ATE106068T1 - Silber-glas-pasten. - Google Patents

Silber-glas-pasten.

Info

Publication number
ATE106068T1
ATE106068T1 AT89309566T AT89309566T ATE106068T1 AT E106068 T1 ATE106068 T1 AT E106068T1 AT 89309566 T AT89309566 T AT 89309566T AT 89309566 T AT89309566 T AT 89309566T AT E106068 T1 ATE106068 T1 AT E106068T1
Authority
AT
Austria
Prior art keywords
paste
silver
glass
glass paste
silver glass
Prior art date
Application number
AT89309566T
Other languages
English (en)
Inventor
My N Nguyen
Julie H Wood
Thomas L Herrington
Original Assignee
Johnson Matthey Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Plc filed Critical Johnson Matthey Plc
Application granted granted Critical
Publication of ATE106068T1 publication Critical patent/ATE106068T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Die Bonding (AREA)
AT89309566T 1988-09-23 1989-09-20 Silber-glas-pasten. ATE106068T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/248,120 US4986849A (en) 1988-09-23 1988-09-23 Silver-glass pastes

Publications (1)

Publication Number Publication Date
ATE106068T1 true ATE106068T1 (de) 1994-06-15

Family

ID=22937758

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89309566T ATE106068T1 (de) 1988-09-23 1989-09-20 Silber-glas-pasten.

Country Status (8)

Country Link
US (1) US4986849A (de)
EP (1) EP0360587B1 (de)
JP (1) JPH02117798A (de)
KR (1) KR900004649A (de)
AT (1) ATE106068T1 (de)
DE (1) DE68915498T2 (de)
FI (1) FI94411C (de)
IE (1) IE893034L (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164119A (en) * 1988-09-23 1992-11-17 Johnson Matthey Inc. Silver-glass pastes
US5183784A (en) * 1990-02-21 1993-02-02 Johnson Matthey Inc. Silver-glass pastes
US5075262A (en) * 1990-02-21 1991-12-24 Johnson Matthey, Inc. Silver-glass pastes
JP2653314B2 (ja) * 1992-02-07 1997-09-17 鳴海製陶株式会社 電磁調理用容器
EP0877003B1 (de) * 1997-05-09 2002-09-18 JSR Corporation Zusammensetzung einer Glaspaste
US6020646A (en) * 1997-12-05 2000-02-01 The Charles Stark Draper Laboratory, Inc. Intergrated circuit die assembly
JP3539195B2 (ja) * 1998-03-25 2004-07-07 株式会社村田製作所 導電ペーストおよびそれを用いたセラミック基板の製造方法
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
JP4583063B2 (ja) * 2004-04-14 2010-11-17 三井金属鉱業株式会社 銀化合物被覆銀粉及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3350341A (en) * 1964-07-16 1967-10-31 Du Pont Silver compositions containing novel vitreous binders and a vehicle
US3497774A (en) * 1967-06-07 1970-02-24 Beckman Instruments Inc Electrical circuit module and method of manufacture
US3898091A (en) * 1973-06-04 1975-08-05 M & T Chemicals Inc Novel glazing composition and method
US4273583A (en) * 1979-06-29 1981-06-16 E. I. Du Pont De Nemours And Company Flake silver powders with chemisorbed monolayer of dispersant
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4436785A (en) * 1982-03-08 1984-03-13 Johnson Matthey Inc. Silver-filled glass
US4636254A (en) * 1985-07-23 1987-01-13 Quantum Materials, Inc. Silver-glass paste for attachment of silicon die to ceramic substrate
US4761224A (en) * 1986-03-10 1988-08-02 Quantum Materials Inc. Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
US4859241A (en) * 1986-04-16 1989-08-22 Johnson Matthey Inc. Metal flake and use thereof
DK54988A (da) * 1987-11-25 1989-05-26 Du Pont Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag

Also Published As

Publication number Publication date
EP0360587A2 (de) 1990-03-28
DE68915498D1 (de) 1994-06-30
KR900004649A (ko) 1990-04-12
FI94411C (fi) 1995-09-11
DE68915498T2 (de) 1994-10-06
FI894501A0 (fi) 1989-09-22
FI894501L (fi) 1990-03-24
EP0360587B1 (de) 1994-05-25
JPH02117798A (ja) 1990-05-02
FI94411B (fi) 1995-05-31
US4986849A (en) 1991-01-22
IE893034L (en) 1990-03-23
EP0360587A3 (en) 1990-10-17

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties