AT519921A3 - Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat - Google Patents

Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat Download PDF

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Publication number
AT519921A3
AT519921A3 ATA50329/2018A AT503292018A AT519921A3 AT 519921 A3 AT519921 A3 AT 519921A3 AT 503292018 A AT503292018 A AT 503292018A AT 519921 A3 AT519921 A3 AT 519921A3
Authority
AT
Austria
Prior art keywords
substrate
aligning
image
positioning device
pixels
Prior art date
Application number
ATA50329/2018A
Other languages
English (en)
Other versions
AT519921A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT519921A2 publication Critical patent/AT519921A2/de
Publication of AT519921A3 publication Critical patent/AT519921A3/de

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Die Erfindung betrifft ein Verfahren (100) zum Aus-richten eines ersten Substrats (201), insbesondere einer Maske, zu einem zweiten Substrat (203), insbesondere einem Wafer, mit: Einsetzen (101) des ersten Substrats (201) und des zweiten Substrats (203) in eine Positionierungseinrichtung (205); Aufnehmen (103) zumindest eines gemeinsamen Bildes (301) des ersten Substrats (201) und des zweiten Substrats (203); Anzeigen (105) des Bildes (301); Markieren (107) einer Vielzahl von Bildpunkten im Bild (301) durch einen Benutzer; und Ermitteln (109) eines Steuerbefehls zum Ansteuern der Positionierungseinrichtung (205) auf der Basis der markierten Bildpunkte, so dass die Substrate (201, 203) zueinander ausgerichtet werden.
ATA50329/2018A 2017-05-05 2018-04-19 Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat AT519921A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2018856A NL2018856B1 (en) 2017-05-05 2017-05-05 Method and device for aligning a first substrate with a second substrate

Publications (2)

Publication Number Publication Date
AT519921A2 AT519921A2 (de) 2018-11-15
AT519921A3 true AT519921A3 (de) 2020-02-15

Family

ID=59812066

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50329/2018A AT519921A3 (de) 2017-05-05 2018-04-19 Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat

Country Status (8)

Country Link
US (1) US20180323069A1 (de)
JP (1) JP2018189953A (de)
KR (1) KR20180122953A (de)
CN (1) CN108807252A (de)
AT (1) AT519921A3 (de)
DE (1) DE102018108948A1 (de)
NL (1) NL2018856B1 (de)
TW (1) TW201843761A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10847369B2 (en) * 2018-12-26 2020-11-24 Samsung Electronics Co., Ltd. Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor
FR3105876B1 (fr) * 2019-12-30 2021-11-26 Soitec Silicon On Insulator Procédé de fabrication d’une structure composite comprenant une couche mince en SiC monocristallin sur un substrat support
CN115274528B (zh) * 2022-09-22 2022-12-06 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 一种芯片倒装键合用标定玻璃片
US20240258141A1 (en) * 2023-01-26 2024-08-01 Applied Materials, Inc. Methods and apparatus for calibration of substrate processing chamber placement via imaging

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030092244A1 (en) * 2000-04-28 2003-05-15 Hiroyuki Oi Method and apparatus for producing bonded dielectric separation wafer
US6856029B1 (en) * 2001-06-22 2005-02-15 Lsi Logic Corporation Process independent alignment marks
US20110134235A1 (en) * 2008-10-30 2011-06-09 Mitsubishi Heavy Industries, Ltd. Alignment unit control apparatus and alignment method
WO2014112512A1 (ja) * 2013-01-15 2014-07-24 株式会社アルバック アラインメント装置、及びアラインメント方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052603A (en) * 1974-12-23 1977-10-04 International Business Machines Corporation Object positioning process and apparatus
EP1253817A3 (de) * 2001-04-23 2003-07-09 Liconic Ag Einrichtung zum Aufnehmen und Plazieren von kleinen Gegenständen
CN100476599C (zh) * 2002-09-20 2009-04-08 Asml荷兰有限公司 光刻标记结构、包含该光刻标记结构的光刻投射装置和利用该光刻标记结构进行基片对准的方法
US7259828B2 (en) * 2004-05-14 2007-08-21 Asml Netherlands B.V. Alignment system and method and device manufactured thereby
JP2010045099A (ja) * 2008-08-11 2010-02-25 Adwelds:Kk アライメントマーク画像の表示方法およびアライメント装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030092244A1 (en) * 2000-04-28 2003-05-15 Hiroyuki Oi Method and apparatus for producing bonded dielectric separation wafer
US6856029B1 (en) * 2001-06-22 2005-02-15 Lsi Logic Corporation Process independent alignment marks
US20110134235A1 (en) * 2008-10-30 2011-06-09 Mitsubishi Heavy Industries, Ltd. Alignment unit control apparatus and alignment method
WO2014112512A1 (ja) * 2013-01-15 2014-07-24 株式会社アルバック アラインメント装置、及びアラインメント方法

Also Published As

Publication number Publication date
US20180323069A1 (en) 2018-11-08
NL2018856B1 (en) 2018-11-14
JP2018189953A (ja) 2018-11-29
CN108807252A (zh) 2018-11-13
AT519921A2 (de) 2018-11-15
KR20180122953A (ko) 2018-11-14
TW201843761A (zh) 2018-12-16
DE102018108948A1 (de) 2018-11-08

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Effective date: 20210515