ATE331758T1 - Flammhemmende formbare zusammensetzungen - Google Patents

Flammhemmende formbare zusammensetzungen

Info

Publication number: ATE331758T1
Authority: AT; Austria
Prior art keywords: molding composition; elements; flame retardant; electrical; group
Prior art date: 2003-04-30

Application number

AT03790193T

Other languages

English (en)

Inventor

Tanweer Ahsan

Charles N Volante

Charles S Bischof

Original Assignee

Henkel Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-04-30

Filing date

2003-11-25

Publication date

2006-07-15

2003-11-25 Application filed by Henkel Corp filed Critical Henkel Corp

2006-07-15 Application granted granted Critical

2006-07-15 Publication of ATE331758T1 publication Critical patent/ATE331758T1/de

Links

239000000203 mixture Substances 0.000 title abstract 5
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract 2
239000003063 flame retardant Substances 0.000 title abstract 2
238000000465 moulding Methods 0.000 abstract 4
239000002184 metal Substances 0.000 abstract 3
150000003839 salts Chemical class 0.000 abstract 2
150000001642 boronic acid derivatives Chemical class 0.000 abstract 1
150000001875 compounds Chemical class 0.000 abstract 1
239000003822 epoxy resin Substances 0.000 abstract 1
238000010438 heat treatment Methods 0.000 abstract 1
ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
229920000647 polyepoxide Polymers 0.000 abstract 1
229920000642 polymer Polymers 0.000 abstract 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34928—Salts
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Paints Or Removers (AREA)
Fireproofing Substances (AREA)

AT03790193T 2003-04-30 2003-11-25 Flammhemmende formbare zusammensetzungen ATE331758T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US10/426,374 US6936646B2 (en)	2003-04-30	2003-04-30	Flame-retardant molding compositions

Publications (1)

Publication Number	Publication Date
ATE331758T1 true ATE331758T1 (de)	2006-07-15

Family

ID=33309850

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT03790193T ATE331758T1 (de)	2003-04-30	2003-11-25	Flammhemmende formbare zusammensetzungen

Country Status (10)

Country	Link
US (2)	US6936646B2 (de)
EP (1)	EP1622976B1 (de)
JP (1)	JP4870928B2 (de)
KR (1)	KR101068791B1 (de)
CN (2)	CN102010574B (de)
AT (1)	ATE331758T1 (de)
AU (1)	AU2003293202A1 (de)
DE (1)	DE60306554T2 (de)
MX (1)	MXPA05011648A (de)
WO (1)	WO2004099313A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6846448B2 (en) *	2001-12-20	2005-01-25	Kimberly-Clark Worldwide, Inc.	Method and apparatus for making on-line stabilized absorbent materials
US7456235B2 (en) *	2003-04-30	2008-11-25	Henkel Corporation	Flame-retardant composition for coating powders
SG109590A1 (en) *	2003-08-29	2005-03-30	Sumitomo Bakelite Co	Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
DE602005017509D1 (de) *	2004-11-26	2009-12-17	Lg Chemical Ltd	Nicht-halogene flammenhemmende epoxidharzzusammensetzung und prepreg sowie kupferkaschiertes laminat damit
US20090234080A1 (en) *	2005-09-27	2009-09-17	Sumitomo Dakelite Co., Ltd.	Process for producing latent catalyst and epoxy resin composition
KR100758880B1 (ko) *	2005-12-20	2007-09-14	제일모직주식회사	비할로겐계 반도체 소자 밀봉용 에폭시 수지 조성물
KR100751181B1 (ko) *	2005-12-21	2007-08-22	제일모직주식회사	반도체 소자 밀봉용 에폭시 수지 조성물
WO2008051120A1 (en) *	2006-10-25	2008-05-02	Pp Polymer Ab	Flame retardant additive for polymers, free of halogens, antimony oxide and phosphorus containg substances
JP5470680B2 (ja) *	2007-02-06	2014-04-16	日亜化学工業株式会社	発光装置及びその製造方法並びに成形体
US20080255283A1 (en) *	2007-02-06	2008-10-16	Takayuki Aoki	Thermosetting epoxy resin composition and semiconductor device
DE102007041988A1 (de) *	2007-09-05	2009-03-12	Forschungszentrum Karlsruhe Gmbh	Flammhemmende Additive
US8703288B2 (en) *	2008-03-21	2014-04-22	General Cable Technologies Corporation	Low smoke, fire and water resistant cable coating
JP5886629B2 (ja) *	2009-01-06	2016-03-16	ブルーキューブアイピーエルエルシー	非臭素化難燃性エポキシ樹脂における金属化合物
JP5504803B2 (ja) *	2009-09-30	2014-05-28	住友ベークライト株式会社	フェノール樹脂成形材料
DE102010004743A1 (de) *	2010-01-14	2011-07-21	Merck Patent GmbH, 64293	Laseradditiv
US8481626B1 (en)	2012-01-16	2013-07-09	Itron, Inc.	Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
US8728568B2 (en)	2012-01-16	2014-05-20	Itron, Inc.	Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
EP2828321B1 (de) *	2012-03-23	2016-04-27	Dow Global Technologies LLC	Flammhemmende epoxidharzstrukturkleber und verfahren zum verkleben von metallteilen
JP2014208839A (ja) *	2014-07-02	2014-11-06	ダウグローバルテクノロジーズエルエルシー	非臭素化難燃性エポキシ樹脂における金属化合物
US10531555B1 (en) *	2016-03-22	2020-01-07	The United States Of America As Represented By The Secretary Of The Army	Tungsten oxide thermal shield
JP6821316B2 (ja) *	2016-03-29	2021-01-27	上野製薬株式会社	液晶ポリマー組成物
EP3275914B1 (de)	2016-07-29	2022-05-11	3M Innovative Properties Company	Flammhemmende klebstoffzusammensetzung
EP3275915B1 (de)	2016-07-29	2022-11-30	3M Innovative Properties Company	Nichthalogener schnellhärtender zweikomponentiger epoxidklebstoff mit flammhemmenden eigenschaften
CN107652684A (zh) *	2017-10-25	2018-02-02	浙江威思康塑胶有限公司	一种电缆用复合阻燃协效剂
WO2019083003A1 (ja) *	2017-10-27	2019-05-02	Ｊｘｔｇエネルギー株式会社	硬化樹脂用組成物、該組成物の硬化物、該組成物および該硬化物の製造方法、ならびに半導体装置
JP6896591B2 (ja) *	2017-11-14	2021-06-30	Ｅｎｅｏｓ株式会社	プリプレグ、繊維強化複合材料及び成形体
TWI889662B (zh)	2018-12-10	2025-07-11	日商引能仕材料股份有限公司	硬化樹脂用組合物、該組合物之硬化物、該組合物及該硬化物之製造方法、與半導體裝置
EP3917982B1 (de) *	2019-01-31	2023-02-01	Dow Global Technologies LLC	Isocyanatreaktive zusammensetzung
US12258472B2 (en)	2019-04-26	2025-03-25	Eneos Corporation	Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device
CN114456543B (zh) *	2021-12-29	2024-02-09	江苏中科科化新材料股份有限公司	环氧树脂组合物、环氧树脂塑封料及其制备方法和应用
CN116478581B (zh) *	2023-03-27	2024-01-02	清华大学	一种持续性除醛阻燃涂料及其制备方法和应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US629665A (en) *	1899-03-24	1899-07-25	Westinghouse Electric & Mfg Co	Controller for electric motors.
JPH06145602A (ja) *	1992-09-02	1994-05-27	Nippon Paint Co Ltd	熱硬化性塗料組成物
DE69401166T2 (de)	1993-05-25	1997-04-03	Sumitomo Bakelite Co	Flammfeste Harzzusammensetzung
JP2000091477A (ja) *	1993-08-20	2000-03-31	Nitto Denko Corp	半導体装置
AT400574B (de) *	1993-10-21	1996-01-25	Isovolta	Halogenfreie harzmischung, ein diese harzmischung enthaltendes, selbstverlöschendes prepreg sowie dessen verwendung
JPH07331033A (ja) *	1994-06-15	1995-12-19	Sumitomo Bakelite Co Ltd	強靭で難燃性良好なエポキシ樹脂組成物
ATE195138T1 (de) *	1995-04-10	2000-08-15	Shinetsu Chemical Co	Epoxyharzmassen zur einkapselung von halbleitern, deren herstellung und verwendung, sowie damit eingekapselte halbleiterbauteile
JPH0940752A (ja) *	1995-07-26	1997-02-10	Toshiba Chem Corp	難燃性エポキシ樹脂組成物
JPH1060229A (ja)	1996-08-20	1998-03-03	Toshiba Chem Corp	難燃性エポキシ樹脂組成物
DE19643279A1 (de) *	1996-10-21	1998-04-23	Basf Ag	Flammgeschützte Formmassen
EP0978542B1 (de)	1997-04-21	2007-10-24	Nitto Denko Corporation	Halbleiter-dichtharzzusammensetzung, damit versiegelte halbleiteranordnung, und verfahren zur herstellung einer halbleiteranordnung.
JPH11100492A (ja)	1997-09-29	1999-04-13	Nitto Denko Corp	半導体封止用樹脂組成物及びそれを用いた半導体装置
BR9806712A (pt) *	1997-10-15	2000-04-04	Otsuka Chemical Co Ltd	Composto de fenoxifosfazeno reticulado, retardadores de chamas, composições de resina retardadora de chamas, de moldagens de resinas retardadoras de chamas
US6207735B1 (en) *	1997-12-08	2001-03-27	Tosch Corporation	Flame retardant and flame retardant resin composition containing it
JP4029456B2 (ja)	1998-01-29	2008-01-09	日立化成工業株式会社	難燃性非ハロゲンエポキシ樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板
DE19903707C2 (de) *	1999-01-30	2003-05-28	Clariant Gmbh	Flammwidrige duroplastische Massen
JP2000226438A (ja) *	1999-02-03	2000-08-15	Sanyu Resin Kk	難燃性エポキシ樹脂組成物
US6440567B1 (en) *	2000-03-31	2002-08-27	Isola Laminate Systems Corp.	Halogen free flame retardant adhesive resin coated composite
JP2001302880A (ja) *	2000-04-18	2001-10-31	Toshiba Chem Corp	封止用樹脂組成物および半導体封止装置
WO2002000667A1 (en) *	2000-06-29	2002-01-03	Nippon Chemical Industrial Co., Ltd.	Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets
JP3511136B2 (ja) *	2000-09-25	2004-03-29	日立化成工業株式会社	封止用エポキシ樹脂成形材料及び半導体装置
US6660811B2 (en) *	2001-01-30	2003-12-09	Dainippon Ink And Chemicals, Inc.	Epoxy resin composition and curing product thereof
US20040166241A1 (en) *	2003-02-20	2004-08-26	Henkel Loctite Corporation	Molding compositions containing quaternary organophosphonium salts

2003
- 2003-04-30 US US10/426,374 patent/US6936646B2/en not_active Expired - Lifetime
- 2003-11-25 MX MXPA05011648A patent/MXPA05011648A/es active IP Right Grant
- 2003-11-25 JP JP2004571722A patent/JP4870928B2/ja not_active Expired - Fee Related
- 2003-11-25 EP EP03790193A patent/EP1622976B1/de not_active Expired - Lifetime
- 2003-11-25 KR KR1020057020483A patent/KR101068791B1/ko not_active Expired - Fee Related
- 2003-11-25 AT AT03790193T patent/ATE331758T1/de not_active IP Right Cessation
- 2003-11-25 CN CN2010105575134A patent/CN102010574B/zh not_active Expired - Fee Related
- 2003-11-25 DE DE60306554T patent/DE60306554T2/de not_active Expired - Lifetime
- 2003-11-25 WO PCT/US2003/038155 patent/WO2004099313A1/en not_active Ceased
- 2003-11-25 CN CNA2003801102888A patent/CN1771290A/zh active Pending
- 2003-11-25 AU AU2003293202A patent/AU2003293202A1/en not_active Abandoned
2005
- 2005-05-17 US US11/130,489 patent/US7338993B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
CN102010574A (zh)	2011-04-13
US7338993B2 (en)	2008-03-04
EP1622976A1 (de)	2006-02-08
DE60306554T2 (de)	2007-06-21
EP1622976B1 (de)	2006-06-28
AU2003293202A1 (en)	2004-11-26
KR101068791B1 (ko)	2011-09-30
MXPA05011648A (es)	2006-02-13
JP4870928B2 (ja)	2012-02-08
JP2006525377A (ja)	2006-11-09
WO2004099313A1 (en)	2004-11-18
DE60306554D1 (de)	2006-08-10
US6936646B2 (en)	2005-08-30
CN1771290A (zh)	2006-05-10
US20040217376A1 (en)	2004-11-04
US20050139861A9 (en)	2005-06-30
US20050209378A1 (en)	2005-09-22
KR20060007042A (ko)	2006-01-23
CN102010574B (zh)	2013-03-13

Legal Events

Date	Code	Title	Description
2006-12-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE331758T1 (de)	2006-07-15	Flammhemmende formbare zusammensetzungen
DE602007010741D1 (de)	2011-01-05	Emi-abschirmungs- und wärmemanagementbaugruppen mielung
TW200833758A (en)	2008-08-16	Heat-dissipating resin composition, substrate for LED mounting, reflector, and substrate for LED mounting having reflector portion
TW201129614A (en)	2011-09-01	Epoxy-containing polymer compound, photocurable resin composition comprising the same, method for forming pattern, and film for protecting electric/electronic part
MY145442A (en)	2012-02-15	Fire retardant compositions using siloxanes
DK1240811T3 (da)	2007-11-12	Konstruktionsramme af termisk ledende materiale
MY150635A (en)	2014-02-14	Resin composition and resin coated copper foil obtained by using the resin composition
DE50106154D1 (de)	2005-06-16	Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte
DE60102912D1 (de)	2004-05-27	Epoxyharzzusammensetzung sowie elektronisches teil
PH12012500386A1 (en)	2013-01-14	Adhesive film, multilayer circuit board, electronic component, and semiconductor device
DE502004007405D1 (de)	2008-07-31	Flammgeschützte polyamidformmassen und deren verwendung
ATE480579T1 (de)	2010-09-15	Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
DK1489140T3 (da)	2008-09-29	Flammehæmmende aromatisk polycarbonatharpikssammensætning
EP2445967A4 (de)	2013-12-18	Thermoplastische zusammensetzung mit expoxidiertem novolak
ATE266689T1 (de)	2004-05-15	Flammhemmende epoxyharze, die mit phosphor und silizium modifiziert sind
WO2007100724A3 (en)	2007-10-25	A halogen-free phosphorous epoxy resin composition
DE60326304D1 (de)	2009-04-09	Flammhemmende Harzzusammensetzungen
ATE398656T1 (de)	2008-07-15	Aushärtbare zusammensetzung und daraus hergestelltes mehrschichtiges substrat
DE602006002273D1 (de)	2008-09-25	Benzoxazin und epoxidharz enthaltende zusammensetzung
TW200631977A (en)	2006-09-16	Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
TW200733824A (en)	2007-09-01	Wiring circuit board
WO2005033161A3 (en)	2005-08-11	Epoxy resin compositions, processes utilzing same and articles made therefrom
TW200701422A (en)	2007-01-01	Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
WO2005033179A8 (en)	2005-05-26	Flame-retardant thermoset composition, method, and article
WO2013009113A3 (en)	2013-06-13	Epoxy resin compound and radiant heat circuit board using the same