限公司 真空键合晶圆片的制造方法及圆形夹具总成
CN110744733B (zh) * 2019-09-25 2021-12-03 智科博芯(北京)科技有限公司 一种基于输送优化的plc内置八度角芯片的晶圆划片机
CN112582296B (zh) * 2019-09-29 2023-06-02 上海微电子装备（集团）股份有限公司 晶圆键合装置及方法
CN111211075B (zh) * 2020-02-28 2025-03-25 上海新微技术研发中心有限公司 一种三层晶圆键合的对准设备以及键合方法
WO2021194782A1 (en) * 2020-03-27 2021-09-30 Corning Incorporated Positioning devices for radially positioning substrates with respect to an air bearing device
KR102808488B1 (ko) * 2021-06-14 2025-05-16 세메스 주식회사 가이드 유닛, 이를 포함하는 반송 어셈블리 및 다이 본딩 장치
CN114361063B (zh) * 2021-11-24 2024-12-13 苏州科阳半导体有限公司 基板键合方法及基板
US20250316523A1 (en) * 2024-04-05 2025-10-09 Nanya Technology Corporation Wafer holding tool

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020032044A (ko) * 2000-10-25 2002-05-03 최우범 웨이퍼 접합장치의 스페이서 이동용 슬라이드장치
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
US20100071847A1 (en) * 2008-09-24 2010-03-25 Samsung Electronics Co., Ltd. Wafer bonding apparatus
KR20110033456A (ko) * 2009-09-25 2011-03-31 김철수 기판의 결합장치 및 결합방법
KR20160064789A (ko) * 2014-11-28 2016-06-08 코스텍시스템(주) 웨이퍼 본딩 장치 및 본딩 방법

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970003907B1 (ko) 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP2867194B2 (ja) 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
US5222293A (en) * 1992-04-23 1993-06-29 Eastman Kodak Company System for placing an object on a carrier and method
US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
JP3892494B2 (ja) 1996-01-26 2007-03-14 東京エレクトロン株式会社 基板搬送装置
JP3722598B2 (ja) 1997-07-16 2005-11-30 株式会社ダイヘン ２アーム方式の搬送用ロボット装置
JP2000100895A (ja) * 1998-09-18 2000-04-07 Nikon Corp 基板の搬送装置、基板の保持装置、及び基板処理装置
EP1401617A1 (de) 2000-09-01 2004-03-31 Asyst Technologies, Inc. Kantengreifausrichtungsvorrichtung mit pufferfähigkeiten
DE10230373B3 (de) 2002-07-05 2004-03-04 Süss Microtec Lithography Gmbh Vorrichtung und Verfahren zum Bonden eines Stapels aus drei oder mehr scheibenförmigen Substraten, insbesondere eines 3-Wafer-Stacks
US7033126B2 (en) * 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
US20060120832A1 (en) 2004-11-08 2006-06-08 Rajeshwar Chhibber Method and apparatus for handling a substrate
JP4439464B2 (ja) 2005-12-06 2010-03-24 東京エレクトロン株式会社 基板搬送方法及び基板搬送装置
US7948034B2 (en) 2006-06-22 2011-05-24 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor bonding
JP4854427B2 (ja) 2006-08-11 2012-01-18 東京エレクトロン株式会社 基板移載装置，基板処理装置，基板移載用アーム
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
JP2009194264A (ja) 2008-02-18 2009-08-27 Nikon Corp 基板貼り合わせ装置
JP5370903B2 (ja) * 2008-02-18 2013-12-18 株式会社ニコン 基板貼り合わせ方法
US8139219B2 (en) 2008-04-02 2012-03-20 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor wafer alignment
JP5226443B2 (ja) * 2008-09-22 2013-07-03 株式会社ウインズ 半導体ウエーハ搬送用ハンド
US8181688B2 (en) 2009-04-16 2012-05-22 Suss Microtec Lithography, Gmbh Apparatus for temporary wafer bonding and debonding
JP2011205004A (ja) 2010-03-26 2011-10-13 Sokudo Co Ltd 基板処理装置および基板処理方法
US8567837B2 (en) 2010-11-24 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Reconfigurable guide pin design for centering wafers having different sizes
JP2012156163A (ja) * 2011-01-21 2012-08-16 Toshiba Corp 半導体製造装置
FR2972078A1 (fr) 2011-02-24 2012-08-31 Soitec Silicon On Insulator Appareil et procédé de collage par adhésion moléculaire
JP5490741B2 (ja) 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
US9293356B2 (en) * 2011-06-03 2016-03-22 Tel Nexx, Inc. Parallel single substrate processing system
CN103021906B (zh) 2011-09-22 2016-10-05 东京毅力科创株式会社 基板处理装置及基板处理方法
TWI523134B (zh) 2011-09-22 2016-02-21 東京威力科創股份有限公司 基板處理系統、基板搬運方法、及電腦記憶媒體
JP5673577B2 (ja) 2012-02-07 2015-02-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
SG194239A1 (en) 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
JP6118044B2 (ja) 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI625814B (zh) * 2012-07-27 2018-06-01 荏原製作所股份有限公司 工件搬送裝置
JP5886821B2 (ja) 2013-01-04 2016-03-16 ピーエスケー インコーポレイテッド 基板処理装置及び方法
US9061423B2 (en) 2013-03-13 2015-06-23 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus
JP6501447B2 (ja) * 2013-03-26 2019-04-17 芝浦メカトロニクス株式会社 貼合装置および貼合基板の製造方法
WO2014165406A1 (en) 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
WO2014188572A1 (ja) 2013-05-23 2014-11-27 株式会社ニコン 基板保持方法及び装置、並びに露光方法及び装置
JP6190645B2 (ja) 2013-07-09 2017-08-30 東京エレクトロン株式会社 基板搬送方法
US9899223B2 (en) 2013-09-25 2018-02-20 Ev Group E. Thallner Gmbh Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substrates
US9202738B2 (en) 2013-09-26 2015-12-01 Applied Materials, Inc. Pneumatic end effector apparatus and substrate transportation systems with annular flow channel
DE102015200698A1 (de) * 2014-01-20 2015-07-23 Süss Microtec Lithography Gmbh System und Verfahren zum Halten eines Substrats
US20150206783A1 (en) 2014-01-20 2015-07-23 Suss Microtec Lithography, Gmbh System amd method for substrate holding
KR20160048301A (ko) 2014-10-23 2016-05-04 삼성전자주식회사 본딩 장치 및 그를 포함하는 기판 제조 설비
US10755960B2 (en) 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
JP6412786B2 (ja) 2014-12-03 2018-10-24 東京応化工業株式会社 搬送方法
FR3031046B1 (fr) 2014-12-24 2018-06-29 Solystic Installation pour la separation et l'individualisation d'objets postaux heterogenes
JP6472693B2 (ja) * 2015-03-24 2019-02-20 株式会社荏原製作所 基板処理装置
US9640418B2 (en) * 2015-05-15 2017-05-02 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
TWM513454U (zh) * 2015-05-29 2015-12-01 漢磊科技股份有限公司 晶圓傳輸裝置
US10381257B2 (en) * 2015-08-31 2019-08-13 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction
KR101817209B1 (ko) 2016-06-24 2018-02-22 세메스 주식회사 기판 처리 장치 및 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020032044A (ko) * 2000-10-25 2002-05-03 최우범 웨이퍼 접합장치의 스페이서 이동용 슬라이드장치
JP2004207436A (ja) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk ウエハのプリアライメント方法とその装置ならびにウエハの貼り合わせ方法とその装置
US20100071847A1 (en) * 2008-09-24 2010-03-25 Samsung Electronics Co., Ltd. Wafer bonding apparatus
KR20110033456A (ko) * 2009-09-25 2011-03-31 김철수 기판의 결합장치 및 결합방법
KR20160064789A (ko) * 2014-11-28 2016-06-08 코스텍시스템(주) 웨이퍼 본딩 장치 및 본딩 방법

Also Published As

Publication number Publication date
JP2019024081A (ja) 2019-02-14
KR102514884B1 (ko) 2023-03-28
CN109003932B (zh) 2023-10-31
KR20180133337A (ko) 2018-12-14
US11183401B2 (en) 2021-11-23
NL2021059A (en) 2018-12-11
SG10201804808TA (en) 2019-01-30
TW201903919A (zh) 2019-01-16
TWI765054B (zh) 2022-05-21
JP7251926B2 (ja) 2023-04-04
US20170372925A1 (en) 2017-12-28
CN109003932A (zh) 2018-12-14
NL2021059B1 (en) 2019-04-19
AT520028A2 (de) 2018-12-15
AT520028B1 (de) 2023-07-15
DE102018112915A1 (de) 2018-12-06

Similar Documents

Publication Publication Date Title
AT520028A3 (de) System und zugehörige Techniken zur Handhabung aufeinander ausgerichteter Substratpaare
JP2018513554A5 (de)
SG11201902878VA (en) Batch bonding apparatus and bonding method
PH12018501980A1 (en) Chip packaging apparatus and method thereof
SG11201806899XA (en) Conveyance system
SG11201806511XA (en) Device and method for bonding substrates
SG11201807215RA (en) Chip bonding apparatus and method
MY191396A (en) Method of reducing residual contamination in singulated semiconductor die
CL2020000525A1 (es) Ensayo para identificar una bacteria capaz de unir metal pesado elemental tal como oro y/o plata. (divisional solicitud 201702462)
EP2489977A3 (de) Vorrichtung und Verfahren zur Bestimmung der 3-D-Koordinaten eines Objekts und zum Kalibrieren eines Industrieroboters
SG11201908780RA (en) Substrate processing apparatus
FR3037142B1 (fr) Dispositif de mesure de pression a fiabilite amelioree et procede de calibrage associe
EP2924417A3 (de) Verfahren und vorrichtung zum bestimmung der korngrösse eines düngers
MY191419A (en) Wafer processing method
MY200378A (en) Wafer processing method
MX2024012594A (es) Sistema y metodo para fabricacion aditiva mediante el uso de un aparato de movimiento magnetico omnidireccional
EP4616777A3 (de) Reinigungssystem und verfahren zur reinigung von reinigungsgut
MY198794A (en) Workpiece processing method and processing apparatus
AT521797A3 (de) Fixierungssystem, Auflageplatte und Herstellungsverfahren
WO2017104354A1 (ja) ガラス板の製造方法
AT517639A5 (de) Vorrichtung und Verfahren zum Bonden
AT519921A3 (de) Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat
KR102321538B1 (ko) 취성재료 기판의 브레이크 장치
EP0791667A3 (de) Vorrichtung zum Greifen, Halten und/oder Transportieren von Substraten
US20170345695A1 (en) Apparatus and method for operating machinery under uniformly distributed mechanical pressure